CN210168285U - 一种内嵌型陶瓷绝缘散热的pcb板 - Google Patents
一种内嵌型陶瓷绝缘散热的pcb板 Download PDFInfo
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- CN210168285U CN210168285U CN201920954887.6U CN201920954887U CN210168285U CN 210168285 U CN210168285 U CN 210168285U CN 201920954887 U CN201920954887 U CN 201920954887U CN 210168285 U CN210168285 U CN 210168285U
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- 239000000919 ceramic Substances 0.000 title claims abstract description 41
- 238000009413 insulation Methods 0.000 title claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- -1 graphite alkene Chemical class 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011889 copper foil Substances 0.000 claims abstract description 7
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 5
- 239000010439 graphite Substances 0.000 claims abstract description 5
- 239000004743 Polypropylene Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000004922 lacquer Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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CN201920954887.6U CN210168285U (zh) | 2019-06-24 | 2019-06-24 | 一种内嵌型陶瓷绝缘散热的pcb板 |
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CN201920954887.6U CN210168285U (zh) | 2019-06-24 | 2019-06-24 | 一种内嵌型陶瓷绝缘散热的pcb板 |
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CN210168285U true CN210168285U (zh) | 2020-03-20 |
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CN201920954887.6U Active CN210168285U (zh) | 2019-06-24 | 2019-06-24 | 一种内嵌型陶瓷绝缘散热的pcb板 |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518000 No. 24, No. 1, No. 2 and No. 3, Shajing Dawangshan Second Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee after: ShenZhen Brightpcb Co.,Ltd. Address before: 518000 No. 24, No. 1, No. 2 and No. 3, Shajing Dawangshan Second Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN MINGZHENGHONG ELECTRONICS Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240201 Address after: 413000 Changchun Industrial Park, Ziyang District, Yiyang, Hunan Patentee after: YIYANG MINGZHENGHONG ELECTRONICS CO.,LTD. Country or region after: China Address before: 518000 No. 24, No. 1, No. 2 and No. 3, Shajing Dawangshan Second Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee before: ShenZhen Brightpcb Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right |