CN210279981U - Wafer magazine workbin belt cleaning device - Google Patents

Wafer magazine workbin belt cleaning device Download PDF

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Publication number
CN210279981U
CN210279981U CN201921015012.6U CN201921015012U CN210279981U CN 210279981 U CN210279981 U CN 210279981U CN 201921015012 U CN201921015012 U CN 201921015012U CN 210279981 U CN210279981 U CN 210279981U
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China
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pure water
rotating cage
cleaning device
pipeline
machine body
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CN201921015012.6U
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Chinese (zh)
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王向阳
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Shanghai Dongpeng Technology Co ltd
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Shanghai Dongpeng Technology Co ltd
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Abstract

The utility model relates to a wafer material box cleaning device, which comprises a machine body, wherein a sealed cavity is arranged in the machine body and is a cleaning chamber; a rotary cage is arranged in the middle of the cleaning chamber, the rotary cage is rotatably mounted on the machine body through a rotating mechanism, and a plurality of wafer material boxes and/or wafer material box placing racks are uniformly distributed on the rotary cage along the periphery of the rotary cage; a spraying cleaning device mechanism and a liquid cutting mechanism are arranged in the cleaning chamber; the spraying and cleaning device is used for spraying pure water and liquid medicine to the rotating cage from the center, the periphery and the upper and lower sides of the rotating cage in sequence; the liquid cutting mechanism sprays nitrogen to the rotating cage from the center, the periphery and the upper and lower sides of the rotating cage; the wafer material box and/or the wafer material box are/is cleaned and dried in an all-around mode by the aid of the liquid medicine, the pure water is at the temperature of less than or equal to 90 ℃, the liquid medicine is used for preparing the liquid medicine, the wafer material box and/or the wafer material box are cleaned by the aid of the high-temperature pure water and the prepared liquid medicine, the wafer material box and/or the wafer material box are cleaned and cleaned, hot air and.

Description

Wafer magazine workbin belt cleaning device
Technical Field
The utility model relates to a cleaning technology that is used for semiconductor, Micro-LED, Micro-OLED production technology, concretely relates to wafer magazine workbin belt cleaning device.
Background
Each component and circuit in the integrated circuit are very fine, and in the manufacturing process, if the integrated circuit is polluted by dust ions, metal, oil stains and the like, the functions of the circuit are easily damaged, and open circuits or short circuits are formed, so that the integrated circuit is failed to influence the stroke of geometric characteristics. Therefore, the semiconductor wafer of the integrated circuit needs to be cleaned many times during the manufacturing process to ensure the impurities such as metal ions, atoms, organic matters, dust particles and the like attached to the surface. Meanwhile, in the large-scale integrated circuit, the cleanliness requirements of a wafer material box and a material box required by the wafer in the carrying process of each station are basically equal to that of the wafer.
Disclosure of Invention
The utility model provides a rotatory belt cleaning device of cage for wafer magazine and/or wafer workbin.
The technical scheme of the utility model:
a cleaning device for a wafer material box comprises a machine body, wherein a sealed cavity is arranged in the machine body and is a cleaning chamber; a rotary cage is arranged in the middle of the cleaning chamber, the rotary cage is rotatably mounted on the machine body through a rotating mechanism, and a plurality of wafer material boxes and/or wafer material box placing racks are uniformly distributed on the rotary cage along the periphery of the rotary cage; a spraying cleaning device mechanism and a liquid cutting mechanism are arranged in the cleaning chamber; the spraying and cleaning device is used for spraying pure water and liquid medicine to the rotating cage from the center, the periphery and the upper and lower sides of the rotating cage in sequence; the liquid cutting mechanism sprays nitrogen to the rotating cage from the center, the periphery and the upper and lower sides of the rotating cage; the machine body is also provided with a door; the pure water is pure water with the temperature of less than or equal to 90 ℃; preferably, the liquid medicine is a low-concentration proportioned acid.
The rotating cage drives the wafer material box and/or the wafer material box placed on the rotating cage to rotate; the spraying and cleaning device sequentially sprays pure water and prepared liquid medicine at the temperature of less than or equal to 90 ℃ to comprehensively clean the wafer material box and/or the wafer material box, common pure water can only wash away simple particles, but cannot wash away oil stains and organic matters, and the pure water and the liquid medicine can only be cleaned at high temperature; the liquid cutting mechanism sprays nitrogen to blow off water on the material box, and the wafer material box and/or the wafer material box are/is dried in all directions.
The technical scheme is further improved and refined, a plurality of outer nozzles and a plurality of inner nozzles are arranged in the cleaning chamber, the outer nozzles and the inner nozzles are fixedly arranged on the machine body, the outer nozzles are distributed on the periphery, the upper side and the lower side of the rotating cage, the inner nozzles are distributed in the center of the rotating cage, and the outer nozzles and the inner nozzles are respectively opposite to the rotating cage; the outer nozzle and the inner nozzle are respectively connected with a pure water pipeline and a liquid medicine pipeline to jointly form the spraying and cleaning device; the outer nozzle and the inner nozzle are respectively connected with a nitrogen pipeline to jointly form the liquid cutting mechanism.
The technical scheme is further improved and refined, the rotating cage comprises a plurality of ring plates which are arranged in parallel from top to bottom, a plurality of connecting rods are uniformly distributed between every two adjacent ring plates, two ends of each connecting rod are fixedly connected with the ring plates respectively, and the connecting rods and the ring plates jointly form the wafer material box and/or the wafer material box placing frame; the rotating mechanism comprises a driving motor which is fixedly arranged on the upper part of the machine body, and the driving motor is in driving connection with the uppermost ring plate; the inner rings of all the ring plates form a columnar space which is the center of the rotating cage, the bottom of the columnar space is provided with an opening, and all the inner nozzles extend into the center of the rotating cage through the opening.
The technical scheme is further improved and refined, the machine body is provided with an air blower, and the air blower is communicated with the cleaning chamber through a hot air pipeline; the hot air pipeline is provided with a high-efficiency air filter; used for filtering dust ions in hot air.
The technical scheme is further improved and refined, an air outlet is formed in the machine body and communicated with the cleaning chamber, and the air outlet is connected with an air exhaust device through a pipeline; the air exhaust device provides negative pressure for plant affairs; a large amount of water vapor is generated during high-temperature cleaning, the exhaust device is used for pumping away the water vapor generated during cleaning, if the water vapor is left, condensation is generated during drying again and is adhered to a material box, and the drying effect is poor or the drying time is prolonged.
Further improvement and refinement are made to above-mentioned technical scheme, be provided with the locating piece on the rack, preferred locating piece is the nylon piece, when preventing to wash, along with rotatory rotating cage rotates, wafer magazine and/or wafer workbin shift.
The technical scheme is further improved and refined, and the machine body is provided with the observation window, so that the cleaning condition in the cleaning chamber can be observed conveniently in real time.
The technical proposal is further improved and refined, and the lower part of the machine body is respectively provided with a liquid medicine box and a pure water box; the liquid medicine box is connected with a liquid medicine pipeline; the pure water tank is divided into a heating tank and a buffer tank, the tops of the heating tank and the buffer tank are communicated, heating devices are respectively arranged in the heating tank and the buffer tank, a water inlet and a water outlet are respectively arranged on the pure water tank, and the water inlet is connected with a pure water supply pipeline and a pure water pipeline at the water outlet; the nitrogen pipeline is connected with a nitrogen supply pipeline; preferably, the heating device is a plurality of heating pipes.
The technical scheme is further improved and refined, the liquid medicine pipeline, the pure water supply pipeline, the pure water pipeline and the nitrogen pipeline are all formed by a plurality of connected pipelines, and control valves are respectively arranged on the pipelines.
Still be provided with the recovery pipeline in the organism, recovery pipeline and other pipelines intercommunication in the organism, still be provided with the leakage fluid dram on the organism, drainage tube is connected to the leakage fluid dram.
The utility model has the advantages of, reasonable in design, simple structure utilizes rotatory cage cooperation to set up air nozzle, the water spout inside and outside rotatory cage, carries out omnidirectional washing, drying to wafer magazine and/or wafer workbin, adopts high temperature pure water and prepares the liquid medicine to wash, and the sanitization adopts hot-blast and nitrogen gas to carry out the drying, and drying effect is better.
Drawings
FIG. 1 is a schematic diagram of a cage type rotary cleaning device.
In the figure, a machine body 1, a cleaning chamber 2, a rotating cage 3, a rotating mechanism 4, an inner nozzle 5, an outer nozzle 6, a pure water pipeline 7, a nitrogen pipeline 9, a blower 10, a hot air pipeline 11, a high-efficiency air filter 12, a pure water tank 13, a pure water tank 14 and a pure water pipeline 15 are arranged.
Detailed Description
As shown in the figure, the first and second,
a wafer material box cleaning device comprises a machine body 1, wherein a sealed cavity is arranged in the machine body 1 and is a cleaning chamber 2; a rotating cage 3 is arranged in the middle of the cleaning chamber 2, the rotating cage 3 is rotatably mounted on the machine body 1 through a rotating mechanism 4, the rotating cage 3 comprises a plurality of ring plates which are arranged in parallel from top to bottom, a plurality of connecting rods are uniformly distributed between every two adjacent ring plates, two ends of each connecting rod are respectively fixedly connected with the ring plates, and the connecting rods and the ring plates jointly form a wafer material box and/or a wafer material box placing rack; the rotating mechanism 4 comprises a driving motor which is fixedly arranged at the upper part of the machine body 1, and the driving motor is in driving connection with the uppermost ring plate; the inner rings of all the ring plates form a columnar space which is the center of the rotating cage, and the bottom of the columnar space is opened; a plurality of outer nozzles 6 and a plurality of inner nozzles 5 are arranged in the cleaning chamber 2, the outer nozzles 6 and the inner nozzles 5 are fixedly arranged on the machine body 1, the outer nozzles 6 are distributed on the periphery, the upper side and the lower side of the rotating cage 3, the inner nozzles 5 extend into the center of the rotating cage through an opening at the bottom of a columnar space, and the outer nozzles 6 and the inner nozzles 5 are respectively opposite to the rotating cage 3; the outer nozzle 6 and the inner nozzle 5 are respectively connected with a pure water pipeline 7 and a medicine liquid pipeline 8 to jointly form a spraying and cleaning device; the outer nozzle 6 and the inner nozzle 5 are respectively connected with a nitrogen pipeline 9 to form a liquid cutting mechanism together; the spraying and cleaning device sprays pure water and liquid medicine to the rotating cage 3 from the center, the periphery and the upper and lower sides of the rotating cage 3 in sequence; the liquid cutting mechanism sprays nitrogen to the rotating cage 3 from the center, the periphery and the upper and lower sides of the rotating cage 3; the machine body 1 is also provided with a door; the pure water is at a temperature of less than or equal to 90 ℃, and the liquid medicine is prepared liquid medicine; the machine body 1 is provided with an air blower 10, and the air blower 10 is communicated with the cleaning chamber 2 through a hot air pipeline 11; the hot air pipeline 11 is provided with a high-efficiency air filter 12; the dust filter is used for filtering dust ions in hot air; an air outlet is formed in the machine body 1 and communicated with the cleaning chamber 2, and the air outlet is connected with an air exhaust device through a pipeline; a positioning block is arranged on the placing frame; an observation window is arranged on the machine body 1; the lower part of the machine body 1 is respectively provided with a liquid medicine box 13 and a pure water box 14; the liquid medicine box 13 is connected with the liquid medicine pipeline 8; the pure water tank 14 is divided into a heating tank and a buffer tank, the tops of the heating tank and the buffer tank are communicated, heating devices are respectively arranged in the heating tank and the buffer tank, a water inlet and a water outlet are respectively arranged on the pure water tank 14, the water inlet is connected with a pure water supply pipeline 15, and the water outlet is connected with a pure water pipeline 7; the nitrogen pipeline 9 is connected with a nitrogen supply pipeline; the liquid medicine pipeline 8, the pure water supply pipeline 15, the pure water pipeline 7 and the nitrogen pipeline 9 are all formed by a plurality of connected pipelines, and control valves are respectively arranged on the pipelines.
Because of the limited character expression, there exist practically unlimited specific structures, and it will be apparent to those skilled in the art that a number of improvements, decorations, or changes may be made without departing from the principles of the present invention, or the above technical features may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention using its spirit and scope, as defined by the claims, may be directed to other uses and embodiments.

Claims (9)

1. A cleaning device for a wafer material box comprises a machine body, wherein a sealed cavity is arranged in the machine body and is a cleaning chamber; the cleaning machine is characterized in that a rotating cage is arranged in the middle of the cleaning chamber, the rotating cage is rotatably mounted on the machine body through a rotating mechanism, and a plurality of wafer material boxes and/or placing frames of the wafer material boxes are uniformly distributed on the rotating cage along the periphery of the rotating cage; a spraying cleaning device mechanism and a liquid cutting mechanism are arranged in the cleaning chamber; the spraying and cleaning device is used for spraying pure water and liquid medicine to the rotating cage from the center, the periphery and the upper and lower sides of the rotating cage in sequence; the liquid cutting mechanism sprays nitrogen to the rotating cage from the center, the periphery and the upper and lower sides of the rotating cage; the machine body is also provided with a door; the pure water is pure water with the temperature of less than or equal to 90 ℃.
2. The wafer magazine cleaning device of claim 1, wherein the cleaning chamber is provided with a plurality of outer nozzles and a plurality of inner nozzles, the outer nozzles and the inner nozzles are fixedly arranged on the machine body, the outer nozzles are distributed on the periphery, the upper side and the lower side of the rotating cage, the inner nozzles are distributed in the center of the rotating cage, and the outer nozzles and the inner nozzles respectively face the rotating cage; the outer nozzle and the inner nozzle are respectively connected with a pure water pipeline and a liquid medicine pipeline to jointly form the spraying and cleaning device; the outer nozzle and the inner nozzle are respectively connected with a nitrogen pipeline to jointly form the liquid cutting mechanism.
3. The wafer magazine bin cleaning device according to claim 2, wherein the rotating cage comprises a plurality of ring plates arranged in parallel from top to bottom, a plurality of connecting rods are uniformly distributed between adjacent ring plates, two ends of each connecting rod are respectively fixedly connected with the ring plates, and the connecting rods and the ring plates jointly form a placing frame for the wafer magazine bin and/or the wafer magazine bin; the rotating mechanism comprises a driving motor which is fixedly arranged on the upper part of the machine body, and the driving motor is in driving connection with the uppermost ring plate; the inner rings of all the ring plates form a columnar space which is the center of the rotating cage, the bottom of the columnar space is provided with an opening, and all the inner nozzles extend into the center of the rotating cage through the opening.
4. The wafer magazine bin cleaning device of claim 1, wherein a blower is arranged on the machine body and communicated with the cleaning chamber through a hot air pipeline; and the hot air pipeline is provided with high-efficiency air filtration.
5. The wafer magazine bin cleaning device of claim 1, wherein the body is provided with an air outlet, the air outlet being in communication with the cleaning chamber, the air outlet being connected to an air exhaust device via a pipe.
6. The wafer magazine bin cleaning device of claim 1, wherein a locating block is disposed on the placement frame.
7. The wafer magazine bin cleaning device of claim 1, wherein the body is provided with a viewing window.
8. The wafer magazine bin cleaning device of claim 2, wherein a liquid medicine tank and a pure water tank are respectively arranged at the lower part of the machine body; the liquid medicine box is connected with a liquid medicine pipeline; the pure water tank is divided into a heating tank and a buffer tank, the tops of the heating tank and the buffer tank are communicated, heating devices are respectively arranged in the heating tank and the buffer tank, a water inlet and a water outlet are respectively arranged on the pure water tank, and the water inlet is connected with a pure water supply pipeline and a pure water pipeline at the water outlet; the nitrogen pipeline is connected with a nitrogen supply pipeline.
9. The wafer magazine cleaning device of claim 8, wherein the liquid chemical line, the pure water supply line, the pure water line and the nitrogen line are formed by a plurality of connected pipes, and the pipes are respectively provided with a control valve.
CN201921015012.6U 2019-07-02 2019-07-02 Wafer magazine workbin belt cleaning device Active CN210279981U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921015012.6U CN210279981U (en) 2019-07-02 2019-07-02 Wafer magazine workbin belt cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921015012.6U CN210279981U (en) 2019-07-02 2019-07-02 Wafer magazine workbin belt cleaning device

Publications (1)

Publication Number Publication Date
CN210279981U true CN210279981U (en) 2020-04-10

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Application Number Title Priority Date Filing Date
CN201921015012.6U Active CN210279981U (en) 2019-07-02 2019-07-02 Wafer magazine workbin belt cleaning device

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112509943A (en) * 2020-11-10 2021-03-16 芯米(厦门)半导体设备有限公司 Wafer surface drying and blowing equipment
CN112657992A (en) * 2020-12-16 2021-04-16 航天科工微电子系统研究院有限公司 Integrated semiconductor wafer cleaning machine and cleaning method
CN112934848A (en) * 2021-01-29 2021-06-11 沈发明 Dust cleaning equipment for semiconductor preparation
CN113578900A (en) * 2021-07-27 2021-11-02 拓思精工科技(苏州)有限公司 Material box cleaning machine and using method thereof
CN117066238A (en) * 2023-10-17 2023-11-17 北京青禾晶元半导体科技有限责任公司 Wafer box cleaning equipment and wafer box cleaning method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112509943A (en) * 2020-11-10 2021-03-16 芯米(厦门)半导体设备有限公司 Wafer surface drying and blowing equipment
CN112657992A (en) * 2020-12-16 2021-04-16 航天科工微电子系统研究院有限公司 Integrated semiconductor wafer cleaning machine and cleaning method
CN112934848A (en) * 2021-01-29 2021-06-11 沈发明 Dust cleaning equipment for semiconductor preparation
CN112934848B (en) * 2021-01-29 2022-10-11 芜湖米格半导体检测有限公司 Dust cleaning equipment for semiconductor preparation
CN113578900A (en) * 2021-07-27 2021-11-02 拓思精工科技(苏州)有限公司 Material box cleaning machine and using method thereof
CN117066238A (en) * 2023-10-17 2023-11-17 北京青禾晶元半导体科技有限责任公司 Wafer box cleaning equipment and wafer box cleaning method
CN117066238B (en) * 2023-10-17 2023-12-15 北京青禾晶元半导体科技有限责任公司 Wafer box cleaning equipment and wafer box cleaning method

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Inventor after: Wang Xiangyang

Inventor after: Pu Zheguo

Inventor before: Wang Xiangyang