CN210443539U

CN210443539U - Slicing sucker for single-side texturing

Info

Publication number: CN210443539U
Application number: CN201921193001.7U
Authority: CN
Inventors: 孙鹏; 张良; 董文成
Original assignee: Zhenjiang Rietech New Energy Science & Technology Co ltd; ZHENJIANG RENDE NEW ENERGY TECHNOLOGY CO LTD
Current assignee: Zhenjiang Rietech New Energy Science & Technology Co ltd; ZHENJIANG RENDE NEW ENERGY TECHNOLOGY CO LTD
Priority date: 2019-07-26
Filing date: 2019-07-26
Publication date: 2020-05-01
Anticipated expiration: 2029-07-26

Abstract

The utility model relates to a slicing sucker for single-side texturing, which comprises a sucker base body, wherein an air exhaust pipeline is arranged inside the sucker base body; the outside of the air exhaust pipeline is connected with a negative pressure ring; a plurality of air exhaust holes are formed in the negative pressure ring; the air exhaust pipeline is connected with a sucker air inlet; the other end of the air inlet of the sucking disc is connected with a vacuum device; the vacuum device is connected with the air inlet of the sucker through an air pipe. The suction cup adopts a negative pressure ring design, and gas is pumped out from the air pumping hole and is discharged through the air pumping pipeline. The suction holes are divided into three layers and are arranged in a concentric circle shape, each layer of suction hole forms an independent negative pressure ring, the heights of the three negative pressure rings are gradually reduced to form a large negative pressure ring, the suction force is enhanced on one hand, on the other hand, the suction ring cannot be in direct contact with a silicon wafer, and the textured surface after texturing is protected from being damaged. The utility model discloses a can reduce burst in-process piece rate to being used for improving the burst problem in the single face making herbs into wool technology effectively, reduce the damage that causes the silicon chip matte, reduce the making herbs into wool cost, promote the making herbs into wool effect.

Description

Slicing sucker for single-side texturing

Technical Field

The utility model belongs to the technical field of solar energy power generation, concretely relates to burst sucking disc for single face making herbs into wool.

Background

The silicon wafer is widely applied to the field of photovoltaic solar energy, and the mainstream silicon wafer cutting method comprises two technologies of mortar and diamond wire cutting, wherein the diamond wire cutting technology adopts a diamond-plated steel wire to perform wire cutting on a crystalline silicon material. The surface damage layer is shallow after cutting, and the line marks are dense. Because the cutting cost is extremely low, diamond wire cutting is the mainstream crystal silicon cutting technology at present.

The core problems of the solar cell technology are that the cost is reduced and the efficiency is improved, the texturing process can prolong the optical path of light on the silicon surface on one hand and increase the area of a PN junction on the other hand, and the reflection loss can be reduced on the other hand, so that the efficiency is improved. The reflectivity of a monocrystalline silicon wafer is 11% under an alkali texturing process, while the reflectivity of a polycrystalline silicon wafer is 16% after the conventional acid texturing treatment, and the light absorption effect is poor due to the higher reflectivity, so that the efficiency is influenced.

In recent years, Metal Catalyzed Chemical Etching (MCCE), which forms pits in the surface of a silicon wafer by catalyzing the etching rate of the contact point with the silicon wafer by metal ions, is rapidly being applied on a large scale as a new texturing technique. Thereby increasing the specific surface area, forming a light trapping structure, reducing the reflectivity and improving the conversion efficiency.

At present, the mainstream texturing process adopts a technical route for texturing the two sides of a silicon wafer, the texture structure on the back side is not beneficial to the full contact between a back electric field electrode and a crystalline silicon substrate, and in addition, the mainstream effect-improving technology, namely the back passivation technology, of the solar cell also requires the back side of the cell to be smooth and flat, so that the efficiency of the double-sided texturing process is limited.

According to the single-side texturing technology, two silicon wafers are bonded together for texturing, the bonding surface cannot be in contact with liquid medicine, the textured surface cannot be formed, the capacity can be greatly expanded, the cost is reduced, and the back surface is smooth and is more favorable for being matched with a battery process. Compared with double-sided black silicon texturing, the biggest difference of single-sided black silicon texturing is that a slicing step is newly added, how to ensure that the texturing pieces which are adhered together are successfully separated under the condition of not damaging the texturing surface, and a slicing sucker for sucking the pieces is a key part of the slicing sucker. In the design of the wafer separator, the wafer suction effect is crucial, the suction force is too small, so that the suction disc and the texturing surface of the silicon wafer are loosely fitted, and in the pulling and separating process, the suction disc and the silicon wafer are displaced to leave scratches on the texturing surface. When the suction force is too large, the silicon chip is deformed, so that fragments are generated; the existing wafer separator is mainly used for controlling the wafer suction effect by adjusting the suction force, the method is low in fault tolerance rate, and the vacuum degree of silicon wafers with different texture structures needs to be frequently adjusted.

In patent CN 109132547a, a single-sided texturing and slicing device and a method for using the same are provided, wherein a slicing mode is adopted in which a certain pressure is applied on a silicon wafer to increase the friction force between the silicon wafer and a belt, the belt moves to drive the silicon wafer to move, the belt needs a large friction force to ensure the silicon wafer to be separated, and thus the belt and the silicon wafer are easily rubbed to generate scratches. In addition, the pressure stress is applied to the silicon wafers and the belt, the friction force between the silicon wafers is correspondingly increased, and the slicing difficulty is increased invisibly.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a burst sucking disc for single face making herbs into wool for improve the burst problem in the single face making herbs into wool technology, reduce burst in-process piece rate, reduce the damage that causes the silicon chip matte, reduce the making herbs into wool cost, promote the effect of making herbs into wool.

In order to achieve the above object, the technical solution of the present invention is as follows.

A piece separating sucker for single-side texturing comprises a sucker base body, wherein an air exhaust pipeline is arranged inside the sucker base body; the outside of the air exhaust pipeline is connected with a negative pressure ring; a plurality of air exhaust holes are formed in the negative pressure ring; the air exhaust pipeline is connected with a sucker air inlet; the other end of the air inlet of the sucking disc is connected with a vacuum device; the vacuum device is connected with the air inlet of the sucker through an air pipe.

Furthermore, the single face of the sucker base body is provided with an air exhaust hole, and the other face of the sucker base body is a smooth surface without an opening.

Furthermore, the negative pressure ring is provided with three layers which are arranged in a concentric circle shape; the height of the negative pressure ring is gradually reduced from outside to inside.

Further, the number of the air exhaust holes is 6-10, and the air exhaust holes are evenly distributed on the negative pressure ring.

Furthermore, the base body of the sucker is made of ceramic, graphite or stainless steel.

The sucking disc sucks the texturing surface during slicing, and then slicing is carried out through pulling. And during slicing, a slicing machine is adopted. The slicing machine comprises a bin to be sliced, a sucking disc, a travelling crane, an empty basket bin and a vacuum device. The wafer dividing bin is internally provided with a carrier for carrying silicon wafers to be divided, when single-side texturing passes through the insert, two silicon wafers are overlapped and inserted into the same basket latch, the silicon wafers can be naturally adsorbed together after texturing due to liquid tension difference, the binding surface is a non-texturing surface, and the outer side is a texturing surface. The sucking disc comprises a magnetic disc substrate and a vacuum air pipe, and a group of sucking disc groups are respectively arranged on the crane jib and the bin to be sliced. The ceramic sucker has the main function of sucking the sheet, and the vacuum air pipe provides negative pressure. The traveling crane is responsible for conveying the ceramic sucker adsorbing the silicon wafer into the empty basket bin, and the main stroke actions are horizontal and vertical displacement. The empty basket bin is mainly used for preventing an empty flower basket and bearing the sliced crystal silicon wafers. The vacuum device functions to generate a negative pressure. The vacuum device is connected with the sucker through an air pipe, one end of the air pipe is connected to the vacuum generating device, and the other end of the air pipe is connected with an air inlet of the sucker.

The utility model discloses a beneficial effect lie in: the suction cup adopts a negative pressure ring design, and gas is pumped out from the air pumping hole and is discharged through the air pumping pipeline. The suction holes are divided into three layers and are arranged in a concentric circle shape, each layer of suction hole forms an independent negative pressure ring, the heights of the three negative pressure rings are gradually reduced to form a large negative pressure ring, the suction force is enhanced on one hand, on the other hand, the suction ring cannot be in direct contact with a silicon wafer, and the textured surface after texturing is protected from being damaged. The utility model discloses a can reduce burst in-process piece rate to being used for improving the burst problem in the single face making herbs into wool technology effectively, reduce the damage that causes the silicon chip matte, reduce the making herbs into wool cost, promote the making herbs into wool effect.

Drawings

Fig. 1 is a schematic diagram of the slicing operation according to the embodiment of the present invention.

Fig. 2 is a schematic view of a cross-sectional structure of a suction cup according to an embodiment of the present invention.

Fig. 3 is a schematic top view of a sucker according to an embodiment of the present invention.

The notation in the figure is: 1. a bin to be partitioned; 2. a vacuum device; 3. a crane jib; 4. an empty basket bin; 5. an air exhaust hole; 6. an air extraction pipeline; 7. a suction cup base; 8. a negative pressure ring; 9. and a suction cup air inlet.

Detailed Description

The following description of the embodiments of the present invention will be provided in conjunction with the accompanying drawings for better understanding of the invention.

The slicing sucker for single-side texturing shown in fig. 1, 2 and 3 comprises a sucker base body 7, wherein an air exhaust pipeline 6 is arranged inside the sucker base body 7; the outside of the air exhaust pipeline 6 is connected with a negative pressure ring 8; the negative pressure ring 8 is provided with a plurality of air extraction holes 5; the air exhaust pipeline 6 is connected with a sucker air inlet 9; the other end of the air inlet 9 of the sucking disc is connected with a vacuum device 2; the vacuum device 2 is connected with the suction cup air inlet 9 by an air pipe. The single face of the sucking disc base body 7 is provided with an air exhaust hole 5, and the other face is a smooth surface without holes. The negative pressure ring 8 is provided with three layers which are arranged in a concentric circle shape; the height of the negative pressure ring 8 is gradually reduced from outside to inside. 6-10 air exhaust holes 5 are arranged and evenly distributed on the negative pressure ring 8. The sucker base body 7 is made of ceramic, graphite or stainless steel.

The utility model discloses an in, the sucking disc adopts the negative pressure ring design, and gas is taken out by aspirating hole 5, discharges through exhaust duct 6. The extraction holes 5 are divided into three layers and are arranged in a concentric circle shape, each layer of extraction holes 5 forms an independent negative pressure ring 8, the heights of the three negative pressure rings are gradually reduced to form a large negative pressure ring, the suction is enhanced on one hand, on the other hand, the suction cannot be directly contacted with a silicon wafer, and the textured surface after texturing is protected from being damaged. The sucking disc sucks the texturing surface during slicing, and then slicing is carried out through pulling. And during slicing, a slicing machine is adopted. The slicing machine comprises a bin to be sliced, a sucking disc, a travelling crane, an empty basket bin and a vacuum device. The wafer dividing bin is internally provided with a carrier for carrying silicon wafers to be divided, when single-side texturing passes through the insert, two silicon wafers are overlapped and inserted into the same basket latch, the silicon wafers can be naturally adsorbed together after texturing due to liquid tension difference, the binding surface is a non-texturing surface, and the outer side is a texturing surface. The sucking disc comprises disk substrate, vacuum pipe, and crane jib 3 and the storehouse of waiting to divide 1 set up a set of sucking disc group respectively. The ceramic sucker has the main function of sucking the sheet, and the vacuum air pipe provides negative pressure. The travelling crane is responsible for conveying the ceramic sucker adsorbing the silicon wafer into the empty basket bin 4, and the main stroke actions are horizontal and vertical displacement. The empty basket bin 4 is mainly used for preventing an empty flower basket and bearing the sliced crystal silicon slices. The vacuum device 2 functions to generate a negative pressure. The vacuum device 2 is connected with the sucker through an air pipe, one end of the air pipe is connected with the vacuum generating device, and the other end of the air pipe is connected with the air inlet 9 of the sucker.

When the silicon wafer slicing device works, a silicon wafer basket bearing a textured silicon wafer is placed in a to-be-sliced bin 1, a sucker in the to-be-sliced bin 1 extends out to suck a silicon wafer on one side, a travelling crane sucker is driven by a servo motor to vertically move downwards, after the travelling crane sucker reaches a lower limit position, a central air hole of the travelling crane sucker is parallel to the center of the silicon wafer, the horizontal distance between the travelling crane sucker and the silicon wafer is about 1-2mm, at the moment, a vacuum valve is opened, negative pressure is generated in the travelling crane sucker, the travelling crane sucker horizontally moves to be close to the silicon wafer. The driving sucker moves upwards and slowly, the double silicon wafers are gradually separated, the driving sucker moves upwards to the upper limit position and then moves horizontally to the upper part of the empty basket bin, then the crystal silicon wafers are vertically downwards inserted into the empty basket, the vacuum valve is closed at the moment, the silicon wafers are separated from the sucker, and the driving sucker returns to the original position to complete the slicing.

The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.

Claims

1. A burst sucking disc for single face making herbs into wool which characterized in that: the sucker comprises a sucker base body, wherein an air exhaust pipeline is arranged inside the sucker base body; the outside of the air exhaust pipeline is connected with a negative pressure ring; a plurality of air exhaust holes are formed in the negative pressure ring; the air exhaust pipeline is connected with a sucker air inlet; the other end of the air inlet of the sucking disc is connected with a vacuum device; the vacuum device is connected with the air inlet of the sucker through an air pipe.

2. The sheet suction cup for single-sided texturing according to claim 1, wherein: the single face of the sucking disc base body is provided with an air exhaust hole, and the other face of the sucking disc base body is a smooth surface without holes.

3. The sheet suction cup for single-sided texturing according to claim 1, wherein: the negative pressure ring is provided with three layers which are arranged in a concentric circle shape; the height of the negative pressure ring is gradually reduced from outside to inside.

4. The sheet suction cup for single-sided texturing according to claim 1, wherein: the number of the air exhaust holes is 6-10, and the air exhaust holes are evenly distributed on the negative pressure ring.

5. The sheet suction cup for single-sided texturing according to claim 1, wherein: the base body of the sucker is made of ceramic, graphite or stainless steel.