CN209906340U - 微机电传感器封装结构 - Google Patents
微机电传感器封装结构 Download PDFInfo
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CN109850839A (zh) * | 2019-04-01 | 2019-06-07 | 武汉耐普登科技有限公司 | 微机电传感器封装结构及制造方法 |
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CN109850839A (zh) * | 2019-04-01 | 2019-06-07 | 武汉耐普登科技有限公司 | 微机电传感器封装结构及制造方法 |
CN109850839B (zh) * | 2019-04-01 | 2023-12-08 | 无锡韦感半导体有限公司 | 微机电传感器封装结构及制造方法 |
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Effective date of registration: 20201113 Address after: 214000 5th floor, building C, swan tower, Wuxi Software Park, No.111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Weil Semiconductor Co.,Ltd. Address before: 430000 Three Floors of Henglong Building D in Huazhong Dawn Software Park, No. 1 Guanshan Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee before: WUHAN NAIPUDENG TECHNOLOGY Co.,Ltd. |
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Address after: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Weigan Semiconductor Co.,Ltd. Address before: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Weil Semiconductor Co.,Ltd. |
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Effective date of registration: 20220930 Address after: Room 501, 5th Floor, Building C, Cygnus Building, Wuxi Software Park, No. 111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Senxin Technology Co.,Ltd. Address before: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Weigan Semiconductor Co.,Ltd. |
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