CN203910775U - Novel vacuum chuck - Google Patents
Novel vacuum chuck Download PDFInfo
- Publication number
- CN203910775U CN203910775U CN201420179655.5U CN201420179655U CN203910775U CN 203910775 U CN203910775 U CN 203910775U CN 201420179655 U CN201420179655 U CN 201420179655U CN 203910775 U CN203910775 U CN 203910775U
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- vacuum chuck
- faced adhesive
- double faced
- novel vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002390 adhesive tape Substances 0.000 claims abstract description 25
- 239000004744 fabric Substances 0.000 claims abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 25
- 229910052710 silicon Inorganic materials 0.000 abstract description 25
- 239000010703 silicon Substances 0.000 abstract description 25
- 238000000034 method Methods 0.000 abstract description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 7
- 229910002804 graphite Inorganic materials 0.000 abstract description 7
- 239000010439 graphite Substances 0.000 abstract description 7
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000001681 protective effect Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000013078 crystal Substances 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a novel vacuum chuck. The novel vacuum chuck comprises a suction nozzle (3); the suction nozzle (3) is provided with a suction hole (4); a sponge double faced adhesive tape (2) is arranged on the suction hole (4) in the suction nozzle (3); the sponge double faced adhesive tape (2) is covered by high-temperature cloth (1); and the sponge double faced adhesive tape (2) and the high-temperature cloth (1) around the suction hole (4) are both provided with a through hole, in order to fully expose the suction hole (4). The novel vacuum chuck has the beneficial effects that a silicon chip before a protective plated film is complete in pile face, free of damage in appearance, and free of scratch and chuck mark; a silicon chip silicon nitride film behind the protective plated film is complete and compact, free of damage in appearance, and free of scratch and chuck mark; rates of broken points, broken edges, broken corners and broken chips in the operation process are reduced; the vacuum chuck is not required to be replaced and can protect a graphite boat, and the production cost is reduced; and the novel vacuum chuck can be realized in various dimensions.
Description
Technical field
The utility model relates to a kind of Novel vacuum chuck.
Background technology
Solar-energy photo-voltaic cell is a kind of semiconductor device that solar energy is converted to electric energy, and its principle is photovoltaic principle.In producing the process of solar-energy photo-voltaic cell; in order to reduce light in the reflection of silicon chip surface; need to utilize on crystal silicon surface PECVD deposition techniques one deck silicon nitride anti-reflecting film; to improve crystal silicon solar batteries, thereby the absorption of light is reached to the photoelectric conversion efficiency that improves solar cell, the silicon nitride film that is simultaneously deposited on silicon chip surface also plays surface passivation and protective effect to crystal silicon solar batteries.Therefore, PECVD plated film is a procedure very important in crystal silicon solar batteries sheet production process.
In crystal silicon solar batteries sheet PECVD coating process, silicon chip is to be placed on to put into PECVD pipe in the middle of graphite boat and carry out plated film.Concrete steps are: 1, with vacuum WAND, utilize vacuum silicon chip is extracted out from the gaily decorated basket and inserted in graphite boat; 2, the graphite boat of filling silicon chip is sent into 400 ℃ of high temperature PECVD pipes and carried out coating process; 3, with vacuum WAND, the silicon chip of finishing coating process is taken out and puts into Carrier box from graphite boat.
Mainly contain in the market the vacuum WAND that two kinds of materials of ceramic material and PP material are made.The vacuum WAND of ceramic material is in vacsorb silicon chip process, the frictional force that very easily forms due to vacuum pressure is excessive causes that silicon chip surface suede structure destroys, silicon nitride film destroyedly even collapses point, collapse limit, hidden splitting and sliver, causes cell piece outward appearance, quality problems; And there is non-refractory, not wear-resisting in the vacuum WAND of PP material, the problem such as easily distortion at short notice, causes to draw to produce in silicon chip process and collapse the problems such as limit collapses a little, and a suction loss is fast.
Utility model content
The purpose of this utility model is to provide a kind of Novel vacuum chuck, and the suction pen that can reduce on silicon chip prints, protection silicon chip surface, and the useful life of increase vacuum WAND.
A kind of Novel vacuum chuck, comprise suction nozzle, on this suction nozzle, be provided with sucker, its special feature is: the sucker place on this suction nozzle is coated with sponge double faced adhesive tape, on this sponge double faced adhesive tape, be coated with high temperature cloth, and in the sponge double faced adhesive tape at this sucker place and high temperature cloth, all have through hole, thereby expose sucker completely.
Wherein sucker is circular, and through hole in sponge double faced adhesive tape and high temperature cloth is ellipse.
Wherein the thickness of sponge double faced adhesive tape is 1mm.
The beneficial effects of the utility model are: 1, before protection plated film, silicon wafer suede is complete, outward appearance not damaged, and no marking and suction pen print; 2, the complete densification of silicon chip silicon nitride film after protection plated film, outward appearance not damaged, no marking and suction pen print; 3, reduce collapsing point, collapse limit, unfilled corner and fragment rate in operating process; 4, without changing vacuum WAND, graphite boat is also had to certain protective role, save production cost; 5, be applicable to the suction pen of needles of various sizes.
Accompanying drawing explanation
Accompanying drawing 1 is structural representation of the present utility model;
The vertical view that accompanying drawing 2 is Fig. 1.
Embodiment
As shown in Figure 1, 2, the utility model is a kind of Novel vacuum chuck, comprise suction nozzle 3, on this suction nozzle 3, be provided with sucker 4, sucker 4 places on this suction nozzle 3 are coated with sponge double faced adhesive tape 2, on this sponge double faced adhesive tape 2, be coated with high temperature cloth 1, and all have through hole in the sponge double faced adhesive tape 2 at these sucker 4 places and high temperature cloth 1, thereby expose sucker 4 completely.
Wherein sucker 4 is circular, and through hole in sponge double faced adhesive tape 2 and high temperature cloth 1 is ellipse, and the thickness of sponge double faced adhesive tape 2 is 1mm in addition.
The utility model is on suction pen surface, to paste the sponge double faced adhesive tape 2 that one deck 1mm is thick (sponge double faced adhesive tape 2 size dimensions are according to suction nozzle 3 and sucker 4 area definitions of the vacuum WAND that will use) according to inhaling pen size, for example, according to sucker 4 areas, then on sponge double faced adhesive tape 2, open Φ 4 * 10mm waist-shaped hole (slotted eye), waist-shaped hole be positioned at sucker 4 on suction nozzle 3 directly over, sponge double faced adhesive tape 2 plays cushioning effect in drawing silicon chip process, prevents sliver.Then at the another side of sponge double faced adhesive tape 2, paste an onesize high temperature cloth 1; and in high temperature cloth 1, open Φ 3 * 10mm waist-shaped hole (high temperature cloth 1 size dimension is same according to suction nozzle 3 and sucker 4 area definitions of the vacuum WAND that will use); waist-shaped hole is positioned to be inhaled directly over a sucker 4, and high temperature cloth 1 plays the effect of protection silicon chip surface with sponge double faced adhesive tape 2 in inserting and drawing silicon chip process simultaneously.
Adopt this design can effectively solve the damage of silicon chip surface matte, silicon nitride anti-reflecting film surface damage problem, guaranteed that the core parameters such as solar battery sheet outward appearance, electrical property and life-span are normal, owing to having avoided inhaling pen, directly contact with silicon chip, graphite boat, directly change in use for some time sponge double faced adhesive tape 2 and high temperature cloth 1, without changing, inhale pen, save production and rise this.
Claims (3)
1. a Novel vacuum chuck, comprise suction nozzle (3), on this suction nozzle (3), be provided with sucker (4), it is characterized in that: the sucker (4) on this suction nozzle (3) locates to be coated with sponge double faced adhesive tape (2), on this sponge double faced adhesive tape (2), be coated with high temperature cloth (1), and in the sponge double faced adhesive tape (2) of locating in this sucker (4) and high temperature cloth (1), all have through hole, thereby expose sucker (4) completely.
2. a kind of Novel vacuum chuck as claimed in claim 1, is characterized in that: wherein sucker (4) is for circular, and through hole in sponge double faced adhesive tape (2) and high temperature cloth (1) is ellipse.
3. a kind of Novel vacuum chuck as claimed in claim 1 or 2, is characterized in that: wherein the thickness of sponge double faced adhesive tape (2) is 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420179655.5U CN203910775U (en) | 2014-04-15 | 2014-04-15 | Novel vacuum chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420179655.5U CN203910775U (en) | 2014-04-15 | 2014-04-15 | Novel vacuum chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203910775U true CN203910775U (en) | 2014-10-29 |
Family
ID=51785030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420179655.5U Expired - Lifetime CN203910775U (en) | 2014-04-15 | 2014-04-15 | Novel vacuum chuck |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203910775U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108133908A (en) * | 2017-12-06 | 2018-06-08 | 中建材浚鑫科技有限公司 | A kind of wand impression method for being used to solve silicon wafer suction pen |
-
2014
- 2014-04-15 CN CN201420179655.5U patent/CN203910775U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108133908A (en) * | 2017-12-06 | 2018-06-08 | 中建材浚鑫科技有限公司 | A kind of wand impression method for being used to solve silicon wafer suction pen |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141029 |