JP2011054908A - Wafer carrying device, and wafer carrying method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer carrying device capable of being adapted to high-speed separation processing, and securely separating and conveying wafers to following processes even if the wafers are partially put one over the other underwater to come into contact with each other. <P>SOLUTION: The wafer carrying device 8 that carries wafers in water, which are separated from a wafer stack WS by a wafer separator device and supplied one after another, to the surface of the wafer is provided with a first endless belt type carrying device 4 which carries the successively supplied wafers W to the surface of the water, and a second endless belt type carrying device 5 which is located downstream in the wafer carrying direction of the first endless belt type carrying device 4, and takes over and carries the wafers W carried by the first endless belt type carrying device 4. The second endless belt type carrying device 5 brings its endless belt into contact with the surface of each wafer W on the opposite side from its wafer stack side in a wet state to carry the wafer W. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wafer transfer apparatus that transfers underwater wafers separated from a wafer stack by a wafer separator and sequentially supplied onto a water surface.

  Silicon wafers used for solar cells and the like are cut out from a silicon ingot to a predetermined thickness of 100 to 200 μm, and a plurality of sheets are stacked, that is, a wafer stack, and then separated one by one and sent to a cleaning process. It is done.

  At this time, conventionally, the wafer stack is manually separated one by one and placed on a transfer device such as an infinite belt type transfer device. However, in JP-A-2000-156396 (Patent Document 1), etc. A technique has been proposed in which the arm is moved and separated while being attracted to the arm.

  However, in such a method, the operation is not smooth, and there is a reciprocating motion or a sudden stop. Therefore, when high-speed separation processing is performed, an accident such as a wafer falling easily occurs. At this time, the wafer is extremely thin as described above. Corresponding to high-speed separation processing such as one per second, for example, because breakage occurs due to fragility, the overall yield decreases, and further problems such as suspension of operation for removal of debris occur. There were difficulties.

JP 2000-156396 A

  The inventors of the present invention have studied using a wafer stack supply device to belt-feed wafers separated into individual wafer stacks supplied to a wafer separator device using water flow, vibration (ultrasonic vibration), bubble flow, or the like. Went.

  However, the wafers once separated by the wafer separator device often come into close contact with each other in the initial stage of belt conveyance, and a plurality of wafers are often conveyed at the same time. Not only the wafer itself but also other wafers can be adversely affected, which can cause serious situations such as a decrease in yield. We intensively studied to improve this defect.

  In other words, the present invention can cope with high-speed separation processing that improves the above-mentioned conventional problems, and even when the supplied wafers are in close contact with each other in the initial stage of conveyance, they are surely separated and later processed. An object of the present invention is to provide a wafer transfer apparatus that can be transferred to a process.

  In order to solve the above problems, a wafer transfer apparatus according to the present invention is a wafer transfer apparatus for transferring wafers in water which are separated from a wafer stack and sequentially supplied by a wafer separator apparatus onto a water surface. A first infinite belt type transfer device for transferring the sequentially supplied wafers onto the water surface, and the first infinite belt type downstream of the first infinite belt type transfer device in the wafer transfer direction. A second infinite belt type transfer device that takes over the wafer transferred by the transfer device and further transfers the wafer, and the second infinite belt type transfer device is in a state where the infinite belt is wet and A wafer transfer apparatus, wherein the wafer is transferred while being in close contact with a surface of the wafer opposite to the wafer stack side.

  Further, as described in claim 2, the wafer transfer apparatus of the present invention is the wafer transfer apparatus according to claim 1, in the vicinity of the upper end roller for suspending the infinite belt of the first infinite belt type transfer apparatus. An upper-end conveyance auxiliary roller that contacts the endless belt and clamps the wafer together with the endless belt is provided.

  According to a third aspect of the present invention, there is provided a wafer conveyance device according to the first or second aspect, wherein the lower end of the first infinite belt type conveyance device is suspended. A pulling auxiliary roller that is in contact with the endless belt and holds the wafer together with the endless belt, and a wafer stack side of the sequentially supplied wafers below the first endless belt type transfer device. And a wafer supply roller for contacting the surface on the opposite side of the wafer and supplying the wafer to the contact portion between the auxiliary pulling roller and the infinite belt.

  According to a fourth aspect of the present invention, there is provided the wafer conveyance device according to the fourth aspect, wherein in the wafer conveyance device according to the third aspect, wafer conveyance is started by the first infinite belt conveyance device in the vicinity of the pulling auxiliary roller. A first wafer sensor for detecting an upper end of the wafer, a second wafer sensor for detecting an end of the upward pulling of the wafer by a contact portion between the auxiliary pulling roller and the infinite belt above the first wafer sensor, Rotate in a reverse direction that is in the opposite direction to the forward direction and the forward direction in contact with the surface opposite to the wafer stack side of the wafers that are sequentially supplied and in contact with the wafer to the contact portion. And a wafer supply auxiliary roller that rotates in the reverse direction when the first wafer sensor detects the start of wafer conveyance. Characterized in that the second wafer supply auxiliary roller control means for rotating said wafer supply auxiliary roller in the forward direction when it detects the end of raising the wafer wafer sensor is provided.

  According to a fifth aspect of the present invention, in the wafer conveyance device according to any one of the second to fourth aspects, the portion of the roller that contacts the wafer is in contact with the wafer. It is characterized by comprising a hydrophilic polymer material having open cells.

  Moreover, the wafer conveyance apparatus of this invention is a wafer conveyance apparatus of any one of Claim 1 thru | or 5 as described in Claim 6, The part which contacts the said wafer of the infinite belt which contacts the said wafer Is made of a hydrophilic polymer material having open cells.

  A wafer transfer method according to the present invention is the wafer transfer method by the wafer transfer apparatus according to any one of claims 1 to 6, wherein the second endless belt transfer is performed. The wafer transfer method is characterized in that a transfer speed of the wafer by the apparatus is higher than a transfer speed of the wafer by the first infinite belt type transfer apparatus.

  According to the wafer transfer apparatus of the present invention, the second endless belt type transfer apparatus is in close contact with the surface of the wafer opposite to the wafer stack side (wafer separator side) while the endless belt is wet. Then, the wafer is transported by the second infinite belt type transport device so that the wafer transport speed is higher than the wafer transport speed by the first infinite belt type transport device. Even wafers can be separated and transported one by one.

  According to the wafer transfer apparatus of the second aspect, the configuration is such that the upper end transfer auxiliary roller that is in contact with the upper end roller that suspends the infinite belt of the first infinite belt type transfer apparatus through the infinite belt is provided more reliably. The wafer can be separated.

  According to the wafer transfer apparatus of the third aspect, the pulling auxiliary roller that is in contact with the lower end roller that suspends the infinite belt of the first infinite belt type transfer apparatus through the infinite belt, and the wafers that are sequentially supplied on the wafer stack side The wafer supply roller that is in contact with the surface opposite to the surface and that feeds the wafer to the contact portion between the auxiliary roller and the infinite belt is provided in the water, so that the wafer can be moved in the first structure while having a simple structure. It can be supplied to an infinite belt type conveying device.

  According to the wafer transfer device of the fourth aspect, the first wafer sensor that detects the start of wafer transfer by the first infinite belt transfer device in the vicinity of the pull-up auxiliary roller, and the pull-up above the first wafer sensor. A second wafer sensor that detects the end of the upward pulling of the wafer by the contact portion between the auxiliary roller and the infinite belt, and a surface that is in contact with the surface opposite to the wafer stack side of the wafer that is sequentially supplied below the auxiliary lifting roller The wafer is lifted by the first wafer sensor, and the wafer supply auxiliary roller that rotates in the reverse direction that is opposite to the forward direction and the forward direction that supplies the wafer to the contact portion between the auxiliary roller and the infinite belt. When the wafer is detected, the wafer supply auxiliary roller is rotated in the reverse direction, and the end of the wafer lifting is detected by the front two wafer sensors. With the configuration wafer supply auxiliary roller control means for rotating the wafer supply auxiliary roller in the forward direction can be provided, it is possible to more reliably separate the wafer.

  According to the wafer transfer apparatus of the fifth aspect, the portion of the roller in contact with the wafer that is in contact with the wafer is made of a hydrophilic polymer material having open cells, thereby improving the adhesion between the roller and the wafer. Is reliably conveyed.

  According to the wafer transfer apparatus of the sixth aspect, the portion of the infinite belt in contact with the wafer is in contact with the wafer by the moisture adhering to the transferred wafer made of the hydrophilic polymer material having open cells. Since the infinite belt of the transfer apparatus can be kept wet, the wafer can be separated more reliably.

It is a model figure which shows the driving | running state (before an operation start) of the example of the wafer conveyance apparatus concerning this invention. FIG. 1A is a right side view. FIG. 1B is a front view. It is a model right view which shows the roller arrangement | positioning of the other example of the wafer conveyance apparatus concerning this invention. It is a model figure which shows the driving | running state (state in which the wafer was conveyed to the detection position by the wafer sensor 6) of the example of the wafer conveyance apparatus concerning this invention. FIG. 3A is a right side view. FIG. 3B is a front view. It is a model figure which shows the driving | running state (state in which the wafer was conveyed to the detection position by the wafer sensor 7) of the example of the wafer conveyance apparatus concerning this invention. FIG. 4A is a right side view. FIG. 4B is a front view. It is a model figure which shows the driving | running state of the example of the wafer transfer apparatus concerning this invention (The state which was conveyed by the takeover part in the state in which two wafers partially overlapped). FIG. 5A is a right side view. FIG. 5B is a front view. FIG. 5C is an enlarged view of the vicinity of the takeover portion.

  The form of the wafer transfer apparatus of the present invention will be described with reference to the drawings.

  FIG. 1 shows a model diagram of an example of a wafer transfer apparatus according to the present invention. 1A is a side view (right side view), and FIG. 1B is a front view.

  An example of this wafer transfer apparatus is a wafer transfer apparatus that transfers wafers W in water separated from a wafer stack WS by a wafer separator device (not shown) and sequentially supplied by a wafer supply device 8 onto a water surface 9. The first infinite belt type transfer device 4 for transferring the supplied wafer W onto the water surface, and the first infinite belt type transfer device 4 downstream of the first infinite belt type transfer device 4 in the wafer W transfer direction. A second infinite belt type transfer device 5 that takes over the transferred wafer W and further transfers it, and the second infinite belt type transfer device 5 is in a state where the infinite belt 5a is wet. This is a wafer transfer device that transfers the wafer W while being in close contact with the surface opposite to the wafer stack WS side of the wafer W taken over from the infinite belt transfer device 4.

  Further, in this wafer transfer apparatus, the infinite belt 4a of the first infinite belt type transfer apparatus 4 is in contact with the same surface as the wafer stack WS side of the sequentially supplied wafers W to transfer the wafers W.

  Further, in this wafer transfer device, the endless belt 4a is placed in the vicinity of the upper end roller 4c for suspending the infinite belt 4a of the first infinite belt type transfer device 4, specifically at a position sandwiching the infinite belt 4a together with the roller 4c. An upper end conveyance auxiliary roller 3b that is in contact with and holds the wafer W together with the infinite belt 4a is provided.

  Further, in this example, the endless belt 4a of the first endless belt type conveying device 4 is in contact with the endless belt 4a in the vicinity of the lower end roller 4b, specifically at a position sandwiching the endless belt 4a together with the roller 4b, Further, a pulling auxiliary roller 3a that holds the wafer W together with the infinite belt 4c and a surface of the wafer W that is sequentially supplied opposite to the wafer stack WS side are brought into contact with the pulling auxiliary roller 3a and the infinite belt 4a. A wafer supply roller 2 that supplies the contact portion is provided.

  Further, in this example, a first wafer sensor (in this example, an optical sensor, which is a light emitting unit, a light receiving unit, and a light receiving unit) detects the start of conveyance of the wafer W by the first infinite belt type conveyance device 4 near the lower end roller 4b. 6, and a second for detecting the end of the upward pulling of the wafer W (for one sheet) by the contact portion between the pulling auxiliary roller 3 a and the infinite belt 4 a above the first wafer sensor 6. Wafer sensor (in this example, it is an optical sensor comprising a pair of a light emitting part and a light receiving part) 7. Below the wafer supply roller 2, the wafer W sequentially supplied is opposite to the wafer stack WS side. The wafer supply auxiliary roller which rotates in the forward direction which is in contact with the surface of the wafer and pulls up the wafer W and supplies it to the contact portion between the auxiliary roller 3a and the infinite belt 4a and the reverse direction of the forward direction. When the first wafer sensor 6 detects the start of the transfer of the wafer W, the wafer supply auxiliary roller 1 is rotated in the reverse direction, and the second wafer sensor 7 detects the completion of the pulling up of the wafer W (for one sheet). At this time, there is provided wafer supply auxiliary roller control means K (shown only in FIG. 1A) for rotating the wafer supply auxiliary roller 1 in the forward direction. Here, wafer supply auxiliary roller control means K calculation determination circuit CPU, ROM storing a control program, RAM for temporarily holding various information (for example, rotation direction information of wafer supply auxiliary roller at that time), various electric signals It is composed of an I / O port etc.

  Here, in the apparatus shown in FIGS. 1 (a) and 1 (b), the upper end conveyance assisting roller 3b is positioned so as to sandwich the infinite belt 4a together with the roller 4c, and the lifting assisting roller 3a is coupled to the endless belt together with the roller 4b. 4a is provided at each of the positions sandwiching the endless belt 4a. However, it is only necessary that the wafers conveyed by the endless belt 4a can be held together with the endless belt 4a. A model diagram (right side view) is shown in FIG.

  However, as described above, the wafer is extremely thin and weak in strength. Therefore, as shown in FIG. Plates 4e and 4d are provided.

  FIGS. 1A and 1B are model diagrams showing a state before the wafer W is pulled up. Each belt and roller rotate in the direction of the arrow in the figure (the rotation direction is not changed except for the wafer supply auxiliary roller 1, and hence the rotation notation will be omitted below).

  Next, the function of this transport apparatus will be described.

  Wafers W separated from the wafer stack WS by a water flow, bubble flow, or ultrasonic vibration by a wafer separator device (not shown) are shown by a wafer supply device 8 that moves little by little in the direction of the arrow (left arrow) in the figure. The rightmost wafer W of the wafer is conveyed in the middle left direction and abuts against the wafer supply auxiliary roller 1 and the wafer supply roller provided on the opposite side of the wafer W from the wafer stack WS side. The underwater is pulled upward by the rotation of the roller.

  The pulled wafer W is supplied to the contact portion between the pulling auxiliary roller 3a and the infinite belt 4a, and is further conveyed upward by these (FIG. 3A (right side view) and FIG. 3B (front view). Refer to the figure).

  The first wafer sensor 6 provided in the vicinity of the malleable roller 4b notifies the wafer supply auxiliary roller control means (not shown) of the start of transfer of the wafer W by the first infinite belt type transfer device 4, and the wafer supply auxiliary roller control means. K rotates the wafer supply auxiliary roller 1 in the reverse direction as shown by an arrow in FIG. 3A, and the other wafer on the right side of the wafer W to be transported is pulled up to overlap the wafer to be transported. To prevent.

  Further, the wafer W is transferred upward by the first infinite belt type transfer device 4, and as shown in FIG. 4A and FIG. 4B, the wafer W is formed by the contact portion between the pulling auxiliary roller 3a and the infinite belt 4a. Is lifted up, and at this time, the second wafer sensor 7 provided above the first wafer sensor 6 causes the upper portion of the wafer W (for one sheet) to come into contact with the pulling auxiliary roller 3a and the infinite belt 4a. A signal indicating that the pulling up is completed is sent to a wafer supply auxiliary roller control means K (not shown), and the wafer supply auxiliary roller control means K rotates the wafer supply auxiliary roller 1 in the forward direction as indicated by an arrow in FIG. Then, it is returned to the state shown in FIG.

  As shown in FIGS. 4A and 4B, when most of the wafer W is above the water surface 9, due to the surface tension of water existing between the wafer W and the infinite belt 4a, Since the wafer W is in close contact with the infinite belt 4a, thereafter, the wafer W is transported upward without dropping or shifting even if a roller or the like is not provided on the opposite side of the wafer W from the infinite belt 4a.

  Thus, the wafer W transferred upward by the first infinite belt type transfer device 4 is taken over by the second infinite belt type transfer device provided downstream of the first infinite belt type transfer device 4 in the wafer transfer direction. Are further conveyed upward. At this time, the wafer W is transferred in close contact with the infinite belt 5a by keeping the infinite belt 5a of the second infinite belt type transfer device wet. In the drawing, a guide 5c for changing the direction of conveyance by the second infinite belt type conveyance device 5 is provided, but a roller having a large diameter that does not impair the adhesion between the belt 5a and the wafer W is provided. It may be used.

  The wafer transported upward by this transport device is taken over by another transport means 10 for transporting to a cleaning device (not shown) in this example and further transported.

  Next, the function of the present apparatus when the wafer W is started to be transferred by the first infinite belt type transfer device 4 and the wafer W1 is pulled up in a state where the other wafer W2 is partially overlapped with the wafer W1 will be described. To do.

  5A is a side view, FIG. 5B is a front view, and FIG. 5C is a wafer takeover between the first endless belt transfer device 4 and the second endless belt transfer device 5. It is an enlarged view of a part.

  Here, the wafer transfer speed by the second infinite belt type transfer device 5 is set to be higher than the wafer transfer speed by the first infinite belt type transfer device 4.

  When the wafer W1 is pulled up on the water surface with another wafer W2 accompanying the wafer W1, the space between the first endless belt transfer device 4 and the second endless belt transfer device 5 is increased. When the first wafer W1 reaches the wafer takeover portion and the surface opposite to the wafer stack WS side comes into close contact with the wet endless belt 5a of the second endless belt type transfer device 5, the wafer W2 is still In this state, the wafer is being transferred by the first infinite belt type transfer device 4. At this time, due to the difference in transfer speed, forces in the direction of separating the wafers W1 and W2 are applied to each other (see FIG. 4C). As a result, the wafers W1 and W2 are separated from each other and sequentially transferred by the second infinite belt type transfer device 5. The above force is more reliably exerted by the upper end conveyance auxiliary roller 3b that is in contact with the upper end roller 4c that suspends the infinite belt 4a of the first infinite belt type conveying device 4 through the infinite belt 4a. Here, the speed ratio of the infinite belt type transfer device is appropriately adjusted depending on the size of the wafer, but is usually about 1: 1.3 to 1: 2.

  The adhesion force between the infinite belt 5a of the second infinite belt type transfer device 5 and the wafer is the surface tension of water, and appears when the infinite belt 5a is wet.

  For this reason, it is necessary to supply water to the infinite belt 5a of the second infinite belt type conveying device 5, but in the case of continuous use, if the place where the wafer contacts is made of a hydrophilic polymer material having open cells, Even if the water is replenished only at the beginning of the operation, and the water is not replenished thereafter, the adhesion force is maintained by the water adhering to the wafer transferred onto the water surface.

  Here, it can be used not only for the infinite belt 5a of the second infinite belt type conveying device 5 but also for the infinite belt 4a of the first infinite belt type conveying device 4 and the wafer contact portion of other rollers, Due to the stable adhesion generated when the hydrophilic polymer material having open cells and the wafer come into contact with each other, accidents such as shifting and dropping during wafer transfer are more effectively prevented.

  Also, if the hydrophilic polymer material with open cells alone, such as a belt, is insufficient in strength, ensure the necessary strength by lining the part that is not in direct contact with the wafer with another high-strength material. Can do.

  Examples of hydrophilic polymer materials having open cells as described above include those known as Aion's Soflas and Glory Sangyo's Ecolon. Using. Since these hydrophilic polymer materials having open cells are flexible, even a very thin wafer can be safely transported without being damaged or scratched. Here, since Aion's Soflas is flexible, it has good adhesion to the wafer even in water, and as described above, the wafer supply by the wafer supply auxiliary roller 1 and the wafer supply roller is particularly good. Performed smoothly.

  As can be understood from the above description, the wafer transfer apparatus of the present invention operates only by the rotational movement of the roller and the belt without reciprocation of the members such as the arm. It can handle high-speed continuous transfer of about one sheet, and the wafer is prevented from dropping due to a transfer failure (usually, the dropped wafer is damaged), so that the reliability is high.

W, W1, W2 Wafer WS Wafer Stack 1 Wafer Supply Auxiliary Roller 2 Wafer Supply Roller 3a Pulling Auxiliary Roller 4 First Infinite Belt Transfer Device 4a, 5a Infinite Belt 4b Lower End Roller 5 Second Infinite Belt Transfer Device 6 First wafer sensor 7 Second wafer sensor 8 Wafer supply device 9 Water surface K Wafer supply auxiliary roller control means

Claims (7)

A wafer transfer device that transfers underwater wafers separated from a wafer stack and sequentially supplied by a wafer separator device onto a water surface,
A first infinite belt type transfer device for transferring the sequentially supplied wafers onto the water surface; and a first infinite belt type transfer device that is downstream of the first infinite belt type transfer device in the wafer transfer direction. A second infinite belt type transfer device that takes over the transferred wafer and further transfers it, and
The second infinite belt type transfer device conveys the wafer while the infinite belt is wet and in close contact with the surface of the wafer opposite to the wafer stack side. Wafer transfer device.   An upper end conveyance auxiliary roller that is in contact with the infinite belt and sandwiches the wafer together with the infinite belt is provided near the upper end roller for suspending the infinite belt of the first infinite belt type conveying apparatus. The wafer transfer apparatus according to claim 1 or 2. A pulling auxiliary roller that is in contact with the endless belt and holds the wafer together with the endless belt near a roller at a lower end that suspends the endless belt of the first endless belt type conveying device;
Below the first infinite belt-type transfer device, the wafer is sequentially brought into contact with the surface opposite to the wafer stack side, and the wafer is brought into contact with the pulling auxiliary roller and the infinite belt. A wafer supply roller to supply;
The wafer transfer apparatus according to claim 1, wherein the wafer transfer apparatus is provided. A first wafer sensor for detecting the start of wafer conveyance by the first infinite belt type conveyance device in the vicinity of the pulling auxiliary roller;
A second wafer sensor for detecting the end of the upward pulling of the wafer by the contact portion between the pulling auxiliary roller and the infinite belt above the first wafer sensor;
A forward direction below the wafer supply roller and in contact with a surface opposite to the wafer stack side of the sequentially supplied wafers in a forward direction and a direction opposite to the forward direction. A wafer supply auxiliary roller rotating in a reverse direction, and
When the first wafer sensor detects the start of wafer transfer, the wafer supply auxiliary roller is rotated in the reverse direction, and when the second wafer sensor detects completion of the wafer lifting, the wafer supply auxiliary roller is rotated. The wafer conveyance device according to claim 3, further comprising a wafer supply auxiliary roller control unit that rotates in the forward direction.   5. The wafer conveyance device according to claim 2, wherein a portion of the roller that contacts the wafer that contacts the wafer is made of a hydrophilic polymer material having open cells. 6.   6. The wafer transfer apparatus according to claim 1, wherein a portion of the endless belt that contacts the wafer is made of a hydrophilic polymer material having open cells.   7. The wafer transfer method by the wafer transfer apparatus according to claim 1, wherein the transfer speed of the wafer by the second infinite belt type transfer apparatus is the first infinite belt type. 8. A wafer transfer method, wherein the transfer speed is higher than a transfer speed of the wafer by a transfer device.

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