CN210805729U - Wafer adsorption carrying disc - Google Patents
Wafer adsorption carrying disc Download PDFInfo
- Publication number
- CN210805729U CN210805729U CN201921908919.5U CN201921908919U CN210805729U CN 210805729 U CN210805729 U CN 210805729U CN 201921908919 U CN201921908919 U CN 201921908919U CN 210805729 U CN210805729 U CN 210805729U
- Authority
- CN
- China
- Prior art keywords
- air suction
- center
- wafer
- supporting seat
- dish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001179 sorption measurement Methods 0.000 title abstract description 16
- 238000005192 partition Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 230000009977 dual effect Effects 0.000 abstract description 3
- 230000006698 induction Effects 0.000 abstract 2
- 238000000605 extraction Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a wafer adsorbs year dish, including carrying the dish, the center of carrying the dish is provided with the baffle, the top surface of baffle is provided with the supporting seat, a plurality of induction ports have been seted up to the top week side of supporting seat, the supporting seat is provided with a plurality ofly and the corresponding suction line of induction port with the center of baffle, the center of carrying the dish is provided with the cavity, the center of carrying dish outer wall one side is provided with the aspirating hole corresponding with the cavity, central suction line has been seted up at the center of baffle, the center of carrying the dish bottom is provided with the central aspirating hole corresponding with central suction line. The utility model discloses in, its structure of the device and design all have great innovation and improvement, should adsorb and carry the dish and not only designed collision device, still design has dual vacuum adsorption device, through carrying out vacuum adsorption to the different positions of wafer to fix the wafer tightly in carrying the dish, work efficiency improves greatly.
Description
Technical Field
The utility model relates to the field of semiconductor technology, especially, relate to a wafer adsorbs and carries dish.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, and various circuit element structures can be manufactured on the silicon wafer to form an IC product with specific electrical functions. The raw material of the wafer is silicon, the crust surface has inexhaustible silicon dioxide, and the silicon dioxide ore is refined by an electric arc furnace, chlorinated by hydrochloric acid and distilled to prepare high-purity polysilicon.
Since the wafer is thin and fragile, the wafer needs to be fixed on a customized carrying disc for protection in the processes of transportation, detection, processing, storage and the like of the wafer, and the adsorption carrying disc adsorbs the wafer and fixes the wafer on the carrying disc by using vacuum negative pressure generated by air suction under the vacuum condition, so that the purpose of fixing the wafer is achieved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a wafer adsorption carrying disc.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a wafer adsorption carrying disc comprises a carrying disc, a partition plate is arranged at the center of the carrying disc, a supporting seat is arranged on the outer surface of the top of the partition plate, a sponge ring is arranged on the periphery of the inner wall of the carrying disc, a plurality of air suction ports are formed in the periphery of the top of the supporting seat, a plurality of air suction pipelines corresponding to the air suction ports are arranged at the centers of the supporting seat and the partition plate, a cavity is formed in the center of the carrying disc, an air suction hole corresponding to the cavity is formed in the center of one side of the outer wall of the carrying disc, a connector corresponding to the air suction hole is arranged on one side of the outer wall of the carrying disc, a sealing cover is arranged at one end, away from the air suction hole, of the connector, a central air suction pipeline is arranged at the center of the partition plate, a first rubber sealing, and a second rubber sealing plug is arranged at the center of the bottom of the central extraction hole.
Further, the supporting seat is arranged in an annular structure.
Further, a plurality of the air suction pipelines are communicated with the cavity.
Further, the outer surface at the top of the supporting seat is provided with a layer of rubber ring.
Further, the height of the top of the supporting seat is lower than that of the top of the carrying disc.
Furthermore, the circle center of the central air suction pipeline and the circle center of the central air suction hole are located on the same straight line, and the central air suction pipeline is communicated with the central air suction hole.
The utility model discloses following beneficial effect has: 1. the utility model provides a pair of wafer adsorbs year dish compares with traditional device, the device simple structure, convenient and practical, through the absorption to the different positions of wafer, can play dual fail-safe's effect, even take place not hard up to the vacuum adsorption of wafer middle part or week side, its normal work also can be guaranteed to the absorption of another position to the effectual condition that has prevented that the wafer from taking place to drop from carrying the dish.
2. Compared with the traditional device, the device has the advantages that the structure and the design are greatly innovated and improved, the adsorption carrying disc is provided with the anti-collision device, the dual vacuum adsorption device is further designed, vacuum adsorption is carried out on different positions of the wafer, so that the wafer is tightly fixed in the carrying disc, the working efficiency is greatly improved, and the device is worthy of being widely popularized.
Drawings
Fig. 1 is a top view structural diagram of a wafer adsorption tray according to the present invention;
FIG. 2 is a front sectional view of a wafer adsorption carrier plate according to the present invention;
fig. 3 is a partially enlarged view of a portion a in fig. 1.
Illustration of the drawings:
1. a carrying tray; 2. a supporting seat; 3. a sponge ring; 4. an air suction port; 5. an air intake duct; 6. a cavity; 7. an air exhaust hole; 8. a connector; 9. a sealing cover; 10. a central suction duct; 11. a first rubber sealing plug; 12. a central air extraction hole; 13. a second rubber sealing plug; 14. a separator.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-3, the present invention provides an embodiment: a wafer adsorption carrying disc comprises a carrying disc 1, a partition plate 14 is arranged at the center of the carrying disc 1, a supporting seat 2 is arranged on the outer surface of the top of the partition plate 14, a sponge ring 3 is arranged on the periphery of the inner wall of the carrying disc 1, when a wafer is separated from the supporting seat 2, the sponge ring 3 can play a certain buffering role to prevent the wafer from directly colliding with the carrying disc 1 to cause damage of the wafer, a plurality of air suction ports 4 are arranged on the periphery of the top of the supporting seat 2, a plurality of air suction pipelines 5 corresponding to the air suction ports 4 are arranged at the centers of the supporting seat 2 and the partition plate 14, a cavity 6 is arranged at the center of the carrying disc 1, an air suction hole 7 corresponding to the cavity 6 is arranged at the center of one side of the outer wall of the carrying disc 1, a connector 8 corresponding to the air suction hole 7 is arranged at one side of the outer wall of, the wafer fixing device is characterized in that an air suction needle is inserted into a connector 8 and enters a cavity 6 through an air suction hole 7, air suction can be started, air in the cavity 6 is completely sucked out through the air suction needle, a vacuum environment is formed, a wafer is adsorbed and fixed on a supporting seat 2 in a carrying disc 1 through vacuum negative pressure generated by air suction, the purpose of fixing the wafer is achieved, a central air suction pipeline 10 is arranged in the center of a partition plate 14, a first rubber sealing plug 11 is arranged in the center of the bottom of the central air suction pipeline 10, a central air suction hole 12 corresponding to the central air suction pipeline 10 is arranged in the center of the bottom of the carrying disc 1, a second rubber sealing plug 13 is arranged in the center of the bottom of the central air suction hole 12, the air suction needle can be inserted from the bottom of the central air suction hole 12 after the air in the cavity 6 is sucked out, and then the air suction is inserted into the central air suction pipeline 10 through, thereby drawing air between the wafer and the spacer 14 to perform a vacuum suction function.
The supporting seat 2 is arranged in an annular structure, and the annular structure can enable the adsorption structure to be more stable.
The plurality of air suction pipes 5 are communicated with the cavity 6, so that the air in the plurality of air suction pipes 5 and the air in the cavity 6 are extracted from the air extraction holes 7.
The surface at 2 tops of supporting seat is provided with the one deck rubber circle, and the rubber circle can make the inseparabler of wafer and 2 laminating of supporting seat, also can play better sealed effects simultaneously.
The height of the top of the supporting seat 2 is lower than that of the top of the carrying disc 1, and only when the height of the top of the supporting seat 2 is lower than that of the top of the carrying disc 1, once the carrying disc is collided, when the wafer is separated from the supporting seat 2, the carrying disc 1 can prevent the wafer from being directly thrown out of the carrying disc 1, and a certain limiting effect is achieved.
The centre of a circle of central aspiration pipeline 10 and the centre of a circle of central aspirating hole 12 are located same straight line, and central aspiration pipeline 10 and central aspirating hole 12 link up each other, only can guarantee when the centre of a circle of central aspiration pipeline 10 and the centre of a circle of central aspirating hole 12 are located same straight line to bleed air when inserting more accurately, the skew can not take place in the position to realize bleeding fast.
The working principle is as follows: the utility model provides a wafer adsorbs and carries dish and traditional device has great improvement innovation, when using, we only need to carefully place the wafer on the supporting seat 2 of carrying in the dish 1, then open the sealed lid 9 of connector 8 one end, then insert the air extraction needle from connector 8, then get into cavity 6 through aspirating hole 7, then just can begin to bleed, thereby utilize the air extraction needle to take out the air in cavity 6 totally, thereby form the environment of vacuum, adsorb the wafer and fix it on supporting seat 2 of carrying in the dish 1 through the vacuum negative pressure that produces of bleeding, thereby realize fixing its week side, after the air in cavity 6 has been taken out, we can reuse the air extraction needle to insert from central aspirating hole 12 bottom, then insert central aspiration pipeline 10 through cavity 6 and inhale in, thereby take out the air between wafer and baffle 14, thereby performing vacuum adsorption on the central part of the wafer.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It should be understood by those skilled in the art that the foregoing embodiments are merely illustrative of the technical concepts and features of the present invention, and the purpose of the present invention is to provide a person skilled in the art with the ability to understand the contents of the present invention and implement the same, and not to limit the scope of the present invention.
Claims (6)
1. A wafer adsorbs and carries dish, includes and carries dish (1), its characterized in that: the center of the carrying disc (1) is provided with a partition plate (14), the outer surface of the top of the partition plate (14) is provided with a supporting seat (2), the inner wall of the carrying disc (1) is provided with a sponge ring (3) in the circumferential side, the top circumferential side of the supporting seat (2) is provided with a plurality of air suction ports (4), the supporting seat (2) and the center of the partition plate (14) are provided with a plurality of air suction pipelines (5) corresponding to the air suction ports (4), the center of the carrying disc (1) is provided with a cavity (6), the center of one side of the outer wall of the carrying disc (1) is provided with an air suction hole (7) corresponding to the air suction hole (6), one side of the outer wall of the carrying disc (1) is provided with a connector (8) corresponding to the air suction hole (7), one end of the connector (8) far away from the air suction hole (7), the central air suction device is characterized in that a first rubber sealing plug (11) is arranged at the center of the bottom of the central air suction pipeline (10), a central air suction hole (12) corresponding to the central air suction pipeline (10) is arranged at the center of the bottom of the carrying disc (1), and a second rubber sealing plug (13) is arranged at the center of the bottom of the central air suction hole (12).
2. The wafer chuck as set forth in claim 1, wherein: the supporting seat (2) is arranged in an annular structure.
3. The wafer chuck as set forth in claim 1, wherein: the air suction pipelines (5) are communicated with the cavity (6).
4. The wafer chuck as set forth in claim 1, wherein: the outer surface of the top of the supporting seat (2) is provided with a layer of rubber ring.
5. The wafer chuck as set forth in claim 1, wherein: the height of the top of the supporting seat (2) is lower than that of the top of the carrying disc (1).
6. The wafer chuck as set forth in claim 1, wherein: the circle center of the central air suction pipeline (10) and the circle center of the central air suction hole (12) are located on the same straight line, and the central air suction pipeline (10) is communicated with the central air suction hole (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921908919.5U CN210805729U (en) | 2019-11-07 | 2019-11-07 | Wafer adsorption carrying disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921908919.5U CN210805729U (en) | 2019-11-07 | 2019-11-07 | Wafer adsorption carrying disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210805729U true CN210805729U (en) | 2020-06-19 |
Family
ID=71226197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921908919.5U Expired - Fee Related CN210805729U (en) | 2019-11-07 | 2019-11-07 | Wafer adsorption carrying disc |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210805729U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437000A (en) * | 2021-05-26 | 2021-09-24 | 苏雪雯 | Wafer bearing disc with high safety performance |
| CN115044971A (en) * | 2022-05-23 | 2022-09-13 | 芯三代半导体科技(苏州)有限公司 | Wafer bearing device for vapor phase growth device and control method |
-
2019
- 2019-11-07 CN CN201921908919.5U patent/CN210805729U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437000A (en) * | 2021-05-26 | 2021-09-24 | 苏雪雯 | Wafer bearing disc with high safety performance |
| CN113437000B (en) * | 2021-05-26 | 2023-11-21 | 鄂尔多斯市骁龙半导体有限公司 | Wafer bearing disc with high safety performance |
| CN115044971A (en) * | 2022-05-23 | 2022-09-13 | 芯三代半导体科技(苏州)有限公司 | Wafer bearing device for vapor phase growth device and control method |
| CN115044971B (en) * | 2022-05-23 | 2023-11-10 | 芯三代半导体科技(苏州)有限公司 | Wafer bearing device for vapor phase growth device and control method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200619 |