CN102064241A - Lens-free LED lamp and encapsulation method thereof - Google Patents
Lens-free LED lamp and encapsulation method thereof Download PDFInfo
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- CN102064241A CN102064241A CN2010105156770A CN201010515677A CN102064241A CN 102064241 A CN102064241 A CN 102064241A CN 2010105156770 A CN2010105156770 A CN 2010105156770A CN 201010515677 A CN201010515677 A CN 201010515677A CN 102064241 A CN102064241 A CN 102064241A
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Abstract
The invention relates to an encapsulation method for a molded light emitting diode (LED) lens die, and aims to provide an encapsulation method for a silica gel lens LED. In order to fulfill the purposes, the encapsulation method for the lens-free LED comprises the following steps of: dehumidifying and cleaning an LED bracket; fixing an LED chip on a pedestal in the cavity of the LED bracket by using silver glue, baking and fixing; connecting the anode and the cathode of the LED chip and the first and second electrodes on the LED bracket respectively; combining a lens on the LED bracket, injecting equivalent transparent silica gel into the cavity of the lens in a mode that a needle cylinder of a glue dispenser is aligned with glue injection holes on two protruded parts of the lens, and putting the lens into a 150 DEG C oven for baking and molding; separating the lens and the LED bracket; and injecting sealant and baking to form a silica gel lens on the bracket. The silica gel lens has small volume so that the light emitted by the LED chip is transmitted as much as possible, the light emitting efficiency and the light flux of the LED are improved, the LED chip has better heat dissipation performance and more stable performance, and the service life of the LED chip is prolonged.
Description
Technical field
The present invention relates to a kind of LED method for packing, relate in particular to a kind of method for packing of LED lens mold forming, its LED light extraction efficiency height, thermal diffusivity is good, and performance is more stable, belongs to the LED encapsulation field.
The invention still further relates to a kind of LED lamp, particularly the LED lamp of silica-gel lens.
Background technology
LED is commonly called as light-emitting diode, as novel solid state light emitter of 21 century, to have energy-conservation, long-life, anti-electric shock, antidetonation, complanation, digitlization, not have stroboscopic, advantage such as no infrared and ultra-violet radiation, photochromism are pure, directivity, designability are strong, particularly under equal brightness of illumination, the power consumption of semiconductor lighting only is 1/8 of incandescent lamp, 1/2 of fluorescent lamp.Because it is little that semiconductor lighting has a volume, plasticity is very strong, can design suitable light fixture as required, be a kind of high benefit, green light source cheaply, application prospect is extensive, and white light LEDs is described as the light source of 21 century most worthy, will cause an illumination revolution.
Traditional metallo-plastic stent-type power-type LED (being commonly called as TOP LED), all be after solid crystalline substance and bonding wire, to cover optical lens, fill casting glue then, become finished product through baking, optical lens is bonded together, LED after this method encapsulation is very serious in the loss of optical lens interior lights, because the refractive index of casting glue and lens is different, so light will antireflection part light at the interface of casting glue and optical lens, the refractive index of optical lens is very big with the air difference again, also can antireflection part light at the interface of optical lens and air, the light that led chip sent just has a big chunk to be lost in device inside like this, makes LED get light extraction efficiency and reduces.And the material of optical lens mainly is an epoxy resin, and the thermal conductivity of epoxy resin is very poor, so the heat that LED gave out when working long hours can not dissipate timely, the junction temperature of LED can raise, and has influenced light efficiency, luminous flux and useful life.
In addition: owing to add sticking optical lens, the secondary operation operation is many, influence volume production, and because of optical lens is bondingly to get on, when crossing high temperature (as the mistake Reflow Soldering), optical lens comes off easily.
Summary of the invention
The object of the present invention is to provide a kind of luminous flux height, light efficiency height, long service life and have the method for packing of the silica-gel lens LED of good heat-sinking capability.
For achieving the above object, technical solution of the present invention is: a kind of method for packing that does not have lens LED is characterized in that: described method for packing is as follows:
1) clean led support: a circular arc cavity is arranged on this led support, be provided with a pedestal in the cavity bottom, the interior edge of circular arc cavity is provided with two earflaps, and described this led support comprises first electrode and second electrode; Led support is dehumidified and cleans;
2) solid brilliant: with led chip with elargol on the pedestal in the led support cavity, baking is fixing;
3) bonding wire: the both positive and negative polarity of led chip is linked to each other with first and second electrodes on the led support respectively;
4) injecting glue: optical lens is closed circular arc cavity in led support, the interior round edge of lens outer rim place incision support, two protuberances of lens are corresponding to two earflaps of circular arc cavity, and described two protuberances are provided with hole for injecting glue; The syringe of point gum machine injects the transparent silica gel of equivalent to going into the hole for injecting glue on the lens;
5) baking: will inject led support behind the silica gel and put into baking oven and toast, described baking temperature is 150 ℃;
6) peel off: lens are separated with led support:
7) annotate fluid sealant: along led support circular arc cavity marginal point one circle casting glue;
8) secondary baking: put into the baking oven baking, described baking temperature is 150 ℃.
The described solid brilliant glue that uses is elargol, and led chip needs through baking under 150 ℃ after on the led support.
Described lens inner concave is handled through the easy demoulding, and the silica gel after lens and the baking is very easily separated.
Described silica gel can be transparent resin, and described silica gel baking back Shore hardness is more than 75 degree.
Second goal of the invention of the present invention: a kind of LED lamp of silica-gel lens is provided, and not only light extraction efficiency height, and thermal diffusivity is better, makes the performance of LED more stable, has prolonged the useful life of LED.
The lensless LED that described a kind of lensless LED method for packing is made, it comprises led support, chip, on the pedestal in the support cavity, the both positive and negative polarity of chip links to each other with first and second electrodes on the led support respectively described chip with elargol; It is characterized in that: also be provided with the silica-gel lens film on cavity, size adapts with the outer rim size of cavity.
Described silica-gel lens film is to be made by transparent silica gel.
Described silica-gel lens edge is provided with a flange.
The invention provides a kind of lensless LED method for packing, purpose is as much as possible the transmitting of luminous energy that led chip is sent, and silica-gel lens LED is the light extraction efficiency height not only, and thermal diffusivity is better, make the performance of LED more stable, prolonged the useful life of LED.
Description of drawings
Fig. 1 is a lensless LED structural representation of the present invention.
Fig. 2 is a led support structural representation of the present invention.
Fig. 3 closes view for lens mould of the present invention.
Fig. 4 is the schematic diagram after lens of the present invention are peeled off.
Fig. 5 is a lensless LED outside drawing of the present invention.
Specific implementation method
Below in conjunction with accompanying drawing, the present invention will be further described:
As follows referring to Fig. 1 to Fig. 5 lensless LED method for packing of the present invention:
A) clean led support: a circular arc cavity 11 is arranged on this led support 1, be provided with a pedestal 12 in cavity 11 bottoms, the interior of circular arc cavity 11 is provided with two earflaps 14 along 13, and described this support comprises first electrode 15 and second electrode 16, referring to Fig. 2; At first led support is carried out dehumidification treatments and plasma cleaning;
B) solid brilliant: led chip 2 usefulness elargol on the pedestal 12 in the support cavity 11, are then put into baking box and toasted, make led chip 2 be fixed in pedestal 12, described baking temperature is 150 ℃;
C) bonding wire: the both positive and negative polarity of led chip 2 on the pedestal 12 is linked to each other with second electrode, the 16 interior pile crowns that are connected respectively at first electrode 15 on the support;
D) injecting glue: lens 3 are closed circular arc cavity 11 in led support 1, and the interior circle of lens 3 outer rim places incision support is along 13, and two protuberances 31 of lens 3 are corresponding to two earflaps 14 of circular arc cavity 11, and described two protuberances are provided with hole for injecting glue 32; The syringe of point gum machine is illustrated in 3 to going into the hole for injecting glue 32 on the lens 3, injects the transparent silica gel of equivalent;
E) baking: will inject led support 1 behind the silica gel and enter in the baking oven and toast, and make the transparent silica gel hardened forming, described baking temperature is 150 ℃;
F) peel off: cool off after the moulding to be baked, lens 3 are separated with led support 1, described transparent silica gel has just formed a Shore hardness and has reached silica-gel lens film 4 more than 75 degree, referring to Fig. 4.
G) annotate fluid sealant: along led support 1 circular arc cavity 11 marginal points one circle casting glue, its casting glue connects in the electrode of its support 1 and has formed a sealant 41 on the pile crown, prevents contacting of the electrode and the external world referring to Fig. 5, can make the work of LED lamp more stable;
H) secondary baking: have the LED of casting glue to put into baking oven once more point and toast, described baking temperature is 150 ℃.
In order to make the lens 3 after the baking be convenient to separate with silica gel, described lens 3 have been done demoulding processing at inner concave, and the silica gel after lens and the baking is separated easily.
Described silica-gel lens edge is provided with a flange 41.
A kind of lensless LED lamp that method for packing of the present invention is made, it comprises led support 1, led chip 2 and silica-gel lens film 4, described led chip 2 usefulness elargol are fixed on the pedestal 12 in support 1 cavity 11, the both positive and negative polarity of led chip 2 respectively with support 1 on first electrode 15 link to each other with second electrode 16; It is characterized in that: described silica-gel lens film 4 is once made by transparent silica gel.
Compare with traditional LED method for packing that is equipped with lens, the method for packing of lensless LED of the present invention, because of adopting ordinary lens 3 as the sealing mould, packaged silica-gel lens film 4 is good with support 1 adhesive effect, because of the inner concave that adopts ordinary lens 3 makes transparent silica gel form a silica-gel lens, both LED had been carried out effective encapsulation, and because formed silica-gel lens volume is little, the luminous energy that makes led chip send is as much as possible to transmit, improved luminous efficiency and the luminous flux of LED, thermal diffusivity is better, makes the junction temperature of the chip of LED be in lower temperature range all the time, cause the performance of LED more stable, prolonged the useful life of LED greatly.
Lensless LED method for packing of the present invention is applicable to the encapsulation of all power LEDs, can reduce production costs significantly in large-scale production.
The above is preferred embodiment of the present invention only, is not to be used for limiting practical range of the present invention; Both all equivalents of being done according to claim scope of the present invention are protection scope of the present invention and cover.
Claims (7)
1. lensless LED method for packing, it is characterized in that: described method for packing is as follows:
1) clean led support: this led support has a circular arc cavity, is provided with a pedestal in the cavity bottom, and the interior edge of circular arc cavity is provided with two earflaps, and described this support comprises first electrode and second electrode; Led support is dehumidified and cleans;
2) solid brilliant: with led chip with elargol on the pedestal in the led support cavity, baking is fixing;
3) bonding wire: the both positive and negative polarity of led chip is linked to each other with first and second electrodes on the led support respectively;
4) injecting glue: lens are closed circular arc cavity in led support, the interior round edge of lens outer rim place incision support, two protuberances of lens are corresponding to two earflaps of circular arc cavity, and described two protuberances are provided with hole for injecting glue; The syringe of point gum machine injects the transparent silica gel of equivalent to going into the hole for injecting glue on the lens;
5) baking: will inject led support behind the silica gel and put into baking oven and toast, described baking temperature is 150 ℃;
6) peel off: lens are separated with led support;
7) annotate fluid sealant: along led support circular arc cavity marginal point one circle casting glue;
8) secondary baking: put into the baking oven baking, described baking temperature is 150 ℃;
2. the method for packing of a kind of lensless LED according to claim 1 is characterized in that: Gu the brilliant glue that uses is elargol, need through toasting down at 150 ℃ after led chip schedules on the support.
3. a kind of lensless LED method for packing according to claim 1 is characterized in that: described lens inner concave is handled through the easy demoulding, and the silica gel after lens and the baking is very easily separated.
4. a kind of lensless LED method for packing according to claim 1, it is characterized in that: described silica gel can be transparent resin, and described silica gel baking back Shore hardness is more than 75 degree.
5. the lensless LED lamp that a kind of lensless LED method for packing according to claim 1 is made, it comprises led support, chip, described chip is with on the pedestal of elargol in the support cavity, and the both positive and negative polarity of chip links to each other with first and second electrodes on the support respectively; It is characterized in that: also be provided with the silica-gel lens film on cavity, size adapts with the outer rim size of cavity.
6. a kind of lensless LED lamp according to claim 5, it is characterized in that: described silica-gel lens film is to be made by transparent silica gel.
7. a kind of lensless LED lamp according to claim 5, it is characterized in that: described silica-gel lens film edge is provided with flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2010105156770A CN102064241A (en) | 2010-10-13 | 2010-10-13 | Lens-free LED lamp and encapsulation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105156770A CN102064241A (en) | 2010-10-13 | 2010-10-13 | Lens-free LED lamp and encapsulation method thereof |
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| CN102064241A true CN102064241A (en) | 2011-05-18 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103131190A (en) * | 2013-02-05 | 2013-06-05 | 广州市爱易迪新材料科技有限公司 | Double-component self-molding lens silica gel for light-emitting diode (LED) package and package process of double-component self-molding lens silica gel |
| CN106251784A (en) * | 2016-08-25 | 2016-12-21 | 广东信达光电科技有限公司 | Production method of LED display screen module |
| CN108160422A (en) * | 2017-12-28 | 2018-06-15 | 旭宇光电（深圳）股份有限公司 | High-power LED lens glue injection method |
| CN112838155A (en) * | 2021-02-26 | 2021-05-25 | 木林森股份有限公司 | LED lamp bead support with wide irradiation range and manufacturing process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101109823A (en) * | 2007-07-18 | 2008-01-23 | 鹤山丽得电子实业有限公司 | LED lens |
| CN101299447A (en) * | 2007-09-29 | 2008-11-05 | 鹤山丽得电子实业有限公司 | Package process for high-power LED |
| CN101355125A (en) * | 2007-07-27 | 2009-01-28 | 李氏工业有限公司 | Method for encapsulating LED wafer |
| CN101413637A (en) * | 2008-11-25 | 2009-04-22 | 董丽霞 | LED road lamp light source with light distribution |
| CN101621092A (en) * | 2008-07-01 | 2010-01-06 | 深圳市九洲光电子有限公司 | Light-emitting diode |
| CN101651172A (en) * | 2008-08-14 | 2010-02-17 | 上海科学院 | LED device and packaging method thereof |
-
2010
- 2010-10-13 CN CN2010105156770A patent/CN102064241A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101109823A (en) * | 2007-07-18 | 2008-01-23 | 鹤山丽得电子实业有限公司 | LED lens |
| CN101355125A (en) * | 2007-07-27 | 2009-01-28 | 李氏工业有限公司 | Method for encapsulating LED wafer |
| CN101299447A (en) * | 2007-09-29 | 2008-11-05 | 鹤山丽得电子实业有限公司 | Package process for high-power LED |
| CN101621092A (en) * | 2008-07-01 | 2010-01-06 | 深圳市九洲光电子有限公司 | Light-emitting diode |
| CN101651172A (en) * | 2008-08-14 | 2010-02-17 | 上海科学院 | LED device and packaging method thereof |
| CN101413637A (en) * | 2008-11-25 | 2009-04-22 | 董丽霞 | LED road lamp light source with light distribution |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103131190A (en) * | 2013-02-05 | 2013-06-05 | 广州市爱易迪新材料科技有限公司 | Double-component self-molding lens silica gel for light-emitting diode (LED) package and package process of double-component self-molding lens silica gel |
| CN106251784A (en) * | 2016-08-25 | 2016-12-21 | 广东信达光电科技有限公司 | Production method of LED display screen module |
| CN106251784B (en) * | 2016-08-25 | 2018-09-14 | 广东信达光电科技有限公司 | Production method of L ED display screen module |
| CN108160422A (en) * | 2017-12-28 | 2018-06-15 | 旭宇光电（深圳）股份有限公司 | High-power LED lens glue injection method |
| CN108160422B (en) * | 2017-12-28 | 2019-01-29 | 旭宇光电（深圳）股份有限公司 | High-power LED lens glue injection method |
| CN112838155A (en) * | 2021-02-26 | 2021-05-25 | 木林森股份有限公司 | LED lamp bead support with wide irradiation range and manufacturing process |
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Application publication date: 20110518 |