CN209859935U - High-precision carrier plate device integrated with needle plate structure - Google Patents
High-precision carrier plate device integrated with needle plate structure Download PDFInfo
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- CN209859935U CN209859935U CN201920993060.6U CN201920993060U CN209859935U CN 209859935 U CN209859935 U CN 209859935U CN 201920993060 U CN201920993060 U CN 201920993060U CN 209859935 U CN209859935 U CN 209859935U
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Abstract
The utility model aims at providing a simple structure, practicality are strong, the measuring accuracy is high and can be applicable to the high accuracy support plate device of the faller structure of blending into of the little chip product test of pinpoint distance. The utility model discloses a base and adaptation are installed locating component on the base, be equipped with movable chamber on the base and locate the faller subassembly of activity intracavity, locating component is last to be equipped with constant head tank and sliding fit and is in locating component is last ejector pad, locating component's inside is equipped with the cooperation and sets up the support plate of faller subassembly top, the ejector pad with the support plate all with the constant head tank cooperatees and sets up. The utility model discloses be applied to the technical field of chip test.
Description
Technical Field
The utility model relates to a support plate structure, in particular to high accuracy support plate device that incorporates faller structure.
Background
In the chip manufacturing process, the chip needs to be tested, and in the test of the small-size chip, because the pin point distance of the small-size chip is small, the alignment of the small-size chip is difficult to control, the manual test is generally adopted, the test efficiency is low, and the rework rate is high; although there are chip testing devices, the structure is complex, the volume is large and the testing of the chip with small pin point distance cannot be accurately completed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that overcome prior art not enough, provide a simple structure, practicality are strong, the measuring accuracy is high and can be applicable to the high accuracy support plate device of the faller structure of blending into of the little chip product test of pinpoint distance.
The utility model adopts the technical proposal that: the utility model discloses a base and adaptation are installed locating component on the base, be equipped with movable chamber on the base and locate the faller subassembly of activity intracavity, locating component is last to be equipped with constant head tank and sliding fit and is in locating component is last ejector pad, locating component's inside is equipped with the cooperation and sets up the support plate of faller subassembly top, the ejector pad with the support plate all with the constant head tank cooperatees and sets up.
By the above technical scheme, it is obvious, through promoting the ejector pad, make with the spring that the ejector pad is connected is compressed, puts the product afterwards on the constant head tank, this moment the support plate forms the support to the bottom of product, resets and then promotes through the spring the ejector pad makes the product location be in on the locating component, through the drive faller subassembly upward movement makes probe on the faller subassembly contacts with the product, and the test data via of final product faller subassembly transmits the computer to the completion test to the product, so, the utility model discloses a set up the faller structure on the support plate device, reduce occupation space and realized the test to the little chip product of pinpoint distance, this device has simple structure, low in manufacturing cost and the high characteristics of test accuracy.
According to a preferable scheme, the top of the base is provided with a plurality of guide pillars, and the bottom of the base is provided with a plurality of guide sleeves.
According to the scheme, the guide pillar and the guide sleeve are arranged for aligning with other structures, so that the structural rigidness and the test accuracy are guaranteed.
One preferred scheme is, locating component include the fixed block and with the locating piece of fixed block adaptation, be equipped with first arc on the circular arc limit of fixed block bottom, be equipped with the second arc on the circular arc limit of locating piece bottom, locating component passes through first arc with second arc threaded connection is in on the base.
It can be seen from the above scheme that the positioning assembly is in threaded connection with the base through the first arc-shaped plate and the second arc-shaped plate, namely the positioning assembly is in a detachable design and is replaced, so that positioning grooves of different sizes are adapted to corresponding chip products, and the practicability is high.
According to a preferable scheme, a sliding groove is formed in the fixing block, and the pushing block is in sliding fit with the sliding groove.
According to the scheme, the pushing block is made to reciprocate on the sliding groove by applying pushing force and pulling force to the pushing block, and the pushing block is matched with the positioning groove for limiting, so that the chip product is fixed, and the positioning effect is good.
According to a preferable scheme, a first groove is formed in the bottom of the fixing block, a second groove is formed in the bottom of the positioning block, a cavity is formed by the first groove and the second groove, the cavity is matched with the needle plate assembly, and the carrier plate is arranged on the cavity.
According to the scheme, the carrier plate is arranged on the cavity, so that the occupied space of the device is reduced, and the supporting force for the chip product is realized.
The fixed block is provided with a spring mounting groove and a fixed spring arranged on the spring mounting groove, and the fixed spring is connected with the tail end of the push block.
According to the scheme, the push block is pushed, so that the fixed spring is compressed, when a product is placed on the positioning groove, the fixed spring is reset, the fixed spring applies pushing force to the push block, and the push block fixes the product.
One preferred scheme is, the faller subassembly includes that PCB keysets, adaptation are installed faller on the PCB keysets, locate installation piece and a plurality of on the faller are all located probe on the installation piece, fixedly connected with a plurality of keysets on the bottom of PCB keysets.
According to the scheme, the pin plate component moves towards the direction of the carrier plate by applying upward thrust to the pin plate component, so that the probe is in contact with the pin point of the chip product, the test of the chip product is completed, and test data of the chip product is transmitted to a computer for analysis through the adapter pin on the PCB adapter plate.
One preferred scheme is that the PCB adapter plate is aligned with the needle plate through a plurality of positioning pins, and the PCB adapter plate is fixedly connected with the needle plate through a plurality of screws.
According to the scheme, the PCB adapter plate and the needle plate are positioned through the positioning pins and fixedly mounted through the screws, the structure is precise, and the testing accuracy is effectively guaranteed.
According to a preferable scheme, the support plate is provided with a support block and a plurality of probe holes which are all formed in the support block, the bottom of the support block is provided with a positioning groove matched with the installation block, the probe holes are communicated with the positioning groove, and the plurality of probe holes correspond to the plurality of probes one to one.
According to the scheme, when the needle plate assembly moves upwards, the probe and the mounting block move upwards along with the needle plate assembly, in the process, the mounting hole is guided and limited through the alignment groove, and the probe can accurately penetrate through the probe hole and finally contacts with a needle point of a chip product.
According to a preferable scheme, the bottom of the carrier plate is provided with a plurality of spring grooves, and the top of the needle plate is provided with a plurality of reset springs which are in one-to-one correspondence with the spring grooves.
According to the scheme, when the chip test is completed, the reset spring is arranged to provide power for resetting the needle plate assembly.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a cross-sectional view of the present invention;
fig. 3 is an exploded schematic view of the present invention;
FIG. 4 is a schematic structural diagram of the carrier plate
FIG. 5 is a schematic view of the construction of the needle board assembly;
fig. 6 is an exploded schematic view of the needle board assembly.
Detailed Description
As shown in fig. 1 to 6, in the present embodiment, the present invention comprises a base 1 and a positioning assembly 2 adapted to be mounted on the base 1, the top of the base 1 is provided with a plurality of guide posts 8, the bottom of the base 1 is provided with a plurality of guide sleeves 9, the base 1 is provided with a movable cavity 3 and a needle plate component 4 arranged in the movable cavity 3, the positioning component 2 is provided with a positioning groove 5 and a push block 6 which is in sliding fit with the positioning component 2, a carrier plate 7 which is arranged above the needle plate assembly 4 in a matching way is arranged in the positioning assembly 2, the push block 6 and the carrier plate 7 are matched with the positioning groove 5, in the design, the push block 6 is provided with a fixing groove matched with a product, the support plate 7 supports the bottom of the product, and the fixing grooves are matched with the positioning grooves 5 to fix the product.
The positioning component 2 comprises a fixed block 10 and a positioning block 11 matched with the fixed block 10, a first arc 12 is arranged on the arc edge of the bottom of the fixed block 10, a second arc 13 is arranged on the arc edge of the bottom of the positioning block 11, the positioning component 2 is in threaded connection with the base 1 through the first arc 12 and the second arc 13, a sliding groove 14 is arranged on the fixed block 10, the push block 6 is in sliding fit with the sliding groove 14, a first groove is arranged on the bottom of the fixed block 10, a second groove is arranged on the bottom of the positioning block 11, a cavity 15 is formed by the first groove and the second groove, the cavity 15 is matched with the needle plate component 4, the carrier plate 7 is arranged on the cavity 15, a spring mounting groove and a fixed spring arranged on the spring mounting groove are arranged on the fixed block 10, the fixed spring is connected with the tail end of the push block 6.
The faller subassembly 4 includes that PCB keysets 16, adaptation are installed faller 17 on the PCB keysets 16, locate installation piece 18 and a plurality of on the faller 17 are all located probe 19 on the installation piece 18, a plurality of switching needle 20 of fixedly connected with on the bottom of PCB keysets 16, PCB keysets 16 through a plurality of locating pin 21 with the faller 17 is counterpointed, and PCB keysets 16 through a plurality of screw with faller 17 fixed connection, in this design, the bottom of faller subassembly 4 is equipped with guide post and uide bushing, be used for with the promotion the power supply of faller subassembly 4 is counterpointed.
The carrier plate 7 is provided with a supporting block 22 and a plurality of probe holes 23 which are all formed in the supporting block 22, the bottom of the supporting block 22 is provided with a positioning groove 24 which is matched with the mounting block 18, the probe holes 23 are communicated with the positioning groove 24, the plurality of probe holes 23 are in one-to-one correspondence with the plurality of probes 19, and in the design, the top of the carrier plate 7 is provided with a plurality of guide pins 26 which are used for positioning with the positioning component 2.
The bottom of the carrier plate 7 is provided with a plurality of spring grooves, and the top of the needle plate 17 is provided with a plurality of reset springs 25 which are in one-to-one correspondence with the spring grooves.
The utility model discloses a theory of operation:
placing the chip product on the positioning slot 5, wherein the carrier plate 7 supports the chip product, the fixing spring is compressed, the fixing spring is reset by the fixing spring, the fixing spring applies a pushing force to the push block 6, the push block 6 slides along the sliding slot 14 in the direction of the chip product, the chip product is fixed by the fixing slot and the positioning slot 5, then the needle plate assembly 4 moves upwards along the movable cavity 3 by applying an upwards moving pushing force to the needle plate assembly 4, in the process, the mounting block 18 and the probe 19 move upwards along with the upwards movement, the reset spring 25 is compressed, the mounting block 18 is guided and limited by the alignment slot 24, so that the probe 19 can accurately pass through the probe hole 23 and finally contact with a probe point of the chip product, thereby accomplish the test, after accomplishing the test, through to push away piece 6 exerts the pulling force, make push away piece 6 keeps away from the chip product, at this moment, can take out the chip product and place the next chip product that awaits measuring, faller subassembly 4 is through the compressed reset spring 25 resets.
The utility model discloses be applied to the technical field of chip test.
Claims (10)
1. The utility model provides a high accuracy support plate device that fuses faller structure which characterized in that: it includes that base (1) and adaptation are installed locating component (2) on base (1), be equipped with movable chamber (3) on base (1) and locate faller subassembly (4) in movable chamber (3), it is in to be equipped with constant head tank (5) and sliding fit on locating component (2) ejector pad (6) on locating component (2), the inside of locating component (2) is equipped with the cooperation and sets up support plate (7) of faller subassembly (4) top, ejector pad (6) with support plate (7) all with constant head tank (5) cooperate the setting.
2. The high precision carrier board device integrated with needle board structure as claimed in claim 1, wherein: the top of the base (1) is provided with a plurality of guide pillars (8), and the bottom of the base (1) is provided with a plurality of guide sleeves (9).
3. The high precision carrier board device integrated with needle board structure as claimed in claim 1, wherein: locating component (2) including fixed block (10) and with locating piece (11) of fixed block (10) adaptation, be equipped with first arc (12) on the circular arc limit of fixed block (10) bottom, be equipped with second arc (13) on the circular arc limit of locating piece (11) bottom, locating component (2) pass through first arc (12) with second arc (13) threaded connection is in on base (1).
4. A high precision carrier board apparatus incorporating a needle board structure as claimed in claim 3 wherein: the fixed block (10) is provided with a sliding groove (14), and the push block (6) is in sliding fit with the sliding groove (14).
5. A high precision carrier board apparatus incorporating a needle board structure as claimed in claim 3 wherein: be equipped with first recess on the bottom of fixed block (10), be equipped with the second recess on the bottom of locating piece (11), first recess with the second recess forms cavity (15), cavity (15) with faller subassembly (4) looks adaptation, support plate (7) are located on cavity (15).
6. A high precision carrier board apparatus incorporating a needle board structure as claimed in claim 3 wherein: the fixed block (10) is provided with a spring mounting groove and a fixed spring arranged on the spring mounting groove, and the fixed spring is connected with the tail end of the push block (6).
7. The high precision carrier board device integrated with needle board structure as claimed in claim 1, wherein: the needle plate assembly (4) comprises a PCB adapter plate (16) and an adaptive installation needle plate (17) arranged on the PCB adapter plate (16), an installation block (18) and a plurality of installation blocks are arranged on the needle plate (17), probes (19) arranged on the installation blocks (18), and a plurality of adapter needles (20) fixedly connected to the bottom of the PCB adapter plate (16).
8. The high precision carrier board device integrated with needle board structure as claimed in claim 7, wherein: the PCB adapter plate (16) is aligned with the needle plate (17) through a plurality of positioning pins (21), and the PCB adapter plate (16) is fixedly connected with the needle plate (17) through a plurality of screws.
9. The high precision carrier board device integrated with needle board structure as claimed in claim 7, wherein: the carrier plate (7) is provided with a supporting block (22) and a plurality of probe holes (23) which are formed in the supporting block (22), the bottom of the supporting block (22) is provided with alignment grooves (24) matched with the mounting blocks (18), the probe holes (23) are communicated with the alignment grooves (24), and the probe holes (23) correspond to the probes (19) one by one.
10. The high precision carrier board device integrated with needle board structure as claimed in claim 7, wherein: the bottom of the carrier plate (7) is provided with a plurality of spring grooves, and a plurality of reset springs (25) which are in one-to-one correspondence with the spring grooves are installed on the top of the needle plate (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920993060.6U CN209859935U (en) | 2019-06-28 | 2019-06-28 | High-precision carrier plate device integrated with needle plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920993060.6U CN209859935U (en) | 2019-06-28 | 2019-06-28 | High-precision carrier plate device integrated with needle plate structure |
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| Publication Number | Publication Date |
|---|---|
| CN209859935U true CN209859935U (en) | 2019-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920993060.6U Active CN209859935U (en) | 2019-06-28 | 2019-06-28 | High-precision carrier plate device integrated with needle plate structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211911A (en) * | 2019-06-28 | 2019-09-06 | 珠海市运泰利自动化设备有限公司 | Incorporate the high-precision support plate device of needle plate structure |
-
2019
- 2019-06-28 CN CN201920993060.6U patent/CN209859935U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211911A (en) * | 2019-06-28 | 2019-09-06 | 珠海市运泰利自动化设备有限公司 | Incorporate the high-precision support plate device of needle plate structure |
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