CN208352559U - A kind of test winding displacement - Google Patents
A kind of test winding displacement Download PDFInfo
- Publication number
- CN208352559U CN208352559U CN201820705364.3U CN201820705364U CN208352559U CN 208352559 U CN208352559 U CN 208352559U CN 201820705364 U CN201820705364 U CN 201820705364U CN 208352559 U CN208352559 U CN 208352559U
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- connector
- substrate
- test
- winding displacement
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Abstract
The utility model discloses a kind of test winding displacements, comprising: substrate；The first end of the substrate is arranged in first connector, for connecting module to be tested；The second end of the substrate is arranged in, for connecting electronic equipment in second connector；The first end of the substrate is arranged in multiple test points, and the first end of each test point is connect by signal wire with first connector, and the second end of each test point is connect by signal wire with second connector.Due to by test point all concentrated settings test winding displacement first end, so, when treating test module and being tested, signal acquisition is more convenient, and the decaying of collected signal is smaller, is conducive to the accuracy rate for improving test, improves except wrong effect.
Description
Technical field
The utility model relates to electronic technology field more particularly to a kind of test winding displacements.
Background technique
In general, be provided on cell phone mainboard multiple modules (such as: camera module, display panel module, fingerprint module,
Etc.), if a certain module there is a problem, may can not work normally.
Test winding displacement can well test these modules, and the one end for testing winding displacement can connect with module to be tested
It connects, the other end is connect with cell phone mainboard, and multiple test points are provided on test winding displacement, and tester can be in these tests
The signal of each pin in module to be tested is collected on point, and test module is treated with this and is tested.
But test winding displacement in the prior art, test point are distributed on entire substrate, test point distribution relatively disperses,
Cause signal acquisition inconvenient, and signal decaying is larger, influences test accuracy rate and except wrong effect.
Utility model content
The embodiment of the present application solves test winding displacement in the prior art, there are signals by providing a kind of test winding displacement
The technical issues of acquisition is inconvenient, and signal decaying is larger, influences test accuracy rate and removes wrong effect.
The application is provided the following technical solutions by the embodiment of the application:
A kind of test winding displacement, comprising:
Substrate；
The first end of the substrate is arranged in first connector, for connecting module to be tested；
The second end of the substrate is arranged in, for connecting electronic equipment in second connector；
The first end of the substrate is arranged in multiple test points, and the first end of each test point passes through signal wire
It is connect with first connector, the second end of each test point is connect by signal wire with second connector.
Preferably, the substrate is specially flexible circuit board.
Preferably, the test point is arranged on the first face and/or the second face of the first end of the substrate.
Preferably, the width of the first end of the substrate is specially 4mm~5mm.
Preferably, the length of the substrate is specially 20mm~40mm.
Preferably, first connector is specially the female of BTB connector, and second connector is specially that BTB connects
Connect the male connector of device.
Preferably, a connector is specially the female of ZIF connector, and second connector is specially ZIF connection
The male connector of device.
Preferably, the first end of the substrate is arranged in the multiple test point point two rows.
Preferably, the width of the second end of the substrate is less than the width of the first end of the substrate.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
In the embodiment of the present application, a kind of test winding displacement is disclosed, comprising: substrate；First connector is arranged in the base
The first end of plate, for connecting module to be tested；The second end of the substrate is arranged in, for connecting electronics in second connector
Equipment；The first end of the substrate is arranged in multiple test points, and the first end of each test point passes through signal wire and institute
The connection of the first connector is stated, the second end of each test point is connect by signal wire with second connector.Due to inciting somebody to action
Test point all concentrated settings test winding displacement first end, so, when treating test module and being tested, signal acquisition is more
It is convenient, and the decaying of collected signal is smaller, to be conducive to improve the accuracy rate of test, improves except wrong effect.
Detailed description of the invention
It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is some implementations of the utility model
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the Facad structure figure of the test winding displacement in the embodiment of the present application；
Fig. 2 is the inverse layer structure figure of the test winding displacement in the embodiment of the present application；
Fig. 3 is the internal wiring figure of the test winding displacement in the embodiment of the present application.
Specific embodiment
The embodiment of the present application solves test winding displacement in the prior art, there are signals by providing a kind of test winding displacement
The technical issues of acquisition is inconvenient, and signal decaying is larger, influences test accuracy rate and removes wrong effect.
In order to better understand the technical solution of the utility model, below in conjunction with Figure of description and specific implementation
Technical solutions of the utility model are described in detail in mode.
Illustrate first, herein presented term "and/or", only a kind of incidence relation for describing affiliated partner, table
Show there may be three kinds of relationships, for example, A and/or B, can indicate: individualism A exists simultaneously A and B, individualism B this three
Kind situation.In addition, character "/" herein, typicallys represent the relationship that forward-backward correlation object is a kind of "or".
A kind of test winding displacement is present embodiments provided, as shown in Figure 1, comprising:
Substrate 100, substrate 100 include both ends (that is: first end 110 and second end 120)；
First connector 111 is arranged on the first face (such as: front) of the first end 110 of substrate 100, for connecting
Module to be tested 200 (such as: camera module to be tested, display panel module, fingerprint module, etc.)；
Second connector 121 is arranged on the second face (such as: the back side) of the second end 120 of substrate 100, for connecting
The mainboard of electronic equipment (such as: mobile phone or tablet computer or smart television or digital camera, etc.), as shown in Figure 2；
The first end 110 of substrate 100 is arranged in multiple test points 112, and the first end 1121 of each test point 112 is logical
It crosses signal wire 113 to connect with the first connector 111, the second end 1122 of each test point 112 is connected by signal wire 113 and second
Connector 121 connects, as shown in Figure 3.
In the specific implementation process, the first connector 111 for connect module to be tested 200 (such as: camera shooting to be tested
Head module, display panel module, fingerprint module, etc.), wherein each pin of module 200 to be tested can be connect with first
First 111 be correspondingly connected with a little is connected.
In the specific implementation process, in the first face of the first end 110 of substrate 100 (such as: front) and/or the second face
Multiple test points are provided on (such as: the back side), these test points 112 divide two rows of (or three rows) concentrated settings.Each test point
It again include two endpoints (that is: first end 1121 and second end 1122), wherein the first end 1121 of each test point 112 is divided
It is not connected with a tie point on the first connector 111, corresponding second end 1122 is corresponding on the second connector 121
Tie point is connected.The first end 1121 of test point 112 is connected with second end 1122 with conducting wire, the first connector can be made
A corresponding tie point is connected to tie point corresponding on the second connector 121 on 111.
Herein, two endpoints (that is: first end 1121 and second end 1122) are arranged in each test point 112, can be convenient
Ground connects ammeter or the measuring instruments such as voltmeter or oscillograph, so that the signal acquired in every signal line is (same: to be tested
Signal on each pin of module), and test module 200 is treated based on collected signal and is tested.
Herein, by 112 centralized arrangement of pilot to be measured in the first end 110 of substrate 100, in this way, signal acquisition is more square
Just, and the decaying of collected signal is smaller, thus guarantee that more accurate signal can be collected in test point 112, thus
The accuracy rate for being conducive to improve test is improved except wrong (Debug) effect.
It in the specific implementation process, can be in the first face (such as: front) of the first end 110 of substrate 100 and the second face
Test point 112 is all set on (such as: the back side), in this way, tester can select from first end 110 according to the actual situation
Signal is acquired on first face or the second face, to keep test process more convenient.
As a kind of optional embodiment, substrate 100 is specially FPC (Flexible Printed Circuit, flexible electrical
Road plate), in this way, convenient for tester (or bending) can be bent to substrate 100 according to the actual situation.Also, due to
Any test point 112 is not provided in the second end 120 of substrate 100, therefore, can the second end 120 to substrate 100 carry out more preferably
Ground bending (or bending), so that substrate 100 can be fully seated in the shell of electronic equipment, the electronics that will not influence is set
Standby shell fastens.
As a kind of optional embodiment, the width of the first end 110 of substrate 100 be specially 4mm~5mm (such as: 4mm,
Or 4.5mm or 5mm, etc.), the first end 110 for dividing two rows of or three rows that substrate 100 is set test point 112, compared to
Test winding displacement in the prior art, it is provided in this embodiment test winding displacement first end 110 width it is shorter, also, due to
Any test point 112 is not provided in the second end 120 of substrate 100, it can be by the width of the second end 120 of substrate 100 is further
It reduces, so that being conducive to winding displacement is applicable in more different electronic equipments.In the present embodiment, the width of the second end 120 of substrate 100
Less than 110 width of first end of substrate 100.
As a kind of optional embodiment, the length of substrate 100 (that is: the first end 110 and second end 120 of substrate 100
Total length) it is specially 20mm~40mm (such as: 20mm or 25mm or 30mm or 35mm or 40mm, etc.), compared to existing
There is the test winding displacement in technology, the length of the substrate 100 of test winding displacement provided in this embodiment is shorter, so that test point
Signal decaying on 112 is smaller, to guarantee that more accurate signal can be collected in test point 112, to be conducive to
The accuracy rate of test is improved, is improved except wrong effect.
As a kind of optional embodiment, the first connector 111 is specially the female (or male connector) of terminal connector, and second
Connector 121 is specially the male connector (or female) of terminal connector.
For example, the first connector 111 is specially that BTB (Branch Target Buffer, board to board connector) connects
The female of device is connect, the second connector 121 is specially the male connector of BTB connector.
For example, the first connector 111 is specially that ZIF (Zero Insertion Force, zero insertion force socket) connects
The female (or male connector) of device is connect, the second connector 121 is specially the male connector (or female) of ZIF connector.
Technical solution in above-mentioned the embodiment of the present application, at least have the following technical effects or advantages:
In the embodiment of the present application, a kind of test winding displacement is disclosed, comprising: substrate；First connector, is arranged in substrate
First end, for connecting module to be tested；The second end of substrate is arranged in, for connecting electronic equipment in second connector；It is multiple
The first end of substrate is arranged in test point, and the first end of each test point is connect by signal wire with the first connector, each
The second end of test point is connect by signal wire with the second connector.Due to by test point all concentrated settings the of test winding displacement
One end, so, when treating test module and being tested, signal acquisition is more convenient, and the decaying of collected signal is smaller, from
And be conducive to improve the accuracy rate of test, it improves except wrong effect.
Although the preferred embodiment of the utility model has been described, once a person skilled in the art knows basic
Creative concept, then additional changes and modifications may be made to these embodiments.It is wrapped so the following claims are intended to be interpreted as
It includes preferred embodiment and falls into all change and modification of the scope of the utility model.
Obviously, it is practical without departing from this can to carry out various modification and variations to the utility model by those skilled in the art
Novel spirit and scope.If in this way, these modifications and variations of the present invention belong to the utility model claims and
Within the scope of its equivalent technologies, then the utility model is also intended to include these modifications and variations.
Claims (9)
1. a kind of test winding displacement characterized by comprising
Substrate；
The first end of the substrate is arranged in first connector, for connecting module to be tested；
The second end of the substrate is arranged in, for connecting electronic equipment in second connector；
The first end of the substrate is arranged in multiple test points, and the first end of each test point passes through signal wire and institute
The connection of the first connector is stated, the second end of each test point is connect by signal wire with second connector.
2. test winding displacement as described in claim 1, which is characterized in that the substrate is specially flexible circuit board.
3. test winding displacement as described in claim 1, which is characterized in that the first end of the substrate is arranged in the test point
On first face and/or the second face.
4. as described in claim 1 test winding displacement, which is characterized in that the width of the first end of the substrate be specially 4mm~
5mm。
5. test winding displacement as described in claim 1, which is characterized in that the length of the substrate is specially 20mm~40mm.
6. the test winding displacement as described in Claims 1 to 5 is any, which is characterized in that first connector is specially BTB connection
The female of device, second connector are specially the male connector of BTB connector.
7. the test winding displacement as described in Claims 1 to 5 is any, which is characterized in that a connector is specially ZIF connector
Female, second connector is specially the male connector of ZIF connector.
8. test winding displacement as described in claim 1, which is characterized in that the multiple test point point is two rows of to be arranged in the substrate
First end.
9. test winding displacement as described in claim 1, which is characterized in that the width of the second end of the substrate is less than the substrate
First end width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820705364.3U CN208352559U (en) | 2018-05-11 | 2018-05-11 | A kind of test winding displacement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820705364.3U CN208352559U (en) | 2018-05-11 | 2018-05-11 | A kind of test winding displacement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208352559U true CN208352559U (en) | 2019-01-08 |
Family
ID=64889096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820705364.3U Expired - Fee Related CN208352559U (en) | 2018-05-11 | 2018-05-11 | A kind of test winding displacement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208352559U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110380273A (en) * | 2019-07-24 | 2019-10-25 | 维沃移动通信有限公司 | A kind of circuit board assemblies and terminal device |
-
2018
- 2018-05-11 CN CN201820705364.3U patent/CN208352559U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110380273A (en) * | 2019-07-24 | 2019-10-25 | 维沃移动通信有限公司 | A kind of circuit board assemblies and terminal device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190108 Termination date: 20200511 |
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| CF01 | Termination of patent right due to non-payment of annual fee |