CN210467874U

CN210467874U - Red light LED packaging structure

Info

Publication number: CN210467874U
Application number: CN201921573621.3U
Authority: CN
Inventors: 李国琪
Original assignee: Hubei Fangjing Electronic Technology Co ltd
Current assignee: Hubei Fangjing Electronic Technology Co ltd
Priority date: 2019-09-20
Filing date: 2019-09-20
Publication date: 2020-05-05
Anticipated expiration: 2029-09-20

Abstract

The utility model provides a ruddiness LED packaging structure, including the base plate, be equipped with blue light LED chip on the base plate, the blue light LED chip outside is equipped with the fluorescent layer, the fluorescent layer is equipped with the blue light and eliminates the membrane outward, and the blue light is eliminated the membrane and is equipped with the fixed bed outward. The packaging structure can reduce blue light leakage and realize high-purity red light excitation.

Description

Red light LED packaging structure

Technical Field

The utility model belongs to the technical field of the encapsulation, in particular to ruddiness LED packaging structure.

Background

In the prior art, a blue LED emits blue light, and the blue light excites phosphor to generate red light, which is a common technique. The prior art adopts blue light flip-chip LED blue light chip, and packaging structure mainly has following structure: the blue LED is encapsulated with a mixture of silica gel capable of exciting red phosphor, see fig. 1. In practical application, most of blue light can be excited by the fluorescent powder glue layer, but a part of blue light can be inevitably transmitted out, so that an ideal red light purity effect cannot be achieved.

And because the fluorescent powder glue is tightly attached to the chip, the temperature of the chip can be directly transmitted to the fluorescent powder glue, and the light emitting temperature of the LED chip can reach 150-250 ℃, so that the fluorescent powder glue is easy to harden, glue crack, peel and the like.

Disclosure of Invention

The utility model aims to solve the technical problem that a ruddiness LED packaging structure is provided, reduces the blue light and spills, realizes that high-purity ruddiness arouses.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is: the utility model provides a ruddiness LED packaging structure, includes the base plate, is equipped with blue light LED chip on the base plate, and the blue light LED chip outside is equipped with the fluorescent layer, the fluorescent layer is equipped with the blue light and eliminates the membrane outward, and the blue light is eliminated the membrane and is equipped with the fixed bed outward.

In a preferred scheme, the fixed layer is transparent silica gel.

In a preferred scheme, the fixing layer comprises a lens, the blue light elimination film is arranged on the inner wall of the lens, and silica gel is filled between the lens and the fluorescent layer.

In a preferred scheme, an isolation layer is arranged between the fluorescent layer and the blue light LED chip.

In a further scheme, the isolation layer is isolation silica gel.

The utility model provides a pair of ruddiness LED packaging structure eliminates the membrane through setting up the blue light, absorbs or reflects the blue light that spills behind the fluorescent layer, reduces the rate of hourglass of blue light to realize that high-purity ruddiness arouses. Preferably, through setting up the isolation layer, effectively the separation is carried out to the heat that blue light LED chip produced, reduces the influence of heat to the fluorescent layer.

Drawings

The invention will be further explained with reference to the following figures and examples:

FIG. 1 is a schematic diagram of a conventional package structure;

FIG. 2 is a schematic view of the overall structure of the present invention;

FIG. 3 is a schematic diagram of a preferred construction;

fig. 4 is another preferred structure diagram of the present invention;

in the figure: the LED substrate comprises a substrate 1, a blue LED chip 2, a fluorescent layer 3, a blue light elimination film 4, a fixed layer 5, filled silica gel 6, an isolation layer 7 and a lens 501.

Detailed Description

Example 1: as shown in fig. 2, a red light LED package structure includes a substrate 1, a blue light LED chip 2 is disposed on the substrate 1, a fluorescent layer 3 is disposed on the outer side of the blue light LED chip 2, the fluorescent layer is made by mixing fluorescent powder and silica gel, a blue light eliminating film 4 is disposed outside the fluorescent layer 3, the blue light eliminating film 4 can be replaced by a blue light protective film disclosed by CN204314496U, or can be replaced by other blue light reflecting films or blue light absorbing films, and a fixing layer 5 is disposed outside the blue light eliminating film 4. In this embodiment, the fixing layer 5 is transparent silicone.

In specific implementation, an electrode of the blue LED chip 2 is welded to a metal circuit welding point of the substrate 1; mixing and blending the fluorescent powder and the silica gel to prepare fluorescent glue, covering the blended fluorescent glue on the blue light LED chip 2 in a sealing film mode, and baking and curing; the blue light eliminating film 4 is coated on the fluorescent layer 6, and after the blue light eliminating film 4 is pasted, transparent silica gel is laid on the outer side of the blue light eliminating film 4 to fix the blue light eliminating film 4 again.

Through setting up blue light elimination membrane 4, absorb or reflect the blue light that spills behind fluorescent layer 3, reduce the hourglass rate of blue light to realize that high-purity ruddiness arouses.

Example 2: as shown in fig. 3, unlike embodiment 1, an isolation layer 7 is provided between the phosphor layer 3 and the blue LED chip 2.

Isolation layer 7 is for keeping apart silica gel, keeps apart silica gel and also can replace with other heat-resistant glues, through setting up isolation layer 7, can make the heat that blue light LED chip 2 gived off can not directly transmit fluorescent layer 3 on, has greatly reduced the influence of heat to fluorescent layer 3.

Example 3: different from embodiment 1, as shown in fig. 4, the fixing layer 5 includes a lens 501, the lens 501 is a hemispherical structure and made of transparent glass or transparent resin, the bottom of the lens 501 is adhered to the substrate 1, the blue light eliminating film 4 is disposed on the inner wall of the lens 501, and a silica gel 6 is filled between the lens 501 and the fluorescent layer 3.

The lens 501 is beneficial to fixing the blue light elimination film 4, and a hemispherical optical lens is formed on the surface of the packaging structure without preparing an optical light-transmitting surface.

Claims

1. The utility model provides a ruddiness LED packaging structure, includes base plate (1), is equipped with blue light LED chip (2) on base plate (1), and blue light LED chip (2) outside is equipped with fluorescent layer (3), its characterized in that: the blue light eliminating film (4) is arranged outside the fluorescent layer (3), and the fixing layer (5) is arranged outside the blue light eliminating film (4).

2. The red LED package structure of claim 1, wherein: the fixed layer (5) is transparent silica gel.

3. The red LED package structure of claim 1, wherein: the fixed layer (5) comprises a lens (501), the blue light elimination film (4) is arranged on the inner wall of the lens (501), and a filling silica gel (6) is arranged between the lens (501) and the fluorescent layer (3).

4. The red LED package structure of claim 1, wherein: an isolation layer (7) is arranged between the fluorescent layer (3) and the blue light LED chip (2).

5. The red LED package structure of claim 4, wherein: the isolation layer (7) is isolation silica gel.