CN210778565U - A MIMO antenna cooling device - Google Patents

Abstract

The utility model relates to a MIMO antenna heat dissipation device, which comprises a hexagon socket head screw, a fan, a sleeve, an aluminum heat dissipation fin, a graphite heat-conducting layer, a semiconductor refrigeration sheet, a graphite heat-conducting layer II and a base. Heat dissipation fins, graphite heat conduction layer 1, semiconductor refrigeration sheet, graphite heat conduction layer 2 are stacked on the base from top to bottom in turn, the sleeve is supported between the fan and the base, and is fastened to the base with hexagon socket screws connected. The beneficial effects are: adopting the semiconductor cooling sheet to conduct heat, can solve the heat dissipation problem of the MIMO antenna, reduce the working temperature of the antenna chip, improve the working efficiency of the chip, and has the characteristics of simple structure, convenient processing, long service life, safety and reliability.

Description

A MIMO antenna cooling device

technical field

The utility model relates to the technical field of heat dissipation of antenna chips, in particular to a heat dissipation device for a MIMO antenna.

Background technique

At present, with the continuous development of communication technology and the continuous improvement of information density, the power of the antenna of the mobile base station is also increasing. The increase in power will lead to a sharp increase in the heat generation of the antenna chip. The traditional cooling method using natural wind or fan can no longer meet the heat dissipation requirements of higher power antennas. The existing antenna radiators mainly have the following problems:

1) Low heat dissipation efficiency;

2) It is difficult to process and has a short service life;

3) The use conditions are harsh and the danger is high.

In order to solve the heat dissipation problem of MIMO antenna, it is urgent to research a new type of heat dissipation device, so as to improve the heat dissipation efficiency of the antenna, stabilize the working temperature of the antenna, and ensure that the antenna can work stably and efficiently. Safety.

Utility model content

In order to overcome the defects of the prior art, the technical problem solved by the present invention is to provide a MIMO antenna heat dissipation device, which adopts a semiconductor cooling sheet to conduct heat, can solve the heat dissipation problem of the MIMO antenna, reduce the working temperature of the antenna chip, and improve the working efficiency of the chip, and has a structure. Simple, easy to manufacture, long service life, safe and reliable.

In order to achieve the above object, the utility model adopts the following technical solutions to realize:

A MIMO antenna heat dissipation device, comprising a hexagon socket screw, a fan, a sleeve, an aluminum heat dissipation fin, a graphite heat conduction layer, a semiconductor refrigeration sheet, a graphite heat conduction layer II and a base, wherein the base is provided with a base. There are threaded holes matched with hexagon socket screws, and the fan is provided with screw through holes corresponding to the threaded holes on the base; the fan, aluminum heat dissipation fins, graphite heat conduction layer 1, semiconductor refrigeration sheet, graphite heat conduction layer The second is stacked on the base from top to bottom in sequence, the sleeve is supported between the fan and the base, and the hexagon socket head screw passes through the screw through hole on the fan and the sleeve is fastened to the threaded hole on the base.

The fan and the semiconductor refrigerating sheet are replaceable parts, which can be replaced with fans and semiconductor refrigerating sheets of different powers depending on the heat dissipation requirements.

The aluminum heat-dissipating fins, the first graphite heat-conducting layer, the semiconductor refrigerating sheet, and the second graphite heat-conducting layer can be bonded with heat-conducting silicone grease.

The aluminum heat dissipation fins are made of AA6063 aluminum alloy material, and are prepared by aluminum extrusion process.

Further, the arrangement of the antenna chips is a square ring arrangement.

Compared with the prior art, the beneficial effects of the present utility model are:

1) AA6063 aluminum alloy material is selected, and aluminum heat dissipation fins are prepared by aluminum extrusion process, which has low cost and good heat dissipation effect;

2) The use of semiconductor refrigeration chips can conduct heat against the temperature gradient, and has high heat conduction efficiency, and can achieve precise temperature control with negative feedback circuit;

3) The reverse power supply of the semiconductor refrigeration sheet can defrost;

4) The antenna chip is arranged in a square ring, which can significantly reduce the heat concentration in the center;

5) Replace some components according to the requirements under the condition that the overall structure remains unchanged, so as to meet different heat dissipation requirements;

6) Simple structure, convenient processing, long service life, safe and reliable.

Description of drawings

Fig. 1 is the structural principle schematic diagram of the present utility model;

FIG. 2 is a schematic diagram of the arrangement of the antenna chips of the present invention.

In the picture: 1-hex socket head cap screw 2-fan 3-sleeve 4-aluminum heat dissipation fin 5-graphite heat-conducting layer one 6-semiconductor cooling fin 7-graphite heat-conducting layer two 8-antenna chip 9-base

Detailed ways

The specific embodiments of the present utility model will be further described below in conjunction with the accompanying drawings:

As shown in FIGS. 1-2 , a MIMO antenna heat dissipation device involved in the present invention includes a hexagon socket head screw 1, a fan 2, a sleeve 3, an aluminum heat dissipation fin 4, a graphite heat conduction layer 5, and a semiconductor cooling fin. 6. The graphite heat-conducting layer 2 7 and the base 9, the base 9 is provided with threaded holes matching with the socket head cap screws 1, and the fan 2 is provided with screw through holes corresponding to the threaded holes on the base 9; The fan 2, aluminum fins 4, graphite heat conduction layer 1 5, semiconductor refrigeration sheet 6, graphite heat conduction layer 2 7 are stacked and placed on the base 9 from top to bottom in sequence, and the sleeve 3 is supported on the fan 2 and the Between the bases 9, the socket head cap screws 1 pass through the screw through holes on the fan 2 and the sleeve 3 to screw the threaded holes provided on the base 9 to fix the components together.

The fan 2 and the semiconductor refrigerating sheet 6 are replaceable parts, which can be replaced with fans 2 and semiconductor refrigerating sheets 6 of different powers depending on the heat dissipation requirements, so as to meet different heat dissipation needs.

The aluminum heat-dissipating fins 4 , the graphite heat-conducting layer 1 5 , the semiconductor refrigeration sheet 6 , and the graphite heat-conducting layer 2 7 , depending on the surface roughness, determine whether to use heat-conducting silicone grease for bonding.

The aluminum heat dissipation fins 4 are made of AA6063 aluminum alloy material, and are prepared by aluminum extrusion process, which has low cost and good heat dissipation effect.

Further, the antenna chips 8 are arranged in a square ring arrangement (see FIG. 2 ) to reduce heat concentration in the core.

when working:

1) Install the antenna chip 8 between the graphite thermal conductive layer 2 7 and the base 9, and decide whether to use thermal conductive silicone grease to bond according to the surface roughness;

2) The fan 2 and the semiconductor refrigerating sheet 6 are connected with direct current, the two ends of the semiconductor refrigerating sheet 6 will produce a temperature difference, the temperature at the antenna chip 8 is low, and the temperature at the aluminum heat dissipation fin 4 is high, and the heat generated at the antenna chip 8 is dissipated. Conducted to the aluminum heat dissipation fins 4, the convection is accelerated by the fan 2, and the heat is dissipated into the atmosphere more efficiently.

Claims (4)

1. A MIMO antenna heat dissipation device comprises inner hexagon screws, a fan, a sleeve, aluminum heat dissipation fins, a first graphite heat conduction layer, a semiconductor refrigeration sheet, a second graphite heat conduction layer and a base, and is characterized in that the base is provided with threaded holes matched with the inner hexagon screws, and the fan is provided with screw through holes corresponding to the threaded holes in the base; fan, aluminium system heat radiation fins, graphite heat-conducting layer one, semiconductor refrigeration piece, graphite heat-conducting layer two are placed on the base from last stack down in proper order, and the sleeve is propped up and is filled up between fan and base, and socket head cap screw passes screw through-hole and the sleeve screw hole that is equipped with on the base on the fan.

2. The MIMO antenna heat dissipation device of claim 1, wherein the fan and the semiconductor chilling plate are replaceable, and the fan and the semiconductor chilling plate are respectively replaced by fans and semiconductor chilling plates with different powers according to heat dissipation requirements.

3. The MIMO antenna heat sink of claim 1, wherein the aluminum heat sink fins, the first graphite heat conducting layer, the semiconductor cooling fins and the second graphite heat conducting layer are bonded together by thermal grease.

4. The MIMO antenna heat sink of claim 1, wherein the aluminum heat sink fins are made of AA6063 aluminum alloy and are fabricated by aluminum extrusion.

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