CN202142573U - LED vacuum packaging device - Google Patents
LED vacuum packaging device Download PDFInfo
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- CN202142573U CN202142573U CN201120268632U CN201120268632U CN202142573U CN 202142573 U CN202142573 U CN 202142573U CN 201120268632 U CN201120268632 U CN 201120268632U CN 201120268632 U CN201120268632 U CN 201120268632U CN 202142573 U CN202142573 U CN 202142573U
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Abstract
The present utility model relates to the LED packaging technology. The LED vacuum packaging device comprises a substrate, a forming die, the substrate is arranged above the forming die, the substrate is matched with the forming die, the vacuum packaging device is also provided with an upper die and a lower die, the upper die is mutually matched with the lower die to form a sealing die cavity, the substrate and the forming die are arranged inside the die cavity, and the die cavity is connected with a vacuum air extracting device During the process of pressing the substrate and the forming mould, the inside of the die cavity is a vacuum environment, bubbles will not be generated when silica gel is pressed on the substrate, the qualified rate is high, and the packaging effect is good.
Description
Technical field
The utility model relates to the LED encapsulation technology, is specifically related to a kind of LED vacuum package device.
Background technology
Lens and lead that the basic part of present light-emitting diode (LED) comprises substrate, led chip, formed by packing colloid.Lead connects the electrode of motor to the substrate on the led chip, guarantees that the outer electrode on the substrate is carried electric current to led chip; Led chip belongs to semi-conducting material, owing to can send visible light, generally is applied to fields such as signal indication, display lighting lamp.The main effect of packing colloid is the protection led chip, and the photoconduction that led chip sends is gone out, and plays the effect of optical lens, therefore, is generally transparent material, like epoxy resin, silicon rubber etc.
In the prior art; The patent No. discloses a kind of power LED and manufacturing approach thereof of glue-filling formed bottom for the Chinese invention patent of " ZL200710031666.3 "; Its technical scheme comprises following processing step: hole for injecting glue and steam vent are set on substrate; Led chip is installed on the substrate and accomplish be electrically connected after, the mould that will be used for lens imaging is pressed in substrate, injects packing colloid from the base plate bottom hole for injecting glue; The band injecting glue is accomplished colloid sclerosis back mold removal, promptly accomplishes the moulding of the package lens of led chip.
The problem that above-mentioned prior art exists is: the cavity of mould and substrate in combination is to have air in the molding cavity of package lens, and in the process that packaging plastic is suppressed, packaging plastic can produce more bubble; Cause encapsulating products defective; If in lens, there is bubble, can make light produce refraction, make the distribution curve flux distortion of lens; Influence the light effect that goes out of LED, and then reduce the light efficiency of LED.
Therefore, to the problem that exists in the prior art, needing badly provides the technology of a kind of LED packaging system and vacuum packaging method particularly important.
Summary of the invention
The purpose of the utility model is the deficiency to prior art, and the LED packaging system that a kind of qualification rate is high, packaging effect is good is provided.
The purpose of the utility model realizes through following technical scheme:
A kind of LED vacuum package device comprises substrate, shaping mould, and said substrate is arranged at said shaping mould top; Said substrate and said shaping mould coupling; Said vacuum package device also is provided with upper die and lower die, and said upper die and lower die mate each other, forms the die cavity of sealing; Said substrate, shaping mould are arranged in the said die cavity, and said die cavity is communicated with vacuum suction device.
Wherein, said patrix is connected with said substrate, and said counterdie is connected with said shaping mould, and said shaping mould is fixed in the said counterdie.
Wherein, the place of being tightly connected of said counterdie and patrix is provided with sealing gasket.
Wherein, said vacuum suction device comprises vacuum tube and vacuum machine, and said vacuum tube one end is communicated with said die cavity, and the other end is communicated with the vacuum machine.
Wherein, said vacuum tube is arranged in the sidewall of said counterdie.
Wherein, said vacuum package device also is provided with drive motors, and said drive motors drives with substrate and is connected.
Wherein, said shaping mould is provided with 1 or more than one nib.
The beneficial effect of the utility model:
A kind of LED vacuum package device of the utility model comprises substrate, shaping mould, and said substrate is arranged at said shaping mould top; Said substrate and said shaping mould coupling; Said vacuum package device also is provided with upper die and lower die, and said upper die and lower die mate each other, forms the die cavity of sealing; Said substrate, shaping mould are arranged in the said die cavity, and said die cavity is communicated with vacuum suction device.Through vacuum suction device the air in the die cavity is extracted out, in substrate and the shaping mould compacting process, owing to be vacuum environment in the die cavity, substrate compacting packaging plastic can not produce bubble, makes rate of finished products improve greatly; The vacuum package device that the utility model provides is on original substrate and shaping mould, to reequip; Having added patrix, following film and vacuum suction device, is substrate compacting packaging plastic, and the environment of vacuum is provided; When making the compacting packaging plastic; Do not have gas remaining, after therefore just having avoided encapsulating completion, produce bubble in the packaging plastic yet.
Description of drawings
Utilize accompanying drawing that the utility model is described further, but the embodiment in the accompanying drawing does not constitute any restriction to the utility model.
Fig. 1 is the structural representation of a kind of LED vacuum package device of the utility model.
In Fig. 1, comprise:
1---patrix, 2---drive motors, 3---substrate, 4---sealing gasket, 5---vacuum tube, 6---the vacuum machine, 7---counterdie, 8---shaping mould, 9---die cavity, 10---nib.
Embodiment
Below in conjunction with embodiment the utility model is elaborated.
A kind of LED vacuum package device, as shown in Figure 1, comprise substrate 3, shaping mould 8; Said substrate 3 is arranged at said shaping mould 8 tops, said substrate 3 and said shaping mould 8 couplings, and said vacuum package device also is provided with patrix 1 and counterdie 7; Said patrix 1, counterdie 7 mate each other; Form the die cavity 9 of sealing, said substrate 3, shaping mould 8 are arranged in the said die cavity 9, and said die cavity 9 is communicated with vacuum suction device.Described patrix 1 and following film 7 snappings through sealing gasket 4 auxiliary seals, after can guaranteeing to bleed, are vacuum environment in the die cavity 9 between patrix 1 and the following film 7.
Through vacuum suction device the air in the die cavity 9 being extracted out, in substrate 3 and shaping mould 8 pressing processes, is vacuum environment in the die cavity 9, and substrate 3 compacting silica gel can not produce bubble, and qualification rate is high, and packaging effect is good.
Wherein, said patrix 1 is connected with said substrate 3, and said counterdie 7 is connected with said shaping mould 8, and said shaping mould 8 is fixed in the said counterdie 7.
Wherein, said counterdie 7 is provided with sealing gasket 4 with the place of being tightly connected of patrix 1.Through sealing gasket 4 sealings, after guaranteeing to vacuumize in the die cavity 9, there is not air to get into good airproof performance.
A kind of LED vacuum package device, as shown in Figure 1, comprise substrate 3, shaping mould 8; Said substrate 3 is arranged at said shaping mould 8 tops, said substrate 3 and said shaping mould 8 couplings, and said vacuum package device also is provided with patrix 1 and counterdie 7; Said patrix 1, counterdie 7 mate each other; Form the die cavity 9 of sealing, said substrate 3, shaping mould 8 are arranged in the said die cavity 9, and said die cavity 9 is communicated with vacuum suction device.Described patrix 1 and following film 7 snappings through sealing gasket 4 auxiliary seals, after can guaranteeing to bleed, are vacuum environment in the die cavity 9 between patrix 1 and the following film 7.
Wherein, said vacuum suction device comprises vacuum tube 5 and vacuum machine 6, and said vacuum tube 5 one ends are communicated with said die cavity 9, and the other end is communicated with vacuum machine 6.
Wherein, said vacuum tube 5 is arranged in the sidewall of said counterdie 7.Vacuum tube 5 is bled from the bottom of die cavity 9, the better effects if of bleeding, and speed is faster.
Wherein, said vacuum package device also is provided with drive motors 2, and said drive motors 2 drives with substrate 3 and is connected.
Wherein, said shaping mould 8 is provided with 3 nibs 10.A plurality of nibs 10 can carry out a plurality of LED and encapsulate simultaneously, and working (machining) efficiency is high.
LED encapsulation described in the utility model is on led chip, to use packaging plastic to encapsulate, and after encapsulation is accomplished, forms the colloid of arc on the led chip surface, plays the effect of lens.
Should be noted that at last; Above embodiment is only in order to the technical scheme of explanation the utility model but not to the restriction of the utility model protection range; Although the utility model has been done detailed description with reference to preferred embodiment; Those of ordinary skill in the art should be appreciated that and can make amendment or be equal to replacement the technical scheme of the utility model, and do not break away from the essence and the scope of the utility model technical scheme.
Claims (7)
1. a LED vacuum package device comprises substrate, shaping mould, and said substrate is arranged at said shaping mould top; Said substrate and said shaping mould coupling; It is characterized in that: said LED vacuum package device also is provided with upper die and lower die, and said upper die and lower die mate each other, forms the die cavity of sealing; Said substrate and said shaping mould are arranged in the said die cavity, and said die cavity is communicated with vacuum suction device.
, a kind of LED vacuum package device according to claim 1, it is characterized in that: said patrix is connected with said substrate, said counterdie is connected with said shaping mould, said shaping mould is fixed in the said counterdie.
3. a kind of LED vacuum package device according to claim 2, it is characterized in that: the place of being tightly connected of said counterdie and said patrix is provided with sealing gasket.
4. a kind of LED vacuum package device according to claim 1 is characterized in that: said vacuum suction device, comprise vacuum tube and vacuum machine, and said vacuum tube one end is communicated with said die cavity, and its other end is communicated with said vacuum machine.
5. a kind of LED vacuum package device according to claim 4, it is characterized in that: said vacuum tube is arranged in the sidewall of said counterdie.
6. a kind of LED vacuum package device according to claim 1, it is characterized in that: said vacuum package device also is provided with drive motors, and said drive motors drives with said substrate and is connected.
7. a kind of LED vacuum package device according to claim 1 is characterized in that: said shaping mould is provided with 1 or more than one nib.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120268632U CN202142573U (en) | 2011-07-27 | 2011-07-27 | LED vacuum packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120268632U CN202142573U (en) | 2011-07-27 | 2011-07-27 | LED vacuum packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202142573U true CN202142573U (en) | 2012-02-08 |
Family
ID=45553617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120268632U Expired - Fee Related CN202142573U (en) | 2011-07-27 | 2011-07-27 | LED vacuum packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202142573U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102270712A (en) * | 2011-07-27 | 2011-12-07 | 东莞市福地电子材料有限公司 | LED (Light-Emitting Diode) vacuum encapsulating device and method |
| CN104210064A (en) * | 2014-08-27 | 2014-12-17 | 广东威创视讯科技股份有限公司 | LED mold pressing molding device and molding method thereof |
-
2011
- 2011-07-27 CN CN201120268632U patent/CN202142573U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102270712A (en) * | 2011-07-27 | 2011-12-07 | 东莞市福地电子材料有限公司 | LED (Light-Emitting Diode) vacuum encapsulating device and method |
| CN104210064A (en) * | 2014-08-27 | 2014-12-17 | 广东威创视讯科技股份有限公司 | LED mold pressing molding device and molding method thereof |
| CN104210064B (en) * | 2014-08-27 | 2016-07-06 | 广东威创视讯科技股份有限公司 | A kind of LED embosses sealing adhesive device and glue sealing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120208 Termination date: 20150727 |
|
| EXPY | Termination of patent right or utility model |