CN210381445U

CN210381445U - Novel circuit board based on thermal conductive plastic

Info

Publication number: CN210381445U
Application number: CN201921112660.3U
Authority: CN
Inventors: 何志聪; 蔺绍江
Original assignee: Hubei Polytechnic University
Current assignee: Hubei Zhongpei Electronic Technology Co ltd
Priority date: 2019-07-16
Filing date: 2019-07-16
Publication date: 2020-04-21
Anticipated expiration: 2029-07-16

Abstract

The utility model discloses a novel circuit board based on thermal conductive plastic, including the base plate, the top welding of base plate has the circuit layer, offers through-hole or wire casing that is used for fixed electronic components on the base plate, is provided with electrically conductive line of walking on the circuit layer, and the bottom of base plate is provided with the heat conduction silica gel layer, and the bottom on heat conduction silica gel layer is provided with the heat dissipation layer, and the top both ends department of base plate all sets up porosely, and a plurality of heat dissipation through-holes have been seted up in the heat dissipation. The utility model discloses well base plate adopts ABS, PC, PA or PEEK plastic material to mould plastics and forms, can freely change appearance and size according to the requirement design of product, can use under damp and hot, vibrations environment simultaneously, avoids traditional printed circuit board's corruption, softening, deformation, milden and rot, the metal level drops, the problem of electric leakage, and its quality is little moreover, intensity is high, corrosion resistance is strong, with low costs, not only reduces enterprise's purchasing cost, still greatly reduced environmental pollution's emission.

Description

Novel circuit board based on thermal conductive plastic

Technical Field

The utility model relates to a circuit board, in particular to novel circuit board based on thermal conductive plastic.

Background

The substrate material used in the present PCB manufacturing process is a copper clad laminate, which is formed by pressing an aluminum plate, a copper foil and fiber cloth, has high price and contains heavy metals, for example, a method of coating an adhesive on an insulating substrate and pasting the copper foil or a method of pouring resin on the copper foil is adopted, but the method needs to use a large amount of adhesive, and the adhesive generally causes environmental problems such as waste water and waste gas, etc., so that the cost of treating environmental pollution by enterprises is increased, and the environmental protection is also affected very badly.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is overcome prior art's defect, a novel circuit board based on thermal-conductive plastic is provided, the base plate adopts ABS, PC, PA or PEEK plastic materials mould plastics and form, can freely change appearance and size according to the requirement design of product enough, simultaneously can be in damp and hot, use under the vibrations environment, avoid traditional printed circuit board's corruption, soften, warp, milden and rot, the metal level drops, the problem of electric leakage, and its quality is little, high strength, strong corrosion resistance, with low costs, not only reduce enterprise's purchasing cost, still greatly reduced environmental pollution's emission.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model relates to a novel circuit board based on thermal conductive plastic, which comprises a substrate, the top welding of base plate has the circuit layer, set up through-hole or wire casing that is used for fixed electronic components on the base plate, it walks the line to be provided with the electricity on the circuit layer, the bottom of base plate is provided with heat conduction silica gel layer, the bottom on heat conduction silica gel layer is provided with the heat dissipation layer, the top both ends department of base plate all sets up porosely, a plurality of heat dissipation through-holes have been seted up in the heat dissipation layer.

As an optimized technical scheme of the utility model, the base plate adopts ABS, PC, PA or PEEK plastic materials to mould plastics and forms.

As a preferred technical scheme of the utility model, electrically conductive on the circuit layer is walked the line and is adopted graphite alkene filler injection moulding, electrically conductive walk the line embedded in the wire casing of base plate.

As an optimized technical scheme of the utility model, the bottom and the heat conduction silica gel layer clearing hole of base plate are connected.

As an optimal technical scheme of the utility model, the heat dissipation layer is the graphite alkene fin.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses well base plate adopts ABS, PC, PA or PEEK plastic material to mould plastics and forms, can freely change appearance and size according to the requirement design of product, can use under damp and hot, vibrations environment simultaneously, avoids traditional printed circuit board's corruption, softening, deformation, milden and rot, the metal level drops, the problem of electric leakage, and its quality is little moreover, intensity is high, corrosion resistance is strong, with low costs, not only reduces enterprise's purchasing cost, still greatly reduced environmental pollution's emission.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is an overall structure of the present invention;

in the figure: 1. a circuit layer; 2. an aperture; 3. a substrate; 4. a heat conductive silica gel layer; 5. a heat dissipation layer; 6. and the heat dissipation through hole.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention. Wherein like reference numerals refer to like parts throughout.

In addition, if a detailed description of the known art is not necessary to show the features of the present invention, it is omitted. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

Example 1

As fig. 1, the utility model provides a novel circuit board based on thermal conductive plastic, including base plate 3, the top welding of base plate 3 has circuit layer 1, offers through-hole or the wire casing that is used for fixed electronic components on the base plate 3, is provided with the electrically conductive line of walking on the circuit layer 1, and the bottom of base plate 3 is provided with heat conduction silica gel layer 4, and the bottom of heat conduction silica gel layer 4 is provided with heat dissipation layer 5, and porose 2 has all been seted up to the top both ends department of base plate 3, has seted up a plurality of heat dissipation through-holes 6 in the heat dissipation layer.

Furthermore, the substrate 3 is formed by injection molding of ABS, PC, PA or PEEK plastic materials, an insulating layer is not required to be coated, the heat conductivity coefficient of the circuit board is not less than 20W/M.K, the product weight, the cost and the operation temperature are reduced, the service life and the operation stability of electronic devices are improved, the high-temperature resistant electronic device is high in temperature resistance of 280 ℃, is not shrunk and deformed, plastic particles can still maintain high mechanical performance under the high-temperature condition, is corrosion-resistant and stress cracking resistant, is stable in size, can reach about 290 ℃ for long-term working temperature and 480 ℃ for short time, can work under the environment of-240 ℃, and is formed by injection molding of sulfur-free plastic molecules, so that the emission of toxic and harmful substances is effectively reduced.

The electrically conductive line on circuit layer 1 adopts graphite alkene filler injection moulding, and electrically conductive line is embedded in the wire casing of base plate 3, can design according to circuit wiring length, thickness, angle demand.

The bottom layer of the substrate 3 is connected with the heat-conducting silica gel layer 4 through the hole 2, and the heat of the circuit board is transferred to the heat dissipation layer 5 through the heat-conducting silica gel layer 4, so that the heat dissipation effect is strong.

The heat dissipation layer 5 is the graphite alkene fin, can be timely dispel the heat that the circuit board produced at the during operation, prevent the damage that the circuit board caused because of the high temperature.

Specifically, the substrate 3 is formed by injection molding of ABS, PC, PA or PEEK plastic materials, an insulating layer is not required to be coated, the product weight, the cost and the operating temperature are reduced, the service life and the operating stability of electronic devices are improved, the circuit layer 1 is welded on the top of the substrate 3, through holes or wire grooves for fixing electronic components are formed in the substrate 3, conductive routing wires are arranged on the circuit layer 1, the bottom of the substrate 3 is provided with a heat conduction silica gel layer 4, the bottom of the heat conduction silica gel layer 4 is provided with a heat dissipation layer 5, holes 2 are formed at two ends of the top of the substrate 3, a plurality of heat dissipation through holes 6 are formed in the heat dissipation layer 5, the conductive routing wires on the circuit layer 1 are formed by injection molding of graphene filler and are embedded in the wire grooves of the substrate 3 and can be designed according to the requirements of length, thickness and angle of the circuit routing wires, the heat of the circuit board is transferred to the heat dissipation layer 5 through the heat conduction silica gel layer 4, so that the heat dissipation effect is strong, the heat dissipation layer 5 is a graphene heat dissipation sheet, the heat generated by the circuit board during working can be dissipated timely, and the circuit board is prevented from being damaged due to overhigh temperature.

The utility model discloses well base plate 3 adopts ABS, PC, PA or PEEK plastic material to mould plastics and forms, can freely change appearance and size according to the requirement design of product, can use under damp and hot, vibrations environment simultaneously, avoids traditional printed circuit board's corruption, softening, deformation, milden and rot, the metal level drops, the problem of electric leakage, and its quality is little moreover, intensity is high, the resistance to corrosion is strong, with low costs, not only reduces enterprise's purchasing cost, still greatly reduced environmental pollution's emission.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a novel circuit board based on thermal conductive plastic, a serial communication port, including base plate (3), the top welding of base plate (3) has circuit layer (1), offer through-hole or wire casing that is used for fixed electronic components on base plate (3), be provided with electrically conductive line on circuit layer (1), the bottom of base plate (3) is provided with heat conduction silica gel layer (4), the bottom of heat conduction silica gel layer (4) is provided with heat dissipation layer (5), porose (2) are all seted up to the top both ends department of base plate (3), a plurality of heat dissipation through-holes (6) have been seted up in heat dissipation layer (5).

2. The novel circuit board based on thermal conductive plastic as claimed in claim 1, wherein the substrate (3) is injection molded from ABS, PC, PA or PEEK plastic materials.

3. The novel circuit board based on thermal conductive plastic as claimed in claim 1, wherein the electrically conductive traces on the circuit layer (1) are formed by injection molding with graphene filler, and the electrically conductive traces are embedded in the wire grooves of the substrate (3).

4. The novel circuit board based on thermal conductive plastic as claimed in claim 1, wherein the bottom layer of the substrate (3) and the thermal conductive silicone layer (4) are connected through the hole (2).

5. The novel circuit board based on thermal conductive plastic as claimed in claim 1, wherein the heat dissipation layer (5) is a graphene heat sink.