CN104658954A - Silicon wafer inserting machine - Google Patents
Silicon wafer inserting machine Download PDFInfo
- Publication number
- CN104658954A CN104658954A CN201510079350.6A CN201510079350A CN104658954A CN 104658954 A CN104658954 A CN 104658954A CN 201510079350 A CN201510079350 A CN 201510079350A CN 104658954 A CN104658954 A CN 104658954A
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- conveyer belt
- silicon chip
- silicon wafer
- silicon
- conveying belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Silicon Compounds (AREA)
Abstract
A silicon wafer inserting machine comprises a no-load silicon wafer carrying box conveying belt, a loaded silicon wafer carrying box conveying belt and a silicon wafer supply device, wherein the silicon wafer supply device comprises a silicon wafer distributing mechanism and a silicon wafer conveying mechanism; the silicon wafer distributing mechanism comprises a first conveying belt, a second conveying belt, a wafer storage box and a blowing port; the silicon wafer conveying mechanism comprises at least one third conveying belt and at least one fourth conveying belt; the second conveying belt of the silicon wafer distributing mechanism is butt-jointed with the silicon wafer conveying mechanism; the no-load silicon wafer carrying box conveying belt and the loaded silicon wafer carrying box conveying belt are parallel to each other and arranged at an interval, and the silicon wafer supply device is arranged between the no-load silicon wafer carrying box conveying belt and the loaded silicon wafer carrying box conveying belt. The silicon wafer inserting machine structurally comprises the no-load silicon wafer carrying box conveying belt, the loaded silicon wafer carrying box conveying belt and the silicon wafer supply device, silicon wafer carrying boxes are loaded with silicon wafers automatically through combination of the no-load silicon wafer carrying box conveying belt, the loaded silicon wafer carrying box conveying belt and the silicon wafer supply device, and the silicon wafer inserting machine has the advantage of high production efficiency.
Description
Technical field
The present invention relates to a kind of silicon chip inserting machine, belong to solar battery sheet and prepare auxiliary device field.
Background technology
Since 21 century, global Energy Consumption sharply rises, and traditional fossil energy is day by day exhausted, and energy problem and environmental problem become two large Important Problems of global concern gradually.Under the pressure of the pressure of sustainable development, solar photovoltaic industry is listed in the emphasis that regenerative resource develops by each major country one after another.Become the second in the world economy along with China, in October, 2013, China's petroleum import in October amount reaches every day 6,300,000 barrels, exceedes the every day 6,240,000 barrels of the U.S., and replacing the U.S. first becomes global maximum net import of oil state.2013, the external dependence degree of CNPC and natural gas reached 58.1% and 31.6% respectively, and China has become global the third-largest natural gas consumption state.Traditional fossil energy is more and more difficult to the thriving demand meeting Chinese national economy.In in the past 20 years, the artificial CO2 emissions in the whole world nearly about 75% derives from combustion of fossil fuel.Therefore, be no matter the energy development angle from low-carbon environment-friendly, still comply with Industry Structure upgrading and transition pressure, China must accelerate development New Energy Industry.
Solar energy belongs to clean reproducible energy.According to " European renewable energy technologies strategic plan " that EU Committee proposes, to the year two thousand twenty, solar energy will account for 15% of European Union's electricity needs.2010, USDOE developed planning, and planned the year two thousand thirty, and solar energy accounts for 10% ~ 15% of total energy consumption figure.Take temperature from worldwide solar energy and the generating of tidal energy aggregate net, China is 3,000,000,000 kilowatt hours, and Germany is 19,000,000,000 dry watt-hours, and Italy is 10,700,000,000 dry watt-hours, and Spain is 9,100,000,000 kilowatt hours, and Japan is 3,800,000,000 kilowatt hours.Following China water power growth space is limited, and nuclear energy exists unsafe factor.Fossil energy will rise by energy-saving and emission-reduction committed cost, the wide market of solar energy power generating.
The processing of monocrystalline silicon piece comprises the first evolution of silicon single crystal rod, then cuts into slices, and the processing of polysilicon chip comprises polycrystal silicon ingot cutting, then cuts into slices, and the processing of quasi-monocrystalline silicon comprises mono-like silicon ingot cutting, then cuts into slices.Generally speaking, section is one of requisite technique in crystal silicon solar cell sheet processing technology.The silicon wafer layer obtained after section stacks, and inserts in silicon wafer bearing box and transport after needing burst, and because silicon chip has thin, crisp, therefore the difficulty of burst, inserted sheet is very large.
Publication number is the application for a patent for invention of CN103681968A, discloses a kind of automatic machine for inserting silicon wafers, and it adopts sucker to capture silicon chip to carry out burst, inserted sheet, and the action capturing silicon chip due to sucker is discontinuous operation, therefore there is inefficient problem.
Summary of the invention
The object of the invention is to provide a kind of silicon chip inserting machine.
For achieving the above object, the technical solution used in the present invention is: a kind of silicon chip inserting machine, comprise unloaded silicon wafer bearing box conveyer belt, load silicon wafer bearing box conveyer belt and silicon chip film feeding apparatus, described silicon chip film feeding apparatus comprises silicon chip separating mechanism and silicon chip conveying mechanism; Described silicon chip separating mechanism comprises the first conveyer belt, the second conveyer belt, hopper and inflatable mouth; Described first conveyer belt and the second conveyer belt are between the upper and lower every setting, described first conveyer belt is positioned at the top of described second conveyer belt, and the projection of the first end of described first conveyer belt is positioned on described second conveyer belt, second end of corresponding described first conveyer belt of described hopper is arranged, and is provided with silicon chip and moves up and down drive unit in described hopper; Described inflatable mouth is positioned at the below of described first conveyer belt, and blowing direction is arranged towards described hopper; Described silicon chip conveying mechanism comprises at least one the 3rd conveyer belt and at least one the 4th conveyer belt; The driven shaft of described 3rd conveyer belt is articulated with on the piston rod of a driving cylinder, and the below of one end of the driven shaft of described 3rd conveyer belt is provided with useless silicon chip receiver; Described 3rd conveyer belt and the 4th conveyer belt series winding are arranged; Second conveyer belt of described silicon chip separating mechanism docks with described silicon chip conveying mechanism; Described unloaded silicon wafer bearing box conveyer belt and the parallel and interval of load silicon wafer bearing box conveyer belt are arranged, and described silicon chip film feeding apparatus is located between described unloaded silicon wafer bearing box conveyer belt and load silicon wafer bearing box conveyer belt.
Preferred technical scheme is: described inflatable mouth is communicated with a feeder by pipeline.
Preferred technical scheme is: described first conveyer belt is obliquely installed.
Preferred technical scheme is: accommodate water in described hopper.
Preferred technical scheme is: described 4th conveyer belt is horizontally disposed with.
Preferred technical scheme is: accommodate water in described useless silicon chip receiver.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
Structure of the present invention comprises unloaded silicon wafer bearing box conveyer belt, load silicon wafer bearing box conveyer belt and silicon chip film feeding apparatus, and three's combination realizes silicon chip and automatically disguises silicon wafer bearing box process, has the advantage that production efficiency is high.
Accompanying drawing explanation
Accompanying drawing 1 is silicon chip inserting machine schematic diagram.
Accompanying drawing 2 is the A portion enlarged drawing of accompanying drawing 1.
Accompanying drawing 3 is the first conveyer belt and the second conveyer belt relation schematic diagram.
Accompanying drawing 4 silicon chip inserting machine film feeding apparatus schematic diagram.
In above accompanying drawing: 1, the first conveyer belt; 2, the second conveyer belt; 3, drive motors; 4, inflatable mouth; 5, the 3rd conveyer belt; 6, the 4th conveyer belt; 7, useless silicon chip receiver; 8, driving cylinder; 11, unloaded silicon wafer bearing box conveyer belt; 12, load silicon wafer bearing box conveyer belt; 13, silicon wafer bearing box conveyer belt.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Embodiment: a kind of silicon chip inserting machine
Shown in accompanying drawing 1 ~ 4, a kind of silicon chip inserting machine, comprise unloaded silicon wafer bearing box conveyer belt 11, load silicon wafer bearing box conveyer belt 12 and silicon chip film feeding apparatus, described silicon chip film feeding apparatus comprises silicon chip separating mechanism and silicon chip conveying mechanism; Described silicon chip separating mechanism comprises the first conveyer belt 1, second conveyer belt 2, hopper and inflatable mouth 3; Described first conveyer belt 1 is obliquely installed, and described first conveyer belt 1 and the second conveyer belt 2 are between the upper and lower every setting; Described first conveyer belt 1 is positioned at the top of described second conveyer belt 2, and the projection of the first end of described first conveyer belt 1 is positioned on described second conveyer belt 2, second end of corresponding described first conveyer belt 1 of described hopper is arranged, and is provided with silicon chip and moves up and down drive unit in described hopper; Described inflatable mouth 4 is positioned at the below of described first conveyer belt 1, and blowing direction is arranged towards described hopper; Water is accommodated in described hopper.Described inflatable mouth 4 is communicated with a feeder by pipeline.
Described silicon chip conveying mechanism comprises the 3rd conveyer belt 5 and three the 4th conveyer belts 6.Described 4th conveyer belt 6 is common Timing Belt, and the distance that its quantity is carried according to silicon chip is determined, can certainly be extended the distance of silicon chip conveying by the length increasing by the 4th conveyer belt 6.3rd conveyer belt 5 drives with drive motors respectively with the driving shaft of the 4th conveyer belt 6 and is connected, and concrete mode can be V belt translation or Chain conveyer.The driven shaft of described 3rd conveyer belt 5 is articulated with on the piston rod of a driving cylinder 8, driving cylinder 8 can be cylinder, also can be hydraulic jack, the present embodiment specifically adopts hydraulic jack, under the piston rod of hydraulic jack is in the state of stretching out, then the 3rd conveyer belt 5 is for being horizontally disposed with, at this moment the silicon chip be positioned on the 3rd conveyer belt 5 can normally be carried, when piston rod is in retracted mode, then the 3rd conveyer belt 5 is for being obliquely installed, at this moment the useless silicon chip receiver 7 that the below that the silicon chip be positioned on the 3rd conveyer belt 5 then slides to one end of the driven shaft of described 3rd conveyer belt 5 is arranged.Described 3rd conveyer belt 5 and the 4th conveyer belt 6 series winding are arranged, and namely described 3rd conveyer belt 5 and the 4th conveyer belt 6 continue and to carry silicon chip.
Second conveyer belt 2 of described silicon chip separating mechanism docks with described silicon chip conveying mechanism, and the silicon chip namely on the second conveyer belt 2 is delivered on the 4th conveyer belt 6 of silicon chip conveying mechanism.Described inflatable mouth is communicated with a feeder by pipeline, and this feeder can be air blast.Described first conveyer belt is obliquely installed.Water is accommodated in described hopper.Described 4th conveyer belt is horizontally disposed with.Water is accommodated in described useless silicon chip receiver.
Described unloaded silicon wafer bearing box conveyer belt 11 and the parallel and interval of load silicon wafer bearing box conveyer belt 12 are arranged, and described silicon chip film feeding apparatus is located between described unloaded silicon wafer bearing box conveyer belt 11 and load silicon wafer bearing box conveyer belt 12.
Unloaded silicon wafer bearing box conveyer belt 11 is used for transporting unloaded silicon wafer bearing box 13.Unloaded silicon wafer bearing box conveyer belt 11, the common end of load silicon wafer bearing box conveyer belt 12 and silicon chip film feeding apparatus is provided with silicon wafer bearing box transfer device, after silicon wafer bearing box 13 is transported to end by unloaded silicon wafer bearing box conveyer belt 11, silicon chip carrying is shifted and is aimed at the conveying end setting of silicon chip film feeding apparatus by silicon wafer bearing box transfer device, silicon chip can be inserted in silicon wafer bearing box 13 by such silicon chip film feeding apparatus, after silicon wafer bearing box 13 sticks with, by silicon wafer bearing box transfer device the silicon wafer bearing box 13 of load moved on load silicon wafer bearing box conveyer belt 12 again and transport.
The driving shaft of the first conveyer belt 1 and the driving shaft of the second conveyer belt drive with same drive motors 3 and are connected, and drive and connect the concrete mode adopting V belt translation.It can be screw-nut body that silicon chip moves up and down drive unit, and the silicon chip of stacking is placed on a platform, and under this platform, effect has screw-nut body, and this screw-nut body is by driving stepper motor.First conveyer belt has two ends, and the one end be positioned at above the second conveyer belt is referred to as first end, and the one end be positioned at above hopper is referred to as the second end.
Method of work: water-filling in hopper, also can adopt the fluid instead of water of other kind, but is advisable with the following process do not damaged with do not affect silicon chip.Then the silicon chip that the silicon chip of stacking is placed in hopper is moved up and down on the platform of drive unit, then start silicon chip and move up and down drive unit and stepping motor, make silicon chip moves until the first silicon chip of top layer of silicon chip of stacking touches the downside of the second end of the first conveyer belt 1, then start drive motors and rotate to drive the first conveyer belt 1 and the second conveyer belt 2.When silicon chip touches the downside of the second end of the first conveyer belt, due to the rotation of the first conveyer belt, and the surface of silicon chip has water, therefore one end of silicon chip utilizes the inertia of the cohesive force of water and the rotation of the first conveyer belt and is absorbed and fixed at the lower surface of the first conveyer belt, gap can be produced between the silicon chip contacted with the first conveyer belt like this and the silicon chip under it, inflatable mouth is then blown towards gap, the silicon chip contacted with the first conveyer belt is thoroughly separated with the silicon chip under it, silicon chip separately utilizes the inertia of the rotation of the first conveyer belt and the cohesive force of water, silicon chip is moved to one end of conveyer belt by the second end of the first conveyer belt, this moves is carry out in the downside of the first conveyer belt.When moving to the first end end of the first conveyer belt, then drop down onto the second conveyer belt upper surface, by the second conveyer belt, silicon chip is sent to realize Fragmentation.
Silicon chip is delivered on first the 4th conveyer belt by the second conveyer belt, the top of the 4th conveyer belt arranges silicon chip checkout equipment, namely a camera lens is set, contrasted by the shooting photo of silicon chip and the silicon chip of control system, when silicon chip is defective, control system sends instruction, the piston rod of driving cylinder is retracted, underproof silicon chip slides in useless silicon chip receiver from the 3rd conveyer belt, and owing to accommodating water in useless silicon chip receiver, therefore useless silicon chip can not be broken into pieces again.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (6)
1. a silicon chip inserting machine, is characterized in that: comprise unloaded silicon wafer bearing box conveyer belt, load silicon wafer bearing box conveyer belt and silicon chip film feeding apparatus, and described silicon chip film feeding apparatus comprises silicon chip separating mechanism and silicon chip conveying mechanism; Described silicon chip separating mechanism comprises the first conveyer belt, the second conveyer belt, hopper and inflatable mouth; Described first conveyer belt and the second conveyer belt are between the upper and lower every setting, described first conveyer belt is positioned at the top of described second conveyer belt, and the projection of the first end of described first conveyer belt is positioned on described second conveyer belt, second end of corresponding described first conveyer belt of described hopper is arranged, and is provided with silicon chip and moves up and down drive unit in described hopper; Described inflatable mouth is positioned at the below of described first conveyer belt, and blowing direction is arranged towards described hopper; Described silicon chip conveying mechanism comprises at least one the 3rd conveyer belt and at least one the 4th conveyer belt; The driven shaft of described 3rd conveyer belt is articulated with on the piston rod of a driving cylinder, and the below of one end of the driven shaft of described 3rd conveyer belt is provided with useless silicon chip receiver; Described 3rd conveyer belt and the 4th conveyer belt series winding are arranged; Second conveyer belt of described silicon chip separating mechanism docks with described silicon chip conveying mechanism; Described unloaded silicon wafer bearing box conveyer belt and the parallel and interval of load silicon wafer bearing box conveyer belt are arranged, and described silicon chip film feeding apparatus is located between described unloaded silicon wafer bearing box conveyer belt and load silicon wafer bearing box conveyer belt.
2. silicon chip inserting machine according to claim 1, is characterized in that: described inflatable mouth is communicated with a feeder by pipeline.
3. silicon chip inserting machine according to claim 1, is characterized in that: described first conveyer belt is obliquely installed.
4. silicon chip inserting machine according to claim 1, is characterized in that: accommodate water in described hopper.
5. silicon chip inserting machine according to claim 1, is characterized in that: described 4th conveyer belt is horizontally disposed with.
6. silicon chip inserting machine according to claim 1, is characterized in that: accommodate water in described useless silicon chip receiver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510079350.6A CN104658954A (en) | 2015-02-13 | 2015-02-13 | Silicon wafer inserting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510079350.6A CN104658954A (en) | 2015-02-13 | 2015-02-13 | Silicon wafer inserting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104658954A true CN104658954A (en) | 2015-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510079350.6A Pending CN104658954A (en) | 2015-02-13 | 2015-02-13 | Silicon wafer inserting machine |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428466A (en) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | Silicon chip insertion device |
| CN105428468A (en) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | Silicon chip inserting device |
| CN105428465A (en) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | Silicon chip separating device |
| CN106684208A (en) * | 2016-12-21 | 2017-05-17 | 无锡市瑞能科技有限公司 | Bidirectional high-speed slice insertion machine |
| CN107863312A (en) * | 2017-11-21 | 2018-03-30 | 乐山新天源太阳能科技有限公司 | Silicon chip auto-flushing takes piece plug-in sheet machine under water |
| CN107887307A (en) * | 2017-11-15 | 2018-04-06 | 四川永祥硅材料有限公司 | A kind of inserted sheet method that can separate defect silicon chip and intelligent plug-in sheet machine device |
| CN109551650A (en) * | 2017-09-26 | 2019-04-02 | 天津环鑫科技发展有限公司 | Wafer dividing mechanism in silicon wafer water |
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| CN203932088U (en) * | 2014-06-19 | 2014-11-05 | 温州海旭科技有限公司 | A kind of Full-automatic silicon chip inserting machine |
| CN204375715U (en) * | 2015-02-13 | 2015-06-03 | 苏州博阳能源设备有限公司 | A kind of silicon chip inserting machine |
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| CN102006976A (en) * | 2007-12-11 | 2011-04-06 | 吉布尔.施密德有限责任公司 | Method of, and apparatus for, separating wafers from a wafer stack |
| CN102498555A (en) * | 2009-05-29 | 2012-06-13 | 亨内克系统有限公司 | Device for transporting wafers and/or solar cells |
| JP2011054908A (en) * | 2009-09-04 | 2011-03-17 | Nippon Bunka Seiko Kk | Wafer carrying device, and wafer carrying method |
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| CN203932088U (en) * | 2014-06-19 | 2014-11-05 | 温州海旭科技有限公司 | A kind of Full-automatic silicon chip inserting machine |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428466A (en) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | Silicon chip insertion device |
| CN105428468A (en) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | Silicon chip inserting device |
| CN105428465A (en) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | Silicon chip separating device |
| CN105428468B (en) * | 2015-12-31 | 2017-03-22 | 苏州博阳能源设备有限公司 | Silicon chip inserting device |
| CN105428466B (en) * | 2015-12-31 | 2017-03-29 | 苏州博阳能源设备有限公司 | Silicon chip inserting piece device |
| CN106684208A (en) * | 2016-12-21 | 2017-05-17 | 无锡市瑞能科技有限公司 | Bidirectional high-speed slice insertion machine |
| CN109551650A (en) * | 2017-09-26 | 2019-04-02 | 天津环鑫科技发展有限公司 | Wafer dividing mechanism in silicon wafer water |
| CN107887307A (en) * | 2017-11-15 | 2018-04-06 | 四川永祥硅材料有限公司 | A kind of inserted sheet method that can separate defect silicon chip and intelligent plug-in sheet machine device |
| CN107887307B (en) * | 2017-11-15 | 2020-06-16 | 四川永祥硅材料有限公司 | Inserting method capable of separating defective silicon wafers and intelligent inserting machine device |
| CN107863312A (en) * | 2017-11-21 | 2018-03-30 | 乐山新天源太阳能科技有限公司 | Silicon chip auto-flushing takes piece plug-in sheet machine under water |
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Application publication date: 20150527 |