CN103647007A - COB (chip on board) encapsulating method - Google Patents
COB (chip on board) encapsulating method Download PDFInfo
- Publication number
- CN103647007A CN103647007A CN201310742594.9A CN201310742594A CN103647007A CN 103647007 A CN103647007 A CN 103647007A CN 201310742594 A CN201310742594 A CN 201310742594A CN 103647007 A CN103647007 A CN 103647007A
- Authority
- CN
- China
- Prior art keywords
- die bond
- functional areas
- layer
- glue
- bond functional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Abstract
The invention relates to a COB (chip on board) encapsulating method. The method comprises the following steps of (1) coating the back surface of a substrate circuit layer with laminating glue; (2) laminating the substrate circuit layer onto the surface of a metal substrate layer, wherein a solid crystal functional area, corresponding to the metal substrate layer, on the substrate circuit layer is provided with a through hole, and the solid-crystal functional area is exposed through the through hole after the substrate circuit layer is laminated with the metal substrate layer; (3) completely covering a joint surface between the substrate circuit layer and the metal substrate layer with the laminating glue, and covering the junction on the edge of the through hole through the laminating glue which overflows from the junction on the edge of the through hole or by applying a layer of glue to the junction on the edge of the through hole; (4) carrying out solid-crystal welding on a wire in the solid-crystal functional area; and (5) sealing a COB. By adopting the method, bubbles can be fundamentally avoided at the source, and the subsequent encapsulation process can be facilitated.
Description
Technical field
The present invention relates to LED illumination, especially a kind of COB method for packing.
Background technology
What current compound substrate adopted is thermoelectric separated structure, enough for guaranteeing die bond functional areas reflective area, circuit layer and metal substrate layer are when pressing, pressing glue consumption can lack point relatively, thereby cause existing between circuit layer and metal substrate layer some small gap, these small gap after sealing, can cause in colloid, there is bubble.In prior art, solving the method that colloid after the COB sealing of this kind of compound substrate produces bubble has two kinds, and the one, before solidifying after sealing, place in vacuum machine and solidify again after vacuumizing and defoaming, the 2nd, after sealing, the segmented of low temperature deaeration high temperature coagulation is solidified.Utilize vacuumizing and defoaming after sealing without bubble, to occur after solidifying, but can cause fluorescent material to reunite and look wafts.Utilize the segmented of low temperature deaeration high temperature coagulation after sealing to solidify, deaeration and look waft completely still to have fraction.Therefore prior art all can not produce bubble to colloid after the COB sealing of the compound substrate of effective solution.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of COB method for packing, effectively solves Bubble formation problem after the COB sealing of compound substrate, can not cause the problems such as fluorescent material skewness and look waft simultaneously.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of COB method for packing, comprises the following steps:
(1) at substrate circuit layer back side coating pressing glue;
(2) substrate circuit lamination is incorporated into metal substrate layer surface, the die bond functional areas on substrate circuit layer in corresponding metal substrate layer are provided with through hole, and after substrate circuit layer and metal substrate layer pressing, expose by through hole die bond functional areas;
(3) faying face of substrate circuit layer and metal substrate layer fills up after pressing glue completely, has pressing glue overflow in the junction at through hole edge, and in die bond functional areas, the peripheral circle glue projection that forms covers the junction at through hole edge;
(4) die bond bonding wire in die bond functional areas;
(5) COB is carried out to sealing.
The present invention permits when substrate circuit layer and metal substrate layer pressing overflows a little pressing glue to die bond functional areas, and pressing glue fills up substrate circuit layer and metal substrate layer completely, makes can not have gap between the two; In addition, the pressing glue overflowing also can be stopped bubble and escape from from the junction between substrate circuit layer and metal substrate layer, solves the generation of bubble from source completely, facilitates the carrying out of follow-up packaging technology.Although there is a little pressing glue to spill into die bond functional areas, do not have too large impact, can ignore.
As improvement, we carry out control rubber quality by controlling area, position and the thickness of pressing glue, suppose that whole substrate area is A, and when die bond functional areas are circular, radius is R, and pressing glue area is A-π
when die bond functional areas are while being square, long is L, wide is D, and pressing glue area is A-(L-0.3) * (D-0.3), and pressing glue is apart from die bond functional areas edge 0.3mm, control again the thickness of pressing glue at 25 ± 5 μ m, pass through to control like this coating amount of pressing glue, thereby control the spill-out of pressing glue, make the pressing glue overflowing can not produce considerable influence to die bond functional areas.
As improvement, the distance that pressing glue overflows to die bond functional areas direction is less than 5mm.
For solving the problems of the technologies described above, another technical scheme of the present invention is: a kind of COB method for packing, comprises the following steps:
(1) at substrate circuit layer back side coating pressing glue;
(2) substrate circuit lamination is incorporated into metal substrate layer surface, the die bond functional areas on substrate circuit layer in corresponding metal substrate layer are provided with through hole, and after substrate circuit layer and metal substrate layer pressing, expose by through hole die bond functional areas;
(3) the junction point one deck glue at through hole edge covers the junction at through hole edge;
(4) die bond bonding wire in die bond functional areas;
(5) COB is carried out to sealing.
After substrate circuit layer and metal substrate layer are closed by pressing glue laminated, at the junction point one deck glue of the two, can stop bubble and escape from from the junction between substrate circuit layer and metal substrate layer, from source, solve the generation of bubble completely, facilitate the carrying out of follow-up packaging technology.
As improvement, the distance that the glue layer of point extends to die bond functional areas direction is less than 5mm, makes it not affect die bond functional areas as far as possible.
The beneficial effect that the present invention compared with prior art brought is:
After substrate circuit layer and metal substrate layer are closed by pressing glue laminated, in the junction at through hole edge, overflow a little pressing glue or some one deck glue, the junction at through hole edge is covered, can stop bubble escapes from from the junction between substrate circuit layer and metal substrate layer, from source, solve the generation of bubble completely, facilitate the carrying out of follow-up packaging technology.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that this substrate circuit layer is combined with metal substrate layer.
Fig. 2 is embodiment 1COB packaging technology flow chart.
Fig. 3 is embodiment 2COB packaging technology flow chart.
Embodiment
Below in conjunction with Figure of description, the invention will be further described.
As shown in Figure 1, 2, a kind of COB method for packing, comprises the following steps:
(1) at substrate circuit layer 2 back side coating pressing glue; Suppose that whole substrate area is A, when die bond functional areas are circular, radius is R, and pressing glue area is A-π
when die bond functional areas are while being square, long is L, wide is D, and pressing glue area is A-(L-0.3) * (D-0.3), and pressing glue is apart from die bond functional areas edge 0.3mm, control again the thickness of pressing glue at 25 ± 5 μ m, pass through to control like this coating amount of pressing glue, thereby control the spill-out of pressing glue, make the pressing glue overflowing can not produce considerable influences to die bond functional areas 3;
(2) substrate circuit layer 2 is pressed to metal substrate layer 1 surface, the die bond functional areas 3 on substrate circuit layer 2 in corresponding metal substrate layer 1 are provided with through hole, and after substrate circuit layer 2 and metal substrate layer 1 pressing, expose by through hole die bond functional areas 3;
(3) substrate circuit layer 2 fills up after pressing glue completely with the faying face of metal substrate layer 1, in the junction at through hole edge, having pressing glue overflows, in die bond functional areas, the 3 peripheral circle glue projections that form cover the junction at through hole edge 4, and the distance that pressing glue overflows to die bond functional areas 3 directions is less than 5mm;
(4) the interior die bond bonding wire in die bond functional areas 3;
(5) COB is carried out to sealing.
The present invention permits and overflows a little pressing glue to die bond functional areas 3 when substrate circuit layer 2 and metal substrate layer 1 pressing, and pressing glue fills up substrate circuit layer 2 and metal substrate layer 1 completely, makes can not have gap between the two; In addition, the pressing glue overflowing also can be stopped bubble and escape from from the junction between substrate circuit layer 2 and metal substrate layer 1, solves the generation of bubble from source completely, facilitates the carrying out of follow-up packaging technology.Although there is a little pressing glue to spill into die bond functional areas 3, do not have too large impact, can ignore.
Embodiment 2
As shown in Figure 1,3, a kind of COB method for packing, comprises the following steps:
(1) at substrate circuit layer 2 back side coating pressing glue;
(2) substrate circuit layer 2 is pressed to metal substrate layer 1 surface, the die bond functional areas 3 on substrate circuit layer 2 in corresponding metal substrate layer 1 are provided with through hole, and after substrate circuit layer 2 and metal substrate layer 1 pressing, expose by through hole die bond functional areas 3;
(3) the combination 4 place's point one deck glue at through hole edge cover the junction at through hole edge, and the glue layer of the some distance that 3 directions are extended to die bond functional areas is less than 5mm;
(4) the interior die bond bonding wire in die bond functional areas 3;
(5) COB is carried out to sealing.
After substrate circuit layer 2 closes by pressing glue laminated with metal substrate layer 1, at 4 of the junctions at through hole edge one deck glue, the junction at through hole edge is covered, can stop bubble escapes from from the junction between substrate circuit layer 2 and metal substrate layer 1, from source, solve the generation of bubble completely, facilitate the carrying out of follow-up packaging technology.
Claims (5)
1. a COB method for packing, is characterized in that, comprises the following steps:
(1) at substrate circuit layer back side coating pressing glue;
(2) substrate circuit lamination is incorporated into metal substrate layer surface, the die bond functional areas on substrate circuit layer in corresponding metal substrate layer are provided with through hole, and after substrate circuit layer and metal substrate layer pressing, expose by through hole die bond functional areas;
(3) faying face of substrate circuit layer and metal substrate layer fills up after pressing glue completely, has pressing glue overflow in the junction at through hole edge, and in die bond functional areas, the peripheral circle glue projection that forms covers the junction at through hole edge;
(4) die bond bonding wire in die bond functional areas;
(5) COB is carried out to sealing.
2. a kind of COB method for packing according to claim 1, is characterized in that: substrate area and pressing glue amount exist following relation, supposes that whole substrate area is A, and when die bond functional areas are circular, radius is R, and pressing glue area is A-π
, when die bond functional areas are while being square, long is L, and wide is D, and pressing glue area is A-(L-0.3) * (D-0.3), and pressing glue is apart from die bond functional areas edge 0.3mm, then the thickness of controlling pressing glue is at 25 ± 5 μ m.
3. a kind of COB method for packing according to claim 1, is characterized in that: the distance that pressing glue overflows to die bond functional areas direction is less than 5mm.
4. a COB method for packing, is characterized in that, comprises the following steps:
(1) at substrate circuit layer back side coating pressing glue;
(2) substrate circuit lamination is incorporated into metal substrate layer surface, the die bond functional areas on substrate circuit layer in corresponding metal substrate layer are provided with through hole, and after substrate circuit layer and metal substrate layer pressing, expose by through hole die bond functional areas;
(3) the junction point one deck glue at through hole edge covers the junction at through hole edge;
(4) die bond bonding wire in die bond functional areas;
(5) COB is carried out to sealing.
5. a kind of COB method for packing according to claim 4, is characterized in that: the distance that the glue layer of point extends to die bond functional areas direction is less than 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310742594.9A CN103647007B (en) | 2013-12-30 | 2013-12-30 | A kind of COB method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310742594.9A CN103647007B (en) | 2013-12-30 | 2013-12-30 | A kind of COB method for packing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103647007A true CN103647007A (en) | 2014-03-19 |
| CN103647007B CN103647007B (en) | 2016-06-08 |
Family
ID=50252199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310742594.9A Active CN103647007B (en) | 2013-12-30 | 2013-12-30 | A kind of COB method for packing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103647007B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106057991A (en) * | 2016-07-01 | 2016-10-26 | 深圳市源磊科技有限公司 | Manufacturing method of integrated LED light source module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002216950A (en) * | 2001-01-24 | 2002-08-02 | Sony Corp | Display device |
| JP2006179352A (en) * | 2004-12-22 | 2006-07-06 | Tohoku Pioneer Corp | Manufacturing method of spontaneous light emitting panel |
| US20080044934A1 (en) * | 2006-08-21 | 2008-02-21 | Loh Ban P | Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips |
| CN102270712A (en) * | 2011-07-27 | 2011-12-07 | 东莞市福地电子材料有限公司 | LED (Light-Emitting Diode) vacuum encapsulating device and method |
| CN202695526U (en) * | 2012-04-12 | 2013-01-23 | 广州市鸿利光电股份有限公司 | COB aluminium substrate being high in reflectivity and good in heat radiation property |
| CN203260639U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | High-luminous-efficiency and good-heat-dissipation COB light source |
-
2013
- 2013-12-30 CN CN201310742594.9A patent/CN103647007B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002216950A (en) * | 2001-01-24 | 2002-08-02 | Sony Corp | Display device |
| JP2006179352A (en) * | 2004-12-22 | 2006-07-06 | Tohoku Pioneer Corp | Manufacturing method of spontaneous light emitting panel |
| US20080044934A1 (en) * | 2006-08-21 | 2008-02-21 | Loh Ban P | Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips |
| CN102270712A (en) * | 2011-07-27 | 2011-12-07 | 东莞市福地电子材料有限公司 | LED (Light-Emitting Diode) vacuum encapsulating device and method |
| CN202695526U (en) * | 2012-04-12 | 2013-01-23 | 广州市鸿利光电股份有限公司 | COB aluminium substrate being high in reflectivity and good in heat radiation property |
| CN203260639U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | High-luminous-efficiency and good-heat-dissipation COB light source |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106057991A (en) * | 2016-07-01 | 2016-10-26 | 深圳市源磊科技有限公司 | Manufacturing method of integrated LED light source module |
| CN106057991B (en) * | 2016-07-01 | 2019-08-20 | 深圳市源磊科技有限公司 | A kind of production method of integrated LED light source mould group |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103647007B (en) | 2016-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204463733U (en) | The border structure of oled panel | |
| EP1993128A3 (en) | Method for manufacturing soi substrate | |
| WO2012048137A3 (en) | Flexible circuits and methods for making the same | |
| RU2013128449A (en) | METHOD FOR MANUFACTURING A PANEL INCLUDING A WEAR-RESISTANT LAYER AND A PANEL | |
| CN105390570B (en) | A kind of manufacture method of LED encapsulation structure | |
| CN105281706A (en) | Surface acoustic wave filter encapsulation structure and manufacturing method | |
| CN105006512A (en) | LED packaging structure and manufacturing method thereof | |
| CN104701443A (en) | LED substrate applicable to simple line COB package and method for preparing same | |
| CN101207095A (en) | Encapsulation construction of ball lattice array for preventing glue overflow | |
| CN104862646A (en) | Masking plate assembly, display device and manufacturing method | |
| CN105704914A (en) | Thick copper plate for different types of circuit boards and production method for circuit board | |
| CN103647007A (en) | COB (chip on board) encapsulating method | |
| CN206584921U (en) | The pre-packaged wettable lead frame structure in many sides | |
| CN103762200B (en) | Chip package and method for packing thereof | |
| CN104290429A (en) | Method for fitting display panel with auxiliary panel and display device | |
| CN205428932U (en) | Mother board, display panel and display device | |
| TWI414821B (en) | E-ink display device and manufacturing method thereof | |
| CN104051278A (en) | Molding and milling-cutting method of DBC ceramic substrate | |
| CN204259273U (en) | A kind of laminar structure of less than four layers Rigid Flexs | |
| CN203618215U (en) | Plate structure for preventing warpage of ladder type printed circuit board | |
| JP2015012203A (en) | Light-emitting device and process of manufacturing the same | |
| CN105101672A (en) | Asymmetric rigid-flex board manufacturing method | |
| CN103269564B (en) | Multilayer board local single-layer area inner layer cutting technique | |
| CN106026959A (en) | Method of 3D printing technology for surface acoustic filter chip packaging manufacturing | |
| CN205385603U (en) | MEMS microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: Huadu District, Guangdong city of Guangzhou Province, 510800 East Town Airport high-tech industrial base and SAST Jingu South Road intersection Patentee before: Guangzhou Hongli Tronic Co., Ltd. |