CN215342565U

CN215342565U - Chip radiating cover

Info

Publication number: CN215342565U
Application number: CN202121673546.5U
Authority: CN
Inventors: 蔡天达; 黄祈荣
Original assignee: Jiangyin Yunfan Technology Co ltd
Current assignee: Jiangyin Yunfan Technology Co ltd
Priority date: 2021-07-22
Filing date: 2021-07-22
Publication date: 2021-12-28
Anticipated expiration: 2031-07-22

Abstract

The utility model relates to a chip radiating cover, and belongs to the technical field of semiconductor chip packaging. The heat dissipation cover is of a sheet structure, a chip contact area, a chip limiting area and a periphery are sequentially arranged at the bottom of the heat dissipation cover from inside to outside, the chip limiting area protrudes out of the chip contact area and the periphery, the chip contact area and the chip limiting area are matched with each other to form a space for accommodating a chip, and the shape of the space is matched with that of the chip; the chip contact area and the periphery are both provided with staggered chutes, and the outer surface of the chip limiting area is a smooth outer surface. The utility model has simple structure, convenient processing, low cost and short development period, and improves the integral heat dissipation effect and the bonding force of the chip.

Description

Chip radiating cover

Technical Field

The utility model relates to the technical field of semiconductor chip packaging, in particular to a chip radiating cover.

Background

With the development of technology, the operation speed of the chip is greatly increased, the functions are enriched, and the heat energy generated by the operation of the chip in the chip is increased. Among the prior art, the heat dissipation lid generally sets up square groove with heat-conducting medium's contact surface, increases the glue area on the one hand, and the encapsulation is with firm, and on the other hand the heat dissipation is better, but this kind of structure adds the man-hour and need use specific mould punching press, also need set up the mould when less or experimental production in batches, and the cost is higher, and development new product cycle length.

Chinese utility model patent with patent publication No. CN210668340U discloses a heat dissipation structure of a substrate, belonging to the technical field of semiconductor chip packaging. It includes heat dissipation lid and heat dissipation lid lug, the heat dissipation lid is the cap form, and the inboard of its crown is used for holding chip and heat dissipation lid lug, and the brim of a hat links firmly with the base plate through bonding glue I, and the central authorities of crown of a hat are chip package region, and the heat dissipation lid lug sets up around the chip to with chip insulation, the lower surface of heat dissipation lid lug flushes with the lower surface of the brim of a hat of heat dissipation lid, and links firmly with the base plate through bonding glue II, the chip is turned over to be adorned on the base plate, and the heat dissipation lid is detained on the base plate, through the back connection and the heat dissipation of coolant and chip. The said patent reduces the warpage of the substrate and improves the poor coplanarity of the solder balls caused by the delamination of the heat dissipation glue and the warpage of the substrate. However, the heat dissipation cover of the patent is in a cap-shaped structure, the mechanism is complex, the assembly is inconvenient, in addition, a specific die is needed for punching when the cap-shaped structure is processed, the number of the dies is small in batch, or the dies need to be arranged during test production, the cost is high, and the period of developing new products is long.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the problems in the background art, and provides a chip radiating cover which is simple in structure, convenient and fast to process, low in cost, short in development period and flexible in application, and the overall radiating effect and the bonding force of a chip are improved.

The purpose of the utility model is realized as follows: a chip heat dissipation cover is of a sheet structure, a chip contact area, a chip limiting area and a periphery are sequentially arranged at the bottom of the heat dissipation cover from inside to outside, the chip limiting area protrudes out of the chip contact area and the periphery, the chip contact area and the chip limiting area are matched with each other to form a space for accommodating a chip, and the shape of the space is matched with that of the chip;

the chip contact area and the periphery are both provided with staggered chutes, and the outer surface of the chip limiting area is a smooth outer surface;

further, the width of the groove of the staggered chute is 0.08-0.14 mm, the depth of the groove is 0.01-0.05 mm, and the inclination of the staggered chute is 10-80 degrees;

furthermore, the grooves of the staggered chutes are mutually spaced by 0.2-0.6 mm;

further, the height of the chip limiting area is 0.1-0.15 mm;

furthermore, four corners of the heat dissipation cover are rounded corners;

furthermore, the heat dissipation cover is made of copper, and a nickel plating layer is arranged on the outer surface of the heat dissipation cover.

Compared with the prior art, the utility model has the advantages that:

the heat dissipation cover adopts a sheet structure, when in processing, the heat dissipation cover only needs to be directly lathed on the surface of a sheet material without using a die, the glue capacity and the heat dissipation effect can be well controlled by the design of the staggered inclined grooves, and the chip can be well positioned when being packaged due to the arrangement of the chip limiting area.

Drawings

FIG. 1 is a schematic structural view of the present invention;

wherein: 1 heat dissipation cover, 2 chip contact areas, 3 chip limiting areas, 4 peripheries and 5 staggered chutes.

Detailed Description

The utility model is described below with reference to the accompanying drawings and specific embodiments:

as shown in fig. 1, a chip heat dissipation cover, wherein the heat dissipation cover 1 is a sheet structure, a chip contact region 2, a chip spacing region 3 and a periphery 4 are sequentially arranged at the bottom of the heat dissipation cover 1 from inside to outside, the chip spacing region 3 protrudes out of the chip contact region 2 and the periphery 4, the surfaces of the chip contact region 2 and the periphery 4 are flush, the chip contact region 2 and the chip spacing region 3 are mutually matched to form a space for accommodating a chip, the shape of the space is matched with the shape of the chip, and the shape of the chip spacing region 3 is matched with the shape of the chip;

the chip contact area 2 and the periphery 4 are both provided with staggered chutes 5, and the outer surface of the chip limiting area 3 is a smooth outer surface;

further, the width of the groove of the staggered chute 5 is 0.08-0.14 mm, the depth is 0.01-0.05 mm, and the inclination of the staggered chute 5 is 10-80 degrees;

furthermore, the grooves of the staggered chutes 5 are mutually spaced by 0.2-0.6 mm;

further, the height of the chip limiting area 2 is 0.1-0.15 mm;

furthermore, four corners of the heat dissipation cover 1 are rounded corners;

furthermore, the heat dissipation cover 1 is made of copper, and a nickel plating layer is arranged on the outer surface of the heat dissipation cover.

When in use, the chip contact area 2 of the heat dissipation cover 1 is coated with glue and directly bonded with a chip; through the degree of depth width etc. of control crisscross chute 5, can effectual control hold gluey volume and radiating effect, the protruding setting in the spacing district 3 of chip in addition, not only can be fine play the chip spacing about, can prevent moreover that glue from spilling over.

The heat dissipation cover 1 adopts a sheet structure and is matched with the staggered chutes 5, so that the heat dissipation effect of the heat dissipation cover 1 is integrally improved, and the heat dissipation cover can be directly machined during machining without using a stamping die, and is convenient to machine, low in cost and short in development period.

The above is only a specific application example of the present invention, and the protection scope of the present invention is not limited in any way. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims

1. A chip heat dissipation cover is characterized in that: the heat dissipation cover (1) is of a sheet structure, a chip contact area (2), a chip limiting area (3) and a periphery (4) are sequentially arranged at the bottom of the heat dissipation cover (1) from inside to outside, the chip limiting area (3) protrudes out of the chip contact area (2) and the periphery (4), the chip contact area (2) and the chip limiting area (3) are matched with each other to form a space for accommodating a chip, and the shape of the space is matched with that of the chip;

the chip contact area (2) and the periphery (4) are both provided with staggered chutes (5), and the outer surface of the chip limiting area (3) is a smooth outer surface.

2. The chip heat dissipation cover of claim 1, wherein: the width of the groove of the staggered chute (5) is 0.08-0.14 mm, the depth is 0.01-0.05 mm, and the inclination of the staggered chute (5) is 10-80 degrees.

3. The heat sink cap of claim 1 or 2, wherein: the grooves of the staggered chutes (5) are mutually spaced by 0.2-0.6 mm.

4. The chip heat dissipation cover of claim 1, wherein: the height of the chip limiting area (3) is 0.1-0.15 mm.

5. The chip heat dissipation cover of claim 1, wherein: four corners of the heat dissipation cover (1) are rounded corners.

6. The chip heat dissipation cover of claim 1, wherein: the heat dissipation cover (1) is made of copper, and a nickel plating layer is arranged on the outer surface of the heat dissipation cover.