CN117712011A - Wafer adsorption carrying disc - Google Patents
Wafer adsorption carrying disc Download PDFInfo
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- CN117712011A CN117712011A CN202410162901.4A CN202410162901A CN117712011A CN 117712011 A CN117712011 A CN 117712011A CN 202410162901 A CN202410162901 A CN 202410162901A CN 117712011 A CN117712011 A CN 117712011A
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000012937 correction Methods 0.000 claims description 51
- 239000002245 particle Substances 0.000 abstract description 16
- 239000012528 membrane Substances 0.000 abstract description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000013618 particulate matter Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 112
- 238000001514 detection method Methods 0.000 description 10
- 239000000523 sample Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 5
- 241000252254 Catostomidae Species 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a wafer adsorption carrier disc, in particular to the technical field of semiconductor equipment. This adsorption equipment is rectified to wafer is provided with supplementary adsorption component, realizes protecting the wafer bottom through adding the ventilated membrane in supplementary sucking disc base member surface, and the ventilated membrane can hold back dust particle, avoids particulate matter to pollute the wafer surface. The device can avoid sucking excessive gas to cause inconsistent adsorption force at a plurality of positions of the wafer when sucking the sucker substrate, thereby realizing control of the flow of peripheral air flow of the sucker substrate into and out of the inner side of the sucker substrate and avoiding the occurrence of wafer surface variation.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a wafer adsorption carrier disc.
Background
Wafer testing is an important step in the semiconductor chip production process, the wafer testing ring can perform feature evaluation on the electrical parameters of the devices, so that qualified chips can be identified before packaging, and production personnel can evaluate the quality level of the production process according to the qualification rate of the devices. In the existing wafer feeding technology, the mechanical arm is used for operation, components of the mechanical arm are worn, particles generated by wear contact with a wafer, the wafer is at risk of being polluted, scattered particles are easy to exist on the surface of the polluted wafer, when particles exist between a plurality of suckers with continuous adsorption surfaces or large contact areas and the wafer, the local part of the wafer is supported, the surface shape of the whole wafer is further deteriorated, and the yield of chip production is further affected.
The prior art provides solutions such as patent US20220118587A1, which provides an air bearing adsorption device comprising a nozzle portion and a gas channel portion. The nozzle portion includes a plurality of small nozzles for generating air, and a cushion is padded on the top surface of the nozzle portion. The gas channel portion includes a first gas channel configured to deliver a first gas into the plurality of mini-nozzles to provide a supporting or adsorbing force. The nozzle, the gas channel and the like provided by the patent are beneficial to reducing the risk of wafer falling possibly generated in the wafer adsorption process, so as to meet the requirement of wafer overturning, and the wafer edge is not easy to crack in the adsorption process. However, the surface shape of the wafer surface cannot be actively corrected, and the phenomenon of local bulging of the wafer when particles remain between the wafer and the nozzle cannot be avoided. Here, the inventors consider that there is still much room for improvement.
Disclosure of Invention
In order to protect the bottom surface of the wafer, the wafer is pre-aligned, and the wafer surface type variation is avoided. The invention provides a wafer adsorption carrier disc, which comprises an adsorption device, wherein the bottom of the adsorption device is connected with a substrate, a controller is arranged on the substrate, a plurality of correction devices are further arranged on the substrate, the controller is arranged on one side of the adsorption device.
Further, the wafer to be detected is placed on the adsorption device, equipment such as a detection probe is further arranged outside the adsorption device, when the detection probe detects that the flatness of the surface of the wafer is not up to the standard, the height of an outer disc high area and an outer disc low area on the adsorption device and the correction device are adjusted to the surface of the wafer, the detection probe can expand the detection range of the wafer by rotating the wafer, and meanwhile, the correction device can effectively solve the problem that the edge of the thinner wafer is easy to crack.
Further, the bottom of the inflatable disc body is provided with an inflatable column which is connected with the inside of the inflatable disc body, when the adsorption device works, the inside of the inflatable disc body is ventilated and swelled, on one hand, the inflatable disc body is provided with the inflatable disc body to buffer the bottom surface of the wafer due to the sudden stress of the wafer in the adsorption process of the wafer and the sucker, so that the problem that the wafer is curled due to the fact that the local support is not in place is avoided; on the other hand, the inflatable disc body can be used for extruding internal gas into the inflatable column at the bottom of the inflatable disc body along with the change of the upper and lower positions of the wafer after the wafer is adsorbed, the inflatable column is inflated along with the wafer, the inflatable column on the periphery of the inflatable disc body can be abutted against the bottom surface of the wafer under the condition that the clearance between the wafer and the surface of the sucker body is small after the wafer is completely adsorbed with the sucker body, the horizontal effect of the wafer adsorption is further ensured, and the inflation and the shrinkage of the inflatable column are helpful for pushing away or removing particles existing on the surface of the sucker body, and meanwhile, the cleaning condition of the surface of the sucker body can be ensured.
In the invention, the outer side of the inner tray body is connected with the outer tray body, the inner tray body and the outer tray body are respectively provided with a first groove, the first grooves of the inner tray body are respectively provided with a sucker base body and an inflatable tray body, the sucker base body and the inflatable tray body are arranged in the first grooves in a surrounding manner, and the sucker base body and the inflatable tray body are arranged at intervals.
According to the invention, the auxiliary sucker comprises an auxiliary outer disc body, a first auxiliary turntable is sleeved on the inner side of the auxiliary outer disc body, a second auxiliary turntable is arranged on the inner side of the first auxiliary turntable, an auxiliary sucker base body is arranged on the inner side of the second auxiliary turntable, a sucker groove body is formed in the upper end face of the auxiliary sucker base body, a main vent hole is formed in the center of the sucker groove body, an auxiliary vent hole is formed in the side face of the main vent hole, a rotating ring is arranged in the main vent hole, the second auxiliary turntable extends towards the inner side of the auxiliary sucker base body, and the rotating ring is sleeved on one side, extending inwards, of the second auxiliary turntable.
Further, the auxiliary sucking disc can be contacted with the bottom surface of the deformed wafer, and the wafer with micro deformation can be corrected, namely, the adsorption force to which the wafer is subjected is adjusted through the auxiliary sucking disc, the correction wheel rotates to drive the wafer to rotate, the circle center of the wafer is determined by means of the detection probe arranged outside, and whether the deviation exists between the determined circle center of the wafer and the circle center of the adsorption device or not is judged, so that the follow-up correction step is facilitated. In addition, the auxiliary vent holes arranged on the side of the main vent holes can rapidly suck gas and exhaust gas, namely the adsorption response speed to the wafer is improved; meanwhile, a ventilated membrane can be additionally arranged on the surface of the auxiliary sucker base body, the ventilated membrane can protect the bottom surface of the wafer, dust particles can be trapped, and the wafer surface is prevented from being polluted by the particles. Furthermore, the existence of the auxiliary sucker can control the speed of the peripheral air flow of the sucker base, namely the flow of the inner air flow of the sucker base, when the wafer and the sucker base are adsorbed, the suction phenomenon can occur, at this time, the auxiliary sucker also can generate the suction phenomenon, the second auxiliary turntable drives the rotating ring to rotate so as to enlarge the aperture of the air flow in the main vent hole, thereby reducing the flow of the air flow outside the sucker base to the inner side, avoiding the problem that the adsorption force of a plurality of positions of the wafer is inconsistent due to excessive air suction when the sucker base is sucked, thereby realizing the control of the flow of the peripheral air flow of the sucker base to the inner side of the sucker base, and also avoiding the phenomenon that particles possibly existing in the air sucked between the wafer and the sucker base stay on the surface of the sucker base due to excessive air suction, and the problem that the particles easily cause the wafer surface variation.
Further, the second auxiliary turntable can be rotated to drive the rotating ring in the main vent hole to rotate, and the rotating ring is used for controlling the air flow of the main vent hole, so that the problem of surface type deterioration caused by insufficient wafer variable adsorption force is avoided.
In the invention, the outer disc body comprises an outer disc short area and an outer disc tall area, the outer disc short area and the outer disc tall area are adjacent and are distributed at intervals, the first grooves on the outer disc short area and the outer disc tall area are internally provided with auxiliary suckers and inflatable disc bodies, the auxiliary suckers and the inflatable disc bodies are circumferentially arranged in the first grooves, and the auxiliary suckers and the inflatable disc bodies are arranged at intervals.
Further, the heights of the sucker bases on the outer disc body are gradually decreased from inside to outside, the bottom of the outer disc body is also provided with a push rod, the push rod is arranged in the adsorption device, the push rod can push the outer disc body to lift, the outer disc body can swing under the lifting action of the push rod at the bottom so as to adjust the heights of the outer disc body, the sucker bases are further in contact with the bottom surface of the wafer, and the sucker bases are ensured to be in effective contact with the bottom surface of the wafer; meanwhile, an inward pressurizing force in an inclined direction is provided for the side of the bottom surface of the wafer, and when the adsorption of the wafer is canceled, the upper and lower swinging of the outer tray body can realize rapid wafer desorption. And the problem that the edge position of the ultrathin wafer is fragile and cannot be sucked by increasing the adsorption force can be effectively solved. Meanwhile, the height of the outer disc high area and the height of the outer disc low area which are arranged on the outer disc body can be adjusted by the push rod at the same time, and a certain clearance is reserved between the outer disc high area and the outer disc low area for adjusting wafers when the subsequent correction device is used for adjusting.
In the invention, the correction device is arranged at the side of the adsorption device in a surrounding way, the correction device comprises a correction wheel assembly, the bottom of the correction wheel assembly is connected with a first steering assembly, the bottom of the first steering assembly is connected with a second steering assembly, the end part of the second steering assembly is connected with a bearing column body, and the bearing column body is connected with the substrate.
According to the invention, the correction wheel assembly comprises a correction wheel, the bottom of the correction wheel is connected with a first rotary disc body, the bottom of the first rotary disc body is connected with a first connecting column, a first blind hole is formed in the side face of the first connecting column, a first through hole is formed in the bottom of the first connecting column, a plurality of clamping blocks are arranged on the outer wall surface of the first connecting column in a surrounding mode, and the clamping blocks are arranged below the first blind hole.
Further, the angle of the wafer on the adsorption device can be adjusted by adjusting the correction wheel, the correction wheel is contacted with the side wall of the wafer, and the current angle of the wafer can be adjusted by rotating the correction wheel.
In the invention, the first steering assembly comprises a first connecting ring, a steering base body is connected below the first connecting ring, a clamping base body is arranged on the outer side of the steering base body in a surrounding mode, one end of the clamping base body extends into the steering base body, steering wheel bodies are connected to the bottoms of the clamping base body and the steering base body, and a first steering column is connected to the bottom of the steering wheel body.
In the invention, one end of a first steering column is provided with a hole groove, a column body connected with a second steering assembly is arranged in the hole groove, the second steering assembly comprises a second steering column, one end of the second steering column is provided with a first arc-shaped groove, a second blind hole is formed in the lower concave position of the first arc-shaped groove, one end of the second steering column is connected with a steering ball body, one end of the steering ball body is connected with a third steering column, the third steering column is connected with a bearing column body, one side of the third steering column body is also provided with a second arc-shaped groove, and the center of the second arc-shaped groove is provided with a third blind hole used for being connected with the bearing column body.
Further, bear the cylinder and be connected with the base plate, be provided with the motor that is used for rotating and bear the cylinder in the base plate, this motor can drive the second that bears the cylinder top and turn to the subassembly and rotate when rotating and bear the cylinder, and the second turns to the subassembly and rotates and drive first steering assembly and rotate and then drive the correction wheel and rotate, and then drive the rotation of wafer. The clamping block is arranged in the middle of the first connecting ring in the assembly, an elastic column body is arranged in the steering base body and is matched with the first blind hole, the clamping block below the correction wheel is matched with the clamping base body extending into the steering base body to drive the correction wheel to start rapidly when the bearing column body rotates, and the correction wheel can slow down the rotating speed and stop due to the matching relation between the clamping block and the clamping base body when the bearing column body speed slows down and stops gradually, so that the rotating inertia of the correction wheel is reduced, and further accurate control is realized.
Compared with the prior art, the invention has the following beneficial effects: be provided with supplementary adsorption component, realize protecting the wafer bottom through adding the ventilated membrane in supplementary sucking disc base member surface, the ventilated membrane can hold back dust particle, avoids the particulate matter to pollute the wafer surface. The existence of the auxiliary sucker can control the speed of the peripheral air flow of the sucker matrix, namely the flow of the inner side of the sucker matrix, when the wafer is adsorbed by the sucker matrix, the suction phenomenon can occur, and at the moment, the auxiliary sucker is also in a suction state, so that the flow of the air flow outside the sucker matrix to the inner side can be reduced, the problem that the adsorption forces of a plurality of positions of the wafer are inconsistent due to excessive air suction when the sucker matrix is sucked is avoided, the flow of the peripheral air flow of the sucker matrix into and out of the inner side of the sucker matrix is controlled, and the occurrence of wafer surface deformation is avoided.
Drawings
FIG. 1 is a schematic diagram of a wafer calibration adsorption apparatus according to the present invention;
FIG. 2 is a top view of an adsorption apparatus according to the present invention;
FIG. 3 is a schematic view of the structure of the inner tray according to the present invention;
FIG. 4 is a schematic view of an auxiliary suction cup according to the present invention;
FIG. 5 is a schematic cross-sectional view of an auxiliary suction cup according to the present invention;
FIG. 6 is a schematic diagram of a calibration device according to the present invention;
FIG. 7 is a schematic illustration of a corrector wheel assembly according to the present invention;
FIG. 8 is a schematic view of a first steering assembly according to the present invention;
FIG. 9 is a schematic view of a second steering assembly according to the present invention;
fig. 10 is a schematic structural view of a second steering assembly according to another aspect of the present invention.
Reference numerals illustrate: 1-an adsorption device, 11-an inner tray body; 12-an outer tray; 121-outer disk short region; 122-outer disk high zone; 14-a first groove; 15-an inflatable tray; 16-a suction cup base; 17-an auxiliary suction cup; 171-a first auxiliary turntable; 172-auxiliary outer tray; 173-a second auxiliary turntable; 174-auxiliary sucker base; 176-sucker groove; 177-primary vent; 178-auxiliary vent holes; 179-a rotating ring; 2-a controller; 3-a substrate; 4-correction means; 41-a correction wheel assembly; 411-correction wheel; 412-a first rotating disc; 413-a first connection post; 414-a first blind hole; 415-clamping blocks; 416-a first via; 42-a first steering assembly; 421-first attachment ring; 422-steering base; 423-clamping the substrate; 424-steering wheel body; 425-a first steering column; 43-a second steering assembly; 431-a second steering column; 432-a first arcuate slot; 433-a second blind hole; 434-steering spheres; 435-a third steering column; 436-a second arcuate slot; 437-third blind hole; 44-carrying columns.
Detailed Description
Example 1:
referring to fig. 1, 2, 3 and 6, the invention provides a wafer adsorption carrier, which comprises an adsorption device 1, wherein the bottom of the adsorption device 1 is connected with a substrate 3, a controller 2 is arranged on the substrate 3, a plurality of correction devices 4 are further arranged on the substrate 3, the controller 2 is arranged on one side of the adsorption device 1, the correction devices 4 are arranged around the side of the adsorption device 1, the adsorption device 1 comprises an inner disc body 11 and an outer disc body 12, a plurality of sucker matrixes 16 are arranged at the center of the inner disc body 11, a plurality of inflatable disc bodies 15 are arranged between the sucker matrixes 16, the side surfaces of the inflatable disc bodies 15 are connected with inflatable columns, and the inflatable columns are partially arranged in the adsorption device 1.
Further, the wafer to be detected is placed on the adsorption device 1, meanwhile, equipment such as a detection probe is further arranged outside the adsorption device 1, when the detection probe detects that the flatness of the surface of the wafer does not reach the standard, the height of the outer disc high area 122 and the outer disc low area 121 on the adsorption device 1 and the height of the correction device 4 are adjusted on the surface of the wafer, the detection probe can expand the detection range by rotating the wafer, and meanwhile, the correction device 4 can effectively solve the problem that the edge of the thinner wafer is easy to crack.
Referring to fig. 1, fig. 2 and fig. 3, further, an air column is arranged at the bottom of the air tray body 15, and is connected with the air tray body 15, when the adsorption device 1 works, the air tray body 15 is ventilated and swelled, on one hand, the air tray body 15 is arranged to buffer the bottom surface of the wafer due to sudden stress of the wafer in the adsorption process of the wafer and the sucker, so that the problem that the wafer is curled due to partial support in place is avoided; on the other hand, after the wafer is adsorbed, the inflatable disk body 15 can be used for extruding internal gas into an inflatable column at the bottom of the inflatable disk body 15 along with the change of the upper and lower positions of the wafer, the inflatable column is inflated along with the wafer, under the condition that the clearance between the wafer and the surface of the sucker base 16 is smaller after the wafer is completely adsorbed by the sucker base 16, the inflatable column at the periphery of the inflatable disk body 15 can be abutted with the round bottom surface of the wafer, the horizontal effect of the wafer adsorption is further ensured, and the inflation and the shrinkage of the inflatable column are helpful for pushing away or removing particles existing on the surface of the sucker base, and meanwhile, the cleaning condition of the surface of the sucker base can be ensured.
In the invention, the outer side of an inner tray body 11 is connected with an outer tray body 12, first grooves 14 are respectively formed in the inner tray body 11 and the outer tray body 12, a sucker base 16 and an inflatable tray body 15 are respectively arranged in the first grooves 14 of the inner tray body 11, the sucker base 16 and the inflatable tray body 15 are circumferentially arranged in the first grooves 14, and the sucker base 16 and the inflatable tray body 15 are arranged at intervals.
Example 2:
the difference between this embodiment and embodiment 1 is that, referring to fig. 4 and fig. 5, in the present invention, the auxiliary suction cup 17 includes an auxiliary outer disk body 172, a first auxiliary turntable 171 is sleeved on the inner side of the auxiliary outer disk body 172, a second auxiliary turntable 173 is provided on the inner side of the first auxiliary turntable 171, an auxiliary suction cup base 174 is provided on the inner side of the second auxiliary turntable 173, a suction cup groove 176 is provided on the upper end surface of the auxiliary suction cup base 174, a main ventilation hole 177 is provided in the center of the suction cup groove 176, an auxiliary ventilation hole 178 is provided on the side surface of the main ventilation hole 177, a rotation ring 179 is provided in the main ventilation hole 177, the second auxiliary turntable 173 extends towards the inner side of the auxiliary suction cup base 174, and a rotation ring 179 is sleeved on the side of the second auxiliary turntable 173 extending inwards.
Referring to fig. 1, fig. 4, fig. 5, fig. 7, and fig. 8, further, the auxiliary suction cup 17 can be in contact with the bottom surface of the deformed wafer, and can also correct the wafer with micro deformation, that is, the auxiliary suction cup 17 adjusts the adsorption force applied to the wafer, the correction wheel 411 rotates to drive the wafer to rotate and determine the circle center of the wafer by means of the externally arranged detection probe, so that whether the deviation exists between the determined circle center of the wafer and the circle center of the adsorption device 1 can be determined, and further, the subsequent correction step is convenient. In addition, the auxiliary vent holes 178 arranged at the sides of the main vent holes 177 can rapidly suck and discharge gas, namely, the adsorption response speed to the wafer is improved; meanwhile, a ventilated membrane can be additionally arranged on the surface of the auxiliary sucker base 174, the ventilated membrane can protect the bottom surface of the wafer, dust particles can be trapped, and the wafer surface is prevented from being polluted by the particles. Furthermore, the existence of the auxiliary chuck 17 can control the speed of the peripheral air flow of the chuck base 16, that is, the flow of the air flow inside the chuck base 16, when the wafer is sucked with the chuck base 16, the suction phenomenon occurs, during this time, the auxiliary chuck 17 also generates the suction phenomenon, the second auxiliary turntable 173 drives the rotating ring 179 to rotate, thereby expanding the aperture of the air flow inside the main ventilation hole 177, so as to reduce the flow of the air flow outside the chuck base 16 to the inner side, thereby avoiding the problem that the suction force of the wafer is inconsistent due to the excessive suction of the air flow inside the chuck base 16 when the chuck base 16 sucks, thereby realizing the control of the flow of the peripheral air flow of the chuck base 16 inside the chuck base 16, and avoiding the problem that the surface of the chuck base 16 is stopped by the particles possibly existing in the air sucked between the wafer and the chuck base 16 due to the excessive suction of the air, and the problem that the particles easily cause the wafer surface to be deformed.
Further, the second auxiliary turntable 173 can be rotated to drive the rotating ring 179 in the main vent 177 to rotate, and the rotating ring 179 is used for controlling the air flow of the main vent 177, so as to avoid the problem of poor surface shape caused by insufficient wafer swing adsorption force.
Referring to fig. 1 and 2, in the present invention, an outer disc 12 includes an outer short area 121 and an outer tall area 122, the outer short area 121 and the outer tall area 122 are adjacent and are arranged at intervals, auxiliary suction cups 17 and an inflatable disc 15 are respectively arranged in first grooves 14 on the outer short area 121 and the outer tall area 122, the auxiliary suction cups 17 and the inflatable disc 15 are circumferentially arranged in the first grooves 14, and the auxiliary suction cups 17 and the inflatable disc 15 are arranged at intervals.
Further, the height of the sucker base 16 on the outer tray body 12 decreases from inside to outside, and a push rod is further arranged at the bottom of the outer tray body 12, the push rod is arranged in the adsorption device 1, the push rod can push the outer tray body 12 to lift, the outer tray body 12 can swing under the lifting action of the push rod at the bottom so as to adjust the height of the outer tray body, the sucker base 16 is in contact with the wafer bottom surface, and the sucker base 16 is ensured to be in effective contact with the wafer bottom surface; meanwhile, an inward pressurizing force in an inclined direction is provided for the bottom side of the wafer, and when the adsorption of the wafer is canceled, the upper and lower swinging of the outer disc body 12 can realize rapid wafer desorption force cancellation. And the problem that the edge position of the ultrathin wafer is fragile and cannot be sucked by increasing the adsorption force can be effectively solved. Meanwhile, the height of the outer disc high area 122 and the height of the outer disc low area 121 which are arranged on the outer disc body 12 can be adjusted by the push rod at the same time, and a certain clearance is reserved for adjusting the wafer when the outer disc high area 122 and the outer disc low area 121 are adjusted by the subsequent correction device 4.
Example 3:
the difference between this embodiment and embodiment 1 is that, referring to fig. 6, 7, 8, 9 and 10, in the present invention, the correction device 4 includes a correction wheel assembly 41, a first steering assembly 42 is connected to the bottom of the correction wheel assembly 41, a second steering assembly 43 is connected to the bottom of the first steering assembly 42, a bearing column 44 is connected to the end of the second steering assembly 43, and the bearing column 44 is connected to the base plate 3. In the present invention, the correction wheel assembly 41 includes a correction wheel 411, a first rotating disc 412 is connected to the bottom of the correction wheel 411, a first connecting post 413 is connected to the bottom of the first rotating disc 412, a first blind hole 414 is formed on a side surface of the first connecting post 413, a first through hole 416 is formed at the bottom of the first connecting post 413, a plurality of clamping blocks 415 are circumferentially arranged on an outer wall surface of the first connecting post 413, and the clamping blocks 415 are disposed below the first blind hole 414.
Further, the angle of the wafer on the suction device 1 can be adjusted by adjusting the correction wheel 411, the correction wheel 411 contacts with the sidewall of the wafer, and the current angle of the wafer can be adjusted by rotating the correction wheel 411.
Referring to fig. 8, in the present invention, the first steering assembly 42 includes a first connecting ring 421, a steering base 422 is connected below the first connecting ring 421, a clamping base 423 is circumferentially disposed on the outer side of the steering base 422, one end of the clamping base 423 extends into the steering base 422, both the clamping base 423 and the bottom of the steering base 422 are connected with a steering wheel 424, and the bottom of the steering wheel 424 is connected with a first steering column 425.
Referring to fig. 9 and 10, in the present invention, a hole groove is formed at one end of a first steering column 425, a column body connected with a second steering assembly 43 is disposed in the hole groove, the second steering assembly 43 includes a second steering column 431, a first arc-shaped groove 432 is formed at one end of the second steering column 431, a second blind hole 433 is formed in a lower recess of the first arc-shaped groove 432, a steering ball 434 is connected to one end of the second steering column 431, a third steering column 435 is connected to one end of the steering ball 434, the third steering column 435 is connected to a bearing column 44, a second arc-shaped groove 436 is also disposed at one side of the third steering column 435, and a third blind hole 437 for connecting with the bearing column 44 is formed at the center of the second arc-shaped groove 436.
Further, the carrying column 44 is connected with the substrate 3, a motor for rotating the carrying column 44 is disposed in the substrate 3, and the motor can drive the second steering assembly 43 above the carrying column 44 to rotate while rotating the carrying column 44, and the second steering assembly 43 rotates to drive the first steering assembly 42 to rotate and then drive the correction wheel 411 to rotate, so as to drive the wafer to rotate. The clamping block 415 is arranged in the middle of the first connecting ring 421 in the assembly process, an elastic column body is arranged in the steering base body 422 and matched with the first blind hole 414, the clamping block 415 below the correction wheel 411 is matched with the clamping base body 423 extending into the steering base body 422 to drive the correction wheel 411 to start rapidly when the bearing column 44 rotates, and when the bearing column 44 slows down and stops gradually, the correction wheel 411 slows down the rotating speed and stops due to the matching relation between the clamping block 415 and the clamping base body 423, so that the rotating inertia of the correction wheel 411 is reduced, and accurate control is realized.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
Claims (7)
1. The utility model provides a wafer adsorbs carrier disc, includes, adsorption equipment (1) bottom is connected with base plate (3), be provided with controller (2) on base plate (3), still be provided with correcting unit (4) on base plate (3), controller (2) are located one side of adsorption equipment (1), correcting unit (4) encircle and set up the side of adsorption equipment (1), a serial communication port, adsorption equipment (1) is including interior disk body (11) and outer disk body (12), interior disk body (11) center department is provided with two at least sucking disc base members (16), be provided with between sucking disc base member (16) and aerify disk body (15), it is connected with the post that aerifys to aerify disk body (15) side.
2. The wafer adsorption carrier according to claim 1, wherein the outer side of the inner disc body (11) is connected with an outer disc body (12), first grooves (14) are formed in the inner disc body (11) and the outer disc body (12), suction disc bases (16) and inflatable disc bodies (15) are respectively arranged in the first grooves (14) of the inner disc body (11), and the suction disc bases (16) and the inflatable disc bodies (15) are circumferentially arranged in the first grooves (14) at intervals.
3. The wafer adsorption carrier according to claim 2, wherein the outer tray body (12) comprises an outer tray short area (121) and an outer tray tall area (122), the outer tray short area (121) and the outer tray tall area (122) are adjacent and are arranged at intervals, the first grooves (14) on the outer tray short area (121) and the outer tray tall area (122) are internally provided with auxiliary suction cups (17) and an inflatable tray body (15), the auxiliary suction cups (17) and the inflatable tray body (15) are circumferentially arranged in the first grooves (14), and the auxiliary suction cups (17) and the inflatable tray body (15) are arranged at intervals.
4. A wafer adsorption carrier according to claim 1, wherein the correction device (4) comprises a correction wheel assembly (41), a first steering assembly (42) is connected to the bottom of the correction wheel assembly (41), a second steering assembly (43) is connected to the bottom of the first steering assembly (42), a bearing column (44) is connected to the end of the second steering assembly (43), and the bearing column (44) is connected to the substrate (3).
5. The wafer adsorption carrier of claim 4, wherein the correction wheel assembly (41) comprises a correction wheel (411), a first rotary disc (412) is connected to the bottom of the correction wheel (411), a first connecting column (413) is connected to the bottom of the first rotary disc (412), a first blind hole (414) is formed in the side face of the first connecting column (413), a first through hole (416) is formed in the bottom of the first connecting column (413), and a clamping block (415) is arranged on the outer wall surface of the first connecting column (413) in a surrounding mode, and the clamping block (415) is arranged below the first blind hole (414).
6. The wafer adsorption carrier of claim 4, wherein the first steering assembly (42) comprises a first connecting ring (421), a steering base (422) is connected below the first connecting ring (421), a clamping base (423) is arranged around the outer side of the steering base (422), one end of the clamping base (423) extends into the steering base (422), steering wheel bodies (424) are connected to the bottoms of the clamping base (423) and the steering base (422), and a first steering column (425) is connected to the bottom of the steering wheel body (424).
7. The wafer adsorption carrier of claim 6, wherein a hole groove is formed in one end of the first steering column (425), a column body connected with the second steering assembly (43) is arranged in the hole groove, the second steering assembly (43) comprises a second steering column (431), a first arc-shaped groove (432) is formed in one end of the second steering column (431), a second blind hole (433) is formed in a lower concave portion of the first arc-shaped groove (432), a steering sphere (434) is connected to one end of the second steering column (431), a third steering column (435) is connected to one end of the steering sphere (434), one side of the third steering column (435) is provided with a second arc-shaped groove (436), and a third blind hole (437) connected with the bearing column (44) is formed in the center of the second arc-shaped groove (436).
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