CN207883670U - A kind of high-precision of chip positions fixed module entirely - Google Patents
A kind of high-precision of chip positions fixed module entirely Download PDFInfo
- Publication number
- CN207883670U CN207883670U CN201820225195.3U CN201820225195U CN207883670U CN 207883670 U CN207883670 U CN 207883670U CN 201820225195 U CN201820225195 U CN 201820225195U CN 207883670 U CN207883670 U CN 207883670U
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- chip
- arc
- precision
- pushing block
- shaped
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- 239000000758 substrate Substances 0.000 claims abstract description 31
- 230000006978 adaptation Effects 0.000 claims abstract description 5
- 239000000523 sample Substances 0.000 claims description 24
- 238000012360 testing method Methods 0.000 abstract description 9
- 238000013461 design Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The utility model discloses a kind of high-precisions of chip to position fixed module entirely, it is desirable to provide the high-precision of chip a kind of reasonable in design and suitable for automatic test scheme positions fixed module entirely.The utility model includes carrier, carrier includes the boss of first substrate and setting on the first substrate, rectangular chip placing groove is provided on boss, chip placing groove is located at the center of boss, chip to be measured is placed in chip placing groove, pushing block slot is also tiltedly installed on boss, pushing block slot is connected to a corner of chip placing groove, pushing block slot adaptation is provided with pushing block, the tail portion of pushing block is provided with spring, withstand chip in the head of pushing block, the two side walls of chip placing groove are both provided with several pin holes, several pin holes are both provided with resilient key, chip is in contact with resilient key.The utility model positions the technical field of fixed module applied to the high-precision of chip entirely.
Description
Technical field
The utility model is related to a kind of high-precisions of chip to position fixed module entirely.
Background technology
The current chip manufacturing side is manufacturing front end because of technology and cost for the smaller chip class product of size
Under limitation, only a few manufacturer can carry out chip the test of performance parameter, and the degree of automation is extremely low, can not be to high-volume laser
The shortcomings of chip class product is tested；In addition, the high accuracy positioning of micro chip and full-automatic mode are fixed so that fixing
The Structural Design Requirement of module is high, and when being tested for laser class particular product performance parameters, needs strict guarantee during the test
The depth of parallelism of chip avoids the inclination because of product from leading to the error measured.Therefore, it needs to design at present a kind of reasonable in design
Fixed module is positioned entirely with the high-precision of the chip suitable for automatic test scheme.
Utility model content
Technical problem to be solved in the utility model is to have overcome the deficiencies of the prior art and provide a kind of structure design conjunction
Reason and the high-precision of chip suitable for automatic test scheme position fixed module entirely.
Technical solution used by the utility model is：The utility model includes carrier, and the carrier includes first substrate
With the boss being arranged on the first substrate, rectangular chip placing groove, the chip placing groove are provided on the boss
Positioned at the center of the boss, chip to be measured is placed in the chip placing groove, is also tiltedly installed with and is pushed away on the boss
Block slot, the pushing block slot are connected to a corner of the chip placing groove, and the pushing block slot adaptation is provided with pushing block, described
The tail portion of pushing block is provided with spring, and the chip is withstood on the head of the pushing block, and the two side walls of the chip placing groove are all provided with
Several pin holes are equipped with, several pin holes are both provided with resilient key, and the chip is in contact with the resilient key.
Further, the boss is cylindrical block, and the boss is by arc-shaped reference block, arc-shaped first locating piece and circle
The second locating piece of arc is constituted, and the circle centre position in the arc-shaped reference block upper surface is arranged in the chip placing groove, described to push away
Block slot is arranged between arc-shaped first locating piece and arc-shaped second locating piece, and the height of the arc-shaped reference block is high
It states in arc-shaped first locating piece and arc-shaped second locating piece and is provided with guide pin on carrier.
Further, probe plate module is connected under the first substrate, the probe plate module includes second substrate, described
Rocker piece is provided on second substrate, be provided on the rocker piece with the matched probe of the chip, open in the carrier
There are one the groove that Open Side Down, hole position is provided on the chip placing groove, the probe passes through the groove and the hole
It is in contact with the chip behind position.
Further, the carrier is provided with the first guide sleeve, and needle plate guide post, the needle plate are additionally provided on the rocker piece
Guide post is matched with first guide sleeve.
Further, the probe plate module is connected with lifting gear, and the lifting gear includes lifter plate and cylinder, described
Lifter plate is arranged in the lower end of the probe plate module, and the cylinder is arranged in the lower end of the lifter plate.
Further, it is provided with benchmark plate module on the carrier, the benchmark plate module includes third substrate and limit base,
For the third substrate connection in the upper end of the limit base, the lower face of the third substrate is plane, the plane with it is described
The upper surface of arc-shaped reference block matches.
Further, it is provided with guide pin on the carrier, is provided with the second guide sleeve on the third substrate, described second
Guide sleeve is matched with the guide pin.
Further, the inner vertical of the arc-shaped reference block is provided with pin, and the pin is located proximate to the core
Piece placing groove.
Further, it is provided with Quick Response Code on arc-shaped second locating piece.
The utility model has the beneficial effects that：Since the utility model includes carrier, the carrier include first substrate and
Boss on the first substrate is set, rectangular chip placing groove, chip placing groove position are provided on the boss
In the center of the boss, chip to be measured is placed in the chip placing groove, and pushing block is also tiltedly installed on the boss
Slot, the pushing block slot are connected to a corner of the chip placing groove, and the pushing block slot adaptation is provided with pushing block, described to push away
The tail portion of block is provided with spring, and the chip is withstood on the head of the pushing block, and the two side walls of the chip placing groove are respectively provided with
There are several pin holes, several pin holes to be both provided with resilient key, the chip is in contact with the resilient key, so, it is described
It is compact in structure that a kind of high-precision of chip positions fixed module entirely, is suitble to full-automatic testing, it can be achieved that micro chip
Positioning, and structure is relatively easy and performance is highly stable.
Description of the drawings
Fig. 1 is the three-dimensional structure diagram of the utility model；
Fig. 2 is the side view of the stereochemical structure of the utility model；
Fig. 3 is the three-dimensional structure diagram of the carrier 1；
Fig. 4 is the partial enlarged view of the carrier 1；
Fig. 5 is the three-dimensional structure diagram of the arc-shaped reference block 11；
Fig. 6 is the three-dimensional structure diagram of the probe plate module 14；
Fig. 7 is the three-dimensional structure diagram of the lifting gear 22；
Fig. 8 is the three-dimensional structure diagram of the benchmark plate module 25.
Specific implementation mode
As Fig. 1, such as Fig. 2, such as Fig. 3, as shown in Figure 4 and Figure 5, in the present embodiment, the utility model includes carrier 1, institute
It states carrier 1 and includes first substrate 2 and the boss 3 being arranged on the first substrate 2, rectangular core is provided on the boss 3
Piece placing groove 4, the chip placing groove 4 are located at the center of the boss 3, and chip 5 to be measured is placed in the chip placing groove 4
It is interior, pushing block slot 6 is also tiltedly installed on the boss 3, the pushing block slot 6 is connected to a turning of the chip placing groove 4
Place, the adaptation of pushing block slot 6 are provided with pushing block 7, and the tail portion of the pushing block 7 is provided with spring 8, and the head of the pushing block 7 is withstood
The two side walls of the chip 5, the chip placing groove 4 are both provided with several pin holes 9, and several pin holes 9 are both provided with bullet
Property pin 10, the chip 5 are in contact with several resilient keys 10, push the pushing block 7 by the spring 8 so that described
Pushing block 7 and the boss 3, which match, to be completed, to the positioning and clamping of the chip 5, the utility model to be made to realize to small core
The positioning of piece.
As shown in figure 3, in the present embodiment, the boss 3 is cylindrical block, the boss 3 by arc-shaped reference block 11,
Arc-shaped first locating piece 12 and arc-shaped second locating piece 13 are constituted, and the chip placing groove 4 is arranged in the arc-shaped base
The circle centre position of 11 upper surface of quasi- block, the setting of pushing block slot 6 is in arc-shaped first locating piece 12 and arc-shaped second positioning
Between block 13, the height of the arc-shaped reference block 11 is determined higher than arc-shaped first locating piece 12 and described arc-shaped second
The height of position block 13 selects the arc-shaped reference block for origin reference location on positioning datum, realizes the high-precision to chip
The height of positioning, the arc-shaped reference block 11 is higher than arc-shaped first locating piece 12 and arc-shaped second locating piece
13 height ensure that the unification of benchmark, it is ensured that the depth of parallelism of the chip 5 during the test.
It is described such as Fig. 3 and as shown in fig. 6, in the present embodiment, probe plate module 14 is connected under the first substrate 2
Probe plate module 14 includes second substrate 15, is provided with rocker piece 16 on the second substrate 15, is arranged on the rocker piece 16
Have with 5 matched probe 17 of the chip, open in the carrier 1 there are one the groove 18 that Open Side Down, the chip is placed
4 are provided with hole position 19 on slot, and the probe 17 is real by being in contact with the chip 5 after the groove 18 and hole position 19
Show contact type measurement function of the probe 17 to the chip 5, contour bolt is additionally provided on the rocker piece 16, it is described
Rocker piece 16 is fixed on by the contour bolt on the second substrate 15, between the contour bolt and the rocker piece 16
There are gaps so that the rocker piece 16 can generate a certain amount of position offset.
Such as Fig. 3 and as shown in fig. 6, in the present embodiment, the carrier 1 is provided with the first guide sleeve 20, the rocker piece 16
On be additionally provided with needle plate guide post 21, the needle plate guide post 21 is matched with first guide sleeve 20, is realized to the height of carrier 1
Precision positions.
As shown in fig. 7, in the present embodiment, lifting gear 22, the lifting dress are connected under the probe plate module 14
It includes lifter plate 23 and cylinder 24 to set 22, and the lifter plate 23 is arranged in the lower end of the probe plate module 14, the cylinder 24
It is arranged in the lower end of the lifter plate 23, the thrust generated by the cylinder 24 pushes the lifter plate 23 to move upwards, from
And the probe plate module 14 and the carrier 1 is made to move upwards.
Such as Fig. 3 and as shown in figure 8, in the present embodiment, benchmark plate module 25, the benchmark are provided on the carrier 1
Plate module 25 includes third substrate 26 and limit base 27, and the third substrate 26 is connected to the upper end of the limit base 27, described
The lower face of third substrate 26 is plane, and the plane is matched with the upper surface of the arc-shaped reference block 11, be ensure that
The depth of parallelism of chip 5 described in test process avoids the inclination because of product from leading to the error measured.
Such as Fig. 3 and as shown in figure 8, in the present embodiment, guide pin 28, the third base are provided on the carrier 1
The second guide sleeve 29 is provided on plate 26, second guide sleeve 29 is matched with the guide pin 28, is realized to the carrier 1
It is accurately positioned.
As shown in figure 3, in the present embodiment, the inner vertical of the arc-shaped reference block 11 is provided with pin 30, described
Pin 30 is located proximate to the chip placing groove 4, and the pin 30 fixes the position of the carrier 1 for vision positioning, with
Reach and precisely pick and place the chip 5 in the inside of the chip placing groove 4, basis is provided for automatic test.
As shown in figure 3, in the present embodiment, it is provided with Quick Response Code 31 on arc-shaped second locating piece 13, described two
Dimension code 31 can be used to identify the number of different carriers, make it easy to data analysis and statistics.
A kind of high-precision of chip positions the operation principle of fixed module entirely：
Thrust is generated by the cylinder 24 of the lifting gear 22, the lifter plate 23 is pushed to move upwards, it is described
Probe plate module 14 is arranged on the lifter plate 23, first guide sleeve 20 on the carrier 1 and the needle plate guide post
21 match to realize being accurately positioned to carrier 1, and then the lifter plate 23 is by pushing the probe plate module 14 to make
The carrier 1 moves upwards, and the guide pin 28 matches to realize to the accurate fixed of carrier 1 with second guide sleeve 29
Position, when lower face of the carrier 1 by the jacking of lifting gear 22 to the third substrate 26, the probe 17 passes through described recessed
It contacts the chip 5 behind slot 18 and hole position 19 and jacks up the chip 5, while passing through the chip placing groove 4 and described
Pushing block 7 fixes the chip 5 jointly.
The utility model positions the technical field of fixed module applied to the high-precision of chip entirely.
Although the embodiments of the present invention are described with practical solution, does not constitute the utility model is contained
Justice limitation, for those skilled in the art, according to this specification to the modification of its embodiment and with the group of other schemes
Conjunction will be apparent from.
Claims (9)
1. a kind of high-precision of chip positions fixed module entirely, it is characterised in that：It includes carrier（1）, the carrier（1）Including
First substrate（2）With setting in the first substrate（2）On boss（3）, the boss（3）On be provided with rectangular chip and put
Set slot（4）, the chip placing groove（4）Positioned at the boss（3）Center, chip to be measured（5）The chip is placed in put
Set slot（4）It is interior, the boss（3）On be also tiltedly installed with pushing block slot（6）, the pushing block slot（6）The chip is connected to place
Slot（4）A corner, the pushing block slot（6）Adaptation is provided with pushing block（7）, the pushing block（7）Tail portion be provided with spring
（8）, the pushing block（7）Head withstand the chip（5）, the chip placing groove（4）Two side walls be both provided with it is several
Pin hole（9）, several pin holes（9）It is both provided with resilient key（10）, the chip（5）With the resilient key（10）It is in contact.
2. a kind of high-precision of chip according to claim 1 positions fixed module entirely, it is characterised in that：The boss
（3）For cylindrical block, the boss（3）By arc-shaped reference block（11）, arc-shaped first locating piece（12）With arc-shaped second
Locating piece（13）It constitutes, the chip placing groove（4）It is arranged in the arc-shaped reference block（11）The circle centre position of upper surface, it is described
Pushing block slot（6）It is arranged in arc-shaped first locating piece（12）With arc-shaped second locating piece（13）Between, it is described arc-shaped
Reference block（11）Height be higher than arc-shaped first locating piece（12）With arc-shaped second locating piece（13）Height.
3. a kind of high-precision of chip according to claim 1 positions fixed module entirely, it is characterised in that：First base
Plate（2）Under be connected with probe plate module（14）, the probe plate module（14）Including second substrate（15）, the second substrate
（15）On be provided with rocker piece（16）, the rocker piece（16）On be provided with and the chip（5）Matched probe（17）, institute
State carrier（1）The groove that Open Side Down there are one inside opening（18）, on the chip placing groove（4）It is provided with hole position（19）, described
Probe（17）Pass through the groove（18）With hole position（19）Afterwards with the chip（5）It is in contact.
4. a kind of high-precision of chip according to claim 3 positions fixed module entirely, it is characterised in that：The carrier
（1）It is provided with the first guide sleeve（20）, the rocker piece（16）On be additionally provided with needle plate guide post（21）, the needle plate guide post
（21）With first guide sleeve（20）It matches.
5. a kind of high-precision of chip according to claim 3 positions fixed module entirely, it is characterised in that：The probe card
Module（14）Under be connected with lifting gear（22）, the lifting gear（22）Including lifter plate（23）And cylinder（24）, the liter
Plate drops（23）It is arranged in the probe plate module（14）Lower end, the cylinder（24）It is arranged in the lifter plate（23）Under
End.
6. a kind of high-precision of chip according to claim 2 positions fixed module entirely, it is characterised in that：The carrier
（1）On be provided with benchmark plate module（25）, the benchmark plate module（25）Including third substrate（26）And limit base（27）, described
Third substrate（26）It is connected to the limit base（27）Upper end, the third substrate（26）Lower face be plane, it is described flat
Face and the arc-shaped reference block（11）Upper surface match.
7. a kind of high-precision of chip according to claim 6 positions fixed module entirely, it is characterised in that：The carrier
（1）On be provided with guide pin（28）, the third substrate（26）On be provided with the second guide sleeve（29）, second guide sleeve（29）
With the guide pin（28）It matches.
8. a kind of high-precision of chip according to claim 6 positions fixed module entirely, it is characterised in that：It is described arc-shaped
Reference block（11）Inner vertical be provided with pin（30）, the pin（30）Be located proximate to the chip placing groove（4）.
9. a kind of high-precision of chip according to claim 8 positions fixed module entirely, it is characterised in that：It is described arc-shaped
Second locating piece（13）On be provided with Quick Response Code（31）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820225195.3U CN207883670U (en) | 2018-02-08 | 2018-02-08 | A kind of high-precision of chip positions fixed module entirely |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820225195.3U CN207883670U (en) | 2018-02-08 | 2018-02-08 | A kind of high-precision of chip positions fixed module entirely |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207883670U true CN207883670U (en) | 2018-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820225195.3U Expired - Fee Related CN207883670U (en) | 2018-02-08 | 2018-02-08 | A kind of high-precision of chip positions fixed module entirely |
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| Country | Link |
|---|---|
| CN (1) | CN207883670U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110187151A (en) * | 2019-06-21 | 2019-08-30 | 东莞市沃德精密机械有限公司 | The coil row line testing device of wireless charging device |
| CN110211911A (en) * | 2019-06-28 | 2019-09-06 | 珠海市运泰利自动化设备有限公司 | Incorporate the high-precision support plate device of needle plate structure |
| CN112053985A (en) * | 2020-07-03 | 2020-12-08 | 北京华卓精科科技股份有限公司 | Wafer alignment device and alignment method thereof |
| CN114264925A (en) * | 2020-09-16 | 2022-04-01 | 武汉国创科光电装备有限公司 | Quantum dot light-emitting diode testing device and calibration method thereof |
-
2018
- 2018-02-08 CN CN201820225195.3U patent/CN207883670U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110187151A (en) * | 2019-06-21 | 2019-08-30 | 东莞市沃德精密机械有限公司 | The coil row line testing device of wireless charging device |
| CN110211911A (en) * | 2019-06-28 | 2019-09-06 | 珠海市运泰利自动化设备有限公司 | Incorporate the high-precision support plate device of needle plate structure |
| CN112053985A (en) * | 2020-07-03 | 2020-12-08 | 北京华卓精科科技股份有限公司 | Wafer alignment device and alignment method thereof |
| CN112053985B (en) * | 2020-07-03 | 2024-02-02 | 北京华卓精科科技股份有限公司 | Wafer alignment device and alignment method thereof |
| CN114264925A (en) * | 2020-09-16 | 2022-04-01 | 武汉国创科光电装备有限公司 | Quantum dot light-emitting diode testing device and calibration method thereof |
| CN114264925B (en) * | 2020-09-16 | 2024-04-12 | 武汉国创科光电装备有限公司 | Quantum dot light emitting diode testing device and calibration method thereof |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180918 |