CN208607300U - Micro electronmechanical attitude measurement element batch-testing device - Google Patents
Micro electronmechanical attitude measurement element batch-testing device Download PDFInfo
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- CN208607300U CN208607300U CN201821375484.8U CN201821375484U CN208607300U CN 208607300 U CN208607300 U CN 208607300U CN 201821375484 U CN201821375484 U CN 201821375484U CN 208607300 U CN208607300 U CN 208607300U
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Abstract
The micro electronmechanical attitude measurement element batch-testing device of the utility model is related to inspection device for components, in order to overcome the problems, such as micro electronmechanical attitude measurement element can not batch testing, including component fixture further includes circuit connecting plate；Component fixture includes parallel circuit connecting plate layer and detected element layer, and circuit connecting plate layer and detected element layer are fixed；Multiple circuit connecting plate caulking grooves are distributed on circuit connecting plate layer, multiple detected element caulking grooves are distributed on detected element layer；Circuit connecting plate corresponds in embedded circuit connecting plate caulking groove；Power spring needle is equipped on each circuit connecting plate, the fixing end of telescopic end towards the corresponding detected element caulking groove, power spring needle of power spring needle is fixed on circuit connecting plate to be electrically connected with element debugging apparatus；Detected element caulking groove is for being embedded in detected element.The utility model can be realized with high efficiency, high reliability to the batch testing function of micro electronmechanical attitude measurement element, and unnecessary damage, strong applicability are avoided.
Description
Technical field
The utility model relates to inspection device for components, and in particular to the device of element batch detection is carried out using fixture.
Background technique
At this stage, micro electronmechanical attitude measurement element has been widely used various fields, with the continuous development of technology and progressive,
The demand of micro electronmechanical attitude measurement element is continuously increased.
Micro electronmechanical attitude measurement element before use, is needed through a series of test and calibration process after fabrication, right
Its constant error compensates, and realizes the purpose for improving measurement accuracy.But the test of micro electronmechanical attitude measurement element at this stage
And calibration, still based on manually testing, this test mode once can only be tested and be demarcated to an element, required
Time is longer, and precision is lower.This test mode efficiency is too low, micro electronmechanical attitude measurement member increasingly increased for demand
Part is unsatisfactory.And based on the automatic test approach having already appeared also all tested with monolithic, improved efficiency is not obvious.Often now
The test method seen increases the production cost of micro electronmechanical attitude measurement element, and has not been able to the element for effectively detecting and demarcating,
There may be hidden danger in use, increase use cost.
And higher cost needed for most methods, the micro electronmechanical attitude measurement element relatively low for single manufacturing cost,
Its universal difficulty is larger.
Summary of the invention
The purpose of this utility model is to overcome micro electronmechanical attitude measurement element can not batch testing the problem of, provide
A kind of micro electronmechanical attitude measurement element batch-testing device.
The micro electronmechanical attitude measurement element batch-testing device of the utility model, including component fixture further include that circuit connects
Fishplate bar；
Component fixture includes parallel circuit connecting plate layer and detected element layer, and circuit connecting plate layer and detected element layer are solid
It is fixed；
Multiple circuit connecting plate caulking grooves are distributed on circuit connecting plate layer, multiple detected elements are distributed on detected element layer
The position of caulking groove, circuit connecting plate caulking groove and detected element caulking groove is corresponding and quantity is equal；
The quantity of circuit connecting plate is less than or equal to the quantity of circuit connecting plate caulking groove and circuit connecting plate corresponds insertion
In circuit connecting plate caulking groove；Power spring needle is equipped on each circuit connecting plate, the telescopic end direction of power spring needle is corresponding
Detected element caulking groove, power spring needle fixing end be fixed on circuit connecting plate and element debugging apparatus be electrically connected；
Detected element caulking groove is used to be embedded in detected element, the pin of detected element is enabled to debug by power spring needle and element
Device electrical connection.
The beneficial effects of the utility model are: the present apparatus can be realized with high efficiency, high reliability to micro electronmechanical attitude measurement
The batch testing function of element can be widely applied to need to carry out on the micro electronmechanical attitude measurement element of batch testing, have
Following advantages:
(1) it is connect using power spring needle contact connection type with detected element, it is unnecessary to detected element to avoid
Damage；
(2) structure design is relatively easy, and circuit connecting plate is simple for structure and is easily changed, and uses in test process simply,
Strong applicability；
(3) overall plan is simple, and the batch of various sizes of micro electronmechanical attitude measurement element and different number is surveyed
Examination need to be only finely adjusted, so that it may realize that the same purpose for improving testing efficiency, efficiency improve at least 100%.
On the whole, present apparatus design structure is simple, and circuit design is succinct, high reliablity, is easy to be mass produced, and is suitble to
It is widely applied, and there is preferable universality for the micro electronmechanical attitude measurement element of different size specification, it can be in the short time
It is interior to realize the purpose for improving micro electronmechanical attitude measurement element test efficiency.
Detailed description of the invention
Fig. 1 is the general structure schematic diagram of the micro electronmechanical attitude measurement element batch-testing device of the utility model；
Fig. 2 is that the structure of the circuit connecting plate layer of the micro electronmechanical attitude measurement element batch-testing device of the utility model is shown
It is intended to；
Fig. 3 is the structural representation of the detected element layer of the micro electronmechanical attitude measurement element batch-testing device of the utility model
Figure；
Fig. 4 is the structural representation of the conductor layer of the micro electronmechanical attitude measurement element batch-testing device of the utility model
Figure；
Fig. 5 is the structural representation of the spring needle layer of the micro electronmechanical attitude measurement element batch-testing device of the utility model
Figure；
Fig. 6 is the structural schematic diagram of the upper cover plate of the micro electronmechanical attitude measurement element batch-testing device of the utility model；
Fig. 7 be the utility model micro electronmechanical attitude measurement element batch-testing device do not include circuit connecting plate group
Assembling structure schematic diagram；
Fig. 8 is the structural representation of the circuit connecting plate of the micro electronmechanical attitude measurement element batch-testing device of the utility model
Figure；
Fig. 9 is the circuit connecting plate and circuit connection of the micro electronmechanical attitude measurement element batch-testing device of the utility model
The fit structure schematic diagram of plate layer；
Figure 10 is the mounting structure of the test cable of the micro electronmechanical attitude measurement element batch-testing device of the utility model
Schematic diagram；
Figure 11 is the back knot of the circuit connecting plate of the micro electronmechanical attitude measurement element batch-testing device of the utility model
Structure schematic diagram；
Figure 12 is the detected element layer of the micro electronmechanical attitude measurement element batch-testing device of the utility model and is tested first
The assembly structure diagram of part.
Specific embodiment
Specific embodiment one
The micro electronmechanical attitude measurement element batch-testing device of the utility model, including component fixture 1 and circuit connecting plate
2；
Component fixture 1 includes parallel circuit connecting plate layer 3 and detected element layer 4, circuit connecting plate layer 3 and detected element
Layer 4 fixation and have interval, should between be divided into power spring needle 7 fixing end length；
Multiple circuit connecting plate caulking grooves 5 are distributed on circuit connecting plate layer 3, are distributed on detected element layer 4 multiple tested
Element caulking groove 6, circuit connecting plate caulking groove 5 is corresponding with the position of detected element caulking groove 6 and quantity is equal；
The main purpose of circuit connecting plate layer 3 is the fixed function realized to circuit connecting plate 2, the laminate with a thickness of
3mm is identical as the thickness of circuit connecting plate 2.Because as shown in Fig. 2, component fixture 1 can be used to realize to 16 identical types
Micro electronmechanical measuring cell batch testing, therefore reserved circuit connecting plate caulking groove 5, size in the circuit connecting plate layer 3
Size is identical as circuit connecting plate 2, and circuit connecting plate 2, which is sequentially placed into, (can not all be put into, determine number as needed
Amount) fixed purpose to circuit connecting plate 2 can be realized in circuit connecting plate caulking groove 5.
The quantity of circuit connecting plate 2 is less than or equal to the quantity of circuit connecting plate caulking groove 5 and circuit connecting plate 2 corresponds
In embedded circuit connecting plate caulking groove 5；The conduction equal with the pin number of detected element 10 is equipped on each circuit connecting plate 2
The fixing end of spring needle 7, telescopic end towards corresponding detected element caulking groove 6, the power spring needle 7 of power spring needle 7 is fixed on
It is electrically connected on circuit connecting plate 2 with element debugging apparatus；
In the present apparatus, detected element 10 refers to micro electronmechanical attitude measurement element, in the present apparatus, has 16 with measurement and draws
For the micro electronmechanical attitude measurement element of foot.
Power spring needle 7 is column, and " syringe needle " with resilientiy stretchable is telescopic end above, columnar non-telescoping
Part is fixing end.
The design of circuit connecting plate 2 mainly avoids detected element 10 from damaging in measurement process, and guarantees entire
It is measured being bonded for element in test process, has both ensured that the electrical stability of detected element 10 and data transmission are stablized
Property.
The circuit connecting plate 2 using power spring needle 7 as the fastening means with detected element 10, in use, only need by
The contact of detected element 10 is pressed on power spring needle 7, so that it may realize the purpose of electrical connection, it in this way both can be with
Ensure the reliability that detected element 10 connects, in turn avoids impacting the contact etc. of detected element 10, while this method
It no longer needs to handle detected element 10.
The main function of circuit connecting plate 2 is will to test cable 12 to be electrically connected with detected element 10, and make tested member
The loss of part 10 during the test is preferably minimized.As shown in Fig. 8, Fig. 9 and Figure 11, it is assumed that the detected element 10 tested is total
There are 16 pins, by circuit connecting plate 2, pin can all be drawn, facilitate the wiring and debugging in test, circuit connects
The circuit design of fishplate bar is simple, low in cost, by the Lossless join mode of circuit connecting plate 2, so that the survey of detected element 10
Trying cost reduces, while also ensuring the reliability in use of detected element 10.
Traditional 10 connection type of detected element is mostly welding manner, by the way that corresponding wire rod is welded in 10 phase of detected element
On the contact answered, although this method can guarantee the stability of connection, detected element 10 can be caused a degree of
Damage, and for detected element 10, because the reasons such as individual difference of its specific chip, need before factory to each element
Corresponding calibration and test are all carried out, at this point, seeming excessively cumbersome by welding manner connection, and certain journey can be caused to element
The damage of degree.
As shown in Fig. 3, Fig. 7 and Figure 11, the detected element caulking groove 6 in detected element layer 4 is for being embedded in detected element 10, enabling
The pin of detected element 10 is electrically connected by power spring needle 7 and element debugging apparatus.Detected element layer 4, can with a thickness of 4mm
To fix 16 identical type detected elements 10 simultaneously, and keep the power spring needle 7 of its contact and circuit connecting plate 2 electrical one by one
Connection, the thickness of the detected element layer 4 in view of the thickness of detected element 10 and the collapsing length of power spring needle 7, therefore its
Thickness is slightly larger than 10 thickness of detected element.
Specific embodiment two
Present embodiment two and the difference of specific embodiment one are, as shown in Fig. 1, Fig. 4, Fig. 7 and Figure 10, member
Part fixture 1 is fixed with conductor layer 8 in the lateral surface of circuit connecting plate layer 3, which is equipped with a plurality of wiring channel 9 and leads
The side openings of line layer 8 are connected to conducting wire outlet 11 by wiring channel 9 as conducting wire outlet 11, a plurality of wiring channel 9；
A plurality of wiring channel 9 is corresponding with the position of circuit connecting plate caulking groove 5 and quantity is equal, and in order to save space,
Communication conductive wire outlet 11. after wiring channel 9 can be converged at finally together
Test cable 12 is placed in wiring channel 9, test 12 one end of cable passes through each wiring channel 9 and corresponding circuit
The electrical connection of connecting plate 2, the other end extend 1 outside of component fixture by conducting wire outlet 11 and electrically connect with element debugging apparatus
It connects.
As shown in Fig. 8, Fig. 9 and Figure 11, there is contact at 2 back side of circuit connecting plate, by the wiring of PCB circuit board with it is positive
The fixing end of power spring needle 7 is electrically connected, and as shown in Figure 10, the interior and circuit that test cable 12 is located at each wiring channel 9 connects
The position of fishplate bar caulking groove 5 also is provided with the contact of identical quantity, for having contact electrical connection with 2 back side of circuit connecting plate, thus
Achieve the purpose that transmit data and power supply.
Conductor layer 8, can be to test cable 12 used in batch testing by the design of the conductor layer 8 with a thickness of 10mm
It is arranged.It is that test cable 12 needed for each detected element 10 has reserved corresponding cloth in the conductor layer 8 of component fixture 1
Line passage 9 draws test cable 12 used in test process by the opening i.e. extraction wire of 8 side of conductor layer
Mouth 11, convenient for being used in three-axle table is tested.
The mode of present apparatus selection Multi-serial port data acquisition carries out data acquisition, and it is defeated with Transistor-Transistor Logic level mode to be tested element
Out, can be by being converted to RS232 interface mode by the conversion circuit that master chip designs of MAX3232 chip, then pass through RS232
Turn USB line to connect with element debugging apparatus (computer etc.), to realize that data acquire, in this way, reduces batch and survey
The cost of examination increases the reliability of test.By Multi-serial port data acquisition modes, the upper limit of batch testing quantity is increased,
Under the premise of having Reliability Assurance, the testing efficiency of detected element 10 is sufficiently improved.
Specific embodiment three
Present embodiment three and the difference of specific embodiment one or two be, circuit connecting plate layer 3 and tested member
Spring needle layer 13 is fixed between part layer 4, which is equipped with spring needle insertion groove 14, power spring needle 7 is located at bullet
In spring needle insertion groove 14, and the thickness of spring needle insertion groove 14 is more than or equal to the length of the fixing end of power spring needle 7.
As shown in figure 5 and figure 7, spring needle layer 13 be mainly used for a thickness of 2mm offset the fixing end of power spring needle 7
Highly.
Specific embodiment four
The difference of present embodiment four and specific embodiment three is that component fixture 1 further includes upper cover plate 15, on this
Cover board 15 is fixed on the outer surface of detected element layer 4.
As shown in Figure 6 and Figure 7, the upper cover plate of the component fixture 1 of the present apparatus is for providing a point pressure, it can be ensured that tested
Element 10 is securely connect with power spring needle 7, while ensuring that the position of detected element 10 immobilizes, to guarantee detected element
Correctness and stability in 10 calibration and measurement process.
Specific embodiment five
Present embodiment five and the difference of specific embodiment one are that the conducting wire tested in cable 12 includes power supply
Line and data transmit-receive line, during the batch testing of detected element 10 for need wire rod to be used mainly have power supply line (+5V or
Other voltages, GND) and data transmit-receive line two parts.
Claims (5)
1. micro electronmechanical attitude measurement element batch-testing device, including component fixture (1), which is characterized in that further include that circuit connects
Fishplate bar (2)；
Component fixture (1) includes parallel circuit connecting plate layer (3) and detected element layer (4), circuit connecting plate layer (3) and tested
Element layer (4) is fixed；
Multiple circuit connecting plate caulking grooves (5) are distributed on circuit connecting plate layer (3), multiple quilts are distributed on (4) in detected element layer
It surveys element caulking groove (6), circuit connecting plate caulking groove (5) is corresponding with the position of detected element caulking groove (6) and quantity is equal；
The quantity of circuit connecting plate (2) is less than or equal to the quantity of circuit connecting plate caulking groove (5) and circuit connecting plate (2) one is a pair of
It answers in embedded circuit connecting plate caulking groove (5)；Power spring needle (7), power spring needle are equipped on each circuit connecting plate (2)
(7) fixing end of telescopic end towards corresponding detected element caulking groove (6), power spring needle (7) is fixed on circuit connecting plate (2)
Upper and element debugging apparatus is electrically connected；
Detected element caulking groove (6) is used to be embedded in detected element (10), the pin of detected element (10) is enabled to pass through power spring needle (7)
It is electrically connected with element debugging apparatus.
2. micro electronmechanical attitude measurement element batch-testing device according to claim 1, which is characterized in that component fixture
(1) conductor layer (8) are fixed in the lateral surface of circuit connecting plate layer (3), the conductor layer (8) be equipped with a plurality of wiring channel (9),
And the side openings of conductor layer (8), as conducting wire outlet (11), a plurality of wiring channel (9) is connected to by wiring channel (9)
Conducting wire outlet (11)；
A plurality of wiring channel (9) is corresponding with the position of circuit connecting plate caulking groove (5) and quantity is equal；
Is placed with test cable (12) in wiring channel (9), test cable (12) one end by each wiring channel (9) with it is corresponding
Circuit connecting plate (2) electrical connection, the other end extend component fixture (1) outside by conducting wire outlet (11) and debug with element
Device electrical connection.
3. micro electronmechanical attitude measurement element batch-testing device according to claim 1 or 2, which is characterized in that circuit connects
Spring needle layer (13) are fixed between fishplate bar layer (3) and detected element layer (4), which is inserted into equipped with spring needle
Slot (14), power spring needle (7) are located in spring needle insertion groove (14), and the thickness of spring needle insertion groove (14) be more than or equal to lead
The length of the fixing end of electrical spring needle (7).
4. micro electronmechanical attitude measurement element batch-testing device according to claim 3, which is characterized in that component fixture
It (1) further include upper cover plate (15), which is fixed on the outer surface of detected element layer (4).
5. micro electronmechanical attitude measurement element batch-testing device according to claim 1, which is characterized in that test cable
(12) conducting wire in includes power supply line and data transmit-receive line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821375484.8U CN208607300U (en) | 2018-08-24 | 2018-08-24 | Micro electronmechanical attitude measurement element batch-testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821375484.8U CN208607300U (en) | 2018-08-24 | 2018-08-24 | Micro electronmechanical attitude measurement element batch-testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208607300U true CN208607300U (en) | 2019-03-15 |
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ID=65679536
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821375484.8U Active CN208607300U (en) | 2018-08-24 | 2018-08-24 | Micro electronmechanical attitude measurement element batch-testing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110672120A (en) * | 2019-09-09 | 2020-01-10 | 武汉元生创新科技有限公司 | Device calibration device |
-
2018
- 2018-08-24 CN CN201821375484.8U patent/CN208607300U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110672120A (en) * | 2019-09-09 | 2020-01-10 | 武汉元生创新科技有限公司 | Device calibration device |
| CN110672120B (en) * | 2019-09-09 | 2021-04-27 | 武汉元生创新科技有限公司 | Device calibration device |
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