CN113437000A - Wafer bearing disc with high safety performance - Google Patents
Wafer bearing disc with high safety performance Download PDFInfo
- Publication number
- CN113437000A CN113437000A CN202110575437.8A CN202110575437A CN113437000A CN 113437000 A CN113437000 A CN 113437000A CN 202110575437 A CN202110575437 A CN 202110575437A CN 113437000 A CN113437000 A CN 113437000A
- Authority
- CN
- China
- Prior art keywords
- cavity
- wafer
- fixedly connected
- bearing disc
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 28
- 230000000903 blocking effect Effects 0.000 claims abstract description 26
- 238000005192 partition Methods 0.000 claims abstract description 21
- 238000002955 isolation Methods 0.000 claims description 18
- 230000029058 respiratory gaseous exchange Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 68
- 238000000034 method Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention relates to the technical field of strategic emerging industries and discloses a wafer bearing disc with high safety performance, which comprises a bearing disc, wherein the top of the bearing disc is provided with an object placing cavity, an inner cavity is formed in the bearing disc, the bottom of the inner cavity is provided with a pressure absorbing cavity, the top of the inner cavity is provided with a blocking ring and a low pressure ring which are uniformly distributed, the bottom end of the low pressure ring is provided with uniformly distributed sucking disc holes, the left center and the right center of the blocking ring and the low pressure ring are fixedly connected with a partition plate, one side of the partition plate, far away from the center, is provided with a vent, and the center of the inner cavity of the bearing disc is fixedly connected with a thermosensitive material rod. According to the wafer bearing device, the wafer can be absorbed in the groove of the bearing disc through the pressure difference between the bottom low-pressure cavity and air when the wafer is placed in the bearing disc through the designed object placing cavity, the low-pressure cavity and the sucking disc hole, so that the outer ring of the wafer is not stressed due to extrusion of the clamping groove, and the outer ring of the wafer is not affected by the clamping problem to cause material waste.
Description
Technical Field
The invention relates to the technical field of strategic emerging industries, in particular to a wafer bearing disc with high safety performance.
Background
In the semiconductor manufacturing process, wafers need to be transferred to reaction chambers of different processing technologies by a transfer device (such as a robot arm) for processing, and the wafers need to be placed in a carrier tray for the convenience of handling and avoiding damage to the wafers.
The existing wafer is clamped in a clamping groove of a bearing plate, the outer ring of the wafer is contacted with the clamping groove, so that the contact surface of the outer ring of the wafer cannot be touched by machinery, the material of the outer ring of the wafer is wasted, the outer ring of the wafer is impacted on the inner wall of the clamping groove of the bearing plate in the process of transferring the wafer and the centrifugal operation in the wafer processing technology, the wafer is easy to be impacted, damaged and stress accumulated and is influenced by the centrifugal force, the wafer has a tendency of moving upwards, the outer ring of the wafer is influenced by the clamping groove, the displacement of the wafer is limited, the stress accumulation is simultaneously generated on the outer ring part of the wafer, a crystal slip line is caused when the wafer is serious, the wafer is damaged, meanwhile, the temperature of the wafer exceeds 650 ℃ after the heat treatment technology is completed, the wafer is arranged in the clamping groove of the bearing plate at the moment, the heat accumulation and the slow heat emission can be caused by the design of the clamping groove structure, this will seriously affect the efficiency of subsequent processing of the wafer.
Disclosure of Invention
Aiming at the defects of the prior wafer bearing disc in the use process in the background technology, the invention provides the wafer bearing disc with high safety performance, which has the advantages of adsorption type fixation, flexible contact between the periphery of the wafer and the side wall of the object placing cavity and air cooling of the wafer after heat treatment, and solves the problems of rigid contact of the clamping groove of the bearing disc with the wafer, mechanical damage and stress concentration on the periphery of the wafer and slow heat dissipation of the wafer after heat treatment in the background technology.
The invention provides the following technical scheme: a wafer bearing disc with high safety performance comprises a bearing disc, wherein an object placing cavity is formed in the top of the bearing disc, an inner cavity is formed in the bearing disc, a pressure absorbing cavity is formed in the bottom of the inner cavity, a blocking ring and a low pressure ring are uniformly distributed on the top of the inner cavity, sucking disc holes are uniformly distributed in the bottom of the low pressure ring, a partition plate is fixedly connected to the left center and the right center of the blocking ring and the low pressure ring, a vent is formed in one side, away from the center, of the partition plate, a thermosensitive material rod is fixedly connected to the center of the inner cavity of the bearing disc, a variable pressure cavity is formed in the bottom of the thermosensitive material rod, a bulging film is fixedly connected to the bottom end of the bulging film, a movable rod is fixedly connected to the bottom end of the bulging film, symmetrical springs are fixedly connected to two sides of the top of the thermosensitive material rod, an isolating slide block is fixedly connected to the other end of each spring, and an annular air duct is formed below the inner cavity of the bearing disc, the bottom in annular wind channel is equipped with annular wind channel spout, the bottom fixedly connected with subassembly of breathing in that bears the weight of the dish.
Preferably, an air inlet channel is formed in one end of the air suction assembly, an air outlet channel is fixedly connected to the other end of the air suction assembly, a moving groove is formed between the air outlet channel and the annular air duct of the bearing disc, a second spring is fixedly connected to one end of the moving groove, a blocking sliding block is fixedly connected to one end of the second spring, and a pull rope is fixedly connected to one end of the blocking sliding block.
Preferably, the air outlet channel is communicated with the annular air duct, the length value of the blocking slide block is one-half and five times that of the air outlet channel, and the other end of the pull rope penetrates through the bearing disc and is fixedly connected with the movable rod.
Preferably, the object placing cavity is in the shape of a circular groove, and the blocking ring and the low-pressure ring are both in the shape of a circular ring.
Preferably, the vent is communicated with a cavity formed by the pressure suction cavity and the partition plate, and an inner cavity formed by the partition plate is communicated with each low-pressure ring.
Preferably, the material of the thermosensitive material rod can be copper, cobalt and manganese, and the top end of the thermosensitive material rod penetrates through the inner cavity of the bearing disc and is parallel to the bottom end of the storage cavity.
Preferably, the isolation slider is located in a space formed by the partition plate, the length, width and height values of the isolation slider are all smaller than the length, width and height values of the space formed by the partition plate by zero point one millimeter, and the isolation slider does not contact with the vent when reaching the maximum stroke.
Preferably, the annular air duct nozzle is located on the inner wall of the object placing cavity, and the lowest point of the annular air duct nozzle is higher than the lowest point of the object placing cavity by more than five millimeters.
The invention has the following beneficial effects:
1. according to the wafer bearing device, the wafer can be absorbed in the groove of the bearing disc through the pressure difference between the bottom low-pressure cavity and air when the wafer is placed in the bearing disc through the designed object placing cavity, the low-pressure cavity and the sucking disc hole, so that the outer ring of the wafer is not stressed due to extrusion of the clamping groove, and the outer ring of the wafer is not affected by the clamping problem to cause material waste.
2. According to the invention, through the designed annular air duct and the isolation sliding block, when the wafer is processed in the centrifugal stage, the isolation sliding block can open the interface between the air outlet channel and the annular air duct, so that the air flow is sprayed out from the nozzle of the annular air duct, and an air wall is formed between the inner wall of the object placing cavity and the outer ring of the wafer, so that when the wafer is shaken under high-speed rotation or movement, the outer ring of the wafer can be influenced by the air wall to be in flexible contact with the inner wall of the object placing cavity, thereby avoiding impact damage of the wafer, and meanwhile, through the designed isolation sliding block, the isolation sliding block is driven by centrifugal force to slide by the bearing disc in rotation and blocks a low pressure ring close to the center, so that the working sucker holes are reduced, thereby increasing the suction force on the wafer, and avoiding the situation that the wafer falls off due to upward movement of the wafer caused by centrifugal rotation.
3. According to the invention, through the designed thermosensitive material rod, the variable pressure cavity and the movable rod, after the wafer is subjected to heat treatment, the air in the variable pressure cavity is heated and expanded by the thermosensitive material in the center, the movable rod synchronously moves downwards, the interface between the air outlet channel and the annular air channel is opened, clean cold air around the annular air channel is continuously sprayed out to contact the wafer, flowing air flow is formed, and thus the heat dissipation speed of the wafer is accelerated.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a storage compartment according to the present invention;
in the figure: 1. a carrier tray; 2. a storage cavity; 3. a suction pressure chamber; 4. a partition plate; 401. a vent; 5. a blocking ring; 6. a low pressure ring; 7. a sucker hole; 8. a rod of thermally sensitive material; 801. a variable pressure chamber; 802. a ballooning film; 803. a movable rod; 9. a first spring; 10. isolating the sliding block; 11. an annular air duct; 111. an annular air duct nozzle; 12. a getter assembly; 121. an air inlet channel; 122. an air outlet channel; 13. a pressure relief valve; 14. a moving groove; 15. blocking the sliding block; 16. a second spring; 17. and pulling a rope.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, a wafer carrier with high safety performance includes a carrier 1, a storage cavity 2 is formed at the top of the carrier 1, the storage cavity 2 is in a circular groove shape, so that a wafer can be placed in the storage cavity 2, an inner cavity is formed in the carrier 1, a suction cavity 3 is formed at the bottom of the inner cavity, a blocking ring 5 and a low pressure ring 6 are uniformly arranged at the top of the inner cavity, the blocking ring 5 and the low pressure ring 6 are both in a circular ring shape, chuck holes 7 are uniformly arranged at the bottom of the low pressure ring 6, the chuck holes 7 are annularly arranged at the bottom of the storage cavity 2, so that the bottom end of the wafer is contacted with the uniformly distributed chuck holes 7 to be adsorbed, thereby avoiding the stress concentration caused by non-uniform contact, a partition plate 4 is fixedly connected to the left center and the right center of the blocking ring 5 and the low pressure ring 6, a vent 401 is formed at one side of the partition plate 4 away from the center, and the vent 401 communicates the suction cavity 3 and the partition plate 4, the inner cavity formed by the partition plate 4 is communicated with each low-pressure ring 6, so that the air suction assembly 12 sucks air in the low-pressure rings 6 through the suction pressure cavity 3, the vent 401, the space formed by the partition plate 4 and the low-pressure rings 6 in sequence to separate the low-pressure rings 6, and the isolation slide block 10 can prevent the low-pressure rings 6 close to the center from continuously sucking air to form a low-pressure area when moving towards the vent 401 in the centrifugal treatment stage.
The center of the inner cavity of the bearing disc 1 is fixedly connected with a thermosensitive material rod 8, the thermosensitive material rod 8 can be made of copper, cobalt and manganese, the top end of the thermosensitive material rod 8 penetrates through the inner cavity of the bearing disc 1 and is parallel to the bottom end of the storage cavity 2, the top end of the thermosensitive material rod 8 can be attached to the bottom end center of a wafer, temperature change of the wafer can be timely transmitted to the thermosensitive material rod 8, heat is transmitted to a pressure changing cavity 801, gas shrinkage and expansion in the pressure changing cavity 801 are controlled, the bottom of the thermosensitive material rod 8 is provided with a pressure changing cavity 801, the bottom of the pressure changing cavity 801 is fixedly connected with a bulging film 802, the bottom of the bulging film 802 is fixedly connected with a movable rod 803, two sides of the top of the thermosensitive material rod 8 are fixedly connected with symmetrical springs 9, the other end of the spring 9 is fixedly connected with an isolation slider 10, the isolation slider 10 is located in a space formed by the partition plate 4, and the isolation slider 10 is long, The width, the high value all is longer than the space that baffle 4 formed, it is wide, the little zero point one millimeter of high value, isolation slider 10 does not contact vent 401 when reaching the maximum stroke, avoid isolation slider 10 and the unable circumstances of recovering of being blocked after the contact of vent 401, make isolation slider 10 can remove to vent 401's direction at the centrifugal processing stage, make it can block to be close to the low-pressure ring 6 at center and continue to be sucked the air and form the low-pressure area, when making centrifugal processing, the sucking disc hole 7 quantity with wafer bottom effect reduces, increase adsorption affinity, thereby avoid the condition that the wafer breaks away from to the top in the rotatory effect of centrifugation top pressure reduction and top.
Bear the inner chamber below of dish 1 and seted up annular wind channel 11, the bottom in annular wind channel 11 is equipped with annular wind channel spout 111, annular wind channel spout 111 is located puts the inner wall in thing chamber 2, the minimum of annular wind channel spout 111 exceeds five millimeters than putting the minimum point in thing chamber 2, make gaseous ability follow annular wind channel spout 111 department blowout back, can form the brattice at the wafer periphery with put between the 2 lateral walls in thing chamber, thereby make the wafer rock down with put the lateral wall flexible contact in thing chamber 2, exceed five millimeter's design simultaneously, avoided gaseous back effect in the wafer bottom of blowing out, thereby make the low-pressure area pressure increase of wafer bottom lead to the condition that the adsorption affinity reduces.
The bottom end of the bearing disc 1 is fixedly connected with an air suction assembly 12, one end of the air suction assembly 12 is provided with an air inlet channel 121, the other end of the air suction assembly 12 is fixedly connected with an air outlet channel 122, one end of the air outlet channel 122 is fixedly connected with a pressure relief valve 13, the air outlet channel 122 is communicated with the annular air duct 11, the bearing disc 1 is positioned between the air outlet channel 122 and the annular air duct 11 and is provided with a moving groove 14, one end of the moving groove 14 is fixedly connected with a second spring 16, one end of the second spring 16 is fixedly connected with a blocking slider 15, the length value of the blocking slider 15 is one-fifth time of the length value of the air outlet channel 122, so that the blocking slider 15 can slide in the moving groove 14 and can open or block the interface between the air outlet channel 122 and the annular air duct 11, one end of the blocking slider 15 is fixedly connected with a pull rope 17, and the other end of the pull rope 17 penetrates through the bearing disc 1 and is fixedly connected with a moving rod 803, the movable rod 803 is pressed down when the gas in the inner cavity of the pressure changing cavity 801 is heated, so that the movable rod can drive the blocking slide block 15 to displace towards the central direction through the pull rope 17, the blocking slide block 15 can open the interface, and the gas can be sprayed out to exchange heat with the high-temperature wafer.
The use method (working principle) of the invention is as follows:
firstly, a wafer is placed in the object placing cavity 2, the air suction assembly 12 is opened to suck air in the low-pressure ring 6, the sucking disc holes 7 adsorb the wafer, at the moment, the air suction assembly 12 continuously sucks the air in the low-pressure ring 6, the low-pressure ring 6 is kept in a state close to vacuum, the air suction assembly 12 continuously sucks the air through the air inlet channel 121, and the sucked air is discharged from the pressure release valve 13 due to the fact that the sliding block 15 is blocked to block an interface between the air outlet channel 122 and the annular air duct 11;
then, when the carrier tray 1 is put into the centrifugal processing ring, the carrier tray 1 rotates at a high speed, at this time, the isolation slider 10 moves towards the direction of the vent 401 under the influence of centrifugal force, so that the opening of the low pressure ring 6 close to the central part is blocked, the blocked low pressure ring 6 loses the low pressure limiting function, the wafer which is reduced by the centrifugal force and the rotation at this time and has the ascending trend is absorbed by less sucker holes 7, thereby increasing the absorption force, simultaneously the blocking slider 15 slides outwards under the influence of the centrifugal force to open the interface of the air outlet channel 122 and the annular air channel 11, so that the air is filled into the annular air channel 11 and is sprayed out from the annular air channel nozzle 111, an air wall is formed between the inner wall of the placing cavity and the outer ring of the wafer, at this time, the pressure release valve 13 is closed, then, after the centrifugal processing is completed, each component is reset, then, after the carrier tray 1 is placed into the heat treatment process, when the temperature of the wafer rises to more than six hundred fifty degrees, the heat-sensitive material rod 8 contacts the lower surface of the wafer and is heated, so that the air in the pressure changing cavity 801 is heated, the swelling film 802 is swelled, the movable rod 803 is moved downwards to pull the pull rope 17, the blocking slider 15 slides inwards to open the interface between the air outlet channel 122 and the annular air duct 11, the air is sprayed out from the annular air duct nozzle 111 again, the flowing air and the wafer exchange heat, the overall temperature of the wafer is gradually reduced, the central temperature of the wafer disappears at the last time end, and the heat-sensitive material rod 8 is continuously heated to keep the continuous spraying of the air;
finally, after the wafer temperature reaches the requirement, the air in the pressure changing cavity 801 contracts, so that the movable rod 803 returns, the blocking slide block 15 blocks the interface again, and at the moment, the mechanical arm moves the bearing disc 1 to the next process.
Finally, the mechanical arm grabs the edge of the bearing plate 1 to displace the bearing plate, so that the bearing plate 1 enters each processing industrial area
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a wafer bearing plate that security performance is high, includes bearing plate (1), its characterized in that: the top of the bearing disc (1) is provided with an object placing cavity (2), an inner cavity is formed in the bearing disc (1), the bottom of the inner cavity is provided with an absorption and pressure cavity (3), the top of the inner cavity is provided with a blocking ring (5) and a low pressure ring (6) which are uniformly distributed, the bottom of the low pressure ring (6) is provided with an absorption and pressure hole (7) which are uniformly distributed, the left center and the right center of the blocking ring (5) and the low pressure ring (6) are fixedly connected with a partition plate (4), one side of the partition plate (4) far away from the center is provided with a vent (401), the inner cavity center of the bearing disc (1) is fixedly connected with a thermosensitive material rod (8), the bottom of the thermosensitive material rod (8) is provided with a variable pressure cavity (801), the bottom of the variable pressure cavity (801) is fixedly connected with an expansion film (802), the bottom of the expansion film (802) is fixedly connected with a movable rod (803), two sides of the top of the thermosensitive material rod (8) are fixedly connected with symmetrical springs (9), the other end fixedly connected with of a spring (9) keeps apart slider (10), bear inner chamber below of dish (1) and seted up annular wind channel (11), the bottom in annular wind channel (11) is equipped with annular wind channel spout (111), bear bottom fixedly connected with subassembly (12) of breathing in of dish (1).
2. A wafer carrier as claimed in claim 1, wherein: air inlet channel (121) have been seted up to the one end of subassembly (12) of breathing in, the other end fixedly connected with air-out passageway (122) of subassembly (12) of breathing in, bear set (1) and be located air-out passageway (122) and seted up shifting chute (14) between annular wind channel (11), No. two spring (16) of one end fixedly connected with of shifting chute (14), No. two spring (16)'s one end fixedly connected with blocks up slider (15), block up one end fixedly connected with stay cord (17) of slider (15).
3. A wafer carrier as claimed in claim 2, wherein: the air outlet channel (122) is communicated with the annular air duct (11), the length value of the blocking slide block (15) is one-to-five times that of the air outlet channel (122), and the other end of the pull rope (17) penetrates through the bearing disc (1) and is fixedly connected with the movable rod (803).
4. A wafer carrier as claimed in claim 1, wherein: the object placing cavity (2) is in a circular groove shape, and the blocking ring (5) and the low-pressure ring (6) are both in a circular ring shape.
5. A wafer carrier as claimed in claim 1, wherein: the vent (401) is communicated with a cavity formed by the pressure suction cavity (3) and the partition plate (4), and an inner cavity formed by the partition plate (4) is communicated with each low-pressure ring (6).
6. A wafer carrier as claimed in claim 1, wherein: the material of the heat-sensitive material rod (8) can be copper, cobalt or manganese, and the top end of the heat-sensitive material rod (8) penetrates through the inner cavity of the bearing disc (1) and is parallel to the bottom end of the storage cavity (2).
7. A wafer carrier as claimed in claim 1, wherein: the isolation sliding block (10) is located in a space formed by the partition plate (4), the length, width and height values of the isolation sliding block (10) are smaller than those of the space formed by the partition plate (4) by zero point one millimeter, and the isolation sliding block (10) does not contact with the vent (401) when reaching the maximum stroke.
8. A wafer carrier as claimed in claim 1, wherein: the annular air duct nozzle (111) is located on the inner wall of the object placing cavity (2), and the lowest point of the annular air duct nozzle (111) is higher than the lowest point of the object placing cavity (2) by more than five millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110575437.8A CN113437000B (en) | 2021-05-26 | 2021-05-26 | Wafer bearing disc with high safety performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110575437.8A CN113437000B (en) | 2021-05-26 | 2021-05-26 | Wafer bearing disc with high safety performance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113437000A true CN113437000A (en) | 2021-09-24 |
| CN113437000B CN113437000B (en) | 2023-11-21 |
Family
ID=77803168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110575437.8A Active CN113437000B (en) | 2021-05-26 | 2021-05-26 | Wafer bearing disc with high safety performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113437000B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115999856A (en) * | 2023-01-28 | 2023-04-25 | 深圳市丰源升科技有限公司 | Perovskite film coating assembly and automatic film coating machine |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008117811A (en) * | 2006-10-31 | 2008-05-22 | Sunx Ltd | Vacuum suction table |
| KR20100109009A (en) * | 2009-03-31 | 2010-10-08 | 피에스케이 주식회사 | Substrates treating apparatus and method |
| JP2016127260A (en) * | 2014-12-26 | 2016-07-11 | 東京エレクトロン株式会社 | Substrate processing apparatus |
| KR101680635B1 (en) * | 2015-08-26 | 2016-11-29 | 국제엘렉트릭코리아 주식회사 | substrate processing apparatus |
| CN108705690A (en) * | 2018-05-29 | 2018-10-26 | 李涵 | A kind of semiconductor crystal wafer scribing machine |
| CN109860332A (en) * | 2018-12-19 | 2019-06-07 | 北京铂阳顶荣光伏科技有限公司 | A kind of cell piece Acetabula device |
| CN210805729U (en) * | 2019-11-07 | 2020-06-19 | 江苏英锐半导体有限公司 | Wafer adsorption carrying disc |
-
2021
- 2021-05-26 CN CN202110575437.8A patent/CN113437000B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008117811A (en) * | 2006-10-31 | 2008-05-22 | Sunx Ltd | Vacuum suction table |
| KR20100109009A (en) * | 2009-03-31 | 2010-10-08 | 피에스케이 주식회사 | Substrates treating apparatus and method |
| JP2016127260A (en) * | 2014-12-26 | 2016-07-11 | 東京エレクトロン株式会社 | Substrate processing apparatus |
| KR101680635B1 (en) * | 2015-08-26 | 2016-11-29 | 국제엘렉트릭코리아 주식회사 | substrate processing apparatus |
| CN108705690A (en) * | 2018-05-29 | 2018-10-26 | 李涵 | A kind of semiconductor crystal wafer scribing machine |
| CN109860332A (en) * | 2018-12-19 | 2019-06-07 | 北京铂阳顶荣光伏科技有限公司 | A kind of cell piece Acetabula device |
| CN210805729U (en) * | 2019-11-07 | 2020-06-19 | 江苏英锐半导体有限公司 | Wafer adsorption carrying disc |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115999856A (en) * | 2023-01-28 | 2023-04-25 | 深圳市丰源升科技有限公司 | Perovskite film coating assembly and automatic film coating machine |
| CN115999856B (en) * | 2023-01-28 | 2023-09-22 | 深圳市丰源升科技有限公司 | Perovskite film coating assembly and automatic film coating machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113437000B (en) | 2023-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113437000A (en) | Wafer bearing disc with high safety performance | |
| JP5752119B2 (en) | Vacuum gripper | |
| US6575737B1 (en) | Method and apparatus for improved substrate handling | |
| JP2000240570A (en) | Shield for protecting array of activated carbon of cryopump from shedding during regeneration of cryopump | |
| CN110668067B (en) | Manual air adsorption type workpiece taking device | |
| CN111189332B (en) | Cross-flow cooling tower | |
| CN212887651U (en) | Pneumatic soft manipulator | |
| CN101567311B (en) | Vacuum processing apparatus, vacuum processing method, electronic device, and electronic device manufacturing method | |
| CN114407063A (en) | Multifunctional mechanical arm end effector | |
| CN113019957A (en) | Full-automatic separation device for LED chip crystal grain disc | |
| CN108470704B (en) | Pass piece cavity and semiconductor processing equipment | |
| CN109167603B (en) | Heat dissipation closing device of transmitter | |
| WO2015197020A1 (en) | Adsorption device and surface treatment device having same | |
| CN115083986A (en) | SCARA robot arm with End effect | |
| CN111571630B (en) | Robot clamp without damaging workpiece | |
| CN113245654B (en) | Automatic chip welding process and welding device | |
| CN115303925A (en) | Vacuum chuck | |
| CN115716123B (en) | Fry look pot apparatus for producing with multi-angle detects function | |
| CN113428652A (en) | Protective glass plate processing and manufacturing equipment | |
| CN217201571U (en) | Vacuum chuck with suck-back prevention device | |
| CN113506762A (en) | Silicon wafer suspension transmission mechanism | |
| CN113460700A (en) | Silicon chip moves and carries mechanism | |
| CN207827670U (en) | A kind of sucker for electric pole production | |
| CN220540312U (en) | Sealing device for wafer loading port and loading machine table | |
| CN112146360A (en) | Gas cooling device for vacuum drying oven and vacuum drying oven |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20231027 Address after: 017000 Office Area 1, 1st Floor, Standardized Factory Building, Yijinhoruo Banner Comprehensive Bonded Zone, Ordos City, Inner Mongolia Autonomous Region Applicant after: Ordos Xiaolong Semiconductor Co.,Ltd. Address before: 528400 No. 20, Houlong street, team 2, Waisha village, Shenwan Town, Zhongshan City, Guangdong Province Applicant before: Su Xuewen |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |