CN210742925U - 一种仿真器接口转接电路板和开发测试系统 - Google Patents
一种仿真器接口转接电路板和开发测试系统 Download PDFInfo
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112084001A (zh) * | 2020-07-22 | 2020-12-15 | 北京杰创永恒科技有限公司 | 基于stm32芯片的仿真器 |
CN114880261A (zh) * | 2022-05-20 | 2022-08-09 | 中国科学院长春光学精密机械与物理研究所 | 一种dsp仿真器接口转接板及接口转换方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112084001A (zh) * | 2020-07-22 | 2020-12-15 | 北京杰创永恒科技有限公司 | 基于stm32芯片的仿真器 |
CN112084001B (zh) * | 2020-07-22 | 2023-05-26 | 北京杰创永恒科技有限公司 | 基于stm32芯片的仿真器 |
CN114880261A (zh) * | 2022-05-20 | 2022-08-09 | 中国科学院长春光学精密机械与物理研究所 | 一种dsp仿真器接口转接板及接口转换方法 |
CN114880261B (zh) * | 2022-05-20 | 2024-02-09 | 中国科学院长春光学精密机械与物理研究所 | 一种dsp仿真器接口转接板及接口转换方法 |
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Effective date of registration: 20201130 Address after: Room 703, 7 / F, building N1, No. 88, Dongchang Road, Suzhou Industrial Park, Suzhou, Jiangsu Province 215008 Patentee after: SUZHOU FURUISI INFORMATION TECHNOLOGY CO.,LTD. Patentee after: HEFEI GEYI INTEGRATED CIRCUIT Co.,Ltd. Patentee after: GIGADEVICE SEMICONDUCTOR(BEIJING) Inc. Address before: 230601 No. 368 Tsinghua Road, Hefei Economic and Technological Development Zone, Anhui Province Patentee before: HEFEI GEYI INTEGRATED CIRCUIT Co.,Ltd. Patentee before: GIGADEVICE SEMICONDUCTOR(BEIJING) Inc. |
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Address after: 215008 room 703, 7 / F, N1 building, 88 Dongchang Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee after: SUZHOU FURUISI INFORMATION TECHNOLOGY CO.,LTD. Patentee after: HEFEI GEYI INTEGRATED CIRCUIT Co.,Ltd. Patentee after: Zhaoyi Innovation Technology Group Co.,Ltd. Address before: 215008 room 703, 7 / F, N1 building, 88 Dongchang Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: SUZHOU FURUISI INFORMATION TECHNOLOGY CO.,LTD. Patentee before: HEFEI GEYI INTEGRATED CIRCUIT Co.,Ltd. Patentee before: GIGADEVICE SEMICONDUCTOR(BEIJING) Inc. |