CN208352337U - A kind of novel quantum dot LED encapsulation structure - Google Patents
A kind of novel quantum dot LED encapsulation structure Download PDFInfo
- Publication number
- CN208352337U CN208352337U CN201821200899.1U CN201821200899U CN208352337U CN 208352337 U CN208352337 U CN 208352337U CN 201821200899 U CN201821200899 U CN 201821200899U CN 208352337 U CN208352337 U CN 208352337U
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- ceramics bracket
- quantum dot
- quartz glass
- encapsulation structure
- led encapsulation
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Abstract
The utility model discloses a kind of novel quantum dot LED encapsulation structures, including in bowl structure ceramics bracket, be welded in ceramics bracket LED chip, be filled between LED chip and ceramics bracket the glue line comprising quanta point material, be fixed on quartz glass ceramics bracket upper end and for sealing glue line in ceramics bracket, and be coated on English glass and ceramics bracket outer surface but the coat of metal except quartz glass light-emitting surface.Quartz glass is connected to the upper end of ceramics bracket by the quantum dot LED encapsulation structure of the utility model by viscose glue, is coated on quartz glass and ceramics bracket junction in conjunction with the coat of metal；The binding force of quartz glass and ceramics bracket is not only increased, and improves the airtightness and thermal diffusivity of LED encapsulation structure, fabulous isolation water oxygen environment is provided for quanta point material.The stability and reliability that device is improved using the quantum dot LED encapsulation structure of the utility model, extend the service life of quantum dot device.
Description
Technical field
The utility model belongs to technical field of semiconductor illumination.More particularly, to a kind of novel quantum dot LED encapsulation
Structure.
Background technique
As technology development is more and more rapider, electronic product updates iteration speed and is getting faster, liquid of the people to high quality
Brilliant display demand is also more more and more urgent, so, it would be highly desirable to a kind of new technical method meets people's demand, existing fluorescent powder LED
Backlight is more difficult for promoting colour gamut due to being limited by material property.Quantum dot is as a kind of novel semi-conductor nano material
(being usually made of IIIB-VB or IIB-VIB element) has good excitation spectrum width, monochromaticjty, glow peak Wavelength tunable, conversion effect
Rate is high, and advantage is had more compared with current fluorescent powder scheme, however, existing quanta point material water oxygen stability is poor, under conventional encapsulation
Failure is fast, the service life is short, is unable to normal use in product.Currently, mainly using the application mode of whole diaphragm, dosage on the market
Greatly, cost is high.And suitability is poor.So how to improve sealing effect on the basis of the encapsulation of single LED is to give full play to
Quantum dot advantage needs the technical problem overcome.
Utility model content
In order to solve the above technical problems, one of the utility model is designed to provide a kind of novel quantum dot LED envelope
Assembling structure.
In order to achieve the above objectives, the utility model uses following technical scheme:
A kind of novel quantum dot LED encapsulation structure, including being in the ceramics bracket of bowl structure, being arranged in the ceramics branch
LED chip in frame, is fixed on institute at the glue-line comprising quanta point material being filled between the LED chip and ceramics bracket
Quartz glass ceramics bracket upper end and for sealing the glue-line in the ceramics bracket is stated, and is coated on the quartzy glass
The outer surface of glass and ceramics bracket but do not include light-emitting surface and ceramics bracket bottom surface right above quartz glass the coat of metal.
Preferably, the quartz glass is quartz glass plate or lens-type and with translucency.
Preferably, the ceramics bracket can be integrally formed；It also may include frame and ceramic substrate, the frame
It is fixed on the ceramic substrate.
Preferably, the coat of metal can be single-layer or multi-layer.
Preferably, the whole surface inside the ceramics bracket or bottom surface are equipped with Ag for improving reflectivity or alloy
The coat of metal.
Preferably, the LED chip is blue-light LED chip or purple LED chip.
Preferably, the structure of the LED chip is positive cartridge chip, flip-chip or vertical chip.
Preferably, the quartz glass is connected with the upper end of the ceramics bracket by viscose glue.
Preferably, the coat of metal is coated on the junction of the quartz glass and ceramics bracket to realize to the pottery
Quantum dot in porcelain bracket carries out water oxygen isolation.
The beneficial effects of the utility model are as follows:
1, quartz glass is connected to the upper end of bracket by the quantum dot LED encapsulation structure of the utility model by viscose glue, knot
It closes the coat of metal and is coated on quartz glass and ceramics bracket junction；Not only increase the combination of quartz glass and ceramics bracket
Power, and the airtightness of LED encapsulation structure is improved, fabulous isolation water oxygen environment is provided for quanta point material.
2, the quantum dot LED encapsulation structure of the utility model due to ceramics bracket is utilized and be coated on ceramics bracket and
The thermal conductive resin of the coat of metal of quartz glass outer surface, to improve the thermal diffusivity of LED encapsulation structure.
3, the stability and reliability that device is improved using the quantum dot LED encapsulation structure of the utility model, are extended
The service life of quantum dot device.
Detailed description of the invention
Specific embodiment of the present utility model is described in further detail with reference to the accompanying drawing.
Fig. 1 shows the schematic diagram of the utility model quantum dot LED encapsulation structure；Wherein, quartz glass is plate stone
English glass schemes (a) and (b) respectively illustrates quartz glass connection type different from ceramics bracket.
Fig. 2 shows the schematic diagrames of the utility model quantum dot LED encapsulation structure；Wherein, quartz glass is lens-type stone
English glass.
Wherein, 1, ceramics bracket, 2, LED chip, 3, quartz glass, 4, viscose glue, 5, the glue-line containing quanta point material, 6, gold
Belong to coating.
Specific embodiment
In order to illustrate more clearly of the utility model, the utility model is done into one below with reference to preferred embodiments and drawings
The explanation of step.It will be appreciated by those skilled in the art that specifically described content is illustrative and be not restrictive below, no
It should limit the protection scope of the present invention.
In a kind of embodiment of the utility model, a kind of novel quantum dot LED encapsulation structure is provided, including is in bowl
Ceramics bracket 1, LED chip 2, the glue-line 5 comprising quanta point material, quartz glass 3 and the coat of metal 6 of cup structure；LED core
Piece 2 is fixed on ceramics bracket 1 by way of crystal-bonding adhesive, elargol bonding or eutectic welding, the glue comprising quanta point material
Layer 5 is filled in ceramics bracket 1 by way of dispensing, injection, printing, and quartz glass 3 is fastened on ceramics by viscose glue
The upper end of bracket 1 is simultaneously matched with ceramics bracket 1, and the outer surface of quartz glass 3 and ceramics bracket 1 but not is arranged in the coat of metal 6
Including 1 bottom surface of light-emitting surface and ceramics bracket right above quartz glass 3.The quantum dot LED encapsulation structure of the utility model passes through
It is bonded quartz glass 3 on ceramics bracket 1, and is incorporated in the coat of metal 6 coated around quartz glass 3 and ceramics bracket 1；
On the one hand the binding force for improving quartz glass 3 and ceramics bracket 1, on the other hand improves the leakproofness of entire encapsulating structure,
To realize that quantum dot effectively completely cuts off water oxygen；The stability and reliability for improving device, extend making for quantum dot device
Use the service life.
In the present embodiment, ceramics bracket 1 can be integrally formed or ceramics bracket 1 include ceramic substrate and
The bottom of frame, frame is fixed on ceramic substrate by modes such as slurry or solderings.
In the present embodiment, the coat of metal 6 can be the metal simple-substances such as Al, Au, be also possible to alloy；The coat of metal 6
It can be single-layer or multi-layer combination；The coat of metal 6 is coated on 3 and of quartz glass by way of vapor deposition, sputtering or plated film
The outer surface of ceramics bracket 1 but do not include quartz glass 3 light-emitting surface and the bottom surface of ceramics bracket 1；It can lead to before cladding
The modes such as block masks are crossed to protect to wrapped position is not needed.
In the present embodiment, the whole surface inside ceramics bracket 1 and bottom surface are equipped with the gold for improving reflectivity
Belong to coating 6, the coat of metal 6 here refers to the coat of metal 6 of Ag or alloy.
In the present embodiment, LED chip 2 is the LED chip 2 of blue wave band or purple light wave band；LED chip 2 is formal dress
Chip, flip-chip or vertical chip etc..
In the present embodiment, the glue-line 5 containing quanta point material refers to by quanta point material or quanta point material and fluorescence
The mixture of powder, the mixture formed in specific proportions with silica gel or other glue.Quanta point material in glue-line 5 can be one kind
Or a variety of quanta point materials.
In the present embodiment, quartz glass 3 is fastened on upper end and and the ceramics bracket of ceramics bracket 1 by viscose glue
1 matching, viscose glue here refer to silica gel or epoxy resin etc..In the present embodiment, the glue line 5 comprising quanta point material
Need to make by modes such as oven or thermal station the silica gel inside ceramics bracket 1 to solidify after being filled in ceramics bracket 1.
In the present embodiment, quartz glass 3 not only has preferable translucency, but also can protect in ceramics bracket 1
The quanta point material of glue-line 5；Quartz glass 3 is plate, lens-type or other shapes；The utility model is to quartz glass 3
Shape does not do any restriction, and the shape of quartz glass 3 is determined according to practical light demand out.As shown in Fig. 1 (a), quartz glass 3 is adopted
It is plate quartz glass, quartz glass 3 is placed on the upper end of ceramics bracket 1 and is connected by viscose glue.Such as Fig. 1 (b) institute
Show, using plate quartz glass, quartz glass 3 is embedded in the upper end of ceramics bracket 1 and is connected by viscose glue quartz glass 3
It connects.As shown in Fig. 2, quartz glass 3 is lens-type quartz glass, quartz glass 3 is embedded in the upper end of ceramics bracket 1 and passes through viscose glue
Connection.
Specifically, a kind of quantum dot LED encapsulation structure, wherein ceramics bracket 1 is integrally formed using sintering process, uses elargol
LED chip 2 is fixed in 1 bowl of ceramics bracket, by bonding wire, by the electrode of LED chip 2 and 1 electrode conduction of ceramics bracket,
The quantum dot of specific wavelength is mixed with silica gel according to proper ratio, is stirred evenly, is filled with gluing process in ceramics bracket 1
Interior, baking makes its solidification in an oven.Then viscose glue is coated onto 1 upper end of ceramics bracket, covers the quartz glass 3 of suitable dimension,
It toasts again, makes its connection.As shown in Figure 1, then (referring in device outer surface block masks plate and going out light in quartz glass 3
Mask plate is blocked in face and the bottom surface of ceramics bracket 1) and vacuum evaporation metal Al or Au etc., the thickness of evaporation film is controlled, it is final to obtain
To the quantum dot LED component of enclosed package.The ceramics bracket 1 and quartz glass 3 of the device have good airtightness, junction
Water oxygen etc. is obstructed by evaporation metal coating 6, so that good enclosed package is carried out to internal quantum dot, moreover, metal
The bracket of the more conventional material of the thermal diffusivity of coating 6 and ceramics bracket 1 will be got well, to improve the thermal diffusivity of LED encapsulation structure.It is whole
Body improves the reliability of device, extends the service life of quantum dot LED.
Obviously, the above embodiments of the present invention is merely examples for clearly illustrating the present invention, and
It is not limitations of the embodiments of the present invention, for those of ordinary skill in the art, in above description
On the basis of can also make other variations or changes in different ways, all embodiments can not be exhaustive here,
It is all to belong to obvious changes or variations that the technical solution of the utility model is extended out still in the utility model
The column of protection scope.
Claims (9)
1. a kind of novel quantum dot LED encapsulation structure, which is characterized in that exist including the ceramics bracket in bowl structure, setting
LED chip in the ceramics bracket, the glue comprising quanta point material being filled between the LED chip and ceramics bracket
Layer is fixed on the quartz glass ceramics bracket upper end and for sealing the glue-line in the ceramics bracket, and cladding
It in the outer surface of the quartz glass and ceramics bracket but does not include light-emitting surface and ceramics bracket bottom surface right above quartz glass
The coat of metal.
2. quantum dot LED encapsulation structure according to claim 1, which is characterized in that the quartz glass be it is plate shaped or
Lens-type and with translucency quartz glass.
3. quantum dot LED encapsulation structure according to claim 1, which is characterized in that the ceramics bracket can be one
It is molding；It also may include frame and ceramic substrate, the frame is fixed on the ceramic substrate.
4. quantum dot LED encapsulation structure according to claim 1, which is characterized in that the coat of metal can be single layer
Or multilayer.
5. quantum dot LED encapsulation structure according to claim 1, which is characterized in that entire inside the ceramics bracket
Surface or bottom surface are equipped with for improving the Ag of reflectivity or the coat of metal of alloy.
6. quantum dot LED encapsulation structure according to claim 1, which is characterized in that the LED chip is blue-ray LED core
Piece or purple LED chip.
7. quantum dot LED encapsulation structure according to claim 6, which is characterized in that the structure of the LED chip is formal dress
Chip, flip-chip or vertical chip.
8. quantum dot LED encapsulation structure according to claim 1, which is characterized in that the quartz glass and the ceramics
The upper end of bracket is connected by viscose glue.
9. quantum dot LED encapsulation structure according to claim 1, which is characterized in that the coat of metal is coated on described
The junction of quartz glass and ceramics bracket carries out water oxygen isolation to the quantum dot in the ceramics bracket to realize.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821200899.1U CN208352337U (en) | 2018-07-26 | 2018-07-26 | A kind of novel quantum dot LED encapsulation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821200899.1U CN208352337U (en) | 2018-07-26 | 2018-07-26 | A kind of novel quantum dot LED encapsulation structure |
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| Publication Number | Publication Date |
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| CN208352337U true CN208352337U (en) | 2019-01-08 |
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| CN201821200899.1U Active CN208352337U (en) | 2018-07-26 | 2018-07-26 | A kind of novel quantum dot LED encapsulation structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI701096B (en) * | 2019-02-01 | 2020-08-11 | 立誠光電股份有限公司 | Lds optical device and manufacturing processes thereof |
| CN111552038A (en) * | 2019-02-12 | 2020-08-18 | 立诚光电股份有限公司 | Laser direct forming optical device and process thereof |
| CN111669888A (en) * | 2019-03-06 | 2020-09-15 | 立诚光电股份有限公司 | Three-dimensional circuit structure and process for optical device |
-
2018
- 2018-07-26 CN CN201821200899.1U patent/CN208352337U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI701096B (en) * | 2019-02-01 | 2020-08-11 | 立誠光電股份有限公司 | Lds optical device and manufacturing processes thereof |
| CN111552038A (en) * | 2019-02-12 | 2020-08-18 | 立诚光电股份有限公司 | Laser direct forming optical device and process thereof |
| CN111669888A (en) * | 2019-03-06 | 2020-09-15 | 立诚光电股份有限公司 | Three-dimensional circuit structure and process for optical device |
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