CN209878943U - MEMS chip test socket - Google Patents
MEMS chip test socket Download PDFInfo
- Publication number
- CN209878943U CN209878943U CN201822266056.8U CN201822266056U CN209878943U CN 209878943 U CN209878943 U CN 209878943U CN 201822266056 U CN201822266056 U CN 201822266056U CN 209878943 U CN209878943 U CN 209878943U
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- base
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- test socket
- tested
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model provides a MEMS chip test socket, which comprises a base, an upper cover, a temperature sensor and a heating element; the upper cover is relatively fixed with the base through the fixing component; the center of the upper surface of the base is provided with a first groove for accommodating a chip to be tested; a first spring probe group is arranged around the bottom surface of the first groove, one end of the first spring probe group is used for being contacted with a pin of a chip to be tested, and the other end of the first spring probe group extends out of the bottom surface of the base and is used for being electrically connected with the PCB; the bottom of the first groove is also provided with a second groove, the temperature sensor is arranged in the second groove, so that when the chip test socket works, the temperature sensor is contacted with a chip to be tested, the bottom surface of the second groove is provided with a second spring probe group, one end of the second spring probe group is used for being contacted with a pin of the temperature sensor, and the other end of the second spring probe group extends out of the bottom surface of the base and is used for being electrically connected with a PCB (printed circuit board); the heating element is connected with an external power supply through a power line and used for heating the chip to be tested. The utility model discloses a MEMS chip test socket makes chip heating cycle shorten to several minutes, and the temperature measurement is more accurate quick, the continuous test of being convenient for.
Description
Technical Field
The utility model relates to a MEMS chip test field, more specifically say, relate to a MEMS chip test socket.
Background
Micro-Electro-Mechanical Systems (MEMS) are Micro-integrated Systems that use integrated circuit fabrication and micromachining to fabricate Micro-structures, Micro-sensors, control and processing circuitry, and even interfaces, communications and power supplies, on one or more chips. In testing a MEMS chip, it is usually necessary to attach the MEMS chip to a PCB board for testing through a test socket and communicate with the PCB board through a conductive wire (e.g., a spring probe). When determining whether the chip has temperature drift and needs temperature compensation, the current common practice is to put the whole test PCB board fixed with the chip and the test socket into a constant temperature oven for heating, and set a temperature sensor on the PCB board to detect the whole temperature of the environment. And when the PCB, the test socket and the chip fixed on the PCB are heated to a preset temperature together by the oven, the chip is tested.
This heating process typically takes 30-40 minutes to consistently bring the test equipment in the oven to the preset temperature. In addition, when the chips to be tested are continuously tested in a large batch, the temperature of the PCB for testing is not recovered to the room temperature after the chips to be tested are replaced and is inconsistent with the temperature of the replaced chips, and the temperature measured by the temperature sensor on the PCB is inconsistent with the actual temperature of the chips when the replaced chips are tested again. Thus, the existing methods cannot be continuously tested. The technical personnel in the field hope to find a new chip testing method which can solve the problems that the existing method has long testing period and can not continuously test.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a MEMS chip test socket and heating temperature measurement method thereof to solve the problem that current test method test cycle is long, unable continuous test.
In order to achieve the above object, the utility model provides a following technical scheme:
a MEMS chip test socket comprises a base, an upper cover, a temperature sensor and a heating element; the upper cover is relatively fixed with the base through a fixing component; a first groove is formed in the center of the upper surface of the base and used for accommodating a chip to be tested; a first spring probe group is arranged around the bottom surface of the first groove, one end of the first spring probe group is used for being in contact with a pin of a chip to be tested, and the other end of the first spring probe group extends out of the bottom surface of the base and is used for being electrically connected with a PCB (printed circuit board); the bottom of the first groove is also provided with a second groove, the temperature sensor is arranged in the second groove, so that when the MEMS chip test socket works, the temperature sensor is in contact with a chip to be tested, the bottom surface of the second groove is provided with a second spring probe group, one end of the second spring probe group is used for being in contact with a pin of the temperature sensor, and the other end of the second spring probe group extends out of the bottom surface of the base and is used for being electrically connected with a PCB (printed circuit board); the heating element is connected with an external power supply through a power line and used for heating the chip to be tested.
Preferably, the upper edge of the side wall of the second groove has a projection extending into the second groove for fixing the temperature sensor.
Preferably, the heating element is a heating rod or a heating plate, and is disposed inside the upper cover such that the heating rod or the heating plate is in contact with the chip to be tested when the upper cover is closed.
Preferably, the heating element is in contact with the chip to be tested through the heat conducting pressing sheet.
Preferably, the heating element is a heating wire or a heating pipe, and is arranged around the inner wall of the first groove of the base.
Preferably, the upper cover comprises a cover body and a cover plate, and the cover plate is connected with the cover body through a spring and can move relative to the cover body for applying pressure to the chip to be tested.
Preferably, the cover plate and the cover body are limited to move in the vertical direction through the positioning pin.
Preferably, the test socket further comprises a protective cover fixed below the base through a fastener and used for protecting contact points of the spring probes exposed on the lower surface of the base when the MEMS chip test socket is stored.
Preferably, the fixed subassembly includes a pair of jack catch, sets up in the relative both sides of upper cover, is equipped with the draw-in groove on the base, and when the jack catch lock was in the draw-in groove, upper cover and base relatively fixed.
Preferably, the fixed subassembly includes the jack catch, and the upper cover is connected through the pivot rotation with the base, and the jack catch setting is equipped with the draw-in groove that corresponds with the jack catch at the opposite side of the relative pivot of upper cover, base for when the jack catch lock is in the draw-in groove, upper cover and base relatively fixed.
A chip testing system comprising a PCB and the MEMS chip testing socket of any one of the preceding claims.
A temperature heating control method for chip testing uses the chip testing system, and comprises the following steps:
a heating element is arranged in the socket for heating the chip to be tested;
a temperature sensor is arranged in a groove at the bottom of the socket and used for measuring the temperature of a chip to be measured in real time;
the temperature sensor is connected with the PCB through the probe, and transmits measured temperature data to the PCB control element to control the heating element to work in real time.
Compared with the prior art, the utility model provides a technical scheme has following advantage:
the utility model provides a MEMS chip test socket and heating temperature measurement method thereof is with temperature sensor and the chip direct contact that awaits measuring to with heating element setting at the opposite side of the chip that awaits measuring, make the chip cycle shorter when the heating, usually for several minutes, the temperature measurement is more accurate quick, and can test in succession.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a general schematic diagram of a MEMS chip test socket according to an embodiment of the present invention;
fig. 2 is an exploded view of an upper cover of a MEMS chip test socket according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a fastening state of a MEMS chip test socket according to an embodiment of the present invention;
fig. 4 is a schematic view illustrating a loose state of a MEMS chip test socket according to an embodiment of the present invention;
fig. 5 is a cross-sectional view of an upper cover of a MEMS chip test socket according to an embodiment of the present invention;
FIG. 6 is an enlarged view of a portion of the area A of FIG. 5;
fig. 7 is an exploded view of a base of a MEMS chip test socket according to an embodiment of the present invention;
fig. 8 is a top view of a base of a MEMS chip test socket according to an embodiment of the present invention;
FIG. 9 is a cross-sectional view taken along plane C-C of FIG. 8
Fig. 10 is a pin diagram of a MEMS chip test socket according to an embodiment of the present invention;
fig. 11 is a spring probe structure diagram of a MEMS chip test socket according to an embodiment of the present invention.
100-an upper cover; 101-a cover body; 102-a jaw; 103-a pin shaft; 104-fixed stop; 105-a first spring; 106-a second spring; 107-first alignment pin; 108-first fixed column; 109-a cover plate; 200-a base; 201-movable plate; 202-a stage; 203-a backplane; 204-a second fixed column; 205-a first nut; 206-a second nut; 207-second locating pin; 208-a third locating pin; 209-a second nut; 210-a second screw; 211-a first screw; 212-first contact point; 213-second contact point; 214-a first spring probe set; 215-a second spring probe set; 300-a temperature sensor; 400-a heating element; 401-heat conducting tabletting; 500-a protective cover; 600-chip to be tested.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
An embodiment of the present invention provides a chip testing socket, as shown in fig. 1, including a base 200 and an upper cover 100. The upper cover 100 is fixed relative to the base 200 by a fixing member. A first groove is formed in the center of the upper surface of the base 200 and used for accommodating a chip 600 to be tested; a first spring probe group 214 is arranged around the bottom surface of the first groove, one end of the first spring probe group is used for contacting with pins of the chip 600 to be tested, and the other end of the first spring probe group extends out of the bottom surface of the base 200 and is used for electrically connecting with a PCB (printed circuit board); the bottom of the first groove is also provided with a second groove, the temperature sensor 300 is arranged in the second groove, so that when the chip test socket works, the temperature sensor 300 is in contact with a chip 600 to be tested, the bottom surface of the second groove is provided with a second spring probe group 215, one end of the second spring probe group is used for being in contact with a pin of the temperature sensor 300, and the other end of the second spring probe group extends out of the bottom surface of the base 200 and is used for being electrically connected with a PCB (printed circuit board); the heating element 400 is connected to an external power source through a power line for heating the chip 600 to be tested. Preferably, the upper edge of the sidewall of the second groove has a protrusion extending into the second groove for fixing the temperature sensor 300 and preventing the temperature sensor 300 from falling off.
Fig. 2 shows an exploded view of the upper cover 100, and in this embodiment, the fixing assembly includes a pair of jaws 102 disposed at opposite sides of the upper cover 100, respectively. Correspondingly, the base 200 is provided with a slot, and when the claws 102 are engaged in the slot, the upper cover 100 is fixed relative to the base 200. Fig. 3 and 4 show a fastened state and an unfastened state, respectively, of the chip test socket of the present embodiment. In other embodiments, the fixing component may also include a claw 102, the upper cover 100 is rotatably connected to the base 200 through a rotating shaft, the claw 102 is disposed on the other side of the upper cover 100 opposite to the rotating shaft, and the base 200 is provided with a slot corresponding to the claw 102, so that when the claw 102 is snapped in the slot, the upper cover 100 is fixed relative to the base 200.
Referring to fig. 2, the top cover 100 includes a cover 101 and a cover plate 109, and the cover plate 109 is connected to the cover 101 through a first fixing pillar 108 and a second spring 106, and is movable relative to the cover 101 for applying pressure to the chip 600 to be tested. The cover plate 109 and the cover 101 are restricted by the first positioning pin 107 from moving in the vertical direction. The jaws 102 are disposed on opposite sides of the cover 101 via pins 103, and the ends of the pins 103 may be provided with fixed stoppers 104 to prevent the pins 103 from being released. A first spring 105 is provided between the upper end of the claw 102 and the cover 101.
Referring to fig. 6, which is a partially enlarged view of a region a of the upper cover 100 shown in fig. 5, the chip test socket of the present embodiment further includes a heating element 400. In this embodiment, the heating element 400 is a heating rod or a heating sheet, and is disposed inside the cover 101 of the upper cover 100, one end of the heating element 400 extends out of the cover 101 and is connected to an external power source through a power line, and the other end of the heating element 400 is connected to a heat-conducting pressing sheet 401, and when the upper cover 100 is closed, the heat-conducting pressing sheet 401 contacts with the chip 600 to be tested, so that the heating element 400 can directly heat the chip 600 to be tested.
Fig. 7 to 9 show an exploded view, a top view and a C-C cross-sectional view of the chip test socket base 200 of the present embodiment. Base 200 includes a stage 202, a movable plate 201, and a bottom plate 203, where stage 202 has an upwardly open cavity, movable plate 201 is located in the cavity, fixed relative to stage 202 by a second fixed column 204 and a second nut 209206, and movable in a vertical direction relative to stage 202. The bottom plate 203 is located on the lower surface of the carrier 202 and is fixed to the other side of the carrier 202 opposite to the cavity by the second screws 210 and the second nuts 209206. The first spring probe set 214 and the second spring probe set 215 are arranged in the carrier 202 in a penetrating manner, one end of the first spring probe set 214 is in contact with the chip 600 to be tested through a through hole on the movable plate 201, and the other end of the first spring probe set passes through a through hole on the bottom plate 203. One end of the second spring probe set 215 is in contact with the temperature sensor 300 through a through hole on the stage 202, and the other end passes through a through hole on the base plate 203.
Preferably, the base 200 further includes a second alignment pin 207 and a third alignment pin 208. A second positioning pin 207 passes through the movable plate 201 and the stage 202, and a third positioning pin 208 passes through the base plate 203 and the stage 202. The second positioning pin 207 and the third positioning pin 208 make the through holes of the movable plate 201, the stage 202, and the bottom plate 203 coaxial, so that the pogo pin set can be safely disposed in the base 200 without being subjected to a tangential force.
Preferably, the base 200 of the present embodiment further includes a protective cover 500 fixed below the base 200 by a fastener for protecting the contact points of the spring probes exposed on the lower surface of the base 200 when the chip test socket is stored. The fastener includes a first threaded shaft 211 and a first nut 205.
In the present embodiment, when the chip test socket does not operate, the movable plate 201 is higher than the upper end of the first spring probe group 214; when the chip test socket operates, the chip 600 to be tested presses the movable plate 201 such that the upper end of the first spring probe group is exposed and electrically contacts the pins of the chip 600 to be tested. The lead structure of the chip package adapted by the first pogo pin set 214 is not particularly limited in this embodiment, and may be a lead structure of a QFN package, an LGA package or other packages. Fig. 10 is a schematic diagram of the pins of the socket for testing chips according to the embodiment, in which the first contact points 212 of the first pogo pin groups 214 connected to the pins of the chip 600 to be tested are on the outer circle, and the second contact points 213 of the second pogo pin groups 215 connected to the pins of the temperature sensor 300 are on the inner circle.
Fig. 11 shows probe structures of the first and second spring probe groups 214 and 215 of the present embodiment, both ends of which may be contact probes having elastic structures. So that the contacts of the terminals are stably electrically contacted with the pins of the chip 600 and the temperature sensor 300.
In addition, in other embodiments, the heating element 400 may also be in the form of a heating wire or a heating tube, for example, disposed around the inner wall of the first groove of the base 200, as long as the heating element 400 can directly heat the chip 600 to be tested.
The utility model also provides a chip test system, including PCB board and the foreland chip test socket.
Wherein, the external power supply connected with the heating element can be a power supply module arranged on the PCB.
The utility model also provides a temperature heating control method when chip test uses aforementioned chip test system, including following step:
a heating element is arranged in the socket for heating the chip to be tested;
a temperature sensor is arranged in a groove at the bottom of the socket and used for measuring the temperature of a chip to be measured in real time;
the temperature sensor is connected with the PCB through the probe, and transmits measured temperature data to the PCB control element to control the heating element to work in real time.
The utility model provides a chip test socket and heating temperature measurement method thereof is with temperature sensor and the chip direct contact that awaits measuring to with heating element setting at the opposite side of the chip that awaits measuring, make the chip cycle when the heating shorter, usually for several minutes, the temperature measurement is more accurate quick, and can test in succession.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A MEMS chip test socket is characterized by comprising a base, an upper cover, a temperature sensor and a heating element;
the upper cover is relatively fixed with the base through a fixing component;
a first groove is formed in the center of the upper surface of the base and used for accommodating a chip to be tested;
a first spring probe group is arranged around the bottom surface of the first groove, one end of the first spring probe group is used for being in contact with a pin of a chip to be tested, and the other end of the first spring probe group extends out of the bottom surface of the base and is used for being electrically connected with a PCB (printed circuit board);
the bottom of the first groove is also provided with a second groove, the temperature sensor is arranged in the second groove, so that when the MEMS chip test socket works, the temperature sensor is in contact with a chip to be tested, the bottom surface of the second groove is provided with a second spring probe group, one end of the second spring probe group is used for being in contact with a pin of the temperature sensor, and the other end of the second spring probe group extends out of the bottom surface of the base and is used for being electrically connected with a PCB (printed circuit board);
the heating element is connected with an external power supply through a power line and used for heating the chip to be tested.
2. The MEMS chip test socket according to claim 1, wherein the upper edge of the sidewall of the second groove has a protrusion extending into the second groove for fixing the temperature sensor.
3. The MEMS chip test socket according to claim 1, wherein the heating element is a heating rod or a heating plate disposed inside the upper lid such that the heating rod or the heating plate contacts the chip to be tested when the upper lid is closed.
4. The MEMS chip test socket of claim 3, wherein the heating element is in contact with the chip under test through a thermally conductive pad.
5. The MEMS chip test socket according to claim 1, wherein the heating element is a heating wire or a heating tube disposed around an inner wall of the first groove of the base.
6. The MEMS chip test socket according to claim 1, wherein the upper cover comprises a cover body and a cover plate, the cover plate is connected to the cover body by a spring and is movable relative to the cover body for applying pressure to the chip to be tested.
7. The MEMS chip test socket of claim 6, wherein the cover plate and the cover are restricted from moving in a vertical direction by the alignment pins.
8. The MEMS chip test socket according to claim 1, further comprising a protective cover secured under the base by fasteners for protecting the exposed spring probe contact points on the lower surface of the base when the MEMS chip test socket is stored.
9. The MEMS chip test socket according to claim 1, wherein the fixing member comprises a pair of claws disposed on opposite sides of the top cover, and the base has a slot, such that the top cover is fixed to the base when the claws are engaged in the slot.
10. The MEMS chip testing socket of claim 1, wherein the fixing member comprises a claw, the upper cover is rotatably connected to the base via a rotating shaft, the claw is disposed on the other side of the upper cover opposite to the rotating shaft, and the base is provided with a slot corresponding to the claw, so that the upper cover is fixed to the base when the claw is engaged in the slot.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711495245 | 2017-12-31 | ||
| CN2017114952456 | 2017-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209878943U true CN209878943U (en) | 2019-12-31 |
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ID=67129843
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811652427.4A Pending CN109991528A (en) | 2017-12-31 | 2018-12-31 | A kind of MEMS chip test jack and heating temp measuring method |
| CN201822266056.8U Active CN209878943U (en) | 2017-12-31 | 2018-12-31 | MEMS chip test socket |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811652427.4A Pending CN109991528A (en) | 2017-12-31 | 2018-12-31 | A kind of MEMS chip test jack and heating temp measuring method |
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| Country | Link |
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| CN (2) | CN109991528A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108507705A (en) * | 2018-07-04 | 2018-09-07 | 上海捷策创电子科技有限公司 | A kind of chip temperature measuring equipment |
| CN110618375A (en) * | 2019-10-18 | 2019-12-27 | 天津津航计算技术研究所 | BGA test socket for rapid temperature change |
| CN112824916A (en) * | 2019-11-20 | 2021-05-21 | 圣邦微电子（北京）股份有限公司 | High-temperature testing device and method for integrated chip |
| CN112881898A (en) * | 2021-02-24 | 2021-06-01 | 李彩芬 | High-temperature aging test device for integrated circuit |
| CN115128312B (en) * | 2022-07-14 | 2024-04-02 | 法特迪精密科技（苏州）有限公司 | Distributed high-power test socket applicable to radio frequency module |
| CN116559633B (en) * | 2023-07-10 | 2023-09-29 | 华羿微电子股份有限公司 | Semiconductor chip high temperature test box |
-
2018
- 2018-12-31 CN CN201811652427.4A patent/CN109991528A/en active Pending
- 2018-12-31 CN CN201822266056.8U patent/CN209878943U/en active Active
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|---|---|
| CN109991528A (en) | 2019-07-09 |
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Address after: 312030 Building 5, intelligent innovation center, 487 Kebei Avenue, Keqiao Economic and Technological Development Zone, Keqiao District, Shaoxing City, Zhejiang Province Patentee after: Shendi semiconductor (Shaoxing) Co.,Ltd. Address before: No.28, Lane 555, huanqiao Road, Pudong New Area, Shanghai, 201315 Patentee before: Senodia Technologies (Shanghai) Co.,Ltd. |