CN112657992A - Integrated semiconductor wafer cleaning machine and cleaning method - Google Patents
Integrated semiconductor wafer cleaning machine and cleaning method Download PDFInfo
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- CN112657992A CN112657992A CN202011481112.5A CN202011481112A CN112657992A CN 112657992 A CN112657992 A CN 112657992A CN 202011481112 A CN202011481112 A CN 202011481112A CN 112657992 A CN112657992 A CN 112657992A
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Abstract
The invention discloses an integrated semiconductor wafer cleaning machine and a cleaning method, wherein the method comprises the following steps: s1, when the cleaning machine body starts to work, the main power supply is powered on, the motor of the exhaust fan is started, the exhaust fan is always in a working state in the wafer cleaning process, the exhaust fan rotates to exhaust air, and water mist in the cleaning cavity in the cleaning machine body is pumped out until the water mist is exhausted by the exhaust pipe; s2, when the exhaust pipe generates condensed water and condensed water in S1, the condensed water and the condensed water flow from the inside of the cleaning machine body to the outside cleaning machine body through the one-way valve, the water flowing back from the outside to the inside cannot pass through the one-way valve, and the condensed water cannot flow back; the method can effectively ensure that no residual stain is left after the wafer is cleaned, no stain is generated after the drying process is finished, and the like.
Description
Technical Field
The invention relates to the field of semiconductor wafer cleaning, in particular to an integrated semiconductor wafer cleaning machine and a cleaning method.
Background
In the semiconductor packaging process flow, wafer scribing and cleaning are very important links, after scribing is completed, the cleaning effect on the wafer directly influences the yield of the subsequent process, and once the wafer is cleaned, the wafer cannot be completely cleaned, the later process flow is difficult and serious.
In the prior art, in a conventional wafer cleaning machine, an air exhaust facility is added to the wafer cleaning machine at a plant service end, so that the wafer cleaning machine meets the air exhaust requirement, for example, an air exhaust pipe is directly externally connected to an air exhaust main pipe of the plant service end at an air exhaust port of the wafer cleaning machine, and the plant service end uses a high-power motor to perform air exhaust operation on all equipment needing air exhaust in a plant. After cleaning, due to factors such as insufficient exhaust air volume caused by a large exhaust load possibly existing at a plant service end, the wafer is not completely cleaned, the surface of the wafer is at risk of stain residue, and the yield of the subsequent process is reduced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides an integrated semiconductor wafer cleaning machine and a cleaning method, which can effectively ensure the drying link in the wafer cleaning process, and the air draft is enough to ensure that the drying link is thorough and effective, so that the wafer is free from residual stains after being cleaned; the additional exhaust pipe is connected with the equipment, the one-way valve is additionally arranged, the flow direction of the valve is from inside to outside, and the condensate water backflow cannot be generated in the use process, so that stains cannot be generated after the drying process is finished, and the like.
The purpose of the invention is realized by the following scheme:
the integrated semiconductor wafer cleaning machine comprises a cleaning machine body, wherein an air exhaust fan is arranged on the cleaning machine body, a one-way valve and a fan motor are arranged on the air exhaust fan, the one-way valve is connected with the fan motor, and the one-way valve is in one-way conduction from inside to outside in the flow direction and is used for enabling the cleaning machine body to exhaust air in operation, so that formed water mist and gas can only flow in one way from inside to outside.
Further, the fan motor comprises a variable frequency motor, a power end of the variable frequency motor is connected with a power end of the cleaning machine body, the variable frequency motor is powered by a power source of the cleaning machine body, and the cleaning machine body can be started to work after being started.
Furthermore, the air outlet of the air exhaust fan is arranged on the right side of the rear part of the cleaning machine body, and the air outlet is arranged between 80mm and 200mm away from the right edge of the cleaning machine body.
Furthermore, the diameter of the air outlet of the air exhaust fan is between 50mm and 75 mm.
Further, the variable frequency motor is arranged at the air outlet of the air exhaust fan.
Further, the device comprises an exhaust pipe, and the exhaust pipe is connected with a one-way valve.
Further, comprising the steps of:
s1, when the cleaning machine body starts to work, the main power supply is powered on, the motor of the exhaust fan is started, the exhaust fan is always in a working state in the wafer cleaning process, the exhaust fan rotates to exhaust air, and water mist in the cleaning cavity in the cleaning machine body is pumped out until the water mist is exhausted by the exhaust pipe;
s2, when the exhaust pipe generates condensed water and condensed water in S1, the condensed water and the condensed water flow from the inside of the cleaner body to the outside cleaner body through the one-way valve, and the water flowing back from the outside to the inside cannot pass through the one-way valve, so that the condensed water cannot flow back.
Further, step S3 is included:
and S3, detaching the exhaust pipe after the cleaning machine body works and operates for a period of time during the equipment periodic maintenance, and draining the water blocked by the check valve.
The invention has the beneficial effects that:
the invention can effectively ensure the drying link in the wafer cleaning process, and the air draft is enough to ensure that the drying link is thorough and effective, thereby ensuring that no residual stain exists after the wafer is cleaned; the joint of the additional exhaust pipe and the equipment is additionally provided with a one-way valve, the flow direction of the valve is from inside to outside, and the backflow of condensed water is prevented in the use process, so that no stain is generated after the drying process is finished; the additional exhaust pipe can use an additional small exhaust fan to directly get electricity from the main power supply of the equipment, so that energy is effectively saved, and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a flow chart of the method steps of the present invention.
Detailed Description
All of the features disclosed in the specification for all of the embodiments (including any accompanying claims, abstract and drawings), or all of the steps of a method or process so disclosed, may be combined and/or expanded, or substituted, in any way, except for mutually exclusive features and/or steps.
As shown in fig. 1, the integrated semiconductor wafer cleaning machine comprises a cleaning machine body, wherein an exhaust fan is arranged on the cleaning machine body, a check valve and a fan motor are arranged on the exhaust fan, the check valve is connected with the fan motor, and the check valve is arranged in a one-way conduction mode from inside to outside in the flow direction, so that the formed water mist and gas can only flow in one way from inside to outside in the operation exhaust process of the cleaning machine body.
Further, the fan motor comprises a variable frequency motor, a power end of the variable frequency motor is connected with a power end of the cleaning machine body, the variable frequency motor is powered by a power source of the cleaning machine body, and the cleaning machine body can be started to work after being started.
Furthermore, the air outlet of the air exhaust fan is arranged on the right side of the rear part of the cleaning machine body, and the air outlet is arranged between 80mm and 200mm away from the right edge of the cleaning machine body.
Furthermore, the diameter of the air outlet of the air exhaust fan is between 50mm and 75 mm.
Further, the variable frequency motor is arranged at the air outlet of the air exhaust fan.
Further, the device comprises an exhaust pipe, and the exhaust pipe is connected with a one-way valve.
Further, comprising the steps of:
s1, when the cleaning machine body starts to work, the main power supply is powered on, the motor of the exhaust fan is started, the exhaust fan is always in a working state in the wafer cleaning process, the exhaust fan rotates to exhaust air, and water mist in the cleaning cavity in the cleaning machine body is pumped out until the water mist is exhausted by the exhaust pipe;
s2, when the exhaust pipe generates condensed water and condensed water in S1, the condensed water and the condensed water flow from the inside of the cleaner body to the outside cleaner body through the one-way valve, and the water flowing back from the outside to the inside cannot pass through the one-way valve, so that the condensed water cannot flow back.
Further, step S3 is included:
and S3, detaching the exhaust pipe after the cleaning machine body works and operates for a period of time during the equipment periodic maintenance, and draining the water blocked by the check valve.
In the embodiment of the invention, the inner diameter of the exhaust hole can be set to be 50.4mm, the right edge of the exhaust hole is 80-200 mm away from the right edge of the equipment, and the upper edge of the exhaust hole is 400-700 mm away from the upper edge of the equipment.
The fan motor is assembled at the opening of the cleaning machine body, the pipe diameter of a fan of the fan motor can be selected from 50-75 mm, and the inner diameter of the opening of the cleaning machine is consistent, so that the fan motor can be stably installed on the air outlet. The fan motor uses a variable frequency motor, and the variable frequency motor can directly change the rotating speed of the motor in a frequency changing mode, so that the rotating speed of the fan is controlled, and the wind speed can be controlled.
The power of fan motor is got from the equipment main power supply, draws 220V alternating current to the volume input of fan motor on the follow equipment three-phase electricity, makes equipment in case after the start-up, and the fan motor keeps normally open state, keeps the work of airing exhaust that lasts to wafer cleaning cavity, and after equipment installs the fan motor additional, external exhaust pipe, exhaust pipe internal diameter and air outlet external diameter phase-match. The exhaust pipe row leaves the outer atmosphere, guarantees that the humidity in clean area that equipment place can not be influenced to the discharged water smoke.
Before the exhaust pipe lies in that equipment body air outlet connects, at exhaust pipe one side, install the check valve additional, the check valve size and exhaust pipe size phase-match, the check valve direction is "by the inside one-way conduction of equipment to exhaust pipe", makes the comdenstion water that the exhaust pipe formed in the course of the work can not flow back inside the equipment, and the comdenstion water backward flow is blockked by the check valve. The conduction direction of the one-way valve is from inside to outside, so that water flowing back from the outside to the inside cannot pass through the one-way valve, and condensed water cannot flow back. After a period of time, the exhaust pipe can be detached under the condition of equipment periodic maintenance, and the water blocked by the one-way valve is discharged, so that the maintenance is more convenient.
In the process of processing the wafer, the wafer is usually required to be cleaned for many times, and if the cleaning process and the cleaning equipment are poor, great loss is caused, so the process and the equipment for cleaning the wafer are extremely high in requirements.
In summary, the integrated wafer cleaning machine provided by the embodiment of the invention integrates the frequency conversion control of the fan motor with the cleaning process, ensures good air exhaust of the equipment, organizes condensate water backflow by using the one-way valve, ensures good cleaning and drying effects, and achieves the effect of integrated wafer cleaning.
Other embodiments than the above examples may be devised by those skilled in the art based on the foregoing disclosure, or by adapting and using knowledge or techniques of the relevant art, and features of various embodiments may be interchanged or substituted and such modifications and variations that may be made by those skilled in the art without departing from the spirit and scope of the present invention are intended to be within the scope of the following claims.
Claims (8)
1. The integrated semiconductor wafer cleaning machine comprises a cleaning machine body and is characterized in that an air exhaust fan is arranged on the cleaning machine body, a one-way valve and a fan motor are arranged on the air exhaust fan, the one-way valve is connected with the fan motor, the flow direction of the one-way valve is in one-way conduction from inside to outside, and the integrated semiconductor wafer cleaning machine is used for enabling formed water mist and gas to only flow in one way from inside to outside in the operation air exhaust process of the cleaning machine body.
2. The integrated semiconductor wafer cleaning machine as claimed in claim 1, wherein the blower motor comprises a variable frequency motor, and a power end of the variable frequency motor is connected with a power end of the cleaning machine body, and the variable frequency motor is powered by the power supply of the cleaning machine body, so that the cleaning machine body can be started to work after being started.
3. The integrated semiconductor wafer cleaning machine as claimed in claim 1, wherein the exhaust outlet of the exhaust fan is disposed at the right side of the rear of the cleaning machine body, and the exhaust outlet is disposed at a distance of 80mm to 200mm from the right edge of the cleaning machine body.
4. The integrated semiconductor wafer cleaning machine of claim 1, wherein the diameter of the exhaust outlet of the exhaust fan is between 50mm and 75 mm.
5. The integrated semiconductor wafer cleaning machine of claim 2, wherein the variable frequency motor is disposed at an air outlet of the exhaust fan.
6. The integrated semiconductor wafer cleaning machine of any one of claims 1 to 5, comprising an exhaust pipe connected to the check valve.
7. The cleaning method of the integrated semiconductor wafer cleaning machine is characterized by comprising the following steps:
s1, when the cleaning machine body starts to work, the main power supply is powered on, the motor of the exhaust fan is started, the exhaust fan is always in a working state in the wafer cleaning process, the exhaust fan rotates to exhaust air, and water mist in the cleaning cavity in the cleaning machine body is pumped out until the water mist is exhausted by the exhaust pipe;
s2, when the exhaust pipe generates condensed water and condensed water in S1, the condensed water and the condensed water flow from the inside of the cleaner body to the outside cleaner body through the one-way valve, and the water flowing back from the outside to the inside cannot pass through the one-way valve, so that the condensed water cannot flow back.
8. The cleaning method using the integrated semiconductor wafer cleaning machine as claimed in claim 7, wherein the step S3 is included:
and S3, detaching the exhaust pipe after the cleaning machine body works and operates for a period of time during the equipment periodic maintenance, and draining the water blocked by the check valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011481112.5A CN112657992A (en) | 2020-12-16 | 2020-12-16 | Integrated semiconductor wafer cleaning machine and cleaning method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011481112.5A CN112657992A (en) | 2020-12-16 | 2020-12-16 | Integrated semiconductor wafer cleaning machine and cleaning method |
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| CN112657992A true CN112657992A (en) | 2021-04-16 |
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| CN202011481112.5A Pending CN112657992A (en) | 2020-12-16 | 2020-12-16 | Integrated semiconductor wafer cleaning machine and cleaning method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115382828A (en) * | 2022-10-27 | 2022-11-25 | 吾拾微电子(苏州)有限公司 | Wafer processing equipment |
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| CN115382828A (en) * | 2022-10-27 | 2022-11-25 | 吾拾微电子(苏州)有限公司 | Wafer processing equipment |
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Application publication date: 20210416 |
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