CN102270712A - LED (Light-Emitting Diode) vacuum encapsulating device and method - Google Patents
LED (Light-Emitting Diode) vacuum encapsulating device and method Download PDFInfo
- Publication number
- CN102270712A CN102270712A CN2011102118875A CN201110211887A CN102270712A CN 102270712 A CN102270712 A CN 102270712A CN 2011102118875 A CN2011102118875 A CN 2011102118875A CN 201110211887 A CN201110211887 A CN 201110211887A CN 102270712 A CN102270712 A CN 102270712A
- Authority
- CN
- China
- Prior art keywords
- vacuum
- led
- substrate
- die
- shaping mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to an LED (Light-Emitting Diode) encapsulating technology. An LED vacuum encapsulating device comprises a substrate and a forming die, wherein the substrate is arranged above the forming die, the substrate is matched with the forming die; and the vacuum encapsulating device is also provided with an upper die and a lower die which are mutually matched to form a sealed die cavity, the substrate and the forming die are arranged in the die cavity, and the die cavity is communicated with a vacuum air extractor. The LED vacuum encapsulating method comprises the following steps of: injecting glue, namely injecting the required encapsulating glue into the forming die; closing the dies comprising the upper die and the lower die, vacuumizing the die cavity by virtue of a vacuum tube, and pressing the injected encapsulating glue by the substrate; extruding the encapsulating glue by the substrate, thus the encapsulating glue flows into a die hole of the forming die; and after the encapsulating glue is hardened, opening the upper die, thus LED encapsulating and forming are completed. In a pressing process of the substrate and the forming die, the die cavity is in a vacuum environment, the substrate presses silica gel without generating bubbles, thus the LED vacuum encapsulating device has high yield and good encapsulating effect.
Description
Technical field
The present invention relates to the LED encapsulation technology, be specifically related to a kind of LED vacuum package device and vacuum packaging method.
Background technology
Lens and lead that the basic part of present light-emitting diode (LED) comprises substrate, led chip, formed by packing colloid.Lead connects the electrode of motor to the substrate on the led chip, guarantees that the outer electrode on the substrate is carried electric current to led chip; Led chip belongs to semi-conducting material, owing to can send visible light, generally is applied to fields such as signal indication, display lighting lamp.The main effect of packing colloid is the protection led chip, and the photoconduction that led chip sends is gone out, and plays the effect of optical lens, therefore, is generally transparent material, as epoxy resin, silicon rubber etc.
In the prior art, the patent No. discloses a kind of power LED and manufacture method thereof of glue-filling formed bottom for the Chinese invention patent of " ZL200710031666.3 ", its technical scheme comprises following processing step: hole for injecting glue and steam vent are set on substrate, led chip is installed on the substrate and finish be electrically connected after, the mould that will be used for lens imaging is pressed in substrate, inject packing colloid from the base plate bottom hole for injecting glue, the band injecting glue is finished colloid sclerosis back mold removal, promptly finishes the moulding of the package lens of led chip.
The problem that above-mentioned prior art exists is: the cavity of mould and substrate in combination is to have air in the molding cavity of package lens, in the process of packaging plastic compacting, packaging plastic can produce more bubble, cause encapsulating products defective, if in lens, there is bubble, can make light produce refraction, make the distribution curve flux distortion of lens, influence the light effect that goes out of LED, and then reduce the light efficiency of LED.
Therefore, at problems of the prior art, needing badly provides the technology of a kind of LED packaging system and vacuum packaging method particularly important.。
Summary of the invention
The objective of the invention is at the deficiencies in the prior art, a kind of qualification rate height, LED packaging system that packaging effect is good are provided.
Another object of the present invention is at the deficiencies in the prior art, provides a kind of packaging effect good LED vacuum packaging method.
Purpose of the present invention is achieved through the following technical solutions: a kind of LED vacuum package device, comprise substrate, shaping mould, described substrate is arranged at described shaping mould top, described substrate and described shaping mould coupling, described vacuum package device also is provided with upper die and lower die, and described upper die and lower die mate mutually, forms the die cavity of sealing, described substrate, shaping mould are arranged in the described die cavity, and described die cavity is communicated with vacuum suction device.
Wherein, described patrix is connected with described substrate, and described counterdie is connected with described shaping mould, and described shaping mould is fixed in the described counterdie.
Wherein, the place of being tightly connected of described counterdie and patrix is provided with sealing gasket.
Wherein, described vacuum suction device comprises vacuum tube and vacuum machine, and described vacuum tube one end is communicated with described die cavity, and the other end is communicated with the vacuum machine.
Wherein, described vacuum tube is arranged in the sidewall of described counterdie.
Wherein, described vacuum package device also is provided with drive motors, and described drive motors drives with substrate and is connected.
Wherein, described shaping mould is provided with the nib more than 1 or 1.
Another object of the present invention is achieved through the following technical solutions:
A kind of LED vacuum packaging method may further comprise the steps:
Step 1, injecting glue inject required packaging plastic in described shaping mould;
Step 2, matched moulds, with patrix and counterdie closure, vacuum tube work, to vacuumizing in the die cavity, the packaging plastic compacting of substrate to injecting simultaneously;
Step 3, substrate extruding packaging plastic, packaging plastic flows into the nib of shaping mould;
After step 4, the glue to be packaged sclerosis, open patrix, promptly finish the LED encapsulated moulding.
Wherein, in the described step 2, the vacuum degree in the die cavity is below-94 kPas.
Wherein, in the described step 2, the pumpdown time is 15s.
Beneficial effect of the present invention: a kind of LED vacuum package device of the present invention, comprise substrate, shaping mould, described substrate is arranged at described shaping mould top, described substrate and described shaping mould coupling, described vacuum package device also is provided with upper die and lower die, and described upper die and lower die mate mutually, forms the die cavity of sealing, described substrate, shaping mould are arranged in the described die cavity, and described die cavity is communicated with vacuum suction device.
By vacuum suction device the air in the die cavity is extracted out, in substrate and the shaping mould compacting process, owing to be vacuum environment in the die cavity, substrate compacting packaging plastic can not produce bubble, makes rate of finished products improve greatly;
Vacuum package device provided by the invention is to reequip on original substrate and shaping mould, patrix, following film and vacuum suction device have been added, be substrate compacting packaging plastic, the environment of vacuum is provided, when making the compacting packaging plastic, do not have gas remnants, so after just having avoided encapsulation to finish, produce bubble in the packaging plastic yet.
A kind of LED vacuum packaging method of the present invention, step 1, injecting glue inject required packaging plastic in described shaping mould; Step 2, matched moulds, with patrix and counterdie closure, vacuum tube work, to vacuumizing in the die cavity, the packaging plastic compacting of substrate to injecting simultaneously; Step 3, substrate extruding packaging plastic, packaging plastic flows into the nib of shaping mould; After step 4, the glue to be packaged sclerosis, open patrix, promptly finish the LED encapsulated moulding.The present invention compared to existing technology, proposed in vacuum environment, to carry out the LED encapsulation, by vacuum suction device the air in the die cavity is extracted out, in substrate and the shaping mould compacting process, owing to be vacuum environment in the die cavity, substrate compacting packaging plastic can not produce bubble, make rate of finished products improve greatly, method for packing provided by the invention, step is simple, technology is simple, is easy to realize.
Description of drawings
The invention will be further described to utilize accompanying drawing, but the embodiment in the accompanying drawing does not constitute any limitation of the invention.
Fig. 1 is the structural representation of a kind of LED vacuum package device of the present invention.
In Fig. 1, comprise:
1---patrix, 2---drive motors, 3---substrate, 4---sealing gasket, 5---vacuum tube, 6---the vacuum machine, 7---counterdie, 8---shaping mould, 9---die cavity, 10---nib.
Embodiment
Below in conjunction with embodiment the present invention is elaborated.
Embodiment 1
A kind of LED vacuum package device, as shown in Figure 1, comprise substrate 3, shaping mould 8, described substrate 3 is arranged at described shaping mould 8 tops, described substrate 3 and described shaping mould 8 couplings, and described vacuum package device also is provided with patrix 1 and counterdie 7, described patrix 1, counterdie 7 mate mutually, form the die cavity 9 of sealing, described substrate 3, shaping mould 8 are arranged in the described die cavity 9, and described die cavity 9 is communicated with vacuum suction device.Described patrix 1 and following film 7 snappings by sealing gasket 4 auxiliary seals, after can guaranteeing to bleed, are vacuum environment in the die cavity 9 between patrix 1 and the following film 7.
By vacuum suction device the air in the die cavity 9 being extracted out, in substrate 3 and shaping mould 8 pressing processes, is vacuum environment in the die cavity 9, and substrate 3 compacting silica gel can not produce bubble, the qualification rate height, and packaging effect is good.
Wherein, described patrix 1 is connected with described substrate 3, and described counterdie 7 is connected with described shaping mould 8, and described shaping mould 8 is fixed in the described counterdie 7.
Wherein, described counterdie 7 is provided with sealing gasket 4 with the place of being tightly connected of patrix 1.By sealing gasket 4 sealings, after guaranteeing to vacuumize in the die cavity 9, there is not air to enter, good airproof performance.
Wherein, described vacuum suction device comprises vacuum tube 5 and vacuum machine 6, and described vacuum tube 5 one ends are communicated with described die cavity 9, and the other end is communicated with vacuum machine 6.
Wherein, described vacuum tube 5 is arranged in the sidewall of described counterdie 7.Vacuum tube 5 is bled from the bottom of die cavity 9, the better effects if of bleeding, and speed is faster.
Wherein, described vacuum package device also is provided with drive motors 2, and described drive motors 2 drives with substrate 3 and is connected.
Wherein, described shaping mould 8 is provided with the nib 10 more than 1 or 1.
Embodiment 2
A kind of LED vacuum packaging method may further comprise the steps:
Step 1, injecting glue use injecting glue equipment to be injected in advance in the pattern 8 according to needed injecting glue amount;
Step 2, matched moulds, with patrix 1 and counterdie 7 closures, 6 work of vacuum machine, by vacuumizing in 5 pairs of die cavitys 9 of vacuum tube, 2 pairs of substrates 3 of drive motors are exerted pressure simultaneously, to the packaging plastic compacting of injecting;
Step 3, substrate 3 extruding packaging plastics, packaging plastic flows into the nib of shaping mould 8;
Step 4, when packaging plastic is transferred to when solid-state by liquid state, open patrix 1, rise substrate 3, packaging plastic is bonded at the surface of substrate 3, promptly finishes the encapsulated moulding of LED.
The present invention compared to existing technology, proposed in vacuum environment, to carry out the LED encapsulation, by vacuum suction device the air in the die cavity 9 is extracted out, in substrate 3 and shaping mould 8 pressing processes, owing to be vacuum environment in the die cavity 9, substrate 3 compacting packaging plastics can not produce bubble, make rate of finished products improve greatly, method for packing provided by the invention, step is simple, technology is simple, is easy to realize.
Wherein, in the described step 2, vacuum degree is below-94 kPas.
Wherein, in the described step 2, the pumpdown time is 15s.
LED encapsulation described in the present invention is to use packaging plastic to encapsulate on led chip, after encapsulation is finished, forms the colloid of arc on the led chip surface, plays the effect of lens.
Should be noted that at last; above embodiment is only in order to illustrate technical scheme of the present invention but not limiting the scope of the invention; although the present invention has been done detailed description with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the essence and the scope of technical solution of the present invention.
Claims (10)
1. LED vacuum package device, comprise substrate, shaping mould, described substrate is arranged at described shaping mould top, described substrate and described shaping mould coupling, it is characterized in that: described LED vacuum package device also is provided with upper die and lower die, and described upper die and lower die mate mutually, forms the die cavity of sealing, described substrate and described shaping mould are arranged in the described die cavity, and described die cavity is communicated with vacuum suction device.
2. a kind of LED vacuum package device according to claim 1 is characterized in that: described patrix is connected with described substrate, and described counterdie is connected with described shaping mould, and described shaping mould is fixed in the described counterdie.
3. a kind of LED vacuum package device according to claim 2, it is characterized in that: the place of being tightly connected of described counterdie and described patrix is provided with sealing gasket.
4. a kind of LED vacuum package device according to claim 1 is characterized in that: described vacuum suction device, comprise vacuum tube and vacuum machine, and described vacuum tube one end is communicated with described die cavity, and its other end is communicated with described vacuum machine.
5. a kind of LED vacuum package device according to claim 4, it is characterized in that: described vacuum tube is arranged in the sidewall of described counterdie.
6. a kind of LED vacuum package device according to claim 1, it is characterized in that: described vacuum package device also is provided with drive motors, and described drive motors drives with described substrate and is connected.
7. a kind of LED vacuum package device according to claim 1, it is characterized in that: described shaping mould is provided with the nib more than 1 or 1.
8. a LED vacuum packaging method that adopts any described LED vacuum package device of claim 1 to 7 is characterized in that, may further comprise the steps:
Step 1, injecting glue inject required packaging plastic in described shaping mould;
Step 2, matched moulds, with patrix and counterdie closure, vacuum tube work, to vacuumizing in the die cavity, the packaging plastic compacting of substrate to injecting simultaneously;
Step 3, substrate extruding packaging plastic, packaging plastic flows into the nib of shaping mould;
After step 4, the glue to be packaged sclerosis, open patrix, promptly finish the LED encapsulated moulding.
9. a kind of LED vacuum packaging method according to claim 8 is characterized in that: in the described step 2, the vacuum degree in the die cavity is below-94 kPas.
10. a kind of LED vacuum packaging method according to claim 8 is characterized in that: in the described step 2, the pumpdown time is 15 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110211887 CN102270712B (en) | 2011-07-27 | 2011-07-27 | LED (Light-Emitting Diode) vacuum encapsulating device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110211887 CN102270712B (en) | 2011-07-27 | 2011-07-27 | LED (Light-Emitting Diode) vacuum encapsulating device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102270712A true CN102270712A (en) | 2011-12-07 |
| CN102270712B CN102270712B (en) | 2013-07-10 |
Family
ID=45052932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110211887 Expired - Fee Related CN102270712B (en) | 2011-07-27 | 2011-07-27 | LED (Light-Emitting Diode) vacuum encapsulating device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102270712B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103647007A (en) * | 2013-12-30 | 2014-03-19 | 广州市鸿利光电股份有限公司 | COB (chip on board) encapsulating method |
| CN106848044A (en) * | 2017-04-06 | 2017-06-13 | 贵州润柏吉科技有限公司 | A kind of LED molding devices and its method for packing |
| CN107038965A (en) * | 2017-05-05 | 2017-08-11 | 深圳浩翔光电技术有限公司 | LED display, shaping module and its production technology |
| CN108109533A (en) * | 2017-12-15 | 2018-06-01 | 深圳市晶台股份有限公司 | A kind of method for packing for realizing LED display modules |
| CN110204225A (en) * | 2019-06-29 | 2019-09-06 | 泉州师范学院 | Safety glass vacuum mold press |
| CN111029451A (en) * | 2018-10-09 | 2020-04-17 | 合肥彩虹蓝光科技有限公司 | LED packaging method |
| CN113036021A (en) * | 2021-03-09 | 2021-06-25 | 北京柒彩智显科技有限公司 | LED (light emitting diode) bottom filling process |
| CN114267779B (en) * | 2021-12-28 | 2023-12-12 | Tcl华星光电技术有限公司 | LED panel and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04132234A (en) * | 1990-09-25 | 1992-05-06 | Nec Corp | Resin molding apparatus for resin molded semiconductor integrated circuit |
| TW200901497A (en) * | 2007-06-23 | 2009-01-01 | Jin-Han Chen | LED chips packaging method |
| CN101763951A (en) * | 2008-12-26 | 2010-06-30 | 财团法人工业技术研究院 | Encapsulating machine table of Dye-sensitized battery |
| CN102079502A (en) * | 2010-12-03 | 2011-06-01 | 华东光电集成器件研究所 | MEMS (micro electro mechanical system) device and wafer-level vacuum packaging method thereof |
| CN202142573U (en) * | 2011-07-27 | 2012-02-08 | 东莞市福地电子材料有限公司 | LED vacuum packaging device |
-
2011
- 2011-07-27 CN CN 201110211887 patent/CN102270712B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04132234A (en) * | 1990-09-25 | 1992-05-06 | Nec Corp | Resin molding apparatus for resin molded semiconductor integrated circuit |
| TW200901497A (en) * | 2007-06-23 | 2009-01-01 | Jin-Han Chen | LED chips packaging method |
| CN101763951A (en) * | 2008-12-26 | 2010-06-30 | 财团法人工业技术研究院 | Encapsulating machine table of Dye-sensitized battery |
| CN102079502A (en) * | 2010-12-03 | 2011-06-01 | 华东光电集成器件研究所 | MEMS (micro electro mechanical system) device and wafer-level vacuum packaging method thereof |
| CN202142573U (en) * | 2011-07-27 | 2012-02-08 | 东莞市福地电子材料有限公司 | LED vacuum packaging device |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103647007A (en) * | 2013-12-30 | 2014-03-19 | 广州市鸿利光电股份有限公司 | COB (chip on board) encapsulating method |
| CN103647007B (en) * | 2013-12-30 | 2016-06-08 | 广州市鸿利光电股份有限公司 | A kind of COB method for packing |
| CN106848044A (en) * | 2017-04-06 | 2017-06-13 | 贵州润柏吉科技有限公司 | A kind of LED molding devices and its method for packing |
| CN108807651A (en) * | 2017-04-06 | 2018-11-13 | 吴彬 | The molding device and its packaging method of LED substrate |
| CN106848044B (en) * | 2017-04-06 | 2019-01-29 | 江苏泰特尔新材料科技有限公司 | A kind of LED molding device and its packaging method |
| CN108807651B (en) * | 2017-04-06 | 2019-12-17 | 佛山市革星照明科技有限公司 | Die pressing device of LED substrate and packaging method thereof |
| CN107038965A (en) * | 2017-05-05 | 2017-08-11 | 深圳浩翔光电技术有限公司 | LED display, shaping module and its production technology |
| CN108109533A (en) * | 2017-12-15 | 2018-06-01 | 深圳市晶台股份有限公司 | A kind of method for packing for realizing LED display modules |
| CN111029451A (en) * | 2018-10-09 | 2020-04-17 | 合肥彩虹蓝光科技有限公司 | LED packaging method |
| CN110204225A (en) * | 2019-06-29 | 2019-09-06 | 泉州师范学院 | Safety glass vacuum mold press |
| CN113036021A (en) * | 2021-03-09 | 2021-06-25 | 北京柒彩智显科技有限公司 | LED (light emitting diode) bottom filling process |
| CN114267779B (en) * | 2021-12-28 | 2023-12-12 | Tcl华星光电技术有限公司 | LED panel and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102270712B (en) | 2013-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102270712B (en) | LED (Light-Emitting Diode) vacuum encapsulating device and method | |
| CN100481546C (en) | Power LED with glue-filling formed bottom and manufacturing method thereof | |
| CN102157634B (en) | Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber | |
| CN105751673A (en) | LED encapsulation printer and LED encapsulation method | |
| CN201930901U (en) | Die used for flat bracket adhesive dispensing | |
| CN2920620Y (en) | Epoxy mould capable of reducing electronic epoxy product air holes and air bubbles | |
| CN103378226A (en) | Method for manufacturing light emitting diode | |
| CN112038469A (en) | LED silica gel manufacturing process | |
| CN202142573U (en) | LED vacuum packaging device | |
| KR101052324B1 (en) | Encapsulation material forming method | |
| CN103254889A (en) | Manufacturing method of phosphor film, packaging method of corresponding light emitting diode | |
| CN204977231U (en) | Vacuum low pressure injection molding machine | |
| CN108400217A (en) | A kind of high efficiency LED chip flip-chip packaged method | |
| KR20100028135A (en) | Light emitting diode and apparatus for lens molding of light emitting diode | |
| CN204333019U (en) | A kind of simple and easy sealed in unit with vacuum plant | |
| JPH03202333A (en) | Injection molding device | |
| CN205326457U (en) | LED encapsulates printing machine | |
| CN208773968U (en) | A kind of semiconductor pumpback core encapsulating mould | |
| CN202678409U (en) | LED lamp bead packaging structure | |
| CN105789417A (en) | Simple packaging equipment with vacuum devices | |
| CN103579456A (en) | COB area light source and glue blocking wall manufacturing method thereof | |
| CN204333018U (en) | A kind of simple and easy sealed in unit with fore-set | |
| CN204333004U (en) | A kind of simple and easy sealed in unit with reference column | |
| CN206022412U (en) | A kind of LED sealed in units | |
| CN204333017U (en) | A kind of simple and easy sealed in unit with boss |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130710 Termination date: 20150727 |
|
| EXPY | Termination of patent right or utility model |