CN210692571U

CN210692571U - LED packaging adhesive packaging structure

Info

Publication number: CN210692571U
Application number: CN201920863404.1U
Authority: CN
Inventors: 王道正
Original assignee: Nanan Yitong Industrial Product Design Co Ltd
Current assignee: Nanan Yitong Industrial Product Design Co Ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-06-05
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses a LED encapsulation glues packaging structure, including heat sink bottom plate, heat sink bottom plate's upper end surface is provided with the plastic mold, the outside that heat sink bottom plate's upper end surface is close to the plastic mold is provided with the mounting plate, the inboard surface of mounting plate is provided with the latch, be provided with the hot melt adhesive between mounting plate and the plastic mold, heat sink bottom plate's upper end surface is close to center department and is provided with heat sink column, the inboard of plastic mold is provided with silica gel, one side surface of plastic mold is provided with the metal baffle, the one end of metal baffle is provided with the connecting plate, one side surface that the connecting plate is close to the metal baffle is provided with the embedding board. The utility model discloses a packaging structure is glued in LED encapsulation, it is comparatively convenient to disassemble the process, can overhaul inside during the trouble, and external frame can be adjusted in a flexible way in order to adapt to the contact position, brings better use prospect.

Description

LED packaging adhesive packaging structure

Technical Field

The utility model relates to an packaging structure field, in particular to packaging structure is glued in LED encapsulation.

Background

The LED packaging is the packaging of a light-emitting chip, which is greatly different from the packaging of an integrated circuit, the packaging of the LED is required to protect a lamp wick and also be transparent, and the LED is generally packaged by filling silica gel in a plastic mold; the existing LED packaging adhesive packaging structure has certain defects when in use, firstly, the disassembly process is inconvenient, the whole body can only be scrapped during fault, the resources are wasted, secondly, the position is usually fixed when the lamp panel is externally connected, the lamp panel can not be matched with the connection of different junction points, the external frame can not be flexibly adjusted, and the inconvenience is brought.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a LED package adhesive package structure, which can effectively solve the problems of the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a LED encapsulation glues packaging structure, includes heat sink bottom plate, heat sink bottom plate's upper end surface is provided with the plastic mold, the outside that heat sink bottom plate's upper end surface is close to the plastic mold is provided with the mounting plate, the inboard surface of mounting plate is provided with the latch, be provided with the hot melt adhesive between mounting plate and the plastic mold, heat sink bottom plate's upper end surface is close to center department and is provided with heat sink, the inboard of plastic mold is provided with silica gel, one side surface of plastic mold is provided with the metal baffle, the one end of metal baffle is provided with the connecting plate, one side surface that the connecting plate is close to the metal baffle is provided with the embedding board, one side surface correspondence of metal baffle is embedded board department and is.

Preferably, the heat sink column is fixedly connected with the heat sink bottom plate, a chip is arranged on the outer surface of the upper end of the heat sink column, a fluorescent layer is arranged at the upper end of the heat sink column, the fluorescent layer and the chip are fixedly connected with the heat sink column, a metal wire is arranged between the metal guide plate and the chip, and the chip is electrically connected with the metal guide plate through the metal wire.

Preferably, the fastening piece is fixedly connected with the heat sink bottom plate, the fastening piece is annularly sleeved on the outer side of the plastic mold, the latch and the fastening piece are fixedly connected, the number of the latch is a plurality of groups, and the latch is arranged in an annular array.

Preferably, the outer surface of the plastic mold is provided with a bayonet at a position corresponding to the latch, the latch is embedded at the inner side of the bayonet, the latch is movably connected with the bayonet, the hot melt adhesive is filled in a gap formed between the fastening sheet and the plastic mold, and the fastening sheet is fixedly connected with the plastic mold through the hot melt adhesive.

Preferably, the outer surface of the inner side of the plastic mold is provided with a transverse plastic plate close to the outer surface of the upper end of the heat sink bottom plate, the transverse plastic plate is fixedly connected with the plastic mold, and the transverse plastic plate and the plastic mold are movably connected with the heat sink bottom plate.

Preferably, the one end of connecting plate is provided with external frame, be fixed connection between external frame and the connecting plate, be fixed connection between connecting plate and the embedding board, the upper end surface of embedding board and metal baffle runs through and is provided with the pivot, be fixed connection between pivot and the embedding board, through pivot swing joint between embedding board and the expansion gap.

Compared with the prior art, the utility model discloses following beneficial effect has: the LED packaging adhesive packaging structure can gradually pick up the hot melt adhesive by means of a tool with a small top end when a fault occurs through the matching of the fastening piece, the latch and the hot melt adhesive, then a certain upward external force is applied to the plastic mold, the fastening piece is stressed and deformed to further separate the latch from the inner side of the bayonet, the separation between the plastic mold and the heat sink bottom plate is completed, the interior can be further overhauled, the position of the plastic mold is restored during splicing, the hot melt adhesive is re-injected into the gap between the fastening piece and the plastic mold, the disassembly and maintenance are convenient, resources are saved, through the arrangement of the embedded plate, the movable opening and the rotating shaft, when the connecting plate corresponds to different contact points, the connecting plate rotates along the rotating shaft, the embedded plate rotates on the inner side of the movable opening to adjust the position of the external frame to adapt to different contact points, the external frame can be electrically connected with the contact points later, and the, the flexible connection of the external connection frame is facilitated, and the using effect of the whole LED packaging adhesive packaging structure is better than that of a traditional mode.

Drawings

Fig. 1 is a schematic view of an overall structure of an LED package structure of the present invention;

fig. 2 is a front sectional view of an LED package adhesive package structure of the present invention;

fig. 3 is an enlarged view of a in fig. 2 of an LED package adhesive package structure of the present invention;

fig. 4 is an enlarged view of B in fig. 2 of the LED package adhesive package structure of the present invention.

In the figure: 1. a heat sink base plate; 2. a heat sink column; 3. a chip; 4. a fluorescent layer; 5. plastic molding; 6. transversely connecting plastic plates; 7. a fastening tab; 8. clamping teeth; 9. hot melt adhesive; 10. silica gel; 11. a metal guide plate; 12. a metal wire; 13. a connecting plate; 14. a built-in plate; 15. a movable opening; 16. a rotating shaft; 17. is externally connected with a frame.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-4, an LED packaging adhesive packaging structure includes a heat sink base plate 1, a plastic mold 5 is disposed on an upper end outer surface of the heat sink base plate 1, a fastening tab 7 is disposed on an outer side of the upper end outer surface of the heat sink base plate 1, which is close to the plastic mold 5, a latch 8 is disposed on an inner side outer surface of the fastening tab 7, a hot melt adhesive 9 is disposed between the fastening tab 7 and the plastic mold 5, a heat sink column 2 is disposed on an upper end outer surface of the heat sink base plate 1, which is close to a center, a silica gel 10 is disposed on an inner side of the plastic mold 5, a metal guide plate 11 is disposed on an outer surface of one side of the plastic mold 5, a connecting plate 13 is disposed on one end of the metal guide plate 11, an embedded plate 14 is disposed on.

The heat sink column 2 is fixedly connected with the heat sink bottom plate 1 to ensure the stability of the heat sink column 2, the chip 3 is arranged on the outer surface of the upper end of the heat sink column 2 and plays a role of emitting light after being electrified, the fluorescent layer 4 is arranged at the upper end of the heat sink column 2 and is matched with the chip 3 to emit light, the fluorescent layer 4 and the chip 3 are fixedly connected with the heat sink column 2 to ensure the stability of the chip 3, a metal wire 12 is arranged between the metal guide plate 11 and the chip 3 for the communication of a circuit, the chip 3 is electrically connected with the metal guide plate 11 through the metal wire 12, and the model of the chip 3 is BP 2808B; the fastening pieces 7 are fixedly connected with the heat sink bottom plate 1 to ensure the stability of the fastening pieces 7, the heat sink bottom plate 1 accelerates heat dissipation, the fastening pieces 7 are annularly sleeved on the outer side of the plastic mold 5, the latch 8 is fixedly connected with the fastening pieces 7, the number of the latch 8 is a plurality of groups, and the latch 8 is arranged in an annular array to ensure the stable connection with the plastic mold 5 everywhere; the outer surface of the plastic mold 5 is provided with bayonets at positions corresponding to the bayonet 8 so as to ensure that the fastening plate 7 and the plastic mold 5 are stable by matching with the bayonet 8, the bayonet 8 is embedded at the inner side of the bayonet, the bayonet 8 is movably connected with the bayonet, the hot melt adhesive 9 is filled in a gap formed between the fastening plate 7 and the plastic mold 5, the hot melt adhesive 9 plays a role in further reinforcing and is easy to clean and drop, and the fastening plate 7 and the plastic mold 5 are fixedly connected through the hot melt adhesive 9; the outer surface of the inner side of the plastic mould 5, which is close to the outer surface of the upper end of the heat sink bottom plate 1, is provided with a transverse plastic plate 6, so that the integral stability of the plastic mould 5 is improved, the transverse plastic plate 6 is fixedly connected with the plastic mould 5, and the transverse plastic plate 6 and the plastic mould 5 are movably connected with the heat sink bottom plate 1, so that the disassembly is convenient; one end of the connecting plate 13 is provided with an external connection frame 17, which is convenient for connection with an external contact, the external connection frame 17 is fixedly connected with the connecting plate 13, the connecting plate 13 is fixedly connected with the embedded plate 14, it is ensured that the connecting plate 13 can drive the embedded plate 14 to rotate, the outer surfaces of the upper ends of the embedded plate 14 and the metal guide plate 11 are provided with a rotating shaft 16 in a penetrating way, the rotating shaft 16 is fixedly connected with the embedded plate 14, the embedded plate 14 is movably connected with the movable port 15 through the rotating shaft 16, and it is ensured that the embedded plate 14 can rotate along the rotating shaft 16.

It should be noted that, the utility model relates to a LED packaging adhesive packaging structure, when the trouble appears in the use, the user can gradually pick out the hot melt adhesive 9 with the help of the tool with a tiny top end, then apply certain upward external force to the plastic mold 5, make the fastening sheet 7 deform under stress and further make the latch 8 break away from the bayonet inside, accomplish the separation between the plastic mold 5 and the heat sink bottom plate 1, and then can overhaul the inside, recover the position of the plastic mold 5 during the splicing, and then squeeze in the hot melt adhesive 9 again in the clearance between the fastening sheet 7 and the plastic mold 5, which is convenient for disassembling and maintaining, and saves resources, when corresponding to different joints, the user rotates the connecting plate 13 along the rotating shaft 16, and simultaneously the embedding plate 14 rotates at the inner side of the movable opening 15, so as to adjust the position of the external frame 17, so as to adapt to different joints, then can electrically connect the external frame 17 with the joints, more convenient, is beneficial to the flexible connection of the external frame 17 and is more practical.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a LED encapsulation glues packaging structure, includes heat sink bottom plate (1), its characterized in that: the outer surface of the upper end of the heat sink bottom plate (1) is provided with a plastic mold (5), the outer surface of the upper end of the heat sink bottom plate (1) close to the outer side of the plastic mold (5) is provided with a fastening piece (7), the outer surface of the inner side of the fastening piece (7) is provided with a latch (8), a hot melt adhesive (9) is arranged between the fastening piece (7) and the plastic mould (5), a heat sink column (2) is arranged on the outer surface of the upper end of the heat sink bottom plate (1) near the center, the inner side of the plastic mould (5) is provided with a silica gel (10), the outer surface of one side of the plastic mould (5) is provided with a metal guide plate (11), one end of the metal guide plate (11) is provided with a connecting plate (13), the outer surface of one side of the connecting plate (13) close to the metal guide plate (11) is provided with an embedded plate (14), the outer surface of one side of the metal guide plate (11) is provided with a movable opening (15) corresponding to the embedded plate (14).

2. The LED package adhesive package structure according to claim 1, wherein: be fixed connection between heat sink column (2) and heat sink bottom plate (1), the upper end surface of heat sink column (2) is provided with chip (3), the upper end of heat sink column (2) is provided with fluorescent layer (4), fluorescent layer (4) and chip (3) all with heat sink column (2) between fixed connection, be provided with between metal guide (11) and chip (3) wire (12), through wire (12) electric connection between chip (3) and metal guide (11).

3. The LED package adhesive package structure according to claim 1, wherein: be fixed connection between fastening tab (7) and heat sink bottom plate (1), fastening tab (7) are cyclic annular cover in the outside of plastic mold (5), be fixed connection between latch (8) and fastening tab (7), the quantity of latch (8) is a plurality of groups, latch (8) are annular array and arrange.

4. The LED package adhesive package structure according to claim 1, wherein: the outer surface of the plastic die (5) is provided with bayonets corresponding to the positions of the latch teeth (8), the latch teeth (8) are embedded in the inner sides of the bayonet sockets, the latch teeth (8) are movably connected with the bayonet sockets, hot melt adhesive (9) is filled in gaps formed between the fastening pieces (7) and the plastic die (5), and the fastening pieces (7) are fixedly connected with the plastic die (5) through the hot melt adhesive (9).

5. The LED package adhesive package structure according to claim 1, wherein: the heat sink is characterized in that a transverse plastic plate (6) is arranged on the outer surface of the upper end, close to the heat sink bottom plate (1), of the inner side of the plastic mold (5), the transverse plastic plate (6) is fixedly connected with the plastic mold (5), and the transverse plastic plate (6) and the plastic mold (5) are movably connected with the heat sink bottom plate (1).

6. The LED package adhesive package structure according to claim 1, wherein: the one end of connecting plate (13) is provided with external frame (17), be fixed connection between external frame (17) and connecting plate (13), be fixed connection between connecting plate (13) and embedded plate (14), the upper end surface of embedded plate (14) and metal baffle (11) runs through and is provided with pivot (16), be fixed connection between pivot (16) and embedded plate (14), through pivot (16) swing joint between embedded plate (14) and movable mouthful (15).