CN201875473U

CN201875473U - LED (light-emitting diode) lamp without lens

Info

Publication number: CN201875473U
Application number: CN2010205700854U
Authority: CN
Inventors: 钱丽君; 朱靖轩; 郭伟玲; 崔德胜
Original assignee: SHANGHAI HENGSHI PHOTOELECTRIC TECHNOLOGY Co Ltd
Current assignee: Qinzhou Shenghe Electronics Technology Co., Ltd.
Priority date: 2010-10-13
Filing date: 2010-10-13
Publication date: 2011-06-22
Anticipated expiration: 2020-10-13

Abstract

The utility model relates to an LED (light-emitting diode) lamp, in particular to an LED lamp without a lens, which is manufactured by an encapsulation method of the LED without the lens. The LED lamp has high efficiency of LED lights extraction, good head dissipation and more stable performance and belongs to the LED field. The LED lamp without the lens comprises an LED support, a chip and a silicone lens, wherein the LED support is provided with a circular arc cavity; the bottom of the circular arc cavity is provided with a base; the LED support comprises a first electrode and a second electrode; the chip is fixed on the base in the cavity of the support; the positive pole and the negative pole of the chip are respectively connected with the first electrode and the second electrode on the support; and the silicone lens which is made of transparent silicone is covered on the circular arc cavity of the LED support. The LED lamp without the lens has high light quantity, high light efficiency, long service life and excellent heat dissipation capacity.

Description

A kind of lensless LED lamp

Technical field

The utility model relates to a kind of LED lamp, relates in particular to the lensless LED lamp that a kind of lensless LED method for packing is made, its LED light extraction efficiency height, and thermal diffusivity is good, and performance is more stable, belongs to the LED field.

Background technology

LED is commonly called as light emitting diode, as novel solid state light emitter of 21 century, to have energy-conservation, long-life, anti-electric shock, antidetonation, complanation, digitlization, not have stroboscopic, advantage such as no infrared and ultra-violet radiation, photochromism are pure, directionality, designability are strong, particularly under equal brightness of illumination, the power consumption of semiconductor lighting only is 1/8 of incandescent lamp, 1/2 of fluorescent lamp.Because it is little that semiconductor lighting has a volume, plasticity is very strong, can design suitable light fixture as required, be a kind of high benefit, green light source cheaply, application prospect is extensive, and white light LEDs is described as the light source of 21 century most worthy, will cause an illumination revolution.

Traditional metallo-plastic stent-type power-type LED (being commonly called as TOP LED), all be after solid crystalline substance and bonding wire, to cover optical lens, fill casting glue then, become finished product through baking, optical lens is bonded together, LED after this method encapsulation is very serious in the loss of optical lens interior lights, because the refractive index of casting glue and lens is different, so light will antireflection part light at the interface of casting glue and optical lens, the refractive index of optical lens is very big with the air difference again, also can antireflection part light at the interface of optical lens and air, the light that led chip sent just has a big chunk to be lost in device inside like this, makes LED get light extraction efficiency and reduces.And the material of optical lens mainly is an epoxy resin, and the thermal conductivity of epoxy resin is very poor, so the heat that LED gave out when working long hours can not dissipate timely, the junction temperature of LED can raise, and has influenced light efficiency, luminous flux and service life.

In addition: owing to add sticking optical lens, the secondary operation operation is many, influence volume production, and because of optical lens is bondingly to get on, when crossing high temperature (as the mistake Reflow Soldering), optical lens comes off easily.

Summary of the invention

The purpose of this utility model is the lensless LED lamp that a kind of luminous flux height, light efficiency height, long service life is provided and has good heat-sinking capability.

For achieving the above object, the utility model is achieved in that a kind of lensless LED lamp, and it comprises led support, chip, and this led support has a circular arc cavity, is provided with a pedestal in the cavity bottom, and described this led support comprises first electrode and second electrode; Described chip is fixed on the pedestal in the support cavity, and the both positive and negative polarity of chip links to each other with first and second electrodes on the support respectively; It is characterized in that: also be coated with the silica-gel lens film on the circular arc cavity on the described led support, size adapts with the outer rim size of circular arc cavity.

Described silica-gel lens film can be transparent resin.

For making above-mentioned lensless LED lamp, what it adopted is the method for packing of no lens LED, and described method for packing is as follows:

1) clean led support: a circular arc cavity is arranged on this led support, be provided with a pedestal in the cavity bottom, the interior edge of circular arc cavity is provided with two earflaps, and described this led support comprises first electrode and second electrode; Led support is dehumidified and cleans;

2) solid brilliant: with led chip with elargol on the pedestal in the led support cavity, baking is fixing;

3) bonding wire: the both positive and negative polarity of led chip is linked to each other with first and second electrodes on the led support respectively;

4) injecting glue: optical lens is closed circular arc cavity in led support, the interior round edge of lens outer rim place incision support, two protuberances of lens are corresponding to two earflaps of circular arc cavity, and described two protuberances are provided with hole for injecting glue; The syringe of point gum machine injects the transparent silica gel of equivalent to going into the hole for injecting glue on the lens;

5) baking: will inject led support behind the silica gel and put into baking oven and toast, described baking temperature is 150 ℃;

6) peel off: lens are separated with led support:

7) annotate fluid sealant: along led support circular arc cavity marginal point one circle casting glue;

8) secondary baking: put into the baking oven baking, described baking temperature is 150 ℃.

The described solid brilliant glue that uses is elargol, and led chip needs through baking under 150 ℃ after on the led support.

The utility model provides a kind of lensless LED lamp, and purpose is as much as possible the transmitting of luminous energy that led chip is sent, and silica-gel lens LED is the light extraction efficiency height not only, and thermal diffusivity is better, makes the performance of LED more stable, has prolonged the service life of LED.

Description of drawings

Fig. 1 is a lensless LED structural representation of the present utility model;

Fig. 2 is a led support structural representation of the present utility model;

Fig. 3 closes view for lens mould of the present utility model;

Fig. 4 is the schematic diagram after lens of the present utility model are peeled off;

Fig. 5 is a lensless LED outside drawing of the present utility model.

The specific embodiment

Below in conjunction with accompanying drawing, the utility model is described further:

Referring to Fig. 1 to Fig. 5 lensless LED lamp of the present utility model, it comprises that led support 1, chip 2 and silica-gel lens film 4 constitute, this led support 1 has a circular arc cavity 11, is provided with a pedestal 12 in cavity 11 bottoms, and described this led support 1 comprises first electrode 15 and second electrode 16; Described chip 2 is fixed on the pedestal 12 in the support cavity 11, and the both positive and negative polarity of chip 2 links to each other with first and second electrodes on the support respectively; It is characterized in that: be coated with silica-gel lens film 4 on the circular arc cavity 11 on the described led support 1, silica-gel lens film 4 is made by transparent silica gel.

The utility model is lensless LED lamp, and it is as follows that it makes the method for packing that is adopted:

A) clean led support: a circular arc cavity 11 is arranged on this led support 1, be provided with a pedestal 12 in cavity 11 bottoms, the interior of circular arc cavity 11 is provided with two earflaps 14 along 13, and described this support comprises first electrode 15 and second electrode 16, referring to Fig. 2; At first led support is carried out dehumidification treatments and plasma cleaning;

B) solid brilliant: led chip 2 usefulness elargol on the pedestal 12 in the support cavity 11, are then put into baking box and toasted, make led chip 2 be fixed in pedestal 12, described baking temperature is 150 ℃;

C) bonding wire: the both positive and negative polarity of led chip 2 on the pedestal 12 is linked to each other with second electrode, the 16 interior pile crowns that are connected respectively at first electrode 15 on the support;

D) injecting glue: lens 3 are closed circular arc cavity 11 in led support 1, and the interior circle of lens 3 outer rim places incision support is along 13, and two protuberances 31 of lens 3 are corresponding to two earflaps 14 of circular arc cavity 11, and described two protuberances are provided with hole for injecting glue 32; The syringe of point gum machine is illustrated in 3 to going into the hole for injecting glue 32 on the lens 3, injects the transparent silica gel of equivalent;

E) baking: will inject led support 1 behind the silica gel and enter in the baking oven and toast, and make the transparent silica gel hardened forming, described baking temperature is 150 ℃;

F) peel off: cool off after the moulding to be baked, lens 3 are separated with led support 1, described transparent silica gel has just formed a Shore hardness and has reached silica-gel lens film 4 more than 75 degree, referring to Fig. 4.

G) annotate fluid sealant: along led support 1 circular arc cavity 11 marginal points one circle casting glue, its casting glue connects in the electrode of its support 1 and has formed a sealant 41 on the pile crown, prevents contacting of the electrode and the external world referring to Fig. 5, can make the work of LED lamp more stable;

H) secondary baking: have the LED of casting glue to put into baking oven once more point and toast, described baking temperature is 150 ℃.

In order to make the lens 3 after the baking be convenient to separate with silica gel, described lens 3 have been done demoulding processing at inner concave, and the silica gel after lens and the baking is separated easily.

Described silica-gel lens edge is provided with a flange 41.

Compare with traditional LED method for packing that is equipped with lens, the method for packing of lensless LED of the present utility model, because of adopting ordinary lens 3 as the sealing mould, packaged silica-gel lens film 4 is good with support 1 adhesive effect, because of the inner concave that adopts ordinary lens 3 makes transparent silica gel form a silica-gel lens, both LED had been carried out effective encapsulation, and because formed silica-gel lens volume is little, the luminous energy that makes led chip send is as much as possible to transmit, luminous efficiency and the luminous flux of LED have been improved, thermal diffusivity is better, make the junction temperature of the chip of LED be in lower temperature range all the time, cause the performance of LED more stable, prolonged the service life of LED greatly.

Lensless LED method for packing of the present utility model is applicable to the encapsulation of all power LEDs, can reduce production costs significantly in large-scale production.

The above is preferred embodiment of the present utility model only, is not to be used for limiting practical range of the present utility model; Both all equivalents of being done according to claim scope of the present utility model are protection domain of the present utility model and cover.

Claims

1. lensless LED lamp, it comprises led support, chip, and this led support has a circular arc cavity, is provided with a pedestal in the cavity bottom, and described this led support comprises first electrode and second electrode; Described chip is fixed on the pedestal in the support cavity, and the both positive and negative polarity of chip links to each other with first and second electrodes on the support respectively; It is characterized in that: also be coated with the silica-gel lens film on the circular arc cavity on the described led support, size adapts with the outer rim size of circular arc cavity.

2. a kind of lensless LED lamp according to claim 1, it is characterized in that: described silica-gel lens film can be transparent resin.