CN210778565U - MIMO antenna heat abstractor - Google Patents
MIMO antenna heat abstractor Download PDFInfo
- Publication number
- CN210778565U CN210778565U CN201922171719.2U CN201922171719U CN210778565U CN 210778565 U CN210778565 U CN 210778565U CN 201922171719 U CN201922171719 U CN 201922171719U CN 210778565 U CN210778565 U CN 210778565U
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- fan
- heat
- base
- conducting layer
- mimo antenna
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a MIMO antenna heat abstractor, including hexagon socket head cap screw, fan, sleeve, aluminium system heat radiation fins, graphite heat-conducting layer one, semiconductor refrigeration piece, graphite heat-conducting layer two and base, fan, aluminium system heat radiation fins, graphite heat-conducting layer one, semiconductor refrigeration piece, graphite heat-conducting layer two are placed on the base from last stack extremely down in proper order, and the sleeve is propped up and is linked together with the base fastening in the adoption hexagon socket head cap screw between fan and base. The beneficial effects are as follows: the semiconductor refrigeration sheet is adopted for heat conduction, so that the heat dissipation problem of the MIMO antenna can be solved, the working temperature of an antenna chip is reduced, the working efficiency of the chip is improved, and the MIMO antenna has the characteristics of simple structure, convenience in processing and manufacturing, long service life, safety and reliability.
Description
Technical Field
The utility model relates to an antenna chip heat dissipation technical field especially relates to a MIMO antenna heat abstractor.
Background
At present, with the continuous development of communication technology, the information density is continuously improved, and the power of the mobile base station antenna is also continuously increased. The power boost can lead to the heat productivity of the antenna chip to be increased greatly, and the traditional cooling mode adopting natural wind or a fan cannot meet the heat dissipation requirement of the antenna with higher power. The existing antenna radiator mainly has the following problems:
1) the heat dissipation efficiency is low;
2) the processing difficulty is high, and the service life is short;
3) the use conditions are harsh and the danger is high.
In order to solve the heat dissipation problem of MIMO antenna, need to study a novel heat abstractor urgently to this radiating efficiency who improves the antenna, stabilize antenna operating temperature, guarantee that the antenna can stably, work high-efficiently, the radiator requires processing simply simultaneously, long service life, safety.
SUMMERY OF THE UTILITY MODEL
For overcoming the prior art defect, the utility model provides a technical problem provides a MIMO antenna heat abstractor adopts the semiconductor refrigeration piece heat conduction, can solve the heat dissipation problem of MIMO antenna, reduces antenna chip operating temperature, improves chip work efficiency, has simple structure, and processing preparation is convenient, long service life, safe and reliable characteristics.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a MIMO antenna heat dissipation device comprises inner hexagon screws, a fan, a sleeve, aluminum heat dissipation fins, a first graphite heat conduction layer, a semiconductor refrigeration sheet, a second graphite heat conduction layer and a base, and is characterized in that the base is provided with threaded holes matched with the inner hexagon screws, and the fan is provided with screw through holes corresponding to the threaded holes in the base; fan, aluminium system heat radiation fins, graphite heat-conducting layer one, semiconductor refrigeration piece, graphite heat-conducting layer two are placed on the base from last stack down in proper order, and the sleeve is propped up and is filled up between fan and base, and socket head cap screw passes screw through-hole and the sleeve screw hole that is equipped with on the base on the fan.
The fan and the semiconductor refrigerating piece are replaceable pieces, and the fan and the semiconductor refrigerating piece with different powers can be replaced according to heat dissipation requirements.
The aluminum heat dissipation fins, the graphite heat conduction layer I, the semiconductor refrigeration sheet and the graphite heat conduction layer II can be bonded by adopting heat conduction silicone grease.
The aluminum radiating fin is made of AA6063 type aluminum alloy and is prepared by an aluminum extrusion process.
Further, the antenna chips are arranged in a square ring shape.
Compared with the prior art, the beneficial effects of the utility model are that:
1) the AA6063 type aluminum alloy material is selected, and the aluminum heat dissipation fin is prepared by adopting an aluminum extrusion process, so that the cost is low and the heat dissipation effect is good;
2) the semiconductor refrigerating sheet can conduct heat in a reverse temperature gradient manner, the heat conduction efficiency is high, and accurate temperature control can be realized by matching with the negative feedback circuit;
3) the semiconductor refrigerating sheet is reversely powered to defrost;
4) the antenna chips are arranged in a square ring shape, so that the heat concentration at the central part can be obviously reduced;
5) part of elements are replaced under the condition that the whole structure is not changed according to requirements, so that different heat dissipation requirements are met;
6) simple structure, convenient processing, long service life, safety and reliability.
Drawings
Fig. 1 is a schematic view of the structure principle of the present invention;
fig. 2 is a schematic diagram of the antenna chip arrangement of the present invention.
In the figure: 1-inner hexagon screw 2-fan 3-sleeve 4-aluminium heat radiation fin 5-graphite heat conduction layer one 6-semiconductor refrigeration sheet 7-graphite heat conduction layer two 8-antenna chip 9-base
Detailed Description
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings:
as shown in fig. 1-2, the MIMO antenna heat dissipation device of the present invention includes an inner hexagon screw 1, a fan 2, a sleeve 3, an aluminum heat dissipation fin 4, a graphite heat conduction layer one 5, a semiconductor refrigeration sheet 6, a graphite heat conduction layer two 7 and a base 9, wherein the base 9 is provided with a threaded hole matching with the inner hexagon screw 1, and the fan 2 is provided with a screw through hole corresponding to the threaded hole of the base 9; fan 2, aluminium system heat radiation fins 4, graphite heat-conducting layer 5, semiconductor refrigeration piece 6, graphite heat-conducting layer two 7 are placed on base 9 from last stack down in proper order, and 3 pads on the sleeve are between fan 2 and base 9, and socket head cap screw 1 passes on the fan 2 screw through-hole and the screw hole that the sleeve 3 was screwed up and is equipped with on base 9, fixes each spare part together.
The fan 2 and the semiconductor refrigerating sheet 6 are replaceable pieces, and the fan 2 and the semiconductor refrigerating sheet 6 with different powers can be respectively replaced according to heat dissipation requirements, so that different heat dissipation requirements can be met.
The aluminum heat dissipation fins 4, the graphite heat conduction layer I5, the semiconductor refrigeration sheet 6 and the graphite heat conduction layer II 7 are bonded by adopting heat conduction silicone grease according to the surface roughness condition.
The aluminum radiating fins 4 are made of AA6063 type aluminum alloy and are prepared by an aluminum extrusion process, so that the cost is low and the radiating effect is good.
Further, the antenna chips 8 are arranged in a square ring shape (see fig. 2) to reduce heat concentration in the core.
When in work:
1) the antenna chip 8 is arranged between the second graphite heat conduction layer 7 and the base 9, and whether heat conduction silicone grease bonding is adopted or not can be determined according to the surface roughness condition;
2) the fan 2 and the semiconductor refrigeration piece 6 are electrified with direct current, the temperature difference is generated at the two ends of the semiconductor refrigeration piece 6, the temperature at the antenna chip 8 is low, the temperature at the aluminum heat dissipation fin 4 is high, the heat generated at the antenna chip 8 is conducted to the aluminum heat dissipation fin 4, and the convection is accelerated through the fan 2, so that the heat is more efficiently dissipated into the atmosphere.
Claims (4)
1. A MIMO antenna heat dissipation device comprises inner hexagon screws, a fan, a sleeve, aluminum heat dissipation fins, a first graphite heat conduction layer, a semiconductor refrigeration sheet, a second graphite heat conduction layer and a base, and is characterized in that the base is provided with threaded holes matched with the inner hexagon screws, and the fan is provided with screw through holes corresponding to the threaded holes in the base; fan, aluminium system heat radiation fins, graphite heat-conducting layer one, semiconductor refrigeration piece, graphite heat-conducting layer two are placed on the base from last stack down in proper order, and the sleeve is propped up and is filled up between fan and base, and socket head cap screw passes screw through-hole and the sleeve screw hole that is equipped with on the base on the fan.
2. The MIMO antenna heat dissipation device of claim 1, wherein the fan and the semiconductor chilling plate are replaceable, and the fan and the semiconductor chilling plate are respectively replaced by fans and semiconductor chilling plates with different powers according to heat dissipation requirements.
3. The MIMO antenna heat sink of claim 1, wherein the aluminum heat sink fins, the first graphite heat conducting layer, the semiconductor cooling fins and the second graphite heat conducting layer are bonded together by thermal grease.
4. The MIMO antenna heat sink of claim 1, wherein the aluminum heat sink fins are made of AA6063 aluminum alloy and are fabricated by aluminum extrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922171719.2U CN210778565U (en) | 2019-12-06 | 2019-12-06 | MIMO antenna heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922171719.2U CN210778565U (en) | 2019-12-06 | 2019-12-06 | MIMO antenna heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210778565U true CN210778565U (en) | 2020-06-16 |
Family
ID=71044253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922171719.2U Expired - Fee Related CN210778565U (en) | 2019-12-06 | 2019-12-06 | MIMO antenna heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210778565U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111769349A (en) * | 2020-08-18 | 2020-10-13 | 成都天锐星通科技有限公司 | Array antenna heat dissipation device |
-
2019
- 2019-12-06 CN CN201922171719.2U patent/CN210778565U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111769349A (en) * | 2020-08-18 | 2020-10-13 | 成都天锐星通科技有限公司 | Array antenna heat dissipation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200616 Termination date: 20211206 |
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| CF01 | Termination of patent right due to non-payment of annual fee |