CN209344122U - A kind of quantum dot LED packaging - Google Patents
A kind of quantum dot LED packaging Download PDFInfo
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- CN209344122U CN209344122U CN201821876178.2U CN201821876178U CN209344122U CN 209344122 U CN209344122 U CN 209344122U CN 201821876178 U CN201821876178 U CN 201821876178U CN 209344122 U CN209344122 U CN 209344122U
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Abstract
The utility model discloses a kind of quantum dot LED packagings, the main mixture including quanta point material or quantum dot and fluorescent powder is between layer glass, or at least upper layer glass protection, the epoxy resin or other protection materials of edge coating between glass, the flip LED chips of glassy layer lower surface bonds, and the white glue coated around film layer and flip LED chips, quanta point material is sealed in by upper layer and lower layer glass, in the airtight cavity that epoxy resin or other protection materials are constituted, after being adhered to the upper surface of flip LED chips below glass, white glue is coated in total surrounding.The utility model is on the basis of guaranteeing light homogeneity out, reduce the dosage of quanta point material, isolation water oxygen sealing is realized simultaneously, to reduce the failure of material, the stability for improving device, in addition, improving the utilization rate to chip light emitting, it improves light efficiency, bear power capability, device suitability and service life, reduce costs.
Description
Technical field
The present invention relates to technical field of semiconductor illumination, in particular to a kind of quantum dot LED packaging and manufacturing method.
Background technique
With the raising of economic level, the pursuit that people live to high-quality is also more more and more urgent, light source, display effect
Promotion will make one to feel more comfortable, satisfied, and quanta point material is as a kind of novel luminescent material, laser spectral width, monochrome
Property it is good, shine wind Wavelength tunable, high conversion efficiency, can be realized effectively mentioning to the control accurate of spectrum and backlight product colour gamut
It rises, economic advantages and application prospect is had more compared with current fluorescent powder scheme.
However, existing quanta point material water oxygen stability is poor, it is conventional to encapsulate the encapsulation side that the lower service life is short, failure is fast, common
Formula can not achieve the effective protection to material, and existing quantum dot application only rests on the diaphragm stage, and the dosage of material is big, device
Suitability is poor, and yield and yield are lower.
Utility model content
It is existing insufficient in practice to solve the prior art that the utility model provides a kind of quantum dot LED packaging,
Quanta point material is sealed in the airtight cavity being made of upper layer and lower layer glass, epoxy resin or other protection materials, glass
After being adhered to flip LED chips upper surface below, white glue is coated in total surrounding, this structure is guaranteeing light homogeneity out
On the basis of, reduce the dosage of quanta point material；The structure realizes isolation water oxygen sealing at the same time, to reduce material
Failure, improves the stability of device.
In order to achieve the above purpose, the utility model is achieved through the following technical solutions:
A kind of quantum dot LED packaging, quantum dot LED packaging include: upper surface glassy layer 1, quantum dot layer
2, LED chip 6 and encapsulating material 7, quantum dot layer 2 is located between upper surface glassy layer 1 and the LED chip 6 of upside-down mounting, in upper surface
Encapsulating material 7 is coated with around glassy layer 1, quantum dot layer 2 and LED chip 6.
As further program of the utility model, quantum dot LED packaging further include: lower surface glassy layer 3, institute
Lower surface glassy layer 3 is stated to be located between quantum dot layer 2 and the LED chip 6 of upside-down mounting.
As further program of the utility model, quantum dot LED packaging further include: glass surface treatment layer 4,
The glass surface treatment layer 4 is coated in the surface of lower surface glassy layer 3, be located at quantum dot layer 2 and lower surface glassy layer 3 it
Between.
As further program of the utility model, the glass surface treatment layer is UV glue thin layer.
As further program of the utility model, quantum dot LED packaging further include: protection materials 5, the guarantor
Protective material 5 is coated in around quantum dot layer 2.
As further program of the utility model, the protection materials include epoxy resin.
As further program of the utility model, quantum dot layer 2 with a thickness of 10~300 microns.
As further program of the utility model, upper surface glassy layer 1 with a thickness of 50~300 microns.
As further program of the utility model, lower surface glassy layer 3 with a thickness of 50~300 microns.
As further program of the utility model, the encapsulating material includes white glue.
Compared with prior art, the utility model at least has the advantages that
The utility model discloses a kind of quantum dot LED packaging, mainly include quanta point material or quantum dot with it is glimmering
The mixture of light powder is between layer glass, or at least upper layer glass protection, the edge coating between glass
Epoxy resin or other protection materials, flip LED chips and film layer and the flip LED chips week of glassy layer lower surface bonds
The white glue for enclosing coating, quanta point material is sealed in be made of upper layer and lower layer glass, epoxy resin or other protection materials it is close
After being adhered to flip LED chips upper surface in closed chamber body, below glass, white glue is coated in total surrounding, this structure is being protected
On the basis of demonstrate,proving out light homogeneity, reducing the dosage of quanta point material, the structure realizes isolation water oxygen sealing at the same time,
To reduce the failure of material, the stability of device is improved, in addition, improving this arrangement enhances the utilization rate to chip light emitting
Light efficiency bears power capability, device suitability and service life, reduces costs.
Detailed description of the invention
By reading the detailed description done with reference to the following drawings to non-limiting embodiment, other of the utility model are special
Advantage of seeking peace will be more obvious:
Fig. 1 is a kind of structural schematic diagram of quantum dot LED packaging of utility model；
Fig. 2 is the structural schematic diagram of utility model another kind quantum dot LED packaging；
Fig. 3 is the structural schematic diagram of another quantum dot of utility model LED packaging；
In figure: the upper surface 1- glassy layer, 2- quantum dot layer, the lower surface 3- glassy layer, 4- glass surface treatment layer, 5- protection
Material, 6- flip LED chips, 7- encapsulating material.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figure 1, the utility model embodiment provides a kind of quantum dot LED packaging, quantum dot LED encapsulation
Device includes: upper surface glassy layer 1, quantum dot layer 2, LED chip 6 and encapsulating material 7, and quantum dot layer 2 is located at upper surface glass
Between layer 1 and the LED chip 6 of upside-down mounting, package material is coated with around upper surface glassy layer 1, quantum dot layer 2 and LED chip 6
Material 7.
As shown in Fig. 2, quantum dot LED packaging is also on the basis of quantum dot LED packaging shown in Fig. 1
It include: protection materials 5, the protection materials 5 are coated in around quantum dot layer 2.
As shown in figure 3, quantum dot LED packaging further include: lower surface glassy layer 3, the lower surface glassy layer 3
Between quantum dot layer 2 and the LED chip of upside-down mounting 6.
In this embodiment, quantum dot LED packaging further include: glass surface treatment layer 4 and protection materials 5, institute
The surface that glass surface treatment layer 4 is coated in lower surface glassy layer 3 is stated, between quantum dot layer 2 and lower surface glassy layer 3；
The protection materials 5 are coated in around quantum dot layer 2.
In an embodiment of the invention, glass surface treatment layer can be UV glue thin layer.Protection materials include asphalt mixtures modified by epoxy resin
Rouge.Encapsulating material includes white glue.Quantum dot layer 2 with a thickness of 10~300 microns.Upper surface glassy layer 1 with a thickness of 50~300
Micron.Lower surface glassy layer 3 with a thickness of 50~300 microns.
The processing method that the quantum dot LED packaging of different structure is provided below.
Quantum dot LED packaging as shown in Figure 1, uniformly coats after the quantum dot of specific wavelength is mixed UV glue in right amount
The lower surface of glassy layer in upper surface, ultraviolet light irradiation make quantum dot mix adhesive curing；Bonding silicon is coated on flip LED chips surface
The upper surface glassy layer that glue and use die bond technique are coated with quantum dot layer is be bonded with its；The surrounding coating of the above device is appropriate
White glue, oven or thermal station baking, are arranged 80~200 DEG C of temperature according to the specific ingredient of glue material, bake about 2~5 hours, make silica gel
And latex solidified, finally obtain the quantum dot packaging with preferably isolation water oxygen ability.
Quantum dot LED packaging as shown in Figure 2, will be on the lower surface surrounding point of the upper surface glassy layer of suitable dimension
Epoxy resin, and baking makes its solidification；Upper surface glass is coated uniformly on after the quantum dot of specific wavelength is mixed UV glue in right amount
Layer has the one side of epoxy resin, and the interior surrounded in epoxy resin, and ultraviolet light irradiation makes quantum dot mix adhesive curing；It is measuring
The lower surface coating bonding silica gel of son point layer is simultaneously Nian Jie with flip LED chips；Appropriate white glue is coated in the surrounding of the above device, is baked
Case or thermal station baking, are arranged 80~200 DEG C of temperature according to the specific ingredient of glue material, bake about 2~5 hours, make silica gel and white glue
Solidification finally obtains the quantum dot packaging with preferably isolation water oxygen ability.
The upper surface of the lower surface glassy layer of suitable dimension is coated UV glue by quantum dot LED packaging as shown in Figure 3
The quantum dot of specific wavelength is coated uniformly on UV glue surface by thin layer in right amount, and ultraviolet light irradiates appropriate time, makes UV adhesive curing；
The epoxy resin on the upper surface surrounding point of lower surface glassy layer, the thickness of epoxy resin are thicker than the thickness of quantum dot layer；It is measuring
The upper surface of son point layer is covered with the upper surface glassy layer of another same size, connect its surrounding with epoxy resin,
Proper temperature heating, makes the epoxy resin cure of surrounding, upper surface glassy layer is connected with lower surface glassy layer；In lower surface glass
The lower surface of glass layer coats silica gel, is stained with flip LED chips；Appropriate white glue, oven or heat are coated in the surrounding of the above device
Platform baking is arranged 80~200 DEG C of temperature according to the specific ingredient of glue material, bakes about 2~5 hours, make silica gel and latex solidified, most
The quantum dot packaging with preferably isolation water oxygen ability is obtained eventually, and glassy layer, epoxy resin and the white glue of the device have
Good leakproofness has preferably completely cut off the water oxygen etc. in air, has carried out good enclosed package to internal quantum dot, from
And improve the reliability of device.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art
Say, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (10)
1. a kind of quantum dot LED packaging, which is characterized in that quantum dot LED packaging includes: upper surface glassy layer
(1), quantum dot layer (2), LED chip (6) and encapsulating material (7), quantum dot layer (2) are located at upper surface glassy layer (1) and upside-down mounting
LED chip (6) between, around upper surface glassy layer (1), quantum dot layer (2) and LED chip (6) be coated with package material
Expect (7).
2. quantum dot LED packaging according to claim 1, which is characterized in that quantum dot LED packaging also wraps
Include: lower surface glassy layer (3), the lower surface glassy layer (3) are located between quantum dot layer (2) and the LED chip (6) of upside-down mounting.
3. quantum dot LED packaging according to claim 2, which is characterized in that quantum dot LED packaging also wraps
Include: glass surface treatment layer (4), the glass surface treatment layer (4) are coated in the surface of lower surface glassy layer (3), are located at amount
Between son point layer (2) and lower surface glassy layer (3).
4. quantum dot LED packaging according to claim 3, which is characterized in that the glass surface treatment layer is UV
Glue thin layer.
5. according to claim 1 or 3 any quantum dot LED packagings, which is characterized in that quantum dot LED encapsulation
Device further include: protection materials (5), the protection materials (5) are coated in around quantum dot layer (2).
6. quantum dot LED packaging according to claim 5, which is characterized in that the protection materials include asphalt mixtures modified by epoxy resin
Rouge.
7. quantum dot LED packaging according to claim 1, which is characterized in that quantum dot layer (2) with a thickness of 10~
300 microns.
8. quantum dot LED packaging according to claim 1, which is characterized in that upper surface glassy layer (1) with a thickness of
50~300 microns.
9. quantum dot LED packaging according to claim 2, which is characterized in that lower surface glassy layer (3) with a thickness of
50~300 microns.
10. quantum dot LED packaging according to claim 1, which is characterized in that the encapsulating material includes white glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821876178.2U CN209344122U (en) | 2018-11-14 | 2018-11-14 | A kind of quantum dot LED packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821876178.2U CN209344122U (en) | 2018-11-14 | 2018-11-14 | A kind of quantum dot LED packaging |
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| CN209344122U true CN209344122U (en) | 2019-09-03 |
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| CN201821876178.2U Active CN209344122U (en) | 2018-11-14 | 2018-11-14 | A kind of quantum dot LED packaging |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111192947A (en) * | 2018-11-14 | 2020-05-22 | 易美芯光（北京）科技有限公司 | Quantum dot LED packaging device and manufacturing method |
-
2018
- 2018-11-14 CN CN201821876178.2U patent/CN209344122U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111192947A (en) * | 2018-11-14 | 2020-05-22 | 易美芯光（北京）科技有限公司 | Quantum dot LED packaging device and manufacturing method |
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