CN105428466A - Silicon chip insertion device - Google Patents
Silicon chip insertion device Download PDFInfo
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- CN105428466A CN105428466A CN201511029608.8A CN201511029608A CN105428466A CN 105428466 A CN105428466 A CN 105428466A CN 201511029608 A CN201511029608 A CN 201511029608A CN 105428466 A CN105428466 A CN 105428466A
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- conveyer belt
- silicon chip
- separating mechanism
- pipeline
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 125
- 239000010703 silicon Substances 0.000 title claims abstract description 125
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 118
- 230000037431 insertion Effects 0.000 title abstract 5
- 238000003780 insertion Methods 0.000 title abstract 5
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 238000007664 blowing Methods 0.000 claims abstract description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 239000011148 porous material Substances 0.000 claims description 29
- 210000005056 cell body Anatomy 0.000 claims description 23
- 230000000740 bleeding effect Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 11
- 150000003376 silicon Chemical class 0.000 claims description 9
- 230000002706 hydrostatic effect Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000010893 paper waste Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000013519 translation Methods 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000003203 everyday effect Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000003345 natural gas Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A silicon chip insertion device comprises a chip separating mechanism, a feeding trough and conveyor belts. The chip separating mechanism comprises a chip separating mechanism body. Two separated chip conveyor belts which are parallelly and separately arranged are configured below the chip separating mechanism body. The chip separating mechanism body is provided with air exhausting holes in a manner of facing the separated chip conveyor belts. The air exhausting holes are communicated with an air exhausting device through pipeline. The chip separating mechanism body is provided with rollers at positions which correspond with the front end of the conveying direction of the separated chip conveyor belts. The chip separating mechanism body is provided with air blowing holes of which the air blowing direction faces the separated chip conveyor belts. The air blowing holes are communicated with an air blower through pipeline. The feeding trough comprises a feeding trough body and a water pump. The feeding trough body accommodates liquid. The depth of the liquid is always larger than the height of stacked silicon chips. The conveyor belts comprise a first conveyor belt, a second conveyor belt, a third conveyor belt and a fourth conveyor belt. The silicon chip insertion device has advantages of high silicon chip insertion efficiency and small silicon chip damage in silicon chip insertion.
Description
Technical field
The present invention relates to a kind of silicon chip inserting piece device, belong to solar battery sheet and prepare auxiliary device field.
Background technology
Since 21 century, global Energy Consumption sharply rises, and traditional fossil energy is day by day exhausted, and energy problem and environmental problem become two large Important Problems of global concern gradually.Under the pressure of the pressure of sustainable development, solar photovoltaic industry is listed in the emphasis that regenerative resource develops by each major country one after another.Become the second in the world economy along with China, in October, 2013, China's petroleum import in October amount reaches every day 6,300,000 barrels, exceedes the every day 6,240,000 barrels of the U.S., and replacing the U.S. first becomes global maximum net import of oil state.2013, the external dependence degree of CNPC and natural gas reached 58.1% and 31.6% respectively, and China has become global the third-largest natural gas consumption state.Traditional fossil energy is more and more difficult to the thriving demand meeting Chinese national economy.In in the past 20 years, the artificial CO2 emissions in the whole world nearly about 75% derives from combustion of fossil fuel.Therefore, be no matter the energy development angle from low-carbon environment-friendly, still comply with Industry Structure upgrading and transition pressure, China must accelerate development New Energy Industry.
Solar energy belongs to clean reproducible energy.According to " European renewable energy technologies strategic plan " that EU Committee proposes, to the year two thousand twenty, solar energy will account for 15% of European Union's electricity needs.2010, USDOE developed planning, and planned the year two thousand thirty, and solar energy accounts for 10% ~ 15% of total energy consumption figure.Take temperature from worldwide solar energy and the generating of tidal energy aggregate net, China is 3,000,000,000 kilowatt hours, and Germany is 19,000,000,000 dry watt-hours, and Italy is 10,700,000,000 dry watt-hours, and Spain is 9,100,000,000 kilowatt hours, and Japan is 3,800,000,000 kilowatt hours.Following China water power growth space is limited, and nuclear energy exists unsafe factor.Fossil energy will rise by energy-saving and emission-reduction committed cost, the wide market of solar energy power generating.
The processing of monocrystalline silicon piece comprises the first evolution of silicon single crystal rod, then cuts into slices, and the processing of polysilicon chip comprises polycrystal silicon ingot cutting, then cuts into slices, and the processing of quasi-monocrystalline silicon comprises mono-like silicon ingot cutting, then cuts into slices.Generally speaking, section is one of requisite technique in crystal silicon solar cell sheet processing technology.The silicon wafer layer obtained after section stacks, and inserts in silicon wafer bearing box and transport after needing burst, and because silicon chip has thin, crisp, therefore the difficulty of burst, inserted sheet is very large.
Publication number is the application for a patent for invention of CN103681968A, discloses a kind of automatic machine for inserting silicon wafers, and it adopts sucker to capture silicon chip to carry out burst, inserted sheet, and the action capturing silicon chip due to sucker is discontinuous operation, therefore there is the inefficient problem of burst.
Summary of the invention
The object of the invention is to provide a kind of silicon chip inserting piece device.
For achieving the above object, the technical solution used in the present invention is: a kind of silicon chip inserting piece device, comprises separating mechanism, feeder channel and conveyer belt; Described separating mechanism comprises silicon chip separating mechanism body, this silicon chip separating mechanism body is to having two parallel and spaced burst conveyer belts, described silicon chip separating mechanism body is provided with towards described burst conveyer belt pore of bleeding, and this pore of bleeding is communicated with air extractor by pipeline; The front end of the throughput direction of the corresponding described burst conveyer belt of described silicon chip separating mechanism body is provided with roller; Described silicon chip separating mechanism body is provided with the air blowing pore of blowing direction towards described burst conveyer belt, and this air blowing pore is communicated with blowing device by pipeline; Described feeder channel comprises feeder channel cell body and water pump, and described feeder channel cell body is provided with overfall, and this overfall is communicated with a reservoir by pipeline; Be provided with the support platform holding stacking silicon chip in described feeder channel cell body, the drive division that this support platform and one moves up and down drive unit is in transmission connection; Described feeder channel cell body is provided with hydrostatic sensor, and this hydrostatic sensor is connected with a Computerized digital control system signal, and described Computerized digital control system is electrically connected with described water pump; Accommodate liquid in described feeder channel cell body, the degree of depth of liquid is always greater than the height of stacking silicon chip; Described conveyer belt comprises the first conveyer belt, the second conveyer belt, the 3rd conveyer belt and the 4th conveyer belt, described first conveyer belt and the second conveyer belt set gradually, described 3rd conveyer belt and the 4th conveyer belt set gradually, and described second conveyer belt becomes angle to arrange with the 3rd conveyer belt; Described 3rd conveyer belt is less than the size of silicon chip towards the distance in the gap of the side of the second conveyer belt and the second conveyer belt end, and another relative side is provided with silicon chip baffle plate, and this silicon chip baffle plate is provided with flexible material layer towards the sidepiece of described second conveyer belt; The top of described second conveyer belt is provided with silicon chip checkout gear, and this silicon chip checkout gear is connected with a control system signal; One end that corresponding described 4th conveyer belt of described 3rd conveyer belt is contrary is provided with waste paper storage box; Described control system is electrically connected with the CD-ROM drive motor of described 3rd conveyer belt; The corresponding described burst conveyer belt of described support platform is arranged; One end of described first conveyer belt is positioned at the below of described roller.
Preferred technical scheme is: described burst conveyer belt is Timing Belt.
Preferred technical scheme is: described Timing Belt is set on driving wheel and driven pulley, and described driving wheel and drive unit are in transmission connection.
Preferred technical scheme is: described drive unit is a CD-ROM drive motor, and output shaft and the described driving wheel of this CD-ROM drive motor pass through V belt translation.
Preferred technical scheme is: described silicon chip separating mechanism body is provided with roller fixed head in the front end of the throughput direction of described burst conveyer belt, and this roller fixed head is towards having pore of bleeding, and this pore of bleeding is communicated with air extractor by pipeline; Described roller rotational support is on described roller fixed head.
Preferred technical scheme is: described silicon chip separating mechanism body is provided with an air cavity closed, and this air cavity is provided with several pores of bleeding towards described burst conveyer belt, and described air cavity is fixed with valve, and this valve is communicated with air extractor by pipeline.
Preferred technical scheme is: the rear end of the throughput direction of the corresponding described burst conveyer belt of described silicon chip separating mechanism body is provided with air blowing air cavity, this air blowing air cavity is provided with the air blowing pore of blowing direction towards described burst conveyer belt, and described air blowing air cavity is communicated with blowing device by pipeline.
Preferred technical scheme for: described in move up and down drive unit be screw-nut body.
Preferred technical scheme is: the water inlet of described water pump is communicated with described reservoir by pipeline, and the delivery port of described water pump is communicated with described feeder channel cell body by pipeline.
Preferred technical scheme is: the material of described flexible material layer is silica gel; Described first conveyer belt is obliquely installed, and its high one end is disposed adjacent with described second conveyer belt; Described first conveyer belt, the second conveyer belt, the 3rd conveyer belt and the 4th conveyer belt are Timing Belt; Described second conveyer belt and the setting at a right angle of the 3rd conveyer belt.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
The present invention when inserted sheet, have inserted sheet efficiency high, little advantage is damaged to silicon chip.
Accompanying drawing explanation
Accompanying drawing 1 is silicon chip separating mechanism schematic perspective view.
Accompanying drawing 2 is silicon chip separating mechanism elevational schematic view.
Accompanying drawing 3 is silicon chip separating mechanism schematic top plan view.
Accompanying drawing 4 is silicon chip separating mechanism schematic side view.
Accompanying drawing 5 is silicon chip separating mechanism schematic rear view.
Accompanying drawing 6 is feeder channel schematic diagram.
Accompanying drawing 7 is conveyer belt schematic side view.
Accompanying drawing 8 is conveyer belt schematic top plan view.
In above accompanying drawing: 1, silicon chip separating mechanism body; 2, burst conveyer belt; 3, to bleed pore; 4, roller; 5, valve; 6, roller fixed head; 7, air blowing pore; 8, air blowing air cavity; 9, pipeline; 10, separating mechanism; 21, feeder channel cell body; 22, water pump; 23, overfall; 24, reservoir; 25, support platform; 26, stacking silicon chip; 27, hydrostatic sensor; 31, the first conveyer belt; 32, the second conveyer belt; 33, the 3rd conveyer belt; 34, the 4th conveyer belt; 35, silicon chip; 36, silicon chip checkout gear; 37, waste paper storage box; 38, silicon chip baffle plate 39, flexible material layer.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Embodiment: silicon chip inserting piece device
Shown in accompanying drawing 1 ~ 8, a kind of silicon chip inserting piece device, comprises separating mechanism 10, feeder channel and conveyer belt.
Separating mechanism 10 comprises silicon chip separating mechanism body 1, this silicon chip separating mechanism body 1 is to having two parallel and spaced burst conveyer belts 2, described silicon chip separating mechanism body 1 is provided with towards described burst conveyer belt 2 pore 3 of bleeding, this pore 3 of bleeding is communicated with air extractor (not shown) by pipeline, and air extractor can be vacuum suction device.The front end of the throughput direction of the corresponding described burst conveyer belt 2 of described silicon chip separating mechanism body 1 is provided with roller 4; Described silicon chip separating mechanism body 1 is provided with the air blowing pore 7 of blowing direction towards described burst conveyer belt 2, and this air blowing pore 7 is communicated with blowing device (not shown) by pipeline 9.Blowing device can be such as air blast.
Be preferred embodiment: described burst conveyer belt 2 is Timing Belt.
Be preferred embodiment: described Timing Belt is set on driving wheel and driven pulley, and described driving wheel and drive unit are in transmission connection.
Be preferred embodiment: described drive unit is a CD-ROM drive motor that output shaft and the described driving wheel of this CD-ROM drive motor pass through V belt translation.CD-ROM drive motor can be hydraulic motor or motor etc.
Be preferred embodiment: described silicon chip separating mechanism body 1 is provided with roller fixed head 6 in the front end of the throughput direction of described burst conveyer belt 2 that this roller fixed head 6 is towards having pore 3 of bleeding, and this pore 3 of bleeding is communicated with air extractor by pipeline; Described roller 4 rotational support is on described roller fixed head 6.
Be preferred embodiment: described silicon chip separating mechanism body 1 is provided with an air cavity closed, and this air cavity is provided with several pores 3 of bleeding towards described burst conveyer belt 2, and described air cavity is fixed with valve 5, and this valve 5 is communicated with air extractor by pipeline.
Be preferred embodiment: the rear end of the throughput direction of the corresponding described burst conveyer belt 2 of described silicon chip separating mechanism body 1 is provided with air blowing air cavity 8, this air blowing air cavity 8 is provided with the air blowing pore 7 of blowing direction towards described burst conveyer belt 2, and described air blowing air cavity 8 is communicated with blowing device by pipeline 9.
Feeder channel comprises feeder channel cell body 21 and water pump 22, and described feeder channel cell body 21 is provided with overfall 23, and this overfall 23 is communicated with a reservoir 24 by pipeline; Be provided with the support platform 25 holding stacking silicon chip 26 in described feeder channel cell body 21, this support platform 25 and a drive division moving up and down drive unit are in transmission connection; Described feeder channel cell body 21 is provided with hydrostatic sensor 27, and this hydrostatic sensor 27 is connected with a Computerized digital control system signal, and described Computerized digital control system is electrically connected with described water pump 22; Accommodate liquid in described feeder channel cell body 1, the degree of depth of liquid is always greater than the height of stacking silicon chip.The described drive unit that moves up and down is screw-nut body.The water inlet of described water pump is communicated with described reservoir by pipeline, and the delivery port of described water pump is communicated with described feeder channel cell body by pipeline.
The liquid level that hydrostatic sensor 27 detects, carry out control system of switching on or off electricity to water pump, to make to accommodate liquid in described feeder channel cell body 1, the degree of depth of liquid is always greater than the height of stacking silicon chip.Liquid in feeder channel cell body 1 is generally water, also can adopt the fluid instead of water of other kind, but can not damage and not affect the following process of silicon chip.
Conveyer belt comprises the first conveyer belt 31, second conveyer belt 32, the 3rd conveyer belt 33 and the 4th conveyer belt 34, in order to extend fed distance, the conveyer belt consistent with the first conveyer belt 31 throughput direction can be increased, the conveyer belt consistent with the 4th conveyer belt 34 throughput direction.
Described first conveyer belt 31 and the second conveyer belt 32 set gradually, and the first conveyer belt 31 is identical with the throughput direction of the second conveyer belt 32, and namely the silicon chip 35 on it is delivered on the second conveyer belt 32 by the first conveyer belt 31.Described 3rd conveyer belt 33 and the 4th conveyer belt 34 set gradually, and namely the silicon chip 35 on it is delivered on the 4th conveyer belt 34 by the 3rd conveyer belt 33, and the 4th conveyer belt 34 the most at last silicon chip is delivered on silicon wafer bearing box.
Described second conveyer belt 32 is arranged with the 3rd conveyer belt 33 one-tenth angle, preferred forms is: described second conveyer belt 32 and the setting at a right angle of the 3rd conveyer belt 33, namely the second conveyer belt 32 is by the end of the silicon chip 35 on it by the second conveyer belt 32, and the side through the 3rd conveyer belt 33 is delivered on the 3rd conveyer belt 33.
Described 3rd conveyer belt 33 is less than the size of silicon chip 35 towards the distance in the gap of the side of the second conveyer belt 32 and the second conveyer belt 32 end, dropped by another side of the 3rd conveyer belt 33 to stop silicon chip 35, another side of described 3rd conveyer belt 33 is provided with silicon chip baffle plate 38, and this silicon chip baffle plate 38 is provided with flexible material layer 39 towards the sidepiece of described second conveyer belt 32; The top of described second conveyer belt 32 is provided with silicon chip checkout gear 36, and this silicon chip checkout gear 36 is connected with a control system signal; One end that corresponding described 4th conveyer belt 34 of described 3rd conveyer belt 33 is contrary is provided with waste paper storage box 37; Described control system is electrically connected with the CD-ROM drive motor of described 3rd conveyer belt 33.
Be preferred embodiment: the material of described flexible material layer 39 is silica gel.
Be preferred embodiment: described first conveyer belt 31 is obliquely installed, its high one end is disposed adjacent with described second conveyer belt 32.
Be preferred embodiment: described first conveyer belt 31, second conveyer belt 32, the 3rd conveyer belt 33 and the 4th conveyer belt 34 are Timing Belt.
Method of work: contacted with the water in feeder channel cell body 21 by separating mechanism 10, best mode is: pore 3 of bleeding is positioned under water, and burst conveyer belt 2 and roller 4 part are positioned under water.
Stacking silicon chip 26 is placed on the support platform 25 in feeder channel cell body 21, and is positioned at immediately below burst conveyer belt 2, start the drive unit that blowing device, air extractor and driving burst conveyer belt rotate.When the downside of silicon chip contact burst conveyer belt, the negative pressure that pore of bleeding produces is to the absorption affinity of silicon chip, the surface of adding silicon chip has water to be made to produce cohesive force between silicon chip and conveyer belt, silicon chip is adsorbed on the downside of burst conveyer belt, gap can be produced between the silicon chip contacted with burst conveyer belt like this and the silicon chip under it, air blowing pore is then blown towards gap, water is made to enter gap between silicon chip, thus the silicon chip contacted with burst conveyer belt is thoroughly separated with the stacking silicon chip under it, silicon chip separately is then moved to the position of roller at effect of inertia, because roller does not have motor to drive, therefore can fall after silicon chip arrives roller, fall on the first conveyer belt 31 of being positioned at below it.Described first conveyer belt 31, second conveyer belt 32, the 3rd conveyer belt 33, the 4th conveyer belt 34 and silicon chip checkout gear 36 run simultaneously.
Silicon chip 35 delivers to the second conveyer belt 32 by the first conveyer belt 31, the silicon chip checkout gear 36(be positioned at above the second conveyer belt 32 is generally CCD industrial camera) silicon chip 35 is detected, silicon chip 35 is delivered on the 3rd conveyer belt 33 by the second conveyer belt 32, when the control device be connected with silicon chip checkout gear 36 signal finds silicon chip 35 existing defects, the motor that control device controls to be connected electrically is sent out and is turned, defective silicon chip is delivered to waste paper storage box 37, normal silicon chip 35 delivers to the 4th conveyer belt 34 by the 3rd conveyer belt 33, by the 4th conveyer belt 34, silicon chip is inserted in silicon wafer bearing box.The effect of silicon chip baffle plate 38 prevents silicon chip 35 from dropping from the 3rd conveyer belt 33, and the effect of flexible material layer 39 is when preventing silicon chip 35 from hitting on silicon chip baffle plate 38, and silicon chip baffle plate 38 pairs of silicon chips produce damage.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (10)
1. a silicon chip inserting piece device, is characterized in that: comprise separating mechanism, feeder channel and conveyer belt; Described separating mechanism comprises silicon chip separating mechanism body, this silicon chip separating mechanism body is to having two parallel and spaced burst conveyer belts, described silicon chip separating mechanism body is provided with towards described burst conveyer belt pore of bleeding, and this pore of bleeding is communicated with air extractor by pipeline; The front end of the throughput direction of the corresponding described burst conveyer belt of described silicon chip separating mechanism body is provided with roller; Described silicon chip separating mechanism body is provided with the air blowing pore of blowing direction towards described burst conveyer belt, and this air blowing pore is communicated with blowing device by pipeline; Described feeder channel comprises feeder channel cell body and water pump, and described feeder channel cell body is provided with overfall, and this overfall is communicated with a reservoir by pipeline; Be provided with the support platform holding stacking silicon chip in described feeder channel cell body, the drive division that this support platform and one moves up and down drive unit is in transmission connection; Described feeder channel cell body is provided with hydrostatic sensor, and this hydrostatic sensor is connected with a Computerized digital control system signal, and described Computerized digital control system is electrically connected with described water pump; Accommodate liquid in described feeder channel cell body, the degree of depth of liquid is always greater than the height of stacking silicon chip; Described conveyer belt comprises the first conveyer belt, the second conveyer belt, the 3rd conveyer belt and the 4th conveyer belt, described first conveyer belt and the second conveyer belt set gradually, described 3rd conveyer belt and the 4th conveyer belt set gradually, and described second conveyer belt becomes angle to arrange with the 3rd conveyer belt; Described 3rd conveyer belt is less than the size of silicon chip towards the distance in the gap of the side of the second conveyer belt and the second conveyer belt end, and another relative side is provided with silicon chip baffle plate, and this silicon chip baffle plate is provided with flexible material layer towards the sidepiece of described second conveyer belt; The top of described second conveyer belt is provided with silicon chip checkout gear, and this silicon chip checkout gear is connected with a control system signal; One end that corresponding described 4th conveyer belt of described 3rd conveyer belt is contrary is provided with waste paper storage box; Described control system is electrically connected with the CD-ROM drive motor of described 3rd conveyer belt; The corresponding described burst conveyer belt of described support platform is arranged; One end of described first conveyer belt is positioned at the below of described roller.
2. silicon chip inserting piece device according to claim 1, is characterized in that: described burst conveyer belt is Timing Belt.
3. silicon chip inserting piece device according to claim 2, is characterized in that: described Timing Belt is set on driving wheel and driven pulley, and described driving wheel and drive unit are in transmission connection.
4. silicon chip inserting piece device according to claim 3, is characterized in that: described drive unit is a CD-ROM drive motor, and output shaft and the described driving wheel of this CD-ROM drive motor pass through V belt translation.
5. silicon chip inserting piece device according to claim 1, it is characterized in that: described silicon chip separating mechanism body is provided with roller fixed head in the front end of the throughput direction of described burst conveyer belt, this roller fixed head is towards having pore of bleeding, and this pore of bleeding is communicated with air extractor by pipeline; Described roller rotational support is on described roller fixed head.
6. silicon chip inserting piece device according to claim 1, it is characterized in that: described silicon chip separating mechanism body is provided with an air cavity closed, this air cavity is provided with several pores of bleeding towards described burst conveyer belt, and described air cavity is fixed with valve, and this valve is communicated with air extractor by pipeline.
7. silicon chip inserting piece device according to claim 1, it is characterized in that: the rear end of the throughput direction of the corresponding described burst conveyer belt of described silicon chip separating mechanism body is provided with air blowing air cavity, this air blowing air cavity is provided with the air blowing pore of blowing direction towards described burst conveyer belt, and described air blowing air cavity is communicated with blowing device by pipeline.
8. silicon chip inserting piece device according to claim 1, is characterized in that: described in move up and down drive unit be screw-nut body.
9. silicon chip inserting piece device according to claim 1, is characterized in that: the water inlet of described water pump is communicated with described reservoir by pipeline, and the delivery port of described water pump is communicated with described feeder channel cell body by pipeline.
10. silicon chip inserting piece device according to claim 1, is characterized in that: the material of described flexible material layer is silica gel; Described first conveyer belt is obliquely installed, and its high one end is disposed adjacent with described second conveyer belt; Described first conveyer belt, the second conveyer belt, the 3rd conveyer belt and the 4th conveyer belt are Timing Belt; Described second conveyer belt and the setting at a right angle of the 3rd conveyer belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029608.8A CN105428466B (en) | 2015-12-31 | 2015-12-31 | Silicon chip inserting piece device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029608.8A CN105428466B (en) | 2015-12-31 | 2015-12-31 | Silicon chip inserting piece device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105428466A true CN105428466A (en) | 2016-03-23 |
| CN105428466B CN105428466B (en) | 2017-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511029608.8A Expired - Fee Related CN105428466B (en) | 2015-12-31 | 2015-12-31 | Silicon chip inserting piece device |
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| CN (1) | CN105428466B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449105A (en) * | 2018-11-19 | 2019-03-08 | 四川英发太阳能科技有限公司 | A kind of plug-in sheet machine supporting block improvement structure |
| CN111416019A (en) * | 2020-03-30 | 2020-07-14 | 中赣新能源股份有限公司 | Inserting piece device for solar cell silicon wafer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013173867A1 (en) * | 2012-05-21 | 2013-11-28 | Newsouth Innovations Pty Limited | Advanced hydrogenation of silicon solar cells |
| CN103681968A (en) * | 2013-12-13 | 2014-03-26 | 无锡先导自动化设备股份有限公司 | Silicon wafer automatic insertion machine |
| CN104658954A (en) * | 2015-02-13 | 2015-05-27 | 苏州博阳能源设备有限公司 | Silicon wafer inserting machine |
| CN205303494U (en) * | 2015-12-31 | 2016-06-08 | 苏州博阳能源设备有限公司 | Silicon chip inserted sheet device |
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2015
- 2015-12-31 CN CN201511029608.8A patent/CN105428466B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013173867A1 (en) * | 2012-05-21 | 2013-11-28 | Newsouth Innovations Pty Limited | Advanced hydrogenation of silicon solar cells |
| CN103681968A (en) * | 2013-12-13 | 2014-03-26 | 无锡先导自动化设备股份有限公司 | Silicon wafer automatic insertion machine |
| CN104658954A (en) * | 2015-02-13 | 2015-05-27 | 苏州博阳能源设备有限公司 | Silicon wafer inserting machine |
| CN205303494U (en) * | 2015-12-31 | 2016-06-08 | 苏州博阳能源设备有限公司 | Silicon chip inserted sheet device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449105A (en) * | 2018-11-19 | 2019-03-08 | 四川英发太阳能科技有限公司 | A kind of plug-in sheet machine supporting block improvement structure |
| CN109449105B (en) * | 2018-11-19 | 2020-11-06 | 四川英发太阳能科技有限公司 | Improved structure of supporting block of sheet inserting machine |
| CN111416019A (en) * | 2020-03-30 | 2020-07-14 | 中赣新能源股份有限公司 | Inserting piece device for solar cell silicon wafer |
| CN111416019B (en) * | 2020-03-30 | 2022-10-25 | 中赣新能源股份有限公司 | Inserting piece device for solar cell silicon wafer |
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| Publication number | Publication date |
|---|---|
| CN105428466B (en) | 2017-03-29 |
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