CN105489534B - A kind of silicon chip slicing apparatus - Google Patents
A kind of silicon chip slicing apparatus Download PDFInfo
- Publication number
- CN105489534B CN105489534B CN201511029675.XA CN201511029675A CN105489534B CN 105489534 B CN105489534 B CN 105489534B CN 201511029675 A CN201511029675 A CN 201511029675A CN 105489534 B CN105489534 B CN 105489534B
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- CN
- China
- Prior art keywords
- silicon chip
- feeder channel
- conveyer belt
- separating mechanism
- fragment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 72
- 239000010703 silicon Substances 0.000 title claims abstract description 72
- 239000012634 fragment Substances 0.000 claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims description 11
- 230000002706 hydrostatic effect Effects 0.000 claims description 6
- 230000001360 synchronised effect Effects 0.000 claims description 6
- 238000005086 pumping Methods 0.000 claims description 3
- 238000013519 translation Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000003345 natural gas Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000003209 petroleum derivative Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
A kind of silicon chip slicing apparatus, including separating mechanism and feeder channel；The separating mechanism includes silicon chip separating mechanism ontology, the silicon chip separating mechanism ontology is arranged in parallel and at interval fragment conveyer belt to having two, the silicon chip separating mechanism ontology is equipped with stomata towards the fragment conveyer belt, which is connected to by pipeline with air extractor；The front end of the conveying direction of the fragment conveyer belt is equipped with idler wheel；The feeder channel includes feeder channel groove body and water pump, and the feeder channel groove body is equipped with overflow port, which is connected to by pipeline with a reservoir；It is equipped in the feeder channel groove body to hold the support platform of stacking silicon chip；The support platform corresponds to the fragment conveyer belt setting.The present invention has the advantages that fragment is efficient, it is small to be damaged to silicon chip in fragment.
Description
Technical field
The present invention relates to a kind of silicon chip slicing apparatus, belong to solar battery sheet and prepare auxiliary device field.
Background technology
Since 21 century, global Energy Consumption drastically rises, and traditional fossil energy increasingly depleted, energy problem and environment are asked
Topic is increasingly becoming two big Important Problems of global concern.Under the pressure of the pressure of sustainable development, each major country is one after another by solar energy
Photovoltaic industry is included in the emphasis of regenerative resource utilization.Along with China become the second in the world economy, in October, 2013,
Chinese petroleum import in October amount reaches daily 6,300,000 barrels, is more than daily 6,240,000 barrels of the U.S., replaces the U.S. to become the whole world for the first time
Maximum net import of oil state.2013, the external dependence degree of China Petroleum and natural gas respectively reached 58.1% and 31.6%, China
Have become the third-largest natural gas consumption state in the whole world.Traditional fossil energy has been increasingly difficult to meet the vigorous need of Chinese national economy
It asks.The artificial CO2 emissions in the whole world about 75% or so derive from combustion of fossil fuel in past 20 years.Cause
This still complies with Industry Structure upgrading and transition pressure, China is necessary either from the energy development angle of low-carbon environment-friendly
Accelerate development New Energy Industry.
Solar energy belongs to clean reproducible energy." the European renewable energy technologies strategy proposed according to EU Committee
Plan ", arrives the year two thousand twenty, and solar energy will account for the 15% of European Union's electricity needs.2010, U.S. Department of Energy developed planning, and plan is arrived
The year two thousand thirty, solar energy account for the 10%~15% of total energy consumption figure.It is sent out from worldwide solar energy and tide energy aggregate net
Electricity sees that China is 3,000,000,000 kilowatt hours, and Germany is 19,000,000,000 dry watt-hours, and Italy is 10,700,000,000 dry watt-hours, and Spain is 9,100,000,000 thousand
Watt-hour, Japan are 3,800,000,000 kilowatt hours.Following China's water power growth space is limited, and there are insecurity for nuclear energy.Fossil energy by
Energy-saving and emission-reduction committed cost will rise, the wide market of solar energy power generating.
The processing of monocrystalline silicon piece includes silicon single crystal rod elder generation evolution, then is sliced, and the processing of polysilicon chip is cut including polycrystal silicon ingot
It cuts, then is sliced, the processing of quasi-monocrystalline silicon includes mono-like silicon ingot cutting, then is sliced.To sum up, slice is the crystalline silicon sun
One of essential technique in energy battery machining process.The silicon chip obtained after slice is stacked together, is inserted after needing fragment
Enter in silicon wafer bearing box and transported, due to silicon chip have the characteristics that it is thin, crisp, fragment, inserted sheet it is difficult.
The application for a patent for invention of Publication No. CN103681968A discloses a kind of automatic machine for inserting silicon wafers, uses suction
Disk captures silicon chip to carry out fragment, inserted sheet, and since the action that sucker captures silicon chip is discontinuous operation, there are fragment effects
The low problem of rate.
Invention content
It is an object of the present invention to provide a kind of silicon chip slicing apparatus.
In order to achieve the above objectives, the technical solution adopted by the present invention is：A kind of silicon chip slicing apparatus, including separating mechanism and
Feeder channel；The separating mechanism includes silicon chip separating mechanism ontology, and the silicon chip separating mechanism ontology is flat to having two
Capable and spaced fragment conveyer belt, the silicon chip separating mechanism ontology are equipped with stomata, the gas towards the fragment conveyer belt
Hole is connected to by pipeline with air extractor；The front end of the conveying direction of the fragment conveyer belt is equipped with idler wheel；The feeder channel packet
Feeder channel groove body and water pump are included, the feeder channel groove body is equipped with overflow port, which is connected to by pipeline with a reservoir；Institute
It states in feeder channel groove body and is equipped with to hold the support platform of stacking silicon chip, which moves up and down driving device
Driving portion is sequentially connected；The feeder channel groove body is equipped with hydrostatic sensor, the hydrostatic sensor and a Computerized digital control system
Signal connects, and the Computerized digital control system is electrically connected with the water pump；Liquid is accommodated in the feeder channel groove body, liquid
Height of the depth always greater than stacking silicon chip；The support platform corresponds to the fragment conveyer belt setting.
Preferably technical solution is：The fragment conveyer belt is synchronous belt.
Preferably technical solution is：The synchronous belt is set on driving wheel and driven wheel, and the driving wheel is filled with driving
Set drive connection.
Preferably technical solution is：The driving device is a drive motor, the output shaft of the drive motor and the master
Driving wheel passes through V belt translation.
Preferably technical solution is：The silicon chip separating mechanism ontology is in the front end of the conveying direction of the fragment conveyer belt
Equipped with idler wheel fixed plate, towards pumping stomata is had, which is connected to by pipeline with air extractor the idler wheel fixed plate；
The idler wheel rotational support is in the idler wheel fixed plate.
Preferably technical solution is：The silicon chip separating mechanism ontology is equipped with a closed air cavity, and the air cavity is towards institute
The direction for stating fragment conveyer belt is equipped with several stomatas, and the air cavity is fixed with gas nozzle, which passes through pipeline and air extractor
Connection.
Preferably technical solution is：The driving device that moves up and down is leadscrew-nut mechanism.
Preferably technical solution is：The water inlet of the water pump is connected to by pipeline with the reservoir, the water pump
Water outlet is connected to by pipeline with the feeder channel groove body.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
The present invention has the advantages that fragment is efficient, it is small to be damaged to silicon chip in fragment.
Description of the drawings
Attached drawing 1 is silicon chip separating mechanism stereoscopic schematic diagram.
Attached drawing 2 is silicon chip separating mechanism elevational schematic view.
Attached drawing 3 is silicon chip separating mechanism schematic top plan view.
Attached drawing 4 is silicon chip separating mechanism schematic side view.
Attached drawing 5 is silicon chip separating mechanism schematic rear view.
Attached drawing 6 is feeder channel schematic diagram.
In the figures above：1, silicon chip separating mechanism ontology；2, fragment conveyer belt；3, stomata；4, idler wheel；5, gas nozzle；6, it rolls
Take turns fixed plate；10, separating mechanism；21, feeder channel groove body；22, water pump；23, overflow port；24, reservoir；25, support platform；
26, stacking silicon chip；27, hydrostatic sensor.
Specific implementation mode
The invention will be further described with reference to the accompanying drawings and embodiments：
It should be clear that structure, ratio, size etc. depicted in this specification institute accompanying drawings, only coordinating specification to be taken off
The content shown is not limited to the enforceable qualifications of the present invention so that those skilled in the art understands and reads, therefore
Do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the present invention
Under the effect of can be generated and the purpose that can reach, it should all still fall and obtain the model that can cover in disclosed technology contents
In enclosing.Meanwhile cited such as "upper" in this specification, "lower", "left", "right", " centre " and " one " term, be also only
Convenient for being illustrated for narration, rather than to limit the scope of the invention, relativeness is altered or modified, in no essence
It changes under technology contents, when being also considered as the enforceable scope of the present invention.
Embodiment：A kind of silicon chip slicing apparatus
Shown in attached drawing 1~6, silicon chip slicing apparatus, including separating mechanism 10 and feeder channel.
Separating mechanism, including silicon chip separating mechanism ontology 1, the silicon chip separating mechanism ontology 1 to have two it is parallel and
Spaced fragment conveyer belt 2, the silicon chip separating mechanism ontology 1 are equipped with stomata 3, the gas towards the fragment conveyer belt 2
Hole 3 passes through pipeline and air extractor（It is not shown in figure）Connection；The front end of the conveying direction of the fragment conveyer belt 2 is equipped with idler wheel
4。
Preferred embodiment is：The fragment conveyer belt 2 is synchronous belt.
Preferred embodiment is：The synchronous belt is set on driving wheel and driven wheel, and the driving wheel is filled with driving
Set drive connection.
Preferred embodiment is：The driving device is a drive motor, the output shaft of the drive motor and the master
Driving wheel passes through V belt translation.Drive motor can be motor or hydraulic motor.
Preferred embodiment is：The silicon chip separating mechanism ontology 1 is before the conveying direction of the fragment conveyer belt 2
End is equipped with idler wheel fixed plate 6, and towards stomata 3 is had, which is connected to by pipeline with air extractor the idler wheel fixed plate 6；Institute
4 rotational support of idler wheel is stated in the idler wheel fixed plate 6.
Preferred embodiment is：The silicon chip separating mechanism ontology 1 is equipped with a closed air cavity, and the air cavity is towards institute
The direction for stating fragment conveyer belt 2 is equipped with several stomatas 3, and the direction opposite towards the fragment conveyer belt 2 is equipped with gas nozzle 5, should
Gas nozzle 5 is connected to by pipeline with the air extractor.
Feeder channel includes feeder channel groove body 21 and water pump 22, and the feeder channel groove body 21 is equipped with overflow port 23, the overflow port
23 are connected to by pipeline with a reservoir 24；It is equipped in the feeder channel groove body 21 to hold the support platform of stacking silicon chip 26
25, the driving portion which moves up and down driving device is sequentially connected；The feeder channel groove body 21 is equipped with liquid
Pressure sensor 27, the hydrostatic sensor 27 are connect with a Computerized digital control system signal, the Computerized digital control system with it is described
Water pump 22 is electrically connected；Accommodate liquid in the feeder channel groove body 1, the height of the depth of liquid always greater than stacking silicon chip.Institute
It is leadscrew-nut mechanism to state and move up and down driving device.The water inlet of the water pump is connected to by pipeline with the reservoir, institute
The water outlet for stating water pump is connected to by pipeline with the feeder channel groove body.
The liquid level that hydrostatic sensor 27 detects carries out control system of switching on or off electricity to water pump, so as to be accommodated in the feeder channel groove body 1
There is liquid, the height of the depth of liquid always greater than stacking silicon chip.Liquid in feeder channel groove body 1 is generally water, can also adopt
With the fluid instead of water of other types, but it cannot damage and not influence the following process of silicon chip.
Working method：Separating mechanism 10 is contacted with the water in feeder channel groove body 21, best mode is：Stomata 3 is located at
Under water, fragment conveyer belt 2 and 4 part of idler wheel are located at underwater.
Stacking silicon chip 26 is placed on the support platform 25 in feeder channel groove body 21, and just positioned at fragment conveyer belt 2
Lower section starts air extractor and drives the driving device of fragment conveyer belt rotation.When silicon chip contacts the downside of fragment conveyer belt
When, adsorption capacity of the negative pressure to silicon chip of stomata generation, the surface along with silicon chip make to produce between silicon chip and conveyer belt there are water
Raw cohesive force, silicon chip are adsorbed on the downside of fragment conveyer belt, the silicon chip contacted in this way with fragment conveyer belt and the silicon chip under it
Between will produce gap, with the rotation of fragment conveyer belt, the silicon chip contacted with fragment conveyer belt and the stacking silicon chip under it are thorough
Bottom separates, and the position that the silicon chip after separating then is moved to idler wheel in effect of inertia is worked as since idler wheel does not have motor driving
Silicon chip can be fallen after reaching idler wheel.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of silicon chip slicing apparatus, it is characterised in that：Including separating mechanism and feeder channel；The separating mechanism includes silicon
Piece separating mechanism ontology, which is arranged in parallel and at interval fragment conveyer belt to having two, described
Silicon chip separating mechanism ontology is equipped with stomata towards the fragment conveyer belt, which is connected to by pipeline with air extractor；It is described
The front end of the conveying direction of fragment conveyer belt is equipped with idler wheel；The feeder channel includes feeder channel groove body and water pump, the feeder channel
Groove body is equipped with overflow port, which is connected to by pipeline with a reservoir；It is equipped in the feeder channel groove body to hold heap
The support platform of pile silicon chip, the support platform and one move up and down driving device driving portion be sequentially connected；The feeder channel slot
Body is equipped with hydrostatic sensor, which connect with a Computerized digital control system signal, the Computerized digital control system
It is electrically connected with the water pump；Accommodate liquid in the feeder channel groove body, the height of the depth of liquid always greater than stacking silicon chip；
The support platform corresponds to the fragment conveyer belt setting.
2. silicon chip slicing apparatus according to claim 1, it is characterised in that：The fragment conveyer belt is synchronous belt.
3. silicon chip slicing apparatus according to claim 2, it is characterised in that：The synchronous belt is set in driving wheel and driven
On wheel, the driving wheel is sequentially connected with driving device.
4. silicon chip slicing apparatus according to claim 3, it is characterised in that：The driving device is a drive motor, should
The output shaft of drive motor passes through V belt translation with the driving wheel.
5. silicon chip slicing apparatus according to claim 1, it is characterised in that：The silicon chip separating mechanism ontology is at described point
The front end of the conveying direction of piece conveyer belt is equipped with idler wheel fixed plate, which has pumping stomata, the pumping gas
Hole is connected to by pipeline with air extractor；The idler wheel rotational support is in the idler wheel fixed plate.
6. silicon chip slicing apparatus according to claim 1, it is characterised in that：The silicon chip separating mechanism ontology is equipped with one
Closed air cavity, the air cavity are equipped with several stomatas towards the direction of the fragment conveyer belt, and the air cavity is fixed with gas nozzle, should
Gas nozzle is connected to by pipeline with air extractor.
7. silicon chip slicing apparatus according to claim 1, it is characterised in that：The driving device that moves up and down is leading screw spiral shell
Parent agency.
8. silicon chip slicing apparatus according to claim 1, it is characterised in that：The water inlet of the water pump passes through pipeline and institute
Reservoir connection is stated, the water outlet of the water pump is connected to by pipeline with the feeder channel groove body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029675.XA CN105489534B (en) | 2015-12-31 | 2015-12-31 | A kind of silicon chip slicing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029675.XA CN105489534B (en) | 2015-12-31 | 2015-12-31 | A kind of silicon chip slicing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105489534A CN105489534A (en) | 2016-04-13 |
| CN105489534B true CN105489534B (en) | 2018-08-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511029675.XA Active CN105489534B (en) | 2015-12-31 | 2015-12-31 | A kind of silicon chip slicing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105489534B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201820777U (en) * | 2010-09-02 | 2011-05-04 | 董维来 | Automatic solar silicon wafer separator by wet process |
| CN202983865U (en) * | 2012-12-07 | 2013-06-12 | 上海釜川超声波科技有限公司 | Silicon wafer separation device |
| CN103601015A (en) * | 2013-11-19 | 2014-02-26 | 张家港市超声电气有限公司 | Piece separating and conveying device |
| CN104016154A (en) * | 2014-06-19 | 2014-09-03 | 张家港市超声电气有限公司 | Silicon wafer separating device |
| CN205303426U (en) * | 2015-12-31 | 2016-06-08 | 苏州博阳能源设备有限公司 | Silicon chip burst device |
-
2015
- 2015-12-31 CN CN201511029675.XA patent/CN105489534B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201820777U (en) * | 2010-09-02 | 2011-05-04 | 董维来 | Automatic solar silicon wafer separator by wet process |
| CN202983865U (en) * | 2012-12-07 | 2013-06-12 | 上海釜川超声波科技有限公司 | Silicon wafer separation device |
| CN103601015A (en) * | 2013-11-19 | 2014-02-26 | 张家港市超声电气有限公司 | Piece separating and conveying device |
| CN104016154A (en) * | 2014-06-19 | 2014-09-03 | 张家港市超声电气有限公司 | Silicon wafer separating device |
| CN205303426U (en) * | 2015-12-31 | 2016-06-08 | 苏州博阳能源设备有限公司 | Silicon chip burst device |
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| Publication number | Publication date |
|---|---|
| CN105489534A (en) | 2016-04-13 |
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Effective date of registration: 20230329 Address after: 224000 Building 2, No. 10, Liujiang Road, Yancheng Economic and Technological Development Zone, Jiangsu Province Patentee after: Jiangsu Boyang Intelligent Equipment Co.,Ltd. Address before: 215000 Wang Wu Road, Wuzhong District, Suzhou, Jiangsu 28 Patentee before: SUZHOU BOYANG ENERGY EQUIPMENT CO.,LTD. |