CN206497880U - A kind of vacuum adsorption equipment for IC chip pad pasting - Google Patents
A kind of vacuum adsorption equipment for IC chip pad pasting Download PDFInfo
- Publication number
- CN206497880U CN206497880U CN201720126747.0U CN201720126747U CN206497880U CN 206497880 U CN206497880 U CN 206497880U CN 201720126747 U CN201720126747 U CN 201720126747U CN 206497880 U CN206497880 U CN 206497880U
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- China
- Prior art keywords
- disk seat
- sucker disk
- air flue
- mounting interface
- suction cup
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Abstract
The utility model discloses a kind of vacuum adsorption equipment for IC chip pad pasting, including base, vacuum generator, transmission air flue, sucker disk seat and Suction cup assembly, it is characterised in that：The base is provided with the vacuum generator and the sucker disk seat, the side wall of the sucker disk seat offers air flue mounting interface, sucker disk seat mounting interface is offered at the top of the sucker disk seat, one end of the transmission air flue is tightly connected with the vacuum generator, the other end of the transmission air flue is tightly connected with the air flue mounting interface, the Suction cup assembly is tightly connected with the sucker disk seat mounting interface, gas port is offered in the middle part of the Suction cup assembly, the gas port, the air flue mounting interface and the sucker disk seat mounting interface are interconnected.Vacuum adsorption equipment of the present utility model for IC chip pad pasting, applied to IC Chip Production apparatus field, the simple cost of complete machine structure is low, easy for installation, do not damage the surface of wafer and circuit.
Description
Technical field
The utility model is related to IC Chip Production apparatus field, more particularly to a kind of to be used for IC chip patch
The vacuum adsorption equipment of film.
Background technology
In ic chip package production process, the thickness of wafer generally can not meet the requirement of plastic package die, institute
To need to carry out skiving processing to wafer with thinned wafer lapping machine.
In the prior art, the disk of various different sizes can not be met due to wafer lapping machine is thinned, makes the circle of different size
Piece can process the film for having to that a piece of PVC is pasted on wafer to be processed is unilateral on same wafer lapping machine, to ensure
Sucker improves its pull of vacuum with wafer sealing.Manufacturer's needs searching one kind is inexpensive, easy for installation, wafer is made
Into the pad pasting adsorption plant that degree of injury is minimum.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of vacuum suction for IC chip pad pasting and set
Standby, the equipment application is in IC Chip Production apparatus field, and the simple cost of complete machine structure is low, easy for installation, will not damage
The surface of wafer and circuit.
In order to solve the above-mentioned technical problem, the technical solution of the utility model is：
A kind of vacuum adsorption equipment for IC chip pad pasting, including base, vacuum generator, transmission air flue,
Sucker disk seat and Suction cup assembly, the base are provided with the vacuum generator and the sucker disk seat, and the side wall of the sucker disk seat is opened
Provided with air flue mounting interface, sucker disk seat mounting interface, one end of the transmission air flue and institute are offered at the top of the sucker disk seat
State vacuum generator to be tightly connected, the other end of the transmission air flue is tightly connected with the air flue mounting interface, the sucker
Component is tightly connected with the sucker disk seat mounting interface, and gas port, the gas port, institute are offered in the middle part of the Suction cup assembly
State air flue mounting interface and the sucker disk seat mounting interface is interconnected.
Preferably, the base is also equipped with air valve switch, and the air valve switch is tightly connected with the vacuum generator.
Preferably, the top both sides of the sucker disk seat are provided with convex locating piece, and the bottom of the Suction cup assembly offers recessed
Shape groove is engaged with the convex locating piece to be fixed at the top of the sucker disk seat.
Preferably, it is also equipped with filter in the vacuum generator.
Using above-mentioned technical proposal, vacuum generator, transmission air flue and Suction cup assembly installed in base are engaged composition
Vacuum adsorption equipment, operating personnel, which need to will only cut appropriate PVC film and be placed on Suction cup assembly, to be adsorbed, and wafer is put
Put in PVC film, applying slight external force to wafer can both cling wafer in PVC film, and operating personnel are without straight
Contact wafer, will not damage surface and the circuit of wafer, and the equipment only has vacuum generator, transmission air flue and sucker group
The several primary clusterings of part, complete machine structure is simple, and easy for installation, cost is low.
Brief description of the drawings
Fig. 1 is the sectional side elevation for the vacuum adsorption equipment that the utility model is used for IC chip pad pasting；
Fig. 2 is the top view for the vacuum adsorption equipment that the utility model is used for IC chip pad pasting.
In figure, 1- bases；2- vacuum generators；3- transmits air flue；4- sucker disk seats；5- Suction cup assemblies；6- air flues are installed and connect
Mouthful；7- sucker disk seat mounting interfaces；8- gas ports；9- air valve switch；10- convex locating pieces；11- Baltimore grooves.
Embodiment
Embodiment of the present utility model is described further below in conjunction with the accompanying drawings.Herein it should be noted that
Explanation for these embodiments is used to help understand the utility model, but does not constitute to restriction of the present utility model.This
Outside, as long as technical characteristic involved in each embodiment of the utility model disclosed below does not constitute conflict each other
It can just be mutually combined.
Shown in reference picture 1, Fig. 2, a kind of vacuum adsorption equipment for IC chip pad pasting, including base 1, vacuum
Generator 2, transmission air flue 3, sucker disk seat 4 and Suction cup assembly 5, base 1 are provided with vacuum generator 2 and sucker disk seat 4, sucker disk seat 4
Side wall offer air flue mounting interface 6, the top of sucker disk seat 4 offers sucker disk seat mounting interface 7, transmits one end of air flue 3
It is tightly connected with vacuum generator 2, the other end of transmission air flue 3 is tightly connected with air flue mounting interface 6, and Suction cup assembly 5 is with inhaling
Disk seat mounting interface 7 is tightly connected, and the middle part of Suction cup assembly 5 offers gas port 8, gas port 8, air flue mounting interface 6 and suction
Disk seat mounting interface 7 is interconnected.Vacuum generator 2, transmission air flue 3 and Suction cup assembly 5 installed in base are engaged composition
Vacuum adsorption equipment, operating personnel, which need to will only cut appropriate PVC film and be placed on Suction cup assembly 5, to be adsorbed, wafer
It is placed in PVC film, applying slight external force to wafer can both cling wafer in PVC film, and operating personnel need not
Directly contact wafer, it is to avoid the surface of damage wafer and circuit, the equipment only has vacuum generator 2, transmission air flue 3 and inhaled
The several primary clusterings of disk component 5, complete machine structure is simple, and easy for installation, cost is low.
Base 1 is also equipped with air valve switch 9, and air valve switch 9 is tightly connected with vacuum generator 2.Air valve switch 9 coordinates very
The empty use of generator 2 can tackle the convenient control negative pressure size of different product process requirements.
The top both sides of sucker disk seat 4 are provided with convex locating piece 10, and the bottom of Suction cup assembly 5 offers Baltimore groove 11 and convex
Locating piece 10, which is engaged, is fixed on the top of sucker disk seat 4.Baltimore groove 11 on Suction cup assembly 5 coordinates spill locating piece on sucker disk seat 4
10 installations make Suction cup assembly 5 more be fixed on sucker disk seat 4.
Filter (not shown) is also equipped with vacuum generator 2.The filter set in vacuum generator 2 is effective
Obstruct the significant components of dust, effectively protection vacuum generator 2.
Embodiment of the present utility model is explained in detail above in association with accompanying drawing, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, it is right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall within protection domain of the present utility model.
Claims (4)
1. a kind of vacuum adsorption equipment for IC chip pad pasting, including base, vacuum generator, transmission air flue, suction
Disk seat and Suction cup assembly, it is characterised in that：The base is provided with the vacuum generator and the sucker disk seat, the sucker disk seat
Side wall offer sucker disk seat mounting interface offered at the top of air flue mounting interface, the sucker disk seat, the transmission air flue
One end is tightly connected with the vacuum generator, and the other end of the transmission air flue is tightly connected with the air flue mounting interface,
The Suction cup assembly is tightly connected with the sucker disk seat mounting interface, and gas port is offered in the middle part of the Suction cup assembly, described
Gas port, the air flue mounting interface and the sucker disk seat mounting interface are interconnected.
2. the vacuum adsorption equipment according to claim 1 for IC chip pad pasting, it is characterised in that：The bottom
Seat is also equipped with air valve switch, and the air valve switch is tightly connected with the vacuum generator.
3. the vacuum adsorption equipment according to claim 1 for IC chip pad pasting, it is characterised in that：It is described to inhale
The top both sides of disk seat are provided with convex locating piece, and the Baltimore groove that the Suction cup assembly is opened up by its bottom is positioned with the convex
Block, which is engaged, to be fixed at the top of the sucker disk seat.
4. the vacuum adsorption equipment according to claim 1 for IC chip pad pasting, it is characterised in that：It is described true
Filter is installed in empty generator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720126747.0U CN206497880U (en) | 2017-02-10 | 2017-02-10 | A kind of vacuum adsorption equipment for IC chip pad pasting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720126747.0U CN206497880U (en) | 2017-02-10 | 2017-02-10 | A kind of vacuum adsorption equipment for IC chip pad pasting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206497880U true CN206497880U (en) | 2017-09-15 |
Family
ID=59804637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720126747.0U Active CN206497880U (en) | 2017-02-10 | 2017-02-10 | A kind of vacuum adsorption equipment for IC chip pad pasting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206497880U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109236840A (en) * | 2018-11-06 | 2019-01-18 | 深圳市诺峰光电设备有限公司 | A kind of detachable suction film head of magnetic |
-
2017
- 2017-02-10 CN CN201720126747.0U patent/CN206497880U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109236840A (en) * | 2018-11-06 | 2019-01-18 | 深圳市诺峰光电设备有限公司 | A kind of detachable suction film head of magnetic |
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Legal Events
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180419 Address after: 529100 2 Dong Hou Road, Xinhui District, Jiangmen, Guangdong, 2 Patentee after: Jiangmen Huakai Technology Co., Ltd. Address before: 529100 2 Dong Hou Road, Xinhui District, Jiangmen, Guangdong, 2 Co-patentee before: Li Jinxia Patentee before: Wen Weijie Co-patentee before: Li Weiguo Co-patentee before: Zhang Yamin |