CN210349809U - Packaging structure based on chip injection molding - Google Patents

Packaging structure based on chip injection molding Download PDF

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Publication number
CN210349809U
CN210349809U CN201921089710.0U CN201921089710U CN210349809U CN 210349809 U CN210349809 U CN 210349809U CN 201921089710 U CN201921089710 U CN 201921089710U CN 210349809 U CN210349809 U CN 210349809U
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Prior art keywords
chip
injection molding
layer
silica gel
structure according
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CN201921089710.0U
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Chinese (zh)
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蒋次为
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Chengdu Hanxin Guoke Integrated Technology Co ltd
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Chengdu Hanxin Guoke Integrated Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The utility model discloses a packaging structure based on chip injection molding, which belongs to the technical field of integrated circuit chip packaging, and aims to solve the problems that a chip is easy to crack when the molding pressure is larger and the chip is damaged due to larger heat productivity in the prior art, the packaging structure comprises a substrate, the chip is arranged above the substrate, a bracket component is arranged between the chip and the substrate, the bracket component comprises a flexible layer, mounting grooves are evenly arranged on the flexible layer at intervals, the chip is arranged in the mounting groove, the periphery of the chip is covered with plastic packaging materials, the surface of the chip is provided with a first lead, the back of the chip is provided with a second lead, the upper end of the flexible layer is provided with a silica gel layer, the upper end of the silica gel layer is bonded with a metal layer, the flexible layer with a sponge structure is arranged, the molding pressure of the injection molding is, the epoxy resin packaging material and the silica gel layer are arranged to conduct heat, and the metal layer is arranged to dissipate heat.

Description

Packaging structure based on chip injection molding
Technical Field
The utility model belongs to the technical field of integrated circuit chip encapsulation, specifically relate to a packaging structure based on chip is moulded plastics.
Background
In the field of integrated circuit technology, packaging chips is one of the most basic processes, and chip packages are classified into many types, which often include plastic packages, ceramic packages, metal packages, and the like according to the nature of raw materials of the packages. Among them, the plastic package is a package structure with low cost, simple process and high reliability, is commonly used in the consumer electronics field, and has the highest market share.
The injection molding of the chip is a basic process for packaging the chip, in the prior art, in the process of plastic packaging of the chip, a substrate is generally placed on a lower die, then the chip is placed on the substrate, then the upper die is covered, after melting the molding compound, the molding compound is injected into a gap between the upper die and the lower die, the chip is sealed, a gold wire is welded on the chip, and a flexible layer is arranged below the chip, as in patent application No. CN201720142102.6, a chip injection molding packaging structure is disclosed, but the structure is simple, although the flexible layer is arranged below the chip, the flexible layer can lose a certain function under the condition of higher molding pressure, so that the chip is easy to break, and the existing chip has higher heat productivity when the power is higher, the injection molding material is easy to expand due to the heat generated by the chip, and the temperature in the chip is too high, and if serious, can damage the chip.
Disclosure of Invention
The utility model aims to provide a: in order to solve the problems that a chip is large in mould pressing and easy to crack and the chip is damaged due to large heat productivity in the prior art, the packaging structure based on chip injection molding is provided.
The utility model adopts the technical scheme as follows:
packaging structure based on chip is moulded plastics, including the base plate, the base plate top is provided with the chip, be provided with the bracket component between chip and the base plate, the bracket component includes the flexible layer, and the mounting groove has evenly been seted up at the interval on the flexible layer, is provided with the chip in the mounting groove, and the chip covers all around has plastic packaging material, plastic packaging material is the epoxy material, the chip surface is provided with first lead wire, the chip back is provided with the second lead wire, flexible layer upper end is provided with the silica gel layer, and silica gel layer lower extreme interval evenly is provided with a plurality of support columns, and silica gel layer upper end bonds has the metal level, all has seted up a plurality of through.
Through the flexible layer that is provided with sponge structure at the base plate with the chip, reduce the mould pressing pressure of moulding plastics, provide certain cushioning effect to the chip, reduce the breakage of chip, at the mounting groove inslot be provided with the chip, and it has epoxy packaging material to cover all around at the chip, epoxy packaging material provides the effect of heat conduction, give the silica gel layer with the heat conduction, be provided with the silica gel layer in the upper end of chip, the silica gel layer plays the effect of a heat conduction, be provided with the metal level in silica gel layer upper end, the metal level plays a radiating effect.
The utility model discloses a further preferred, interval between mounting groove lateral wall and the chip is 0.1 mm-0.3 mm, and the packing gap intussuseption between mounting groove and the chip is filled with the epoxy material, plays the effect of conducting the heat of the chip that generates heat greatly.
The utility model discloses a further preferably, the interval of adjacent mounting groove is 2 mm-3 mm, provides an integrate chip mounting module, realizes the high integration of a plurality of or polylith chip, improves the utilization ratio of base plate, and then realizes multi-chip package structure's miniaturization.
The utility model discloses a further preferred, flexible layer is sponge structure for sponge structure, and sponge structure compares in other silica gel pads, rubber circle, has better buffering operation, comparatively speaking, and the cost is lower, more is favorable to engineering and large-scale operation.
The utility model discloses a further preferred, support column lower extreme edge is stretched out outward and is formed with the protruding dish of toper, and the good heat conduction of the protruding dish of toper is used, simultaneously, also is favorable to buffering the impact force of mould pressing pressure to the chip, improves the bearing capacity of chip.
The utility model discloses a further preferred, protruding dish of toper is the silica gel structure, sets up to the toper structure, is favorable to improving the area of contact of support column and chip, improves the compressive capacity, improves the heat-sinking capability.
The utility model discloses a further preferred, the thickness of silica gel layer is 0.1 mm-0.2 mm.
The utility model discloses a further preferred, the metal layer surface is provided with a plurality of circular archs that outwards stand out to be provided with circular arch on the surface on silica gel layer, improve the area of contact of metal level and air, improve the radiating effect of metal level.
The present invention is further preferred, wherein the metal layer is a copper or aluminum material, providing a heat sink material.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses a flexible layer at the structure of being provided with sponge, reduce the mould pressing pressure of moulding plastics, provide certain cushioning effect to the chip, reduce the breakage of chip, be provided with the chip in the mounting groove inslot, and it has epoxy packaging material to cover all around at the chip, epoxy packaging material provides the effect of heat conduction, conduct the heat for the silica gel layer, be provided with the silica gel layer in the upper end of chip, the silica gel layer plays the effect of a heat conduction, be provided with the metal level in silica gel layer upper end, the metal level plays a radiating effect.
2. The support column lower extreme edge is stretched out outward and is formed with the protruding dish of toper, and the good heat conduction effect of the protruding dish of toper, simultaneously, also is favorable to buffering the impact force of mould pressing pressure to the chip, improves the bearing capacity of chip, the protruding dish of toper is the silica gel structure, sets up to the toper structure, is favorable to improving the area of contact of support column and chip, improves the compressive capacity, improves the heat-sinking capability.
3. The metal layer surface is provided with a plurality of circular archs that outwards protrude to be provided with circular arch on the surface of silica gel layer, improve the area of contact of metal level and air, improve the radiating effect of metal level.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a schematic structural diagram of the metal layer with the circular protrusions;
fig. 3 is a schematic structural view of the pillar of the present invention.
Reference numerals: 1-chip, 2-flexible layer, 3-plastic packaging material, 4-silica gel layer, 5-metal layer, 6-through hole, 7-support column, 8-conical protruding disc, 9-mounting groove, 10-substrate, 11-second lead, 12-first lead and 13-circular bump.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limiting the invention, i.e., the described embodiments are merely a few embodiments, rather than all embodiments, and that all features disclosed in this specification, or all methods or process steps disclosed, may be combined in any suitable manner, except for mutually exclusive features and/or steps.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.
It is noted that relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The present invention will be described in detail with reference to fig. 1, 2 and 3.
The first embodiment is as follows: the chip injection molding packaging structure is simple in structure, although a flexible layer is arranged below the chip, the flexible layer can lose a certain function under the condition of higher molding pressure, so that the chip is easy to break, and the existing chip has higher heat productivity when the power is higher, the injection molding material is easy to expand due to the heat generated by the chip, and the temperature in the chip is too high, and if serious, can damage the chip.
Providing a packaging structure based on chip 1 injection molding, which comprises a substrate 10, wherein a chip 1 is arranged above the substrate 10, a bracket assembly is arranged between the chip 1 and the substrate 10, the bracket assembly comprises a flexible layer 2, mounting grooves 9 are uniformly arranged on the flexible layer 2 at intervals, the chip 1 is arranged in the mounting grooves 9, a plastic package material 3 covers around the chip 1, the plastic package material 3 is an epoxy resin material, the distance between the side wall of the mounting groove 9 and the chip 1 is 0.1 mm-0.3 mm, an epoxy resin material is filled in a filling gap between the mounting groove 9 and the chip 1, a first lead 12 is arranged on the surface of the chip 1, a second lead 11 is arranged on the back of the chip 1, a silica gel layer 4 is arranged at the upper end of the flexible layer 2, the thickness of the silica gel layer 4 is 0.1 mm-0.2 mm, a plurality of support pillars 7 are uniformly arranged at intervals at the lower end of the, the metal layer 5 is made of copper or aluminum materials and provides a heat-dissipating material, a plurality of through holes 6 are formed in the metal layer 5 and the silica gel layer 4, and the plastic package material 3 is filled in the through holes 6.
The working principle is as follows: through the flexible layer 2 that is provided with sponge structure at base plate 10 and chip 1, flexible layer 2 is sponge structure for sponge structure, sponge structure compares in other silica gel pads, the rubber circle, better buffering operation has, comparatively speaking, the cost is lower, be more favorable to engineering and large-scale operation, reduce the mould pressing pressure of moulding plastics, provide certain cushioning effect to chip 1, reduce chip 1's breakage, be provided with chip 1 in mounting groove 9 inslot, and it has epoxy packaging material to cover all around chip 1, epoxy packaging material provides the effect of heat conduction, give silica gel layer 4 with the heat conduction, be provided with silica gel layer 4 in chip 1's upper end, silica gel layer 4 plays the effect of a heat conduction, be provided with metal level 5 in silica gel layer 4 upper end, metal level 5 plays a radiating effect.
The second embodiment: this implementation is further optimized on the basis of embodiment 1, and this embodiment focuses on explaining the improved portions compared with embodiment 1, and the same portions are not described again, and the distance between adjacent mounting grooves 9 is 2 mm to 3 mm, so as to provide an integrated chip 1 mounting module, which realizes high integration of a plurality of or multiple chips 1, improves the utilization rate of the substrate 10, and further realizes miniaturization of the multi-chip 1 package structure.
The third embodiment is as follows: as shown in fig. 2, a plurality of circular protrusions 13 protruding outward are disposed on the surface of the metal layer 5, and the circular protrusions 13 are disposed on the surface of the silica gel layer 4, so that the contact area between the metal layer 5 and air is increased, and the heat dissipation effect of the metal layer 5 is improved.
The fourth embodiment is as follows: as shown in fig. 3, the edge of the lower end of the supporting column 7 extends outwards to form a conical protruding disk 8, the conical protruding disk 8 has a good heat conduction effect, and meanwhile, the impact force of the die pressing pressure on the chip 1 is favorably buffered, the bearing capacity of the chip 1 is improved, the conical protruding disk 8 is of a silica gel structure and is set to be of a conical structure, the contact area between the supporting column 7 and the chip 1 is favorably increased, the bearing capacity is improved, and the heat dissipation capacity is improved.
The fixed connection, fixed mounting or fixed arrangement mode comprises the existing common technologies, such as bolt fixing, welding, riveting and the like, and all the technologies play a role in fixing without influencing the overall effect of the device.
Although the invention has been described herein with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this invention. More specifically, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure and claims of this application. In addition to variations and modifications in the component parts and/or arrangements, other uses will also be apparent to those skilled in the art.

Claims (9)

1. The packaging structure based on chip injection molding comprises a substrate (10), a chip (1) is arranged above the substrate (10), it is characterized in that a bracket component is arranged between the chip (1) and the substrate (10), the bracket component comprises a flexible layer (2), mounting grooves (9) are uniformly arranged on the flexible layer (2) at intervals, the chip (1) is arranged in the mounting grooves (9), the periphery of the chip (1) is covered with a plastic packaging material (3), the plastic package material (3) is an epoxy resin material, the surface of the chip (1) is provided with a first lead (12), chip (1) back is provided with second lead wire (11), flexible layer (2) upper end is provided with silica gel layer (4), and silica gel layer (4) lower extreme interval evenly is provided with a plurality of support columns (7), and bonding has metal level (5) on silica gel layer (4), has all seted up a plurality of through holes (6) on metal level (5) and silica gel layer (4).
2. The chip injection molding based package structure according to claim 1, wherein the distance between the side wall of the mounting groove (9) and the chip (1) is 0.1 mm-0.3 mm.
3. The chip injection molding based package structure according to claim 1, wherein the pitch of the adjacent mounting grooves (9) is 2 mm-3 mm.
4. The chip injection molding-based packaging structure according to claim 1, wherein the flexible layer (2) is a sponge structure.
5. The chip injection molding-based packaging structure according to claim 1, wherein the lower end edge of the supporting pillar (7) is formed with a conical protruding disk (8) extending outwards.
6. The chip injection molding-based package structure according to claim 5, wherein the cone-shaped protruding disk (8) is of a silicone structure.
7. The chip injection molding-based package structure according to claim 1, wherein the thickness of the silicone layer (4) is 0.1 mm-0.2 mm.
8. The chip injection molding based package structure according to claim 1, wherein the surface of the metal layer (5) is provided with a plurality of circular bumps (13) protruding outwards.
9. The chip injection molding based package structure according to claim 1, wherein the metal layer (5) is a copper or aluminum material.
CN201921089710.0U 2019-07-12 2019-07-12 Packaging structure based on chip injection molding Active CN210349809U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921089710.0U CN210349809U (en) 2019-07-12 2019-07-12 Packaging structure based on chip injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921089710.0U CN210349809U (en) 2019-07-12 2019-07-12 Packaging structure based on chip injection molding

Publications (1)

Publication Number Publication Date
CN210349809U true CN210349809U (en) 2020-04-17

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Application Number Title Priority Date Filing Date
CN201921089710.0U Active CN210349809U (en) 2019-07-12 2019-07-12 Packaging structure based on chip injection molding

Country Status (1)

Country Link
CN (1) CN210349809U (en)

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