JPH04132234A - Resin molding apparatus for resin molded semiconductor integrated circuit - Google Patents
Resin molding apparatus for resin molded semiconductor integrated circuitInfo
- Publication number
- JPH04132234A JPH04132234A JP25446890A JP25446890A JPH04132234A JP H04132234 A JPH04132234 A JP H04132234A JP 25446890 A JP25446890 A JP 25446890A JP 25446890 A JP25446890 A JP 25446890A JP H04132234 A JPH04132234 A JP H04132234A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold cavity
- lower mold
- upper mold
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 71
- 229920005989 resin Polymers 0.000 title claims abstract description 71
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 238000000465 moulding Methods 0.000 title description 5
- 238000007789 sealing Methods 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims 2
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂封止型半導体集積回路の樹脂封止装置に関
し、特にマルチプランジャー方式による樹脂封止型集積
回路の樹脂封止装置に間する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a resin sealing device for a resin-sealed semiconductor integrated circuit, and particularly to a resin-sealing device for a resin-sealed integrated circuit using a multi-plunger method. do.
従来の樹脂封止型半導体集積回路の樹脂封止装置金型は
、第３図の斜視図のように、下部チェイスブロック１に
おいては、下型ランナー２．ゲート３．及び下型キャビ
ティー４を備えている。As shown in the perspective view of FIG. 3, in a conventional resin molding device mold for a resin molded semiconductor integrated circuit, a lower chase block 1 has a lower mold runner 2. Gate 3. and a lower mold cavity 4.
従来、この種の樹脂封止型半導体集積回路の樹脂封止は
、以下の如く、行なわれていた。まず、樹脂封止型半導
体集積回路（チップ）を搭載したリードフレームを、下
型チェイスブロック１上に位置決め載置する０次に、こ
こでは図示しないが、下型センターブロックに埋設した
ポット内にタブレット状の樹脂を投入し、下型を上昇さ
せることにより、上型チェイスブロックと下型チェイス
ブロックとでリードフレームを挟持する。Conventionally, resin sealing of this type of resin-sealed semiconductor integrated circuit has been carried out as follows. First, a lead frame on which a resin-sealed semiconductor integrated circuit (chip) is mounted is positioned and placed on the lower chase block 1.Next, although not shown here, it is placed in a pot embedded in the lower center block. By charging tablet-shaped resin and raising the lower die, the lead frame is held between the upper chase block and the lower chase block.
その後、ロアープランジャーにより、ポット内の樹脂を
上型キャビティー及び下型キャビティー４内に注入する
。この時の樹脂の経路は、上型カル→上型ランナーー下
型ランナー２→ゲート３→上型キャビティー及び下型キ
ャビティー４となる、上型キャビティー及び下型キャビ
ティー４内のエアーは、上型エアーベント及び下部エア
ーベント５により金型外へ放出される。Thereafter, the resin in the pot is injected into the upper mold cavity and the lower mold cavity 4 using the lower plunger. The path of the resin at this time is upper mold cull → upper mold runner - lower mold runner 2 → gate 3 → upper mold cavity and lower mold cavity 4.The air inside the upper mold cavity and lower mold cavity 4 is , is discharged to the outside of the mold through the upper mold air vent and the lower air vent 5.
ところで、最近の樹脂封止型半導体集積回路の高機能化
の要求により、樹脂封止型集積回路チップ寸法の大型化
につれて、パッケージの大型化が進んでいる。そこで、
従来の樹脂封止型半導体集積回路の樹脂封止装置では、
以下のような欠点がある。By the way, due to the recent demand for higher functionality of resin-sealed semiconductor integrated circuits, the size of resin-sealed integrated circuit chips is increasing, and the size of the package is also increasing. Therefore,
Conventional resin molding equipment for resin molded semiconductor integrated circuits
It has the following drawbacks.
第４図の断面図に示す如く、ゲート３より注入される樹
脂１１は、ゲート３の上向きの注入角度のため、下型キ
ャビティー４内よりも、上型キャビティー９内へ早く充
填される。パ・ツケージが大きければ大きい程、上型キ
ャビティー９と下型キャビティー４への樹脂の充填量の
差は大きくなる。As shown in the cross-sectional view of FIG. 4, the resin 11 injected through the gate 3 is filled into the upper mold cavity 9 faster than into the lower mold cavity 4 due to the upward injection angle of the gate 3. . The larger the package, the larger the difference in the amount of resin filled into the upper mold cavity 9 and the lower mold cavity 4.
そのため、上型キャビティー９内に充填しきった樹脂は
、上型エアーベント１０及び下部エアーベント５が設け
である上型キャビティー９及び下型キャビティー４のコ
ーナ一部より回り込んで、下型キャビティー４内へ充填
されようとし、下部キャビティー４内のエアーの放出口
である下型エアーベント５を塞いでしまうことになる。Therefore, the resin that is completely filled into the upper mold cavity 9 goes around the corners of the upper mold cavity 9 and the lower mold cavity 4, where the upper mold air vent 10 and the lower mold cavity 5 are provided, and flows downward. This tends to fill the mold cavity 4 and block the lower mold air vent 5, which is the air outlet in the lower cavity 4.
逃げ道を失った下型キャビティー４内のエアーは、成形
後、第５図の断面図に示すように、耐湿性劣化の原因と
なり、また、製品外観上不良の要因となるボイド１２を
、パッケージ裏面に発生させるという問題点があった。After molding, the air in the lower mold cavity 4, which has lost its escape route, causes voids 12, which cause deterioration of moisture resistance and cause defects in product appearance, to be removed from the package, as shown in the cross-sectional view of FIG. There was a problem that it occurred on the back side.
本発明の樹脂封止型半導体集積回路の樹脂封止装置は、
下型チェイスブロックの各キャビティーのゲートと対向
する側の近傍に、樹脂溜り領域を備えている。The resin-sealing device for a resin-sealed semiconductor integrated circuit of the present invention includes:
A resin reservoir area is provided near the side facing the gate of each cavity of the lower chase block.
本発明の樹脂封止型半導体集積回路の樹脂封止装置は、
上型キャビティーと下型キャビティーの樹脂の充填量の
差によって下型キャビティーに残留するエアーを下型キ
ャビティーから押し出すために、樹脂溜り領域を下型キ
ャビティの近傍に設けなもので、この樹脂溜り領域は、
下型キャビティーからエアーを押し出すのに必要とした
余分の樹脂を溜めておくことができる。その結果、上型
キャビティーと下型キャビティーの樹脂の充填量の差を
吸収することができる。The resin-sealing device for a resin-sealed semiconductor integrated circuit of the present invention includes:
A resin reservoir area is provided near the lower mold cavity in order to push out the air remaining in the lower mold cavity due to the difference in the filling amount of resin between the upper mold cavity and the lower mold cavity. This resin pool area is
The excess resin needed to push air out of the lower mold cavity can be stored. As a result, the difference in the filling amount of resin between the upper mold cavity and the lower mold cavity can be absorbed.
次に本発明の実施例につき、図面を参照しながら説明す
る。第１図は本発明の第１の実施例の下型チェイスブロ
ックの斜視図である。Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a lower chase block according to a first embodiment of the present invention.
まず、樹脂封止型半導体集積回路（チップ）を搭載した
り−ドフレ・−ムを、下型チェイスブロック１上に位置
決め搭載する０次に、ここでは図示しないが、下型セン
ターブロックに埋設したポット内に、タブレット状の樹
脂を投入し、下型を上昇させることにより、上型チェイ
スブロックと下型チェイスブロックとでリードフレーム
を挟持する。First, a resin-sealed semiconductor integrated circuit (chip) or frame is positioned and mounted on the lower chase block 1.Next, although not shown here, it is embedded in the lower center block. A tablet-shaped resin is put into the pot and the lower die is raised to sandwich the lead frame between the upper chase block and the lower chase block.
その後、ロアープランジャーによりポット内の樹脂を上
型キャビティー及び下型キャビティー４内に注入する。Thereafter, the resin in the pot is injected into the upper mold cavity and the lower mold cavity 4 using the lower plunger.
この時の樹脂の経路は、上型カル→上型ランナーー下型
ランナー２−ゲート３−上型キャビティー及び下型キャ
ビティー４→樹脂溜り領域６となる。樹脂が、上型キャ
ビティー及び下型キャビティー４、樹脂溜り領域６に入
る状態を以下に詳細に説明する。The path of the resin at this time is as follows: upper mold cull -> upper mold runner - lower mold runner 2 - gate 3 - upper mold cavity and lower mold cavity 4 -> resin pool area 6. The state in which the resin enters the upper mold cavity, the lower mold cavity 4, and the resin reservoir region 6 will be described in detail below.
ゲート３より注入される樹脂は、ゲート３の上向きの注
入角度のなめ、下型キャビティー４内よりも上型キャビ
ティー内へ早く充填される。上型キャビティー内に樹脂
が充填されきっても、さらに樹脂は、上型キャビティー
内にも充填され続ける。従って、上型キャビティー内よ
りあふれた樹脂は、下型キャビティー４内、及び樹脂溜
り領域６内へと流れる。Due to the upward injection angle of the gate 3, the resin injected through the gate 3 is filled into the upper mold cavity faster than into the lower mold cavity 4. Even when the upper mold cavity is completely filled with resin, the resin continues to be filled into the upper mold cavity. Therefore, the resin overflowing from the upper mold cavity flows into the lower mold cavity 4 and into the resin reservoir region 6.
樹脂溜り領域６の大きさは、上型キャビティー内よりあ
ふれ出て下型キャビティー４内まで回り込んだ樹脂が、
ゲート３側から下型キャビティー４内に注入された樹脂
により、樹脂溜り領域６内に押し出された時点で充填し
きる程度とする。また、樹脂溜り領域６はゲート３と対
向するキャビティーコーナーの近傍に設けである。ゲー
ト３と樹脂溜り領域６が設けであるキャビティーコーナ
ー以外のコーナー、及び樹脂溜り領域６のキャビティー
と対向する側には、キャビティー内及び樹脂溜り領域内
のエアーを放出するためのエアーベントが設けである０
本実施例によると、上型キャビティーと下型キャビティ
ー４への樹脂の充填の差を吸収できる。The size of the resin reservoir area 6 is such that the resin that overflows from the upper mold cavity and wraps around into the lower mold cavity 4,
When the resin injected into the lower mold cavity 4 from the gate 3 side is pushed out into the resin reservoir region 6, the resin is completely filled. Further, the resin reservoir region 6 is provided near the cavity corner facing the gate 3. At corners other than the cavity corner where the gate 3 and the resin pool area 6 are provided, and on the side of the resin pool area 6 facing the cavity, there are air vents for discharging the air inside the cavity and the resin pool area. is set to 0
According to this embodiment, the difference in filling of resin into the upper mold cavity and the lower mold cavity 4 can be absorbed.
第２図は本発明の第２の実施例の下型チェイスブロック
の斜視図である。第１の実施例と比較して、第２の実施
例は、隣り合う樹脂溜り領域６を樹脂流路７にて連結し
たものであり、樹脂使用効率の面で第１の実施例よりも
劣るが、自動運転の安定化という面では、成形後、余剰
樹脂となる樹脂溜り領域６を一括して除去できるので運
転効率が向上する。樹脂封止方法は、第１の実施例と同
様である。FIG. 2 is a perspective view of a lower chase block according to a second embodiment of the present invention. Compared to the first embodiment, the second embodiment has adjacent resin reservoir regions 6 connected by a resin flow path 7, and is inferior to the first embodiment in terms of resin usage efficiency. However, in terms of stabilizing automatic operation, the operating efficiency is improved because the resin pool area 6 that becomes surplus resin can be removed all at once after molding. The resin sealing method is the same as in the first embodiment.
以上説明したように、本発明の樹脂封止型半導体集積回
路の樹脂封止装置は、下型チェイスブロックに樹脂溜り
領域を設けることによって、上型キャビティーと下型キ
ャビティーへの樹脂の充填量の差を吸収するので、パッ
ケージコーナ一部裏面へのボイドの発生を防ぎ、耐湿性
の面１．及び、製品外観上の面から製造歩留りを向上す
ることができる。As described above, the resin sealing apparatus for resin-sealed semiconductor integrated circuits of the present invention is capable of filling the upper mold cavity and the lower mold cavity with resin by providing a resin reservoir area in the lower mold chase block. Since it absorbs the difference in amount, it prevents the occurrence of voids on the back side of some corners of the package, and improves moisture resistance. In addition, manufacturing yield can be improved from the viewpoint of product appearance.
第１図は本発明の第１の実施例の斜視図、第２図は第２
の実施例の斜視図、第３図は従来の樹脂封止型半導体集
積回路の樹脂封止装置の斜視図、第４図は従来の樹脂封
止装置における樹脂充填途中状態を示す正面断面図、第
５図は従来の樹脂封止装置における樹脂充填終了状態を
示す正面断面図である。
１・・・下型チェイスブロック、２・・・下型ランナー
３・・・ゲート、４・・・下型キャビティー ５・・
・下型エアーベント、６・・・樹脂溜り領域、７・・・
樹脂流路、８・・・上型チェイスブロック、９・・・上
型キャビティー、１０・・・上型エアーベント、１１・
・・樹脂、１２・・・ボイド。
ｔ Ａ 図
刀
図
見
図
党
図FIG. 1 is a perspective view of a first embodiment of the present invention, and FIG. 2 is a perspective view of a second embodiment of the present invention.
FIG. 3 is a perspective view of a conventional resin sealing device for a resin-sealed semiconductor integrated circuit, and FIG. 4 is a front sectional view showing a state in the middle of resin filling in a conventional resin sealing device. FIG. 5 is a front sectional view showing a state in which resin filling is completed in a conventional resin sealing device. 1...Lower die chase block, 2...Lower die runner 3...Gate, 4...Lower die cavity 5...
・Lower mold air vent, 6...Resin pool area, 7...
Resin flow path, 8... Upper die chase block, 9... Upper die cavity, 10... Upper die air vent, 11.
...Resin, 12...Void. t A Zuto Zuken Zu Party Zu
Claims (1)
積回路の樹脂封止装置において、下型チェイスブロック
の各キャビティーのゲートと対向する側の近傍に、樹脂
溜り領域を備えることことを特徴とする樹脂封止型半導
体集積回路の樹脂封止装置。 ２、各樹脂溜り領域が樹脂流路で連結されている請求項
１記載の樹脂封止型半導体集積回路の樹脂封止装置。[Claims] 1. In a multi-plunger type resin-sealed semiconductor integrated circuit resin sealing device, a resin reservoir region is provided in the vicinity of the side facing the gate of each cavity of the lower chase block. A resin encapsulation device for a resin encapsulation type semiconductor integrated circuit characterized by the following. 2. The resin sealing device for a resin-sealed semiconductor integrated circuit according to claim 1, wherein each resin reservoir region is connected by a resin flow path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25446890A JPH04132234A (en) | 1990-09-25 | 1990-09-25 | Resin molding apparatus for resin molded semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25446890A JPH04132234A (en) | 1990-09-25 | 1990-09-25 | Resin molding apparatus for resin molded semiconductor integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04132234A true JPH04132234A (en) | 1992-05-06 |
Family
ID=17265454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25446890A Pending JPH04132234A (en) | 1990-09-25 | 1990-09-25 | Resin molding apparatus for resin molded semiconductor integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04132234A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6200121B1 (en) * | 1998-06-25 | 2001-03-13 | Nec Corporation | Process for concurrently molding semiconductor chips without void and wire weep and molding die used therein |
| JP2009277835A (en) * | 2008-05-14 | 2009-11-26 | Shin Etsu Polymer Co Ltd | Holding fixture and method of manufacturing the same |
| CN102157634A (en) * | 2011-01-19 | 2011-08-17 | 木林森股份有限公司 | Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber |
| CN102185044A (en) * | 2011-04-01 | 2011-09-14 | 木林森股份有限公司 | High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould |
| CN102270712A (en) * | 2011-07-27 | 2011-12-07 | 东莞市福地电子材料有限公司 | LED (Light-Emitting Diode) vacuum encapsulating device and method |
-
1990
- 1990-09-25 JP JP25446890A patent/JPH04132234A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6200121B1 (en) * | 1998-06-25 | 2001-03-13 | Nec Corporation | Process for concurrently molding semiconductor chips without void and wire weep and molding die used therein |
| US6315540B1 (en) * | 1998-06-25 | 2001-11-13 | Nec Corporation | Molding die for concurrently molding semiconductor chips without voids and wire weep |
| JP2009277835A (en) * | 2008-05-14 | 2009-11-26 | Shin Etsu Polymer Co Ltd | Holding fixture and method of manufacturing the same |
| CN102157634A (en) * | 2011-01-19 | 2011-08-17 | 木林森股份有限公司 | Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber |
| CN102185044A (en) * | 2011-04-01 | 2011-09-14 | 木林森股份有限公司 | High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould |
| CN102270712A (en) * | 2011-07-27 | 2011-12-07 | 东莞市福地电子材料有限公司 | LED (Light-Emitting Diode) vacuum encapsulating device and method |
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