CN210443553U - Plastic package IGBT module - Google Patents
Plastic package IGBT module Download PDFInfo
- Publication number
- CN210443553U CN210443553U CN201921846146.2U CN201921846146U CN210443553U CN 210443553 U CN210443553 U CN 210443553U CN 201921846146 U CN201921846146 U CN 201921846146U CN 210443553 U CN210443553 U CN 210443553U
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- CN
- China
- Prior art keywords
- frame
- ceramic substrate
- sub
- plastic package
- copper ceramic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a plastic envelope IGBT module, this module includes: the chip package comprises a copper ceramic substrate, N groups of chips, pins, a frame and a plastic package body; the copper ceramic substrate is fixed at the bottom of the frame and is integrated with the frame; the frame is divided into N sub-frames, and a group of chips are welded at the copper ceramic substrate corresponding to each sub-frame; two sides of each subframe are respectively provided with n pins, wherein n is greater than 4, one part of each pin is positioned in the corresponding subframe and is called as an inner pin, and the rest part of each pin is positioned outside the corresponding subframe and is called as an outer pin; the frame, the inner pins, the copper ceramic substrate and the chip are sealed in the plastic package; four inner pins on each sub-frame are fixed with the copper ceramic substrate, and the rest inner pins are electrically connected with the chips in the sub-frames. The whole manufacturing process of the plastic package IGBT module can be completely automated, so that UPH production is greatly improved, manual working procedures are reduced, stability of product quality is guaranteed, and after the whole process is changed, the cost of a single product can be reduced by 10% -25%.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor, more specifically, the utility model relates to a plastic envelope IGBT module.
Background
The module of this kind mainly uses in aspects such as power, converter on the existing market, and the electrical insulation of whole module is sealed to adopt the encapsulating technology preparation, and this IGBT module is by DBC (pottery cover the copper base plate), the chip, the metal wire, the shell (contains the pin), silica gel and lid are constituteed, and main process flow is: firstly, brushing solder paste at the corresponding position of the DBC, then pasting a chip, coating a sealant on the DBC after the completion of the pasting to install a shell, wherein the shell is provided with a pin for encapsulating the corresponding pin, bonding a wire after the installation of the shell is completed, filling the wire with silicone gel for insulation sealing after the bonding of the wire is completed, and finally installing a cover. Due to the characteristics of each process, the automation of the processes such as shell assembly, glue pouring, cover installation and the like cannot be well realized, the processes can only be realized manually or semi-automatically, the number of manual processes is large, and only single operation is realized, so that the UPH is too low in production, the quality is difficult to control, and the difficulty in mass production is increased.
SUMMERY OF THE UTILITY MODEL
The utility model provides a plastic envelope IGBT module improves the degree of automation of its preparation flow.
The utility model discloses a realize like this, a plastic envelope IGBT module, the module includes:
the chip package comprises a copper ceramic substrate, N groups of chips, pins, a frame and a plastic package body;
the copper ceramic substrate is fixed at the bottom of the frame and is integrated with the frame;
the frame is divided into N sub-frames, and a group of chips are welded at the copper ceramic substrate corresponding to each sub-frame;
two sides of each subframe are respectively provided with n pins, wherein n is greater than 4, one part of each pin is positioned in the corresponding subframe and is called as an inner pin, and the rest part of each pin is positioned outside the corresponding subframe and is called as an outer pin;
the frame, the inner pins, the copper ceramic substrate and the chip are sealed in the plastic package;
four inner pins on each sub-frame are fixed with the copper ceramic substrate, and the rest inner pins are electrically connected with the chips in the sub-frames.
Furthermore, the plastic package body is made of epoxy resin and is formed through injection molding through a plastic package process.
Further, three lead wire subframes are arranged per lead frame.
The whole manufacturing process of the plastic package IGBT module can be completely automated, so that UPH production is greatly improved, manual working procedures are reduced, the stability of product quality is ensured, and the cost of a single product can be reduced by 10% -25% after the whole process is changed; in addition, the plastic package IGBT module can be compatible with the functions of the existing glue filling module.
Drawings
Fig. 1 is a schematic perspective view of a plastic package IGBT module provided in an embodiment of the present invention;
fig. 2 is a cross-sectional view of a plastic package IGBT module provided by an embodiment of the present invention;
1. the chip package comprises a copper ceramic substrate, 2. a chip, 3. pins, 4. a frame, 5. a plastic package body and 6. a metal wire.
Detailed Description
The following detailed description of the embodiments of the present invention will be provided to help those skilled in the art to more fully, accurately and deeply understand the concept and technical solutions of the present invention, through the description of the embodiments with reference to the accompanying drawings.
Fig. 1 is the utility model provides a three-dimensional schematic diagram of plastic envelope IGBT module, fig. 2 is the utility model provides a cross-sectional view of plastic envelope IGBT module, for the convenience of explanation, only show with the embodiment of the utility model provides a relevant part.
This plastic envelope IGBT module includes: the chip package comprises a copper ceramic substrate 1, N groups of chips 2, pins 3, a frame 4 and a plastic package body 5;
the copper ceramic substrate 1 is fixed at the bottom of the frame 4 and is integrated with the frame 4; the frame 4 is divided into N sub-frames, and a group of chips are welded at the copper ceramic substrate 1 corresponding to each sub-frame; two sides of each subframe are respectively provided with n pins 3, wherein n is greater than 4, one part of each pin 3 is positioned in the corresponding subframe and is called as an inner pin, and the rest part of each pin 3 is positioned outside the corresponding subframe and is called as an outer pin; the frame 4, the inner pin, the copper ceramic substrate 1 and the chip 3 are sealed in the plastic package body 5; four inner pins on each sub-frame are fixed with the copper ceramic substrate 1, and the rest inner pins are electrically connected with the chips 2 in the sub-frames through metal wires 6.
In the embodiment of the present invention, the plastic package body 5 is made of epoxy resin and is injection molded by plastic package process.
In the embodiment of the utility model, at least three sub-frames are arranged on each frame 4; if each sub-frame corresponds to one product, namely, the plastic package IGBT module can form three same products once.
The manufacturing method of the plastic package IGBT module comprises the following specific steps: s1, fixing the copper ceramic substrate on the frame; s2, printing a conductive paste on the copper ceramic substrate, and fixing N groups of chips at the designated positions of the copper ceramic substrate in a reflow soldering mode; s3, fixedly connecting inner pins in the sub-frame with the copper ceramic substrate, and connecting the remaining inner pins with chips in the sub-frame; s4, electrically sealing the frame, the inner pin, the copper ceramic substrate and the chip through a plastic package process to form a plastic package body for electrical insulation and sealing; and S5, performing rib cutting and forming on the outer pins.
The whole manufacturing process of the plastic package IGBT module can be completely automated, so that UPH production is greatly improved, manual working procedures are reduced, the stability of product quality is ensured, and the cost of a single product can be reduced by 10% -25% after the whole process is changed; in addition, the plastic package IGBT module can be compatible with the functions of the existing glue filling module.
The present invention has been described above with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above-mentioned manner, and various insubstantial improvements can be made without modification to the method and technical solution of the present invention, or the present invention can be directly applied to other occasions without modification, all within the scope of the present invention.
Claims (3)
1. The utility model provides a plastic envelope IGBT module which characterized in that, the module includes:
the chip package comprises a copper ceramic substrate, N groups of chips, pins, a frame and a plastic package body;
the copper ceramic substrate is fixed at the bottom of the frame and is integrated with the frame;
the frame is divided into N sub-frames, and a group of chips are welded at the copper ceramic substrate corresponding to each sub-frame;
two sides of each subframe are respectively provided with n pins, wherein n is greater than 4, one part of each pin is positioned in the corresponding subframe and is called as an inner pin, and the rest part of each pin is positioned outside the corresponding subframe and is called as an outer pin;
the frame, the inner pins, the copper ceramic substrate and the chip are sealed in the plastic package;
four inner pins on each sub-frame are fixed with the copper ceramic substrate, and the rest inner pins are electrically connected with the chips in the sub-frames.
2. The plastic package IGBT module according to claim 1, wherein the plastic package body is made of epoxy resin and is injection molded by a plastic package process.
3. A plastic encapsulated IGBT module as defined in claim 1 or 2, characterized in that three lead sub-frames are arranged per lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921846146.2U CN210443553U (en) | 2019-10-30 | 2019-10-30 | Plastic package IGBT module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921846146.2U CN210443553U (en) | 2019-10-30 | 2019-10-30 | Plastic package IGBT module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210443553U true CN210443553U (en) | 2020-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921846146.2U Active CN210443553U (en) | 2019-10-30 | 2019-10-30 | Plastic package IGBT module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210443553U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022021094A1 (en) * | 2020-07-28 | 2022-02-03 | 华为技术有限公司 | Power module, and preparation mold and apparatus |
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2019
- 2019-10-30 CN CN201921846146.2U patent/CN210443553U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022021094A1 (en) * | 2020-07-28 | 2022-02-03 | 华为技术有限公司 | Power module, and preparation mold and apparatus |
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Address after: 241000 1803, building 3, service outsourcing park, Wuhu high tech Industrial Development Zone, Anhui Province Patentee after: Anhui Changfei Advanced Semiconductor Co.,Ltd. Address before: 241000 1803, building 3, service outsourcing park, high tech Industrial Development Zone, Yijiang District, Wuhu City, Anhui Province Patentee before: WUHU QIDI SEMICONDUCTOR Co.,Ltd. |