CN210272318U

CN210272318U - Injection molding, filling and sealing support structure for chip

Info

Publication number: CN210272318U
Application number: CN201921089780.6U
Authority: CN
Inventors: 刘丽
Original assignee: Chengdu Hanxin Guoke Integrated Technology Co ltd
Current assignee: Chengdu Hanxin Guoke Integrated Technology Co ltd
Priority date: 2019-07-12
Filing date: 2019-07-12
Publication date: 2020-04-07
Anticipated expiration: 2029-07-12

Abstract

The utility model discloses an embedment supporting structure of moulding plastics of chip belongs to integrated circuit chip packaging technology field, receives the extrusion easily in order to solve silica gel pad and the rubber circle among the prior art and leads to the problem that the chip is damaged to make the pressure sensor disability rate improve, including the shell, the shell bottom is provided with the base plate, is provided with the chip on the base plate, be provided with the bracket component between chip and the base plate, the bracket component includes flexible layer, and the interval has evenly seted up the mounting groove on the flexible layer, is provided with the chip in the mounting groove, and the chip covers all around has plastic envelope material, flexible layer upper end is provided with the silica gel layer, and silica gel layer lower extreme interval evenly is provided with a plurality of support columns, is provided with the atmospheric pressure hole in the support column, and silica gel layer upper. Silica gel layer lower extreme sets up the support column, slows down the pressure of metal level and mould pressing, sets up the foam-rubber cushion around the support column, seals the atmospheric pressure hole through the foam-rubber cushion.

Description

Injection molding, filling and sealing support structure for chip

Technical Field

The utility model belongs to the technical field of integrated circuit chip encapsulation, specifically relate to an embedment supporting structure of moulding plastics of chip.

Background

The chip is injected with plastic, which is a basic process for encapsulating the chip, in the prior art, the chip is lost to carry out plastic encapsulation, a substrate is generally placed on a lower die, then the chip is placed on the substrate, an upper die is covered, after a plastic encapsulation material is melted, a gap between the upper die and the lower die is injected, the chip is encapsulated, when the pressure sensor is generally encapsulated, other parts except the chip are required to be protected to prevent the chip from being corroded and damaged by air and moisture, generally, the other parts are required to be subjected to glue pouring treatment, meanwhile, in order to prevent the air pressure hole of the pressure sensor from being blocked by glue, the air pressure hole is generally fixed by using a silica gel pad and a rubber ring, so that the production cost is high, the silica gel pad and the rubber ring in the prior art are easily extruded, so that the chip is damaged, and the rejection rate of the pressure sensor is improved.

Disclosure of Invention

The utility model aims to provide a: in order to solve the problem that silica gel pad and rubber circle among the prior art receive the extrusion easily for the damaged disability rate that makes pressure sensor of chip improves, provide the embedment supporting structure that moulds plastics of a chip.

The utility model adopts the technical scheme as follows:

the utility model provides an embedment supporting structure moulds plastics of chip, includes the shell, and the shell bottom is provided with the base plate, is provided with the chip on the base plate, its characterized in that, be provided with the bracket component between chip and the base plate, the bracket component includes the flexible layer, and the mounting groove has evenly been seted up at the interval on the flexible layer, is provided with the chip in the mounting groove, and the chip covers all around has plastic packaging material, plastic packaging material is epoxy material, the chip back is provided with the lead wire, flexible layer upper end is provided with the silica gel layer, and silica gel layer lower extreme interval evenly is provided with a plurality of support columns, is provided with the atmospheric pressure hole in the support column, and silica gel layer upper end bonds.

Through the flexible layer that is provided with sponge structure at the base plate with the chip, reduce the mould pressing pressure of moulding plastics, provide certain cushioning effect to the chip, reduce the breakage of chip, be provided with the chip in the mounting groove inslot, and it has epoxy packaging material to cover all around at the chip, epoxy packaging material provides the effect of heat conduction, give the silica gel layer with heat conduction, upper end at the chip is provided with the silica gel layer, the silica gel layer plays the effect of a heat conduction, silica gel layer lower extreme is provided with the support column, slow down the effect of metal level and mould pressing pressure, set up the foam-rubber cushion all around at the support column, seal the atmospheric pressure hole through the foam-rubber cushion, compare in traditional silica gel cushion and rubber circle, weight is lower, it is downthehole to have glue flow to atmospheric pressure when preventing the encapsulating, be provided with the metal level in silica gel layer.

The utility model discloses a further preferred, the interval between mounting groove lateral wall and the chip is 0.1 mm-0.3 mm. The filling gap between the mounting groove and the chip is filled with the epoxy resin material, and the filling gap between the mounting groove and the chip is filled with the epoxy resin material, so that the effect of conducting heat of the chip with large heat generation amount is achieved.

The utility model discloses a further preferably, the interval of adjacent mounting groove is 2 mm-3 mm, provides an integrate chip mounting module, realizes the high integration of a plurality of or polylith chip, improves the utilization ratio of base plate, and then realizes multi-chip package structure's miniaturization.

The utility model discloses a further preferred, the flexible layer is the silica gel structure for sponge structure, compares in other silica gel pads, has better buffering operation, comparatively speaking, and the cost is lower, more is favorable to engineering and large-scale operation.

The utility model discloses a further preferred, support column lower extreme edge is stretched out outward and is formed with the protruding dish of toper, and the good heat conduction effect of the protruding dish of toper, the good heat conduction effect of the protruding dish of toper also are favorable to buffering mould pressing pressure to the impact force of chip, improve the bearing capacity of chip simultaneously.

The utility model discloses a further preferred, the thickness of silica gel layer is 0.1 mm-0.2 mm, reduces weight, provides good heat-conducting capacity.

The utility model discloses a further preferred, the metal layer surface is provided with a plurality of circular archs that outwards stand out to be provided with circular arch on the surface on silica gel layer, improve the area of contact of metal level and air, improve the radiating effect of metal level.

The present invention is further preferred, wherein the metal layer is a copper or aluminum material, providing a heat sink material.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:

1. the utility model reduces the molding pressure of injection molding by arranging the flexible layer with a sponge structure, provides a certain buffer effect for the chip, reduces the breakage of the chip, is provided with the chip in the mounting groove, and the periphery of the chip is covered with the epoxy resin packaging material which provides the heat conduction effect and conducts the heat to the silica gel layer, the upper end of the chip is provided with the silica gel layer, the lower end of the silica gel layer is provided with the support column, the effect of slowing down the metal layer and the molding pressure is realized, the sponge pad is arranged around the support column, the air pressure hole is sealed by the sponge pad, compared with the traditional silica gel pad and the rubber ring, the weight is lower, no glue flows into the air pressure hole when the glue filling is prevented, the metal layer is arranged at the upper end of the silica gel layer, the metal layer plays a heat dissipation effect, the silica gel layer plays a heat conduction effect, the, the metal layer serves as a heat sink.

2. The support column lower extreme edge is stretched out outward and is formed with the protruding dish of toper, and the good heat conduction effect of the protruding dish of toper, simultaneously, also is favorable to buffering the impact force of mould pressing pressure to the chip, improves the bearing capacity of chip, the protruding dish of toper is the silica gel structure, sets up to the toper structure, is favorable to improving the area of contact of support column and chip, improves the compressive capacity, improves the heat-sinking capability.

3. The metal layer surface is provided with a plurality of circular archs that outwards protrude to be provided with circular arch on the surface of silica gel layer, improve the area of contact of metal level and air, improve the radiating effect of metal level.

Drawings

The invention will now be described, by way of example, with reference to the accompanying drawings, in which:

fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a schematic structural diagram of the metal layer with the circular protrusions;

fig. 3 is a schematic structural view of the pillar of the present invention.

Reference numerals: 1-chip, 2-flexible layer, 3-mounting groove, 4-spongy cushion, 5-glue filling material, 6-silica gel layer, 7-metal layer, 8-air pressure hole, 9-support column, 10-conical protruding disc, 11-substrate, 12-lead and 13-circular bump.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limiting the invention, i.e., the described embodiments are merely a few embodiments, rather than all embodiments, and that all features disclosed in this specification, or all methods or process steps disclosed, may be combined in any suitable manner, except for mutually exclusive features and/or steps.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.

It is noted that relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The present invention will be described in detail with reference to fig. 1, 2 and 3.

The first embodiment is as follows: the injection molding of the chip is a basic process for packaging the chip, in the prior art, in the process of plastic packaging of the chip, a substrate is generally prevented on a lower die, then the chip is placed on the substrate, then an upper die is covered, after a plastic package material is melted, the plastic package material is injected into a gap between the upper die and the lower die, the chip is encapsulated, when the pressure sensor is generally packaged, other parts except the chip are required to be protected from being corroded and damaged by air and moisture, generally, glue filling treatment is required to be carried out on other parts, meanwhile, in order to prevent an air pressure hole of the pressure sensor from being blocked by glue, the air pressure hole is generally fixed by using a silica gel pad and a rubber ring, so that the production cost is high, the silica gel pad and the rubber ring in the prior art are easily extruded, so that the chip is damaged, the rejection rate of the pressure sensor is improved, and an injection molding encapsulation support structure of the chip 1 is provided, the solar cell module comprises a housing, the bottom of the housing is provided with a substrate 11, a chip 1 is arranged on the substrate 11, a bracket assembly is arranged between the chip 1 and the substrate 11, the bracket assembly comprises a flexible layer 2, mounting grooves 3 are uniformly formed in the flexible layer 2 at intervals, the chip 1 is arranged in the mounting grooves 3, the chip 1 is covered with a plastic package material at the periphery, the plastic package material is an epoxy resin material, a lead 12 is arranged on the back surface of the chip 1, a silica gel layer 6 is arranged at the upper end of the flexible layer 2, the thickness of the silica gel layer 6 is 0.1 mm-0.2 mm, the weight is reduced, good heat conduction capability is provided, a plurality of support columns 9 are uniformly arranged at the lower end of the silica gel layer 6 at intervals, air pressure holes 8 are formed in the support columns 9, a metal layer 7 is bonded at the upper end of the silica gel layer 6, the.

The working principle is as follows: the flexible layer 2 with a sponge structure is arranged on the substrate 11 and the chip 1, so that the molding pressure of injection molding is reduced, providing a certain buffer action for the chip 1, reducing the breakage of the chip 1, arranging the chip 1 in the mounting groove 3, and the periphery of the chip 1 is covered with epoxy resin packaging material which provides the function of heat conduction and conducts the heat to the silica gel layer 6, the upper end of the chip 1 is provided with the silica gel layer 6, the silica gel layer 6 plays a role in heat conduction, the lower end of the silica gel layer 6 is provided with the support column 9 for slowing down the action of the metal layer 7 and the mould pressing pressure, set up foam-rubber cushion 4 around support column 9, seal up atmospheric pressure hole 8 through foam-rubber cushion 4, compare in traditional silica gel pad and rubber circle, weight is lower, does not have during the glue filling glue rivers to atmospheric pressure hole 8 in, is provided with metal level 7 in 6 upper ends on silica gel layer, and metal level 7 plays a radiating effect.

The second embodiment: the implementation is further optimized on the basis of embodiment 1, and this embodiment focuses on explaining the improvement compared with embodiment 1, and the details of the same are not repeated, and the distance between the side wall of the mounting groove 3 and the chip 1 is 0.1 mm to 0.3 mm. The filling gap between the mounting groove 3 and the chip 1 is filled with epoxy resin materials, and the filling gap between the mounting groove 3 and the chip 1 is filled with epoxy resin materials, so that the effect of conducting heat of the chip 1 with large heat generation is achieved.

The third embodiment is as follows: this implementation is further optimized on the basis of embodiment 1, and this embodiment focuses on explaining the improved portions compared with embodiment 1, and the same portions are not repeated, and the distance between adjacent mounting grooves 3 is 2 mm to 3 mm, so as to provide an integrated chip 1 mounting module, which realizes high integration of a plurality of or multiple chips 1, improves the utilization rate of the substrate 11, and further realizes miniaturization of the multi-chip 1 package structure.

The fourth embodiment is as follows: this implementation is further optimized on the basis of embodiment 1, and this embodiment emphatically explains the improvement place compared with embodiment 1, and the same part is no longer repeated, and flexible layer 2 is the silica gel structure for the sponge structure, compares in other silica gel pads, has better buffering operation, and comparatively speaking, the cost is lower, is more favorable to engineering and large-scale operation.

The fifth embodiment: as shown in fig. 3, this embodiment is further optimized on the basis of embodiment 1, and this embodiment focuses on explaining the improved portions compared with embodiment 1, and details of the same portions are omitted, the edge of the lower end of the supporting pillar 9 extends outward to form a conical protruding disk 10, the conical protruding disk 10 has a good heat conduction effect, and at the same time, the impact force of the molding pressure on the chip 1 is also favorably buffered, and the pressure-bearing capacity of the chip 1 is improved.

The sixth implementation case: as shown in fig. 2, the present embodiment is further optimized on the basis of embodiment 1, and this embodiment focuses on explaining the improved parts compared with embodiment 1, and the same parts are not repeated, and the surface of the metal layer 7 is provided with a plurality of circular protrusions 13 protruding outward, and the surface of the silica gel layer 6 is provided with the circular protrusions 13, so that the contact area between the metal layer 7 and air is increased, and the heat dissipation effect of the metal layer 7 is improved.

The fixed connection, fixed mounting or fixed arrangement mode comprises the existing common technologies, such as bolt fixing, welding, riveting and the like, and all the technologies play a role in fixing without influencing the overall effect of the device.

Although the invention has been described herein with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this invention. More specifically, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure and claims of this application. In addition to variations and modifications in the component parts and/or arrangements, other uses will also be apparent to those skilled in the art.

Claims

1. A chip injection molding encapsulation support structure comprises a shell, a substrate (11) is arranged at the bottom of the shell, and a chip (1) is arranged on the substrate (11), and is characterized in that a support assembly is arranged between the chip (1) and the substrate (11), the support assembly comprises a flexible layer (2), mounting grooves (3) are uniformly formed in the flexible layer (2) at intervals, the chip (1) is arranged in the mounting groove (3), a plastic package material covers the periphery of the chip (1), the plastic package material is an epoxy resin material, a lead (12) is arranged on the back of the chip (1), a silica gel layer (6) is arranged at the upper end of the flexible layer (2), a plurality of support columns (9) are uniformly arranged at the lower end of the silica gel layer (6) at intervals, air pressure holes (8) are formed in the support columns (9), a metal layer (7) is arranged at the upper end of the silica gel layer (, sponge cushions (4) are arranged around the supporting columns (9).

2. An injection molding, potting and support structure for chips according to claim 1, wherein the distance between the side wall of the mounting groove (3) and the chip (1) is 0.1 mm-0.3 mm, and the filling gap between the mounting groove (3) and the chip (1) is filled with epoxy resin material.

3. An injection molding, potting and support structure for chips according to claim 1, wherein the pitch of the adjacent mounting grooves (3) is 2 mm-3 mm.

4. An injection moulding potting fixture structure of a chip according to claim 1, wherein the flexible layer (2) is a silicone structure.

5. An injection molding, potting and mounting structure for chips as claimed in claim 1, wherein the lower end edge of the support column (9) is formed with a conical protruding disk (10) extending outward, the conical protruding disk (10) having good heat conduction.

6. An injection-molding, potting support structure for chips according to claim 1, wherein the thickness of the silicone layer (6) is 0.1 mm to 0.2 mm.

7. An injection moulding potting carrier structure for chips as claimed in claim 1, wherein the surface of the metal layer (7) is provided with a number of outwardly protruding circular protrusions (13).

8. An injection molded potting support structure of a chip according to claim 1, wherein the metal layer (7) is a copper or aluminum material.