CN217691093U - Bench disc jig of wafer film sticking machine - Google Patents
Bench disc jig of wafer film sticking machine Download PDFInfo
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- CN217691093U CN217691093U CN202222043861.0U CN202222043861U CN217691093U CN 217691093 U CN217691093 U CN 217691093U CN 202222043861 U CN202222043861 U CN 202222043861U CN 217691093 U CN217691093 U CN 217691093U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
A table plate jig of a wafer film sticking machine comprises a table plate body and a first placing groove, wherein the first placing groove is formed in the center of the table plate body; the first adsorption part is arranged along the edge of the first placing groove and used for fixing the edge of the wafer; the second placing groove is circular and is arranged at the bottom of the first placing groove, and the circle centers of the second placing groove and the first placing groove are superposed; the second adsorption part is arranged at the bottom of the second placing groove and is used for auxiliary fixation of the wafer; and the taking and placing port is communicated with the first placing groove. The utility model discloses at simple structure, getting when easily the wafer pad pasting is put, fix a position, the wafer lobe risk that probably causes when having reduced the pad pasting and having taken up the cutting ring after accomplishing more is favorable to reducing the damage that the platform dish caused to the wafer surface (including bumps such as the gold ball of planting, tin ball).
Description
Technical Field
The utility model relates to an electronic chip encapsulation production facility field, especially a platform dish tool of wafer sticking film machine.
Background
In the flow of various packaging (including SMD, CSP, WLP, etc.) of surface acoustic wave devices, a wafer needs to be cut, and a wafer fixing process, namely wafer mount, is performed before cutting. In the existing wafer film sticking machine, a wafer is placed on an integral straight circular table disc with the front face facing downwards, the surface of the table disc is provided with vacuum holes/grooves for adsorption, then a cutting film is tightly and straightly attached to the back face of the wafer, and the cutting film is pressed and covered by rollers. Different sticking film machine platform discs can directly influence whether the sticking film operation causes adverse effects on the wafer. The table disc of the prior wafer laminator has the following defects: 1, the wafer is inconvenient to take and place and can slide; 2, the contact surface between the surface of the wafer and the table plate is large, so that strong adhesion is possible, and the wafer is easy to crack when the cutting ring is taken up after film pasting is finished; 3, if the surface of the wafer is implanted with metal bumps such as gold balls or solder balls, it is easy to damage and deform the wafer.
Disclosure of Invention
The utility model aims at providing a platform dish tool of wafer sticking film machine to solve the problem that provides in the background art.
The technical solution of the utility model is that: a bench disc jig of a wafer film sticking machine comprises a bench disc body and further comprises
The first placing groove is formed in the center of the table disc body;
the first adsorption part is arranged along the edge of the first placing groove and used for fixing the edge of the wafer;
the second placing groove is circular and is arranged at the bottom of the first placing groove, and the circle centers of the second placing groove and the first placing groove are overlapped;
the second adsorption part is arranged at the bottom of the second placing groove and is used for auxiliary fixation of the wafer;
and the taking and placing port is communicated with the first placing groove.
Preferably, the first suction part includes first vacuum suction grooves disposed along edges of the first placement groove and symmetrically distributed in the first placement groove, and first vacuum suction holes disposed at a bottom of the first vacuum suction grooves.
Preferably, the first vacuum adsorption tank is arc-shaped.
Preferably, the second adsorption part comprises a plurality of second vacuum adsorption grooves arranged at the bottom of the second placing groove, and the second vacuum adsorption grooves are annular and coincide with the circle center of the second placing groove.
Preferably, the second suction unit includes a first vacuum suction chute crossing the bottom of the second placement tank, and a crossing point of the first vacuum suction chute coincides with a center of the second placement tank.
Preferably, the second adsorption part comprises a plurality of third vacuum adsorption grooves formed in the bottom of the second placing groove, the third vacuum adsorption grooves are annular, and the adjacent third vacuum adsorption grooves are communicated through second vacuum adsorption chutes.
Preferably, the groove depth of the first placing groove is 0.20-0.40mm.
Preferably, the groove depth of the second placing groove is 0.80-1.20mm.
Preferably, the taking and placing opening is a circular groove with the diameter of 15mm, and the groove depth is 5mm.
The utility model has the advantages that:
compared with the prior art, the utility model discloses at simple structure, getting when easily the wafer pad pasting is put, fix a position, the wafer lobe risk that probably causes when having reduced the pad pasting and having taken up the cutting ring after accomplishing more is favorable to reducing the damage that the platform dish caused to the wafer surface (bump such as gold ball, tin ball planted).
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a second adsorption part in embodiment 2;
FIG. 3 is a schematic view of a second adsorption part in example 3;
FIG. 4 is a schematic view of a second adsorption part in embodiment 4;
Detailed Description
The present invention will be further described with reference to the following embodiments in conjunction with the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Embodiment 1, as shown in fig. 1, a table jig of a wafer film laminator includes a table body 1, and further includes a first placing groove 101, the first placing groove 101 is formed in the center of the table body 1, the depth of the first placing groove 101 is 0.20-0.40mm, and the first placing groove 101 fits with the outer contour of a wafer, and is used for positioning the wafer;
the first adsorption part 2 is arranged along the edge of the first placing groove 101 and used for fixing the edge of the wafer, so that the wafer is prevented from shifting after being placed in the first placing groove 101, and further, the damage of the table disc to the surface of the wafer caused by implanted salient points such as gold balls and tin balls is reduced;
the second placing groove 102 is circular and is arranged at the bottom of the first placing groove 101, the circle centers of the second placing groove 102 and the first placing groove 101 are overlapped, and the groove depth of the second placing groove 102 is 0.80-1.20mm, so that the contact between the surface of the table plate and the main central area of the surface of the wafer is avoided, and the damage of the table plate to the surface of the wafer, including bumps such as implanted gold balls and tin balls, is reduced;
the second adsorption part 3 is arranged at the bottom of the second placing groove 102, and the wafer is assisted and fixed through vacuum adsorption, so that the position of the wafer is further prevented from being deviated;
the taking and placing port 103 is communicated with the first placing groove 101, the taking and placing port 103 is a circular groove with the diameter of 15mm, the groove depth is 5mm, and the wafer taking and placing operation is carried out by entering the first placing groove 101 through the taking and placing port 103.
The utility model discloses at simple structure, getting when easily the wafer pad pasting is put, fix a position, the wafer lobe of a leaf risk that probably causes when having reduced the pad pasting and having taken up the cutting ring after accomplishing more is favorable to reducing the damage that the platform dish caused to the wafer surface bump such as gold ball, tin ball of planting.
Further, first absorption portion 2 includes along first standing groove 101 edge setting and the first vacuum adsorption groove 201 of symmetric distribution in first standing groove 101, establish the first vacuum adsorption hole 202 in first vacuum adsorption groove 201 bottom, first vacuum adsorption groove 201 is the arc, adsorb fixedly through first vacuum adsorption groove 201 and first vacuum adsorption hole 202 to the wafer edge, prevent to take place the skew after the first standing groove 101 is put into to the wafer, and then reduce the platform dish including the gold ball of planting, the damage that bumps such as tin ball caused to the wafer surface.
Embodiment 4, this embodiment is different from embodiment 1 in that the second suction portion 3 includes a plurality of third vacuum suction grooves 303 disposed at the bottom of the second placement groove 102, the third vacuum suction grooves 303 are annular, adjacent third vacuum suction grooves 303 are communicated with each other through the second vacuum suction chute 304, and preferably, the third vacuum suction grooves 303 include three concentric rings having diameters of 30mm, 50mm, and 70mm, respectively, and the third vacuum suction grooves 303 and the second vacuum suction chute 304 assist in fixing the wafer, thereby further preventing the wafer from being shifted in position.
Claims (9)
1. The utility model provides a bench hassock of wafer sticking film machine, includes bench hassock body (1), its characterized in that: and also comprises
A first placing groove (101), wherein the first placing groove (101) is formed in the center of the table plate body (1);
the first adsorption part (2) is arranged along the edge of the first placing groove (101) and used for fixing the edge of the wafer;
the second placing groove (102), the second placing groove (102) is circular and is arranged at the bottom of the first placing groove (101), and the circle centers of the second placing groove (102) and the first placing groove (101) are overlapped;
the second adsorption part (3) is arranged at the bottom of the second placing groove (102) and used for assisting and fixing the wafer;
the taking and placing opening (103) is communicated with the first placing groove (101).
2. The platen jig of the wafer laminator according to claim 1, wherein: the first adsorption part (2) comprises first vacuum adsorption grooves (201) which are arranged along the edges of the first placing grooves (101) and symmetrically distributed in the first placing grooves (101) and first vacuum adsorption holes (202) which are arranged at the bottoms of the first vacuum adsorption grooves (201).
3. The platen jig of the wafer laminator according to claim 2, wherein: the first vacuum adsorption groove (201) is arc-shaped.
4. The table plate jig of the wafer film sticking machine according to claim 1, characterized in that: the second adsorption part (3) comprises a plurality of second vacuum adsorption grooves (301) arranged at the bottoms of the second placing grooves (102), and the second vacuum adsorption grooves (301) are annular and coincide with the circle centers of the second placing grooves (102).
5. The platen jig of the wafer laminator according to claim 1, wherein: the second suction unit (3) includes a first vacuum suction chute (302) that is distributed across the bottom of the second placement tank (102), and the intersection of the first vacuum suction chute (302) coincides with the center of the second placement tank (102).
6. The platen jig of the wafer laminator according to claim 1, wherein: the second adsorption part (3) comprises a plurality of third vacuum adsorption grooves (303) arranged at the bottom of the second placing groove (102), the third vacuum adsorption grooves (303) are annular, and adjacent third vacuum adsorption grooves (303) are communicated through a second vacuum adsorption chute (304).
7. The table plate jig of the wafer film sticking machine according to claim 1, characterized in that: the depth of the first placing groove (101) is 0.20-0.40mm.
8. The platen jig of the wafer laminator according to claim 1, wherein: the depth of the second placing groove (102) is 0.80-1.20mm.
9. The platen jig of the wafer laminator according to claim 1, wherein: the taking and placing opening (103) is a circular groove with the diameter of 15mm, and the depth of the groove is 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222043861.0U CN217691093U (en) | 2022-08-04 | 2022-08-04 | Bench disc jig of wafer film sticking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222043861.0U CN217691093U (en) | 2022-08-04 | 2022-08-04 | Bench disc jig of wafer film sticking machine |
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| Publication Number | Publication Date |
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| CN217691093U true CN217691093U (en) | 2022-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222043861.0U Active CN217691093U (en) | 2022-08-04 | 2022-08-04 | Bench disc jig of wafer film sticking machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117712011A (en) * | 2024-02-05 | 2024-03-15 | 无锡星微科技有限公司杭州分公司 | Wafer adsorption carrying disc |
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2022
- 2022-08-04 CN CN202222043861.0U patent/CN217691093U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117712011A (en) * | 2024-02-05 | 2024-03-15 | 无锡星微科技有限公司杭州分公司 | Wafer adsorption carrying disc |
| CN117712011B (en) * | 2024-02-05 | 2024-04-19 | 无锡星微科技有限公司杭州分公司 | Wafer adsorption carrying disc |
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