CN108507705A - A kind of chip temperature measuring equipment - Google Patents
A kind of chip temperature measuring equipment Download PDFInfo
- Publication number
- CN108507705A CN108507705A CN201810725012.9A CN201810725012A CN108507705A CN 108507705 A CN108507705 A CN 108507705A CN 201810725012 A CN201810725012 A CN 201810725012A CN 108507705 A CN108507705 A CN 108507705A
- Authority
- CN
- China
- Prior art keywords
- temperature measuring
- chip
- conduction element
- measuring device
- measuring equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 claims abstract description 56
- 230000005611 electricity Effects 0.000 claims description 2
- 239000000523 sample Substances 0.000 claims description 2
- 238000005259 measurement Methods 0.000 abstract description 12
- 238000003780 insertion Methods 0.000 abstract description 6
- 230000037431 insertion Effects 0.000 abstract description 6
- 208000033999 Device damage Diseases 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to test correlative technology fields, a kind of chip temperature measuring equipment is disclosed, including test bench and the temperature measuring device, at least one first conduction element and at least one second conduction element that are installed in the test bench, temperature measuring device with the lower surface of chip to be measured for being in contact, first conduction element is for temperature measuring device and external test circuitry to be conducted, and the second conduction element is for chip to be measured to be conducted with external test circuitry.Temperature measuring equipment provided by the invention can test the temperature of chip lower surface, to keep the actual temperature of measured temperature and chip closer, reduce measurement error, improve the accuracy of measurement result, and temperature measuring equipment provided by the invention is simple in structure, and it is easy to operate, without will be in temperature measuring device insertion apparatus when test, the case where measurement stability caused by plugging temperature measuring device is declined with measurement device damage is avoided, the service life of device is improved.
Description
Technical field
The present invention relates to test correlative technology field more particularly to a kind of chip temperature measuring equipments.
Background technology
IC chip after a series of manufacturing process, is usually also needing to carry out a variety of tests, chip temperature
Test is one such.Existing chip temperature test device is usually to insert temperature measuring device from the instrument connection above device
Enter and is contacted with the upper surface of chip, the temperature for the mainly chip upper surface that temperature measuring device is tested.On the one hand, due to chip
Pyrotoxin generally proximate to its lower surface, so there are larger mistakes for the chip temperature measured by existing chip temperature measuring equipment
Difference, measurement result are inaccurate；On the other hand, existing chip temperature measuring equipment is using plug-in type temperature measuring device, and when measurement grasps
It is inconvenient to make, and since to be easy to cause temperature measuring device different from the exposure level of chip upper surface for the difference of insertion depth, from
And the job stability of temperature measuring equipment and accuracy is caused to decline, temperature measuring device is easily damaged in swapping process in addition, is caused
The service life of chip temperature measuring equipment declines.
Invention content
Based on the above, the purpose of the present invention is to provide a kind of chip temperature measuring equipments, to solve existing chip thermometric
Above-mentioned technical problem existing for device.
In order to achieve the above object, the present invention uses following technical scheme：
A kind of chip temperature measuring equipment, including test bench and be installed in the test bench temperature measuring device, at least one the
One conduction element and at least one second conduction element, the temperature measuring device with the lower surface of chip to be measured for being in contact, and described the
One conduction element for the temperature measuring device to be conducted with external test circuitry, second conduction element be used for chip to be measured and
External test circuitry is conducted.
Further, first conduction element and second conduction element are probe.
Further, further include fixed block, the fixed block is installed in the test bench, and is located at the temperature measuring device
Lower section, for fixing first conduction element.
Further, at least one first conduction element open-work is provided on the fixed block, first conduction element is worn
In in the first conduction element open-work, and one end of first conduction element is conducted with the temperature measuring device.
Further, at least one second conduction element open-work is provided on the test bench, second conduction element is worn
In in the second conduction element open-work, and one end of second conduction element is conducted with chip to be measured.
Further, it is provided with temperature measuring device mounting hole on the test bench, for installing the temperature measuring device.
Further, it is provided with guide groove on the test bench, guide plate, the guide plate are provided in the guide groove
For being positioned to chip to be measured.
Further, chip hole is provided on the guide plate, the chip hole is for placing chip to be measured.
Further, further include bottom plate, the bottom plate is installed on the lower section of the test bench.
Further, it is provided with multiple via holes on the bottom plate, first conduction element and second conduction element
One end is conducted across the via hole with external test circuitry.
Beneficial effects of the present invention are：
The present invention makes the lower surface of temperature measuring device and chip to be measured by being arranged temperature measuring device in the lower section of chip to be measured
Be in contact, it is ensured that temperature measuring device can be measured that the temperature close to chip lower surface pyrotoxin, to make measured temperature with
The actual temperature of chip is closer, reduces measurement error, improves the accuracy of measurement result.And by thermometric in the present invention
Device is fixed in temperature measuring equipment, and temperature measuring device and the external circuit board are conducted by the first conduction element, make temperature measuring equipment
Structure is simpler, and operation is more convenient, without by temperature measuring device insertion apparatus, avoiding due to temperature measuring device when thermometric
Temperature measuring device caused by the insertion depth difference situation different from chip exposure level, to improve the operation is stable of device
Property and accuracy, while avoiding in temperature measuring device swapping process to the damage caused by temperature measuring device, improve chip thermometric
The service life of device.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, institute in being described below to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example without creative efforts, can also be implemented for those of ordinary skill in the art according to the present invention
The content of example and these attached drawings obtain other attached drawings.
Fig. 1 is the structural schematic diagram of chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 2 is the explosive view of chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 3 is the partial sectional view of chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of test bench in chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the first conduction element in chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of fixed block in chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 7 is the structural schematic diagram of the second conduction element in chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 8 is the structural schematic diagram of chip temperature measuring equipment bottom plate provided in an embodiment of the present invention.
In figure：
100- chips to be measured；
1- test benches；11- the second conduction element open-works；12- temperature measuring device mounting holes；13- guide grooves；
2- temperature measuring devices；
The first conduction elements of 3-；First shaft shoulders of 31-；Second shaft shoulders of 32-；
The second conduction elements of 4-；The upper shaft shoulders of 41-；The shaft shoulder under 42-；
5- fixed blocks；51- the first conduction element open-works；
6- guide plates；61- chip holes；
7- bottom plates；71- via holes.
Specific implementation mode
For make present invention solves the technical problem that, the technical solution that uses and the technique effect that reaches it is clearer, below
The technical solution of the embodiment of the present invention will be described in further detail in conjunction with attached drawing, it is clear that described embodiment is only
It is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art exist
The every other embodiment obtained under the premise of creative work is not made, shall fall within the protection scope of the present invention.
As shown in Figure 1-Figure 3, the present embodiment provides a kind of chip temperature measuring equipment, including test bench 1 and it is installed on test bench 1
In temperature measuring device 2, at least one first conduction element 3 and at least one second conduction element 4, temperature measuring device 2 be used for and core to be measured
The lower surface of piece 100 is in contact, and the first conduction element 3 is for temperature measuring device 2 to be conducted with external test circuitry, the second conduction element
4 for chip 100 to be measured to be conducted with external test circuitry.The preferred structure of first conduction element 3 and the second conduction element 4 is to visit
Needle.
When measuring chip temperature, chip 100 to be measured is put in device first, makes 100 and second conduction element 4 of chip to be measured
It is in contact, and the lower surface of chip 100 to be measured is made to be in contact with temperature measuring device 2, chip 100 to be measured in this way will be led by second
Parts 4 are connected with external test circuitry, so that chip 100 to be measured is maintained in normal operating circuit, while temperature measuring device 2 can be surveyed
The temperature of 100 lower surface of chip to be measured is measured, and the temperature data of measurement is fed back to and external testing electricity by the first conduction element 3
In the temperature readout device of road connection, and then realize the test to 100 temperature of chip to be measured.
Temperature measuring device 2 is arranged in the lower section of chip 100 to be measured in the present embodiment, makes temperature measuring device 2 and chip 100 to be measured
Lower surface be in contact, it is ensured that temperature measuring device 2 can be measured that the temperature of chip lower surface, to make measured temperature and core
The actual temperature of piece is closer, reduces measurement error, improves the accuracy of measurement result.And by thermometric in the present embodiment
Device 2 is installed in test bench 1, and temperature measuring device 2 is conducted with external test circuitry by the first conduction element 3, thermometric is made to fill
The structure set is simpler, and operation is more convenient, without by 2 insertion apparatus of temperature measuring device, avoiding due to thermometric when test
Temperature measuring device 2 caused by the insertion depth difference of device 2 situation different from chip exposure level, to improve device
Job stability and accuracy, while avoiding in 2 swapping process of temperature measuring device to the damage caused by temperature measuring device 2, it is promoted
The service life of chip temperature measuring equipment.In addition, the quantity of the first conduction element 3 and the second conduction element 4 can root in the present embodiment
It is adjusted according to the demand of chip 100 to be measured.
Specifically, as shown in figure 4, in order to provide certain installation space to temperature measuring device 2, survey is provided on test bench 1
Warm device mounting hole 12, for installing temperature measuring device 2.As shown in figure 5, being provided with first shaft shoulder 31 and on the first conduction element 3
Two shaft shoulders 32.In order to which the first conduction element 3 is fixed, fixed block 5 is additionally provided in chip temperature measuring equipment, fixed block 5 is installed
In in test bench 1, and positioned at the lower section of temperature measuring device 2.As shown in fig. 6, being provided at least one first conduction element on fixed block 5
Open-work 51, the first conduction element open-work 51 are the stepped hole that upper end diameter is less than lower end diameter, and the first conduction element 3 is arranged in first and leads
In parts open-work 51, the upper end of the first conduction element 3 is pierced by the first conduction element open-work 51 and is conducted with temperature measuring device 2.Such as Fig. 7 institutes
Show, the shaft shoulder 41 and the lower shaft shoulder 42 are provided on the second conduction element 4.In order to realize the fixation to the second conduction element 4, test bench 1
On be additionally provided at least one second conduction element open-work 11, the second conduction element 4 is arranged in the second conduction element open-work 11, and second
The upper end of conduction element 4 is conducted with chip 100 to be measured, and the second conduction element open-work 11 is the platform that upper end diameter is less than lower end diameter
Rank.
Temperature measuring device 2 is set in temperature measuring device mounting hole 12 in the present embodiment, on the one hand may be implemented to thermal detector
The positioning of part 2 ensures accuracy and stability that temperature measuring device 2 is contacted with the first conduction element 3；On the other hand, temperature measuring device is pacified
Dress hole 12 can play the protective effect to temperature measuring device 2, prevent extraneous factor from being damaged to temperature measuring device 2, extend thermometric
The service life of device 2.
First conduction element 3 is fixed using fixed block 5 in the present embodiment, the first conduction element 3 when device being made to work
Steady contact between upper end and temperature measuring device 2, the accuracy that stability and data to ensure that device work acquire.And
And set the first conduction element open-work 51 to the smaller stepped hole of upper end diameter in the present embodiment, pass through stepped hole and first shaft shoulder
31 match the limit realized to 3 upper end of the first conduction element, avoid since the upper end of the first conduction element 3 is pierced by the first conducting
The length of part open-work 51 is long and the case where cause the upper end of the first conduction element 3 and temperature measuring device 2 to damage, be conducive to lead to first
The upper end of parts 3 and temperature measuring device 2 are protected.In addition, the second conduction element open-work 11 is also configured as upper end in the present embodiment
The smaller stepped hole of diameter realizes the limit to 4 upper end of the second conduction element using stepped hole, it is therefore prevented that the second conduction element 4
The length that upper end is pierced by the second conduction element open-work 11 is long, is conducive to carry out the upper end of the second conduction element 4 and chip lower surface
Protection.
In order to provide certain placement space to chip 100 to be measured, guide groove 13, guide groove are additionally provided on test bench 1
It is provided with guide plate 6 in 13, chip hole 61 is provided on guide plate 6, chip 100 to be measured is positioned in chip hole 61.This implementation
Guide plate 6 is installed in the guide groove 13 of test bench 1 in example, ensure that and opposite move does not occur between guide plate 6 and test bench 1
It is dynamic, steady contact when to ensure that test between chip lower surface and temperature measuring device 2.Chip 100 to be measured is positioned over and is led
Into the chip hole 61 of plate 6, contact when not only further ensuring test between chip lower surface and temperature measuring device 2 is stablized
Property, and the positioning to chip 100 to be measured is realized, ensure that between 100 and second conduction element 4 of chip to be measured accurate connects
It touches.
In order to which the lower end to the first conduction element 3 and the second conduction element 4 is fixed and limits, temperature measuring equipment further includes bottom plate
7, bottom plate 7 is installed on the lower section of test bench 1, and positioned at the top of external test circuitry.As shown in figure 8, being provided on bottom plate 7 more
Under a via hole 71, via hole 71 are matched with the first conduction element open-work 51 and the second conduction element open-work 11, and via hole 71 is
Diameter is held to be less than the stepped hole of upper end diameter, the lower end of the first conduction element 3 and the second conduction element 4 passes through via hole 71 to be surveyed with external
Examination circuit is conducted.7 one side of bottom plate in the present embodiment ensure that the lower end of the first conduction element 3 always with external test circuitry
It is connected, to be conducive to the stability of temperature data transmission；On the other hand, it ensure that the second conduction element 4 during thermometric
Lower end is connected with external test circuitry always, and chip is made to be in normal operating circuit always.In addition, will in the present embodiment
Via hole 71 is set as the smaller stepped hole of lower end diameter, and realization is matched with second shaft shoulder 32 and the lower shaft shoulder 42 by stepped hole
Limit to 4 lower end of the first conduction element 3 and the second conduction element, is conducive to 4 lower end of the first conduction element 3 and the second conduction element
Protection.
Chip to be measured ensure that by being used cooperatively for test bench 1, fixed block 5, guide plate 6 and bottom plate 7 in the present embodiment
100 and device in each device stablize and be accurately positioned, to improve the stability of device work, improve measurement result
Accuracy.
Note that above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The present invention is not limited to specific embodiments described here, can carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out to the present invention by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
May include other more equivalent embodiments, and the scope of the present invention is determined by scope of the appended claims.
Claims (10)
1. a kind of chip temperature measuring equipment, which is characterized in that including test bench (1) and the thermometric being installed in the test bench (1)
Device (2), at least one first conduction element (3) and at least one second conduction element (4), the temperature measuring device (2) are used for and wait for
The lower surface for surveying chip (100) is in contact, and first conduction element (3) is used for the temperature measuring device (2) and external testing electricity
Road is conducted, and second conduction element (4) is for chip to be measured (100) to be conducted with external test circuitry.
2. chip temperature measuring equipment according to claim 1, which is characterized in that first conduction element (3) and described second
Conduction element (4) is probe.
3. chip temperature measuring equipment according to claim 1, which is characterized in that further include fixed block (5), the fixed block
(5) it is installed in the test bench (1), and positioned at the lower section of the temperature measuring device (2), for fixing first conduction element
(3)。
4. chip temperature measuring equipment according to claim 3, which is characterized in that be provided at least one on the fixed block (5)
A first conduction element open-work (51), first conduction element (3) are arranged in the first conduction element open-work (51), and described the
One end of one conduction element (3) is conducted with the temperature measuring device (2).
5. chip temperature measuring equipment according to claim 1, which is characterized in that be provided at least one on the test bench (1)
A second conduction element open-work (11), second conduction element (4) are arranged in the second conduction element open-work (11), and described the
One end of two conduction elements (4) is conducted with chip to be measured (100).
6. chip temperature measuring equipment according to claim 1, which is characterized in that be provided with thermal detector on the test bench (1)
Part mounting hole (12), for installing the temperature measuring device (2).
7. chip temperature measuring equipment according to claim 1, which is characterized in that be provided with guide groove on the test bench (1)
(13), guide plate (6) is provided in the guide groove (13), the guide plate (6) is for determining chip to be measured (100)
Position.
8. chip temperature measuring equipment according to claim 7, which is characterized in that be provided with chip hole on the guide plate (6)
(61), the chip hole (61) is for placing chip to be measured (100).
9. chip temperature measuring equipment according to claim 1, which is characterized in that further include bottom plate (7), bottom plate (7) peace
Lower section loaded on the test bench (1).
10. chip temperature measuring equipment according to claim 9, which is characterized in that be provided with multiple conductings on the bottom plate (7)
One end of hole (71), first conduction element (3) and second conduction element (4) passes through the via hole (71) and external testing
Circuit is conducted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810725012.9A CN108507705B (en) | 2018-07-04 | 2018-07-04 | Chip temperature measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810725012.9A CN108507705B (en) | 2018-07-04 | 2018-07-04 | Chip temperature measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108507705A true CN108507705A (en) | 2018-09-07 |
| CN108507705B CN108507705B (en) | 2024-10-18 |
Family
ID=63404211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810725012.9A Active CN108507705B (en) | 2018-07-04 | 2018-07-04 | Chip temperature measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108507705B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109459683A (en) * | 2018-12-26 | 2019-03-12 | 上海捷策创电子科技有限公司 | A kind of apparatus for testing chip |
| CN111951877A (en) * | 2019-05-16 | 2020-11-17 | 第一检测有限公司 | Detection device |
| CN115808613A (en) * | 2023-01-17 | 2023-03-17 | 天芯电子科技(南京)有限公司 | Chip heat dissipation test seat with heat measurement function |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5911897A (en) * | 1997-01-13 | 1999-06-15 | Micro Control Company | Temperature control for high power burn-in for integrated circuits |
| JP2004140167A (en) * | 2002-10-17 | 2004-05-13 | Dainippon Screen Mfg Co Ltd | Method of measuring temperature of substrate, and substrate heat treatment apparatus and method of correcting setting temperature therein |
| US20050189957A1 (en) * | 2004-02-27 | 2005-09-01 | Wells-Cti, Llc. An Oregon Limited Liability Company | Integrated circuit temperature sensing device and method |
| CN1704737A (en) * | 2004-05-26 | 2005-12-07 | 鸿富锦精密工业（深圳）有限公司 | Chip temperature measurement device and method |
| JP2007227444A (en) * | 2006-02-21 | 2007-09-06 | Ricoh Co Ltd | Ic test method, probe guard, test prober, and ic tester |
| JP2008171940A (en) * | 2007-01-10 | 2008-07-24 | Advics:Kk | Load driving device |
| CN201853148U (en) * | 2010-11-10 | 2011-06-01 | 中国电子科技集团公司第十四研究所 | High-reliability moralized chip temperature control device |
| CN102082107A (en) * | 2009-12-01 | 2011-06-01 | 中芯国际集成电路制造(上海)有限公司 | Method and device for measuring temperature of chip |
| CN103344347A (en) * | 2013-05-23 | 2013-10-09 | 常州瑞华电力电子器件有限公司 | Power semiconductor module for measuring chip temperature conveniently |
| CN205139319U (en) * | 2015-11-27 | 2016-04-06 | 法特迪精密科技（苏州）有限公司 | Heavy current semiconductor test seat |
| TW201629510A (en) * | 2014-10-23 | 2016-08-16 | Murata Manufacturing Co | Electronic component test device |
| CN106291302A (en) * | 2015-06-23 | 2017-01-04 | 三菱电机株式会社 | Contact probe type temperature detector, the evaluating apparatus of semiconductor device and the evaluation methodology of semiconductor device |
| CN205861226U (en) * | 2016-08-12 | 2017-01-04 | 泰科电子(上海)有限公司 | Temperature measuring equipment, electric appliance component and battery bag |
| CN106371001A (en) * | 2016-09-27 | 2017-02-01 | 上海华岭集成电路技术股份有限公司 | Device and method for controlling test temperature of chip to be tested |
| CN106793490A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB and its detection method of circuit abnormality are detected based on temperature fluctuation |
| CN206270369U (en) * | 2016-10-31 | 2017-06-20 | 广东利扬芯片测试股份有限公司 | A kind of fingerprint chip testing socket |
| CN107873080A (en) * | 2015-01-23 | 2018-04-03 | 三菱电机株式会社 | Instrument, semiconductor device evaluating apparatus and semiconductor device evaluation method are used in semiconductor device evaluation |
| CN207263851U (en) * | 2017-09-26 | 2018-04-20 | 颖崴科技股份有限公司 | Electronic assembly test device and its system |
| CN208313474U (en) * | 2018-07-04 | 2019-01-01 | 上海捷策创电子科技有限公司 | A kind of chip temperature measuring equipment |
| CN109991528A (en) * | 2017-12-31 | 2019-07-09 | 深迪半导体(上海)有限公司 | A kind of MEMS chip test jack and heating temp measuring method |
-
2018
- 2018-07-04 CN CN201810725012.9A patent/CN108507705B/en active Active
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5911897A (en) * | 1997-01-13 | 1999-06-15 | Micro Control Company | Temperature control for high power burn-in for integrated circuits |
| JP2004140167A (en) * | 2002-10-17 | 2004-05-13 | Dainippon Screen Mfg Co Ltd | Method of measuring temperature of substrate, and substrate heat treatment apparatus and method of correcting setting temperature therein |
| US20050189957A1 (en) * | 2004-02-27 | 2005-09-01 | Wells-Cti, Llc. An Oregon Limited Liability Company | Integrated circuit temperature sensing device and method |
| CN1704737A (en) * | 2004-05-26 | 2005-12-07 | 鸿富锦精密工业（深圳）有限公司 | Chip temperature measurement device and method |
| JP2007227444A (en) * | 2006-02-21 | 2007-09-06 | Ricoh Co Ltd | Ic test method, probe guard, test prober, and ic tester |
| JP2008171940A (en) * | 2007-01-10 | 2008-07-24 | Advics:Kk | Load driving device |
| CN102082107A (en) * | 2009-12-01 | 2011-06-01 | 中芯国际集成电路制造(上海)有限公司 | Method and device for measuring temperature of chip |
| CN201853148U (en) * | 2010-11-10 | 2011-06-01 | 中国电子科技集团公司第十四研究所 | High-reliability moralized chip temperature control device |
| CN103344347A (en) * | 2013-05-23 | 2013-10-09 | 常州瑞华电力电子器件有限公司 | Power semiconductor module for measuring chip temperature conveniently |
| TW201629510A (en) * | 2014-10-23 | 2016-08-16 | Murata Manufacturing Co | Electronic component test device |
| CN107873080A (en) * | 2015-01-23 | 2018-04-03 | 三菱电机株式会社 | Instrument, semiconductor device evaluating apparatus and semiconductor device evaluation method are used in semiconductor device evaluation |
| CN106291302A (en) * | 2015-06-23 | 2017-01-04 | 三菱电机株式会社 | Contact probe type temperature detector, the evaluating apparatus of semiconductor device and the evaluation methodology of semiconductor device |
| CN205139319U (en) * | 2015-11-27 | 2016-04-06 | 法特迪精密科技（苏州）有限公司 | Heavy current semiconductor test seat |
| CN205861226U (en) * | 2016-08-12 | 2017-01-04 | 泰科电子(上海)有限公司 | Temperature measuring equipment, electric appliance component and battery bag |
| CN106371001A (en) * | 2016-09-27 | 2017-02-01 | 上海华岭集成电路技术股份有限公司 | Device and method for controlling test temperature of chip to be tested |
| CN206270369U (en) * | 2016-10-31 | 2017-06-20 | 广东利扬芯片测试股份有限公司 | A kind of fingerprint chip testing socket |
| CN106793490A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB and its detection method of circuit abnormality are detected based on temperature fluctuation |
| CN207263851U (en) * | 2017-09-26 | 2018-04-20 | 颖崴科技股份有限公司 | Electronic assembly test device and its system |
| CN109991528A (en) * | 2017-12-31 | 2019-07-09 | 深迪半导体(上海)有限公司 | A kind of MEMS chip test jack and heating temp measuring method |
| CN208313474U (en) * | 2018-07-04 | 2019-01-01 | 上海捷策创电子科技有限公司 | A kind of chip temperature measuring equipment |
Non-Patent Citations (2)
| Title |
|---|
| 李梦琳;郑东飞;: "三维叠层模块温度监测及故障分析技术", 电子技术应用, no. 01, 18 January 2017 (2017-01-18) * |
| 杨宝生等: "高速芯片温度检测技术研究与应用", 仪表技术与传感器, no. 02, 28 February 2006 (2006-02-28) * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109459683A (en) * | 2018-12-26 | 2019-03-12 | 上海捷策创电子科技有限公司 | A kind of apparatus for testing chip |
| CN111951877A (en) * | 2019-05-16 | 2020-11-17 | 第一检测有限公司 | Detection device |
| CN115808613A (en) * | 2023-01-17 | 2023-03-17 | 天芯电子科技(南京)有限公司 | Chip heat dissipation test seat with heat measurement function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108507705B (en) | 2024-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108507705A (en) | A kind of chip temperature measuring equipment | |
| CN104613844B (en) | Thickness measuring device | |
| TW200903705A (en) | Fixing device of probe card | |
| CN107345986B (en) | Impedance testing method in de-embedding mode | |
| CN109737911A (en) | A kind of calibration tool, blind-mating connector interworking gap measuring device and method | |
| US20140327462A1 (en) | Test socket providing mechanical stabilization for pogo pin connections | |
| CN105092910B (en) | The arrangements of electric connection measured for electronic transport | |
| CN208313474U (en) | A kind of chip temperature measuring equipment | |
| CN108107237A (en) | The SATA signal testings gauge and test method of a kind of Slimline interfaces | |
| CN205262470U (en) | Electron grade rod | |
| CN210348628U (en) | Simple structure can real time monitoring show machine of getting rice of rice surplus | |
| CN208097326U (en) | A kind of student's long-jump detector | |
| CN218329728U (en) | Parallelism detection device between guide rails | |
| EP2866037A1 (en) | Releaseable probe connection | |
| CN208607300U (en) | Micro electronmechanical attitude measurement element batch-testing device | |
| CN213302274U (en) | Multi-angle test fixture for electromagnetic emission of integrated circuit | |
| CN205643569U (en) | Device of test cell -phone card signal | |
| CN212111534U (en) | Probe device of buckling | |
| CN209182370U (en) | Through silicon via channel measuring apparatus | |
| CN210487806U (en) | One-stop electric testing tool for multifunctional testing of composite battery busbar | |
| CN205809200U (en) | Portable information lane testing instrument | |
| CN103455400A (en) | Method for testing SMI2 (intel scalable memory interface 2) signals of internal memory | |
| JP2018189458A (en) | Electric connection device and method for manufacturing the same | |
| CN208547302U (en) | A kind of electronic joint external detection detection device | |
| CN102353467B (en) | System and method for verifying detection accuracy of internal core temperature of chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |