CN105428466B - Silicon chip inserting piece device - Google Patents
Silicon chip inserting piece device Download PDFInfo
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- CN105428466B CN105428466B CN201511029608.8A CN201511029608A CN105428466B CN 105428466 B CN105428466 B CN 105428466B CN 201511029608 A CN201511029608 A CN 201511029608A CN 105428466 B CN105428466 B CN 105428466B
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- Prior art keywords
- conveyer belt
- silicon chip
- separating mechanism
- burst
- pipeline
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 128
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 128
- 239000010703 silicon Substances 0.000 title claims abstract description 128
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 238000007664 blowing Methods 0.000 claims abstract description 37
- 239000011148 porous material Substances 0.000 claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 210000005056 cell body Anatomy 0.000 claims abstract description 25
- 238000005086 pumping Methods 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 230000002706 hydrostatic effect Effects 0.000 claims description 6
- 239000010893 paper waste Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000013519 translation Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000003345 natural gas Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005276 aerator Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Silicon chip inserting piece device, including separating mechanism, feeder channel and conveyer belt；The separating mechanism includes silicon chip separating mechanism body, the silicon chip separating mechanism body is to having two parallel and spaced burst conveyer belts, the silicon chip separating mechanism body is provided with pumping pore towards the burst conveyer belt, and the pumping pore is connected with air extractor by pipeline；The front end of the conveying direction of the corresponding burst conveyer belt of the silicon chip separating mechanism body is provided with roller；The silicon chip separating mechanism body is provided with blowing direction towards the air blowing pore of the burst conveyer belt, and the air blowing pore is connected with blowing device by pipeline；The feeder channel includes feeder channel cell body and water pump, accommodates liquid in the feeder channel cell body, the height of the depth of liquid always greater than stacking silicon chip；The conveyer belt includes first conveyer belt, the second conveyer belt, the 3rd conveyer belt and the 4th conveyer belt.The present invention has the advantages that inserted sheet efficiency high, damages little to silicon chip in inserted sheet.
Description
Technical field
The present invention relates to a kind of silicon chip inserting piece device, belongs to solar battery sheet and prepares auxiliary device field.
Background technology
Since 21 century, global Energy Consumption drastically rises, traditional fossil energy increasingly depleted, and energy problem and environment are asked
Topic is increasingly becoming two big Important Problems of global concern.Under the pressure of the pressure of sustainable development, each major country is one after another by solar energy
Photovoltaic industry lists the emphasis of regenerative resource exploitation in.Become the second in the world economy along with China, in October, 2013,
Chinese October petroleum import amount reaches daily 6,300,000 barrels, more than daily 6,240,000 barrels of the U.S., replaces the U.S. to become the whole world first
Maximum net import of oil state.2013, the external dependence degree of CNPC and natural gas respectively reached 58.1% and 31.6%, China
Global the third-largest natural gas consumption state is become.Traditional fossil energy has been increasingly difficult to meet the vigorous need of Chinese national economy
Ask.In past 20 years, the artificial CO2 emissions in the whole world about 75% or so derive from combustion of fossil fuel.Cause
This, either from the energy development angle of low-carbon environment-friendly, still complies with Industry Structure upgrading and transition pressure, and China is necessary
Accelerate development New Energy Industry.
Solar energy belongs to clean reproducible energy.According to " the European renewable energy technologies strategy that EU Committee proposes
Plan ", to the year two thousand twenty, solar energy will account for the 15% of European Union's electricity needs.2010, USDOE developed planning, and plan is arrived
The year two thousand thirty, solar energy account for the 10%～15% of total energy consumption figure.Send out from worldwide solar energy and tide energy aggregate net
Electricity sees that China is 3,000,000,000 kilowatt hours, and Germany is 19,000,000,000 dry watt-hours, and Italy is 10,700,000,000 dry watt-hours, and Spain is 9,100,000,000 thousand
Watt-hour, Japan are 3,800,000,000 kilowatt hours.Following China's water power growth space is limited, and nuclear energy has unsafe factor.Fossil energy is received
Energy-saving and emission-reduction committed cost will rise, the wide market of solar energy power generating.
The processing of monocrystalline silicon piece includes silicon single crystal rod elder generation evolution, then cuts into slices, and the processing of polysilicon chip is cut including polycrystal silicon ingot
Cut, then cut into slices, the processing of quasi-monocrystalline silicon includes that mono-like silicon ingot is cut, then cuts into slices.Sum it up, section is the crystalline silicon sun
One of requisite technique in energy battery machining process.The silicon chip obtained after section is stacked together, inserts after needing burst
Transported in entering silicon wafer bearing box, the characteristics of thin, crisp as silicon chip has, therefore the difficulty of burst, inserted sheet is very big.
The application for a patent for invention of Publication No. CN103681968A, discloses a kind of automatic machine for inserting silicon wafers, and which adopts suction
Disk captures silicon chip to carry out burst, inserted sheet, is discontinuous operation as sucker captures the action of silicon chip, therefore there is burst effect
The low problem of rate.
The content of the invention
It is an object of the present invention to provide a kind of silicon chip inserting piece device.
To reach above-mentioned purpose, the technical solution used in the present invention is：A kind of silicon chip inserting piece device, including separating mechanism,
Feeder channel and conveyer belt；The separating mechanism includes silicon chip separating mechanism body, and the silicon chip separating mechanism body is to having two
Individual parallel and spaced burst conveyer belt, the silicon chip separating mechanism body are provided with pumping gas towards the burst conveyer belt
Hole, the pumping pore are connected with air extractor by pipeline；The corresponding burst conveyer belt of the silicon chip separating mechanism body
The front end of conveying direction is provided with roller；The silicon chip separating mechanism body is provided with blowing direction blowing towards the burst conveyer belt
Gas pore, the air blowing pore are connected with blowing device by pipeline；The feeder channel includes feeder channel cell body and water pump, the confession
Hopper cell body is provided with overfall, and the overfall is connected with a reservoir by pipeline；It is provided with to contain in the feeder channel cell body
The support platform of stacking silicon chip is put, the support platform is connected with a drive division for moving up and down driving means；The feed
Groove cell body is provided with hydrostatic sensor, and the hydrostatic sensor is connected with a Computerized digital control system signal, the computer numerical control
System is electrically connected with the water pump；Liquid is accommodated in the feeder channel cell body, the depth of liquid is always greater than stacking silicon chip
Highly；The conveyer belt includes first conveyer belt, the second conveyer belt, the 3rd conveyer belt and the 4th conveyer belt, first conveying
Band and the second conveyer belt set gradually, and the 3rd conveyer belt and the 4th conveyer belt set gradually, second conveyer belt and
Three conveyer belts are arranged into angle；Side and the gap of second conveying strap end portion of 3rd conveyer belt towards the second conveyer belt
Size of the distance less than silicon chip, relative another side are provided with silicon chip baffle plate, and the silicon chip baffle plate is towards second conveyer belt
Sidepiece is provided with flexible material layer；Silicon chip detection means is provided with above second conveyer belt, the silicon chip detection means is controlled with one
System signal connection processed；The contrary one end of corresponding 4th conveyer belt of 3rd conveyer belt is provided with waste paper storage box；The control
System processed is electrically connected with the drive motor of the 3rd conveyer belt；The corresponding burst conveyer belt of the support platform is arranged；Institute
The one end for stating first conveyer belt is located at the lower section of the roller.
Preferred technical scheme is：The burst conveyer belt is Timing Belt.
Preferred technical scheme is：The Timing Belt is set on drivewheel and driven pulley, and the drivewheel is filled with driving
Put and be connected.
Preferred technical scheme is：The driving means are a drive motor, the output shaft of the drive motor and the master
Driving wheel passes through V belt translation.
Preferred technical scheme is：The silicon chip separating mechanism body is in the front end of the conveying direction of the burst conveyer belt
Roller fixed plate is provided with, towards pumping pore is had, the pumping pore is connected with air extractor the roller fixed plate by pipeline；
The roller rotational support is in the roller fixed plate.
Preferred technical scheme is：The silicon chip separating mechanism body is provided with the air cavity of a closing, and the air cavity is towards institute
State burst conveyer belt and be provided with several pumping pores, the air cavity is fixed with valve, and the valve is connected with air extractor by pipeline
It is logical.
Preferred technical scheme is：After the conveying direction of the corresponding burst conveyer belt of the silicon chip separating mechanism body
End is provided with air blowing air cavity, and the air blowing air cavity is provided with blowing direction towards the air blowing pore of the burst conveyer belt, the inflatable gas
Chamber is connected with blowing device by pipeline.
Preferred technical scheme is：It is described to move up and down driving means for screw-nut body.
Preferred technical scheme is：The water inlet of the water pump is connected with the reservoir by pipeline, the water pump
Outlet is connected with the feeder channel cell body by pipeline.
Preferred technical scheme is：The material of the flexible material layer is silica gel；The first conveyer belt is obliquely installed, its
High one end is disposed adjacent with second conveyer belt；The first conveyer belt, the second conveyer belt, the 3rd conveyer belt and the 4th are defeated
Band is sent to be Timing Belt；Second conveyer belt and the 3rd conveyer belt are arranged at a right angle.
As above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
The present invention has the advantages that inserted sheet efficiency high, damages little to silicon chip in inserted sheet.
Description of the drawings
Accompanying drawing 1 is silicon chip separating mechanism schematic perspective view.
Accompanying drawing 2 is silicon chip separating mechanism elevational schematic view.
Accompanying drawing 3 is silicon chip separating mechanism schematic top plan view.
Accompanying drawing 4 is silicon chip separating mechanism schematic side view.
Accompanying drawing 5 is silicon chip separating mechanism schematic rear view.
Accompanying drawing 6 is feeder channel schematic diagram.
Accompanying drawing 7 is conveyer belt schematic side view.
Accompanying drawing 8 is conveyer belt schematic top plan view.
In the figures above：1st, silicon chip separating mechanism body；2nd, burst conveyer belt；3rd, it is evacuated pore；4th, roller；5th, valve；
6th, roller fixed plate；7th, air blowing pore；8th, air blowing air cavity；9th, pipeline；10th, separating mechanism；21st, feeder channel cell body；22nd, water pump；
23rd, overfall；24th, reservoir；25th, support platform；26th, stacking silicon chip；27th, hydrostatic sensor；31st, first conveyer belt；32nd,
Two conveyer belts；33rd, the 3rd conveyer belt；34th, the 4th conveyer belt；35th, silicon chip；36th, silicon chip detection means；37th, waste paper storage box；38、
Silicon chip baffle plate 39, flexible material layer.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment the invention will be further described：
It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., only to coordinate description to be taken off
The content shown, so that those skilled in the art understands and reads, is not limited to enforceable qualificationss of the invention, therefore
Do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not affecting the present invention
Under the effect that can be generated and the purpose that can be reached, all should still fall and the model that can cover is obtained in disclosed technology contents
In enclosing.Meanwhile, in this specification it is cited such as " on ", D score, "left", "right", the term of " centre " and " " etc., be also only
It is easy to what is described to understand, and is not used to limit enforceable scope of the invention, its relativeness is altered or modified, without essence
Under change technology contents, when being also considered as enforceable category of the invention.
Embodiment：Silicon chip inserting piece device
Referring to shown in accompanying drawing 1～8, a kind of silicon chip inserting piece device, including separating mechanism 10, feeder channel and conveyer belt.
Separating mechanism 10 includes silicon chip separating mechanism body 1, the silicon chip separating mechanism body 1 to have two it is parallel and
Spaced burst conveyer belt 2, the silicon chip separating mechanism body 1 are provided with pumping pore 3 towards the burst conveyer belt 2,
The pumping pore 3 passes through pipeline and air extractor（Not shown in figure）Connection, air extractor can be vacuum suction device.It is described
Silicon chip separating mechanism body 1 corresponds to the front end of the conveying direction of the burst conveyer belt 2 and is provided with roller 4；The silicon chip wafer separator
Structure body 1 is provided with blowing direction towards the air blowing pore 7 of the burst conveyer belt 2, and the air blowing pore 7 is by pipeline 9 and blowing
Device（Not shown in figure）Connection.Blowing device can for example be aerator.
It is preferred embodiment：The burst conveyer belt 2 is Timing Belt.
It is preferred embodiment：The Timing Belt is set on drivewheel and driven pulley, and the drivewheel is filled with driving
Put and be connected.
It is preferred embodiment：The driving means are a drive motor, the output shaft of the drive motor and the master
Driving wheel passes through V belt translation.Drive motor can be hydraulic motor or motor etc..
It is preferred embodiment：The silicon chip separating mechanism body 1 is before the conveying direction of the burst conveyer belt 2
End is provided with roller fixed plate 6, and, towards pumping pore 3 is had, the pumping pore 3 is by pipeline and pumping dress for the roller fixed plate 6
Put connection；4 rotational support of the roller is in the roller fixed plate 6.
It is preferred embodiment：The silicon chip separating mechanism body 1 is provided with the air cavity of a closing, and the air cavity is towards institute
State burst conveyer belt 2 and be provided with several pumping pores 3, the air cavity is fixed with valve 5, the valve 5 is by pipeline and pumping dress
Put connection.
It is preferred embodiment：The silicon chip separating mechanism body 1 corresponds to the conveying direction of the burst conveyer belt 2
Rear end is provided with air blowing air cavity 8, and the air blowing air cavity 8 is provided with blowing direction towards the air blowing pore 7 of the burst conveyer belt 2, described
Air blowing air cavity 8 is connected with blowing device by pipeline 9.
Feeder channel includes feeder channel cell body 21 and water pump 22, and the feeder channel cell body 21 is provided with overfall 23, the overfall
23 are connected with a reservoir 24 by pipeline；It is provided with to hold the support platform of stacking silicon chip 26 in the feeder channel cell body 21
25, the support platform 25 is connected with a drive division for moving up and down driving means；The feeder channel cell body 21 is provided with liquid
Pressure sensor 27, the hydrostatic sensor 27 are connected with a Computerized digital control system signal, the Computerized digital control system with it is described
Water pump 22 is electrically connected；Accommodate liquid in the feeder channel cell body 1, the height of the depth of liquid always greater than stacking silicon chip.Institute
State driving means are moved up and down for screw-nut body.The water inlet of the water pump is connected with the reservoir by pipeline, institute
The outlet for stating water pump is connected with the feeder channel cell body by pipeline.
The liquid level of the detection of hydrostatic sensor 27, carries out control system of switching on or off electricity to water pump, so as to accommodate in the feeder channel cell body 1
There is liquid, the height of the depth of liquid always greater than stacking silicon chip.Liquid in feeder channel cell body 1 is generally water, it is also possible to adopt
With the fluid instead of water of other species, but can not damage and not affect the following process of silicon chip.
Conveyer belt includes first conveyer belt 31, the second conveyer belt 32, the 3rd conveyer belt 33 and the 4th conveyer belt 34, in order to prolong
Long fed distance, can increase the conveyer belt consistent with 31 conveying direction of first conveyer belt, with 34 conveying direction of the 4th conveyer belt
Consistent conveyer belt.
The first conveyer belt 31 and the second conveyer belt 32 set gradually, and first conveyer belt 31 and the second conveyer belt 32
Conveying direction is identical, i.e., first conveyer belt 31 is delivered to silicon chip 35 thereon on the second conveyer belt 32.3rd conveyer belt
33 and the 4th conveyer belt 34 set gradually, i.e., the 3rd conveyer belt 33 is delivered to silicon chip 35 thereon on the 4th conveyer belt 34,
Four conveyer belts 34 most deliver on silicon wafer bearing box at last by silicon chip.
33 one-tenth angles of second conveyer belt 32 and the 3rd conveyer belt are arranged, and preferred forms are：Second conveying
Band 32 and the 3rd conveyer belt 33 arrange at a right angle, i.e. the second conveyer belt 32 by silicon chip 35 thereon by the second conveyer belt 32 end
Portion, the side of the 3rd conveyer belts 33 of Jing are delivered on the 3rd conveyer belt 33.
Distance of 3rd conveyer belt 33 towards the gap of the side and 32 end of the second conveyer belt of the second conveyer belt 32
Less than the size of silicon chip 35, in order to prevent silicon chip 35 from being dropped by another side of the 3rd conveyer belt 33, the 3rd conveyer belt 33
Another side be provided with silicon chip baffle plate 38, the silicon chip baffle plate 38 is provided with flexible material layer towards the sidepiece of second conveyer belt 32
39；The top of second conveyer belt 32 is provided with silicon chip detection means 36, the silicon chip detection means 36 and a control system signal
Connection；The contrary one end of corresponding 4th conveyer belt 34 of 3rd conveyer belt 33 is provided with waste paper storage box 37；The control system
System is electrically connected with the drive motor of the 3rd conveyer belt 33.
It is preferred embodiment：The material of the flexible material layer 39 is silica gel.
It is preferred embodiment：The first conveyer belt 31 is obliquely installed, its high one end and second conveyer belt
32 are disposed adjacent.
It is preferred embodiment：The first conveyer belt 31, the second conveyer belt 32, the 3rd conveyer belt 33 and the 4th conveying
Band 34 is Timing Belt.
Method of work：Separating mechanism 10 is contacted with the water in feeder channel cell body 21, optimal mode is：Pumping pore 3
Positioned under water, burst conveyer belt 2 and 4 part of roller are located under water.
On the support platform 25 that stacking silicon chip 26 is placed in feeder channel cell body 21, and positioned at burst conveyer belt 2 just
Lower section, starts blowing device, air extractor and drives the driving means of burst conveyer belt rotation.When silicon chip contacts burst conveyer belt
Downside when, be evacuated pore produce absorption affinity of the negative pressure to silicon chip, the surface along with silicon chip there are water make silicon chip with
Cohesive force is produced between conveyer belt, silicon chip is adsorbed in the downside of burst conveyer belt, the silicon chip for so being contacted with burst conveyer belt
Gap can be produced between the silicon chip under which, air blowing pore is then blown towards gap, the gap for making water enter between silicon chip, so as to
The silicon chip contacted with burst conveyer belt is made thoroughly to separate with the stacking silicon chip under which, the silicon chip after separating then is moved down in effect of inertia
The position of roller is moved, as roller does not have Motor drive, therefore can be fallen after silicon chip reaches roller, be fallen and be disposed below
First conveyer belt 31 on.The first conveyer belt 31, the second conveyer belt 32, the 3rd conveyer belt 33, the 4th conveyer belt 34 and silicon
Piece detection means 36 is run simultaneously.
Silicon chip 35 delivers to the second conveyer belt 32 by first conveyer belt 31, the silicon chip detection dress above the second conveyer belt 32
Put 36（Generally CCD industrial cameras）Silicon chip 35 is detected, silicon chip 35 is delivered to the 3rd conveyer belt 33 by the second conveyer belt 32
On, when the control device being connected with 36 signal of silicon chip detection means finds 35 existing defects of silicon chip, control device control is electric with which
The motor of connection is sent out and is turned, and defective silicon chip is delivered to waste paper storage box 37, and normal silicon chip 35 is then sent by the 3rd conveyer belt 33
To the 4th conveyer belt 34, silicon chip is inserted in silicon wafer bearing box by the 4th conveyer belt 34.The effect of silicon chip baffle plate 38 is to prevent silicon
Piece 35 drops from the 3rd conveyer belt 33, when the effect of flexible material layer 39 is to prevent silicon chip 35 from hitting on silicon chip baffle plate 38, silicon
Piece baffle plate 38 produces damage to silicon chip.
Above-described embodiment technology design only to illustrate the invention and feature, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and implement according to this, can not be limited the scope of the invention with this.It is all according to the present invention
Equivalence changes or modification that spirit is made, should all be included within the scope of the present invention.
Claims (10)
1. a kind of silicon chip inserting piece device, it is characterised in that：Including separating mechanism, feeder channel and conveyer belt；The separating mechanism bag
Silicon chip separating mechanism body is included, two parallel and spaced burst conveyer belts below the silicon chip separating mechanism body, are provided with,
The silicon chip separating mechanism body is provided with pumping pore towards the burst conveyer belt, and the pumping pore is by pipeline and pumping dress
Put connection；The front end of the conveying direction of the corresponding burst conveyer belt of the silicon chip separating mechanism body is provided with roller；The silicon
Piece separating mechanism body is provided with blowing direction towards the air blowing pore of the burst conveyer belt, and the air blowing pore passes through pipeline and blows
Wind apparatus are connected；The feeder channel includes feeder channel cell body and water pump, and the feeder channel cell body is provided with overfall, and the overfall leads to
Cross pipeline to connect with a reservoir；It is provided with to hold the support platform of stacking silicon chip in the feeder channel cell body, the support is put down
Platform is connected with a drive division for moving up and down driving means；The feeder channel cell body is provided with hydrostatic sensor, the hydraulic pressure
Sensor is connected with a Computerized digital control system signal, and the Computerized digital control system is electrically connected with the water pump；The feed
Accommodate liquid in groove cell body, the height of the depth of liquid always greater than stacking silicon chip；The conveyer belt include first conveyer belt,
Second conveyer belt, the 3rd conveyer belt and the 4th conveyer belt, the first conveyer belt and the second conveyer belt set gradually, and the described 3rd
Conveyer belt and the 4th conveyer belt set gradually, and second conveyer belt and the 3rd conveyer belt are arranged into angle；3rd conveying
The size of silicon chip, relative opposite side are less than with the distance towards the side of the second conveyer belt and the gap of the second conveying strap end portion
While being provided with silicon chip baffle plate, the silicon chip baffle plate is provided with flexible material layer towards the sidepiece of second conveyer belt；Second conveying
Silicon chip detection means is provided with above band, the silicon chip detection means is connected with a control system signal；3rd conveyer belt pair
The one end for answering the 4th conveyer belt contrary is provided with waste paper storage box；The drive motor of the control system and the 3rd conveyer belt
Electrical connection；The corresponding burst conveyer belt of the support platform is arranged；One end of the first conveyer belt is located at the roller
Lower section.
2. silicon chip inserting piece device according to claim 1, it is characterised in that：The burst conveyer belt is Timing Belt.
3. silicon chip inserting piece device according to claim 2, it is characterised in that：The Timing Belt is set in drivewheel and driven
On wheel, the drivewheel is connected with driving means.
4. silicon chip inserting piece device according to claim 3, it is characterised in that：The driving means are a drive motor, should
The output shaft of drive motor passes through V belt translation with the drivewheel.
5. silicon chip inserting piece device according to claim 1, it is characterised in that：The silicon chip separating mechanism body is at described point
The front end of the conveying direction of piece conveyer belt is provided with roller fixed plate, and roller fixed plate court has pumping pore, the pumping gas
Hole is connected with air extractor by pipeline；The roller rotational support is in the roller fixed plate.
6. silicon chip inserting piece device according to claim 1, it is characterised in that：The silicon chip separating mechanism body is provided with one
The air cavity of closing, the air cavity are provided with several pumping pores towards the burst conveyer belt, and the air cavity is fixed with valve, the gas
Mouth is connected with air extractor by pipeline.
7. silicon chip inserting piece device according to claim 1, it is characterised in that：The silicon chip separating mechanism body correspondence is described
The rear end of the conveying direction of burst conveyer belt is provided with air blowing air cavity, and the air blowing air cavity is provided with blowing direction and conveys towards the burst
The air blowing pore of band, the air blowing air cavity are connected with blowing device by pipeline.
8. silicon chip inserting piece device according to claim 1, it is characterised in that：It is described to move up and down driving means for leading screw spiral shell
Parent agency.
9. silicon chip inserting piece device according to claim 1, it is characterised in that：The water inlet of the water pump passes through pipeline and institute
Reservoir connection is stated, the outlet of the water pump is connected with the feeder channel cell body by pipeline.
10. silicon chip inserting piece device according to claim 1, it is characterised in that：The material of the flexible material layer is silica gel；
The first conveyer belt is obliquely installed, and its high one end is disposed adjacent with second conveyer belt；The first conveyer belt, second
Conveyer belt, the 3rd conveyer belt and the 4th conveyer belt are Timing Belt；Second conveyer belt and the 3rd conveyer belt are arranged at a right angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029608.8A CN105428466B (en) | 2015-12-31 | 2015-12-31 | Silicon chip inserting piece device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029608.8A CN105428466B (en) | 2015-12-31 | 2015-12-31 | Silicon chip inserting piece device |
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| CN109449105B (en) * | 2018-11-19 | 2020-11-06 | 四川英发太阳能科技有限公司 | Improved structure of supporting block of sheet inserting machine |
| CN111416019B (en) * | 2020-03-30 | 2022-10-25 | 中赣新能源股份有限公司 | Inserting piece device for solar cell silicon wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103681968A (en) * | 2013-12-13 | 2014-03-26 | 无锡先导自动化设备股份有限公司 | Silicon wafer automatic insertion machine |
| CN104658954A (en) * | 2015-02-13 | 2015-05-27 | 苏州博阳能源设备有限公司 | Silicon wafer inserting machine |
| CN205303494U (en) * | 2015-12-31 | 2016-06-08 | 苏州博阳能源设备有限公司 | Silicon chip inserted sheet device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103681968A (en) * | 2013-12-13 | 2014-03-26 | 无锡先导自动化设备股份有限公司 | Silicon wafer automatic insertion machine |
| CN104658954A (en) * | 2015-02-13 | 2015-05-27 | 苏州博阳能源设备有限公司 | Silicon wafer inserting machine |
| CN205303494U (en) * | 2015-12-31 | 2016-06-08 | 苏州博阳能源设备有限公司 | Silicon chip inserted sheet device |
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