CN210443549U - PCB power element radiator - Google Patents
PCB power element radiator Download PDFInfo
- Publication number
- CN210443549U CN210443549U CN201921833679.7U CN201921833679U CN210443549U CN 210443549 U CN210443549 U CN 210443549U CN 201921833679 U CN201921833679 U CN 201921833679U CN 210443549 U CN210443549 U CN 210443549U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- heat dissipation
- pcb
- layer
- power component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a PCB power component radiator, including the heat dissipation main part, the heat dissipation main part includes power component, top layer copper foil, intermediate level, bottom copper foil and supplementary heat dissipation layer, power component sets up on the top layer copper foil, intermediate level, bottom copper foil and supplementary heat dissipation layer are from last to stacking up the setting down, the intermediate level is aluminium oxide layer or aluminium nitride layer. The utility model has the advantages that: the power element is attached to the corresponding top copper foil or bottom copper foil, so that an effective heat dissipation function is achieved, heat of the top copper foil or the bottom copper foil can be conducted to the bottom copper foil and the auxiliary heat dissipation layer through the aluminum oxide layer or the aluminum nitride layer, further accelerated heat dissipation is achieved, and the heat dissipation effect is improved.
Description
Technical Field
The utility model relates to a PCB especially relates to a PCB power component radiator.
Background
The heat dissipation structure of the traditional crystal (such as MOS and IC) is complex, the cost is high, and the processing operation is not facilitated.
Disclosure of Invention
In order to solve the problems in the prior art, the utility model provides a PCB power component radiator.
The utility model provides a PCB power component radiator, including the heat dissipation main part, the heat dissipation main part includes power component, top layer copper foil, intermediate level, bottom copper foil and supplementary heat dissipation layer, power component sets up on top layer copper foil or the bottom copper foil, top layer copper foil, intermediate level, bottom copper foil and supplementary heat dissipation layer are from last to stacking up the setting down, the intermediate level is aluminium oxide layer or aluminium nitride layer.
As a further improvement, the PCB power component radiator further includes a PCB, the PCB is provided with a through hole, and the heat dissipation main body is disposed inside the through hole.
As the utility model discloses a further improvement, PCB includes from last to lower range upon range of top surface copper foil, glass fiber board and bottom surface copper foil, the top layer copper foil of heat dissipation main part with PCB's the laminating of top surface copper foil alignment, the bottom copper foil of heat dissipation main part with PCB's the laminating of bottom surface copper foil alignment.
As a further improvement of the present invention, the power element is a heating element such as MOS or IC
As a further improvement of the present invention, the height of the heat dissipating body is equal to the height of the PCB.
The utility model has the advantages that: the power element is attached to the corresponding top copper foil or bottom copper foil, so that an effective heat dissipation function is achieved, heat of the top copper foil or bottom copper foil can be conducted to the bottom copper foil or top copper foil and the auxiliary heat dissipation layer through the aluminum oxide layer or the aluminum nitride layer, further accelerated heat dissipation is achieved, and the heat dissipation effect is improved.
Drawings
Fig. 1 is a schematic diagram of a PCB power component heat sink according to the present invention.
Fig. 2 is an exploded view of the PCB power device heat sink of the present invention.
Detailed Description
The present invention will be further described with reference to the following description and embodiments.
As shown in fig. 1-2, a PCB power component radiator, including the heat dissipation main part, the heat dissipation main part includes power component 1, top layer copper foil 2, intermediate level 3, bottom copper foil 4 and supplementary heat dissipation layer 5, power component 1 sets up on top layer copper foil 2 (or bottom copper foil 4), top layer copper foil 2, intermediate level 3, bottom copper foil 4 and supplementary heat dissipation layer 5 are from last to the setting of range upon range of down, intermediate level 3 is aluminium oxide layer or aluminium nitride layer. When the heating component reaches a certain temperature, the metal radiating fins can be added to assist in radiating, and the metal radiating fins do not need to be added in a normal temperature range.
As shown in fig. 1 to 2, the PCB power component heat sink further includes a PCB6 (i.e., a circuit board), a through hole 61 is formed on the PCB6, and the heat dissipation body is disposed in the through hole 61.
As shown in fig. 1 to 2, the PCB6 includes a top copper foil 62, a glass fiber board 63 and a bottom copper foil 64 stacked from top to bottom, the top copper foil 2 of the heat dissipating body is aligned and attached to the top copper foil 62 of the PCB6, and the bottom copper foil 4 of the heat dissipating body is aligned and attached to the bottom copper foil 64 of the PCB 6.
As shown in fig. 1 to 2, the power element 1 is a heat generating component such as a MOS or an IC.
As shown in fig. 1-2, the height of the heat dissipating body is equal to the height of the PCB 6.
The utility model provides a pair of PCB power component radiator, inlay within PCB6, can cross in proper order and fold and press multilayer copper clad line board, it all has the copper foil to cover to go up the lower floor, can reach the radiating efficiency of multilayer copper foil, can set up the shape of heat dissipation main part according to actual line, can set up to circular, square, multiple shapes such as polygon and rectangle, help a plurality of MOS or IC or a plurality of components and parts that generate heat to dispel the heat, make the heat that its work distributed out, through top layer copper foil 2, intermediate level 3, bottom copper foil 4 and supplementary heat dissipation layer 5 and PCB6 heat dissipation.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (5)
1. A PCB power component radiator, its characterized in that: including the heat dissipation main part, the heat dissipation main part includes power element, top layer copper foil, intermediate level, bottom copper foil and supplementary heat dissipation layer, power element sets up on top layer copper foil or the bottom copper foil, top layer copper foil, intermediate level, bottom copper foil and supplementary heat dissipation layer are from last to stacking up the setting down, the intermediate level is aluminium oxide layer or aluminium nitride layer.
2. The PCB power component heat sink of claim 1, wherein: the PCB power component radiator further comprises a PCB, a through hole is formed in the PCB, and the radiating main body is arranged in the through hole.
3. The PCB power component heat sink of claim 2, wherein: PCB includes from last top surface copper foil, glass fiber board and the bottom surface copper foil of range upon range of down, the top layer copper foil of heat dissipation main part with the top surface copper foil of PCB laminates mutually, the bottom layer copper foil of heat dissipation main part with the laminating of bottom surface copper foil of PCB is mutually aligned.
4. The PCB power component heat sink of claim 3, wherein: the height of the heat dissipation main body is equal to that of the PCB.
5. The PCB power component heat sink of claim 1, wherein: the power element is MOS or IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921833679.7U CN210443549U (en) | 2019-10-29 | 2019-10-29 | PCB power element radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921833679.7U CN210443549U (en) | 2019-10-29 | 2019-10-29 | PCB power element radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210443549U true CN210443549U (en) | 2020-05-01 |
Family
ID=70411751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921833679.7U Active CN210443549U (en) | 2019-10-29 | 2019-10-29 | PCB power element radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210443549U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113075979A (en) * | 2021-03-26 | 2021-07-06 | 山东英信计算机技术有限公司 | Conduction structure using PCB for heat dissipation and implementation method |
-
2019
- 2019-10-29 CN CN201921833679.7U patent/CN210443549U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113075979A (en) * | 2021-03-26 | 2021-07-06 | 山东英信计算机技术有限公司 | Conduction structure using PCB for heat dissipation and implementation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210443549U (en) | PCB power element radiator | |
| CN205071462U (en) | Multilayer circuit board heat conduction radiation structure | |
| CN105578736A (en) | High-cooling-efficiency FPC board used for camera module group and manufacturing method thereof | |
| CN109644553B (en) | Circuit board and super computing device | |
| CN201726633U (en) | Hollow laminar type cooling plate unit structure | |
| CN207744224U (en) | A kind of pcb board part of thermoelectricity separation | |
| CN103987211B (en) | A kind of high-efficiency heat-radiating aluminum plate based on increase aluminium base face and preparation method thereof | |
| CN109565930B (en) | Circuit board and super computing device | |
| EP1945009A2 (en) | Combination assembly of led and liquid-vapor thermally dissipating device | |
| CN204014255U (en) | A kind of accurate wiring board of PCB with radiating structure | |
| CN207766651U (en) | A kind of low thermal resistance metal-based copper-clad plate | |
| CN207149548U (en) | A kind of radiator structure of package substrate | |
| CN202475945U (en) | Heat dissipation component | |
| JP6098705B1 (en) | Inverter | |
| CN101908490A (en) | Circuit substrate module with heat radiator and production method thereof | |
| CN208016227U (en) | A kind of assembly substrate of circuit board | |
| CN210781511U (en) | Heat dissipation type LED circuit board | |
| CN209787544U (en) | Metal-based copper-clad circuit board and computing equipment comprising same | |
| JP2014117106A (en) | Conduction heat dissipation structure of power supply device | |
| CN210042352U (en) | Circuit board and super computing device | |
| CN213280465U (en) | Efficient heat dissipation ring for copper-clad plate | |
| CN207283902U (en) | One kind heat dissipation pcb board | |
| CN211240607U (en) | Novel heat dissipation device | |
| CN208985983U (en) | A kind of anti-tampering integrated circuit | |
| CN204377309U (en) | Electronic heat sink module and Combined electronic radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |