CN213875919U - Semiconductor chip test seat - Google Patents
Semiconductor chip test seat Download PDFInfo
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- CN213875919U CN213875919U CN202022743186.3U CN202022743186U CN213875919U CN 213875919 U CN213875919 U CN 213875919U CN 202022743186 U CN202022743186 U CN 202022743186U CN 213875919 U CN213875919 U CN 213875919U
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- test
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- positioning
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- 238000012360 testing method Methods 0.000 title claims abstract description 167
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000012545 processing Methods 0.000 abstract description 9
- 238000012423 maintenance Methods 0.000 abstract description 7
- 229910052755 nonmetal Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to a semiconductor chip test seat, which comprises a bottom frame, wherein a containing cavity is arranged in the bottom frame, and a contact port is arranged in the containing cavity; the test seat main body is arranged in the accommodating cavity; the chip positioning plate is arranged above the test seat main body and is provided with a holding groove; the chip positioning plate and the test seat main body are covered on the bottom frame by the upper cover, and the upper cover is provided with a through hole; the accommodating groove is positioned in the through hole, and a chip is arranged in the accommodating groove; test seat main part one end and chip vertical contact, the other end runs through perpendicularly touch the mouth, the utility model provides a needle point and the pin of first test piece and second test piece respectively with the pin of chip and touch the mouth and run through perpendicularly and touch, the whole location is accurate to the location fit precision of chip and first test piece and second test piece is high, the test of having improved whole test seat is accurate, simple structure, and is with low costs, and manufacturing can shorten processing cycle conveniently, and it is convenient to maintain in later stage customer uses, can save maintenance time and improve production efficiency.
Description
Technical Field
The utility model relates to an electrical property detection device especially relates to a semiconductor chip is with test seat.
Background
The test seat has the advantages that various performance tests are required in the large-scale research and development and production processes of semiconductor chips, the chip test seat is a key part in testing, the test seat has the function of positioning the chips and then transmitting electronic signal current between circuit boards, so that the test effect is achieved, and the quality and the matching degree of the test seat directly influence the test judgment accuracy.
Common test seat product location is ordinary suction nozzle automatic correction counterpoint location and presss from both sides and grabs the location at present, but discovers after long-time production:
1. the positioning mode is not accurate, the metal part of the test seat is widely used, the processing is complex and difficult, and the cost is high.
2. The test seat has the advantages of short test life, easy abrasion, frequent maintenance and replacement, high cost and capacity reduction.
3. The structure is complicated, the processing and the maintenance are complicated, and the production cost and the later maintenance cost are higher.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art and providing a processing cost is low, and the test precision of chip is high, and simple structure, later maintenance convenient test seat for semiconductor chip.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a semiconductor chip test socket comprising:
the device comprises a base frame, a plurality of contact ports and a plurality of connecting rods, wherein an accommodating cavity is formed in the base frame;
the test seat main body is arranged in the accommodating cavity;
the chip positioning plate is arranged above the test seat main body, and is provided with a holding tank for limiting a chip;
the upper cover covers the chip positioning plate and the test seat main body on the bottom frame, and a through hole is formed in the upper cover;
the accommodating groove is positioned in the through hole, and a chip is arranged in the accommodating groove; one end of the test seat main body is vertically contacted with the chip, and the other end of the test seat main body vertically penetrates through the contact port.
Further, the accommodating cavity is in a cross shape.
Furthermore, the test seat main body comprises four test sheet assemblies arranged in a cross shape; the test piece assembly comprises a test piece group and a positioning assembly for placing the test piece group;
wherein the test strip group comprises a first test strip and a second test strip; the second test piece is arranged in the accommodating cavity formed by the first test piece; the first test piece and the second test piece are both provided with a needle leg and a needle point, and the needle legs and the needle points on the first test piece and the second test piece are arranged left and right; a first clamping block and a second clamping block are respectively arranged on the first test piece and the second test piece; the needle legs of the first test piece and the second test piece penetrate through the contact port.
Furthermore, the positioning assembly comprises a first positioning block, a second positioning block and a third positioning block which are sequentially connected; a plurality of first vertical grooves penetrating through the first positioning block are formed in one side of the first positioning block, first through holes penetrating through the first positioning block are formed in the lower portions of the first vertical grooves, and the first through holes are perpendicular to the vertical grooves;
the second positioning block is provided with a second vertical groove and a third vertical groove which are step-shaped, the third vertical groove is provided with a second through hole which is perpendicular to the third vertical groove, and the second through hole penetrates through the second positioning block; a first opening positioned below the third vertical groove is formed in the second positioning block;
fourth vertical grooves are symmetrically arranged up and down on the third positioning block, and a second opening is formed in one side of each fourth vertical groove;
the middle part of the first test piece is arranged in the first vertical groove, the first fixture block is clamped in the first through hole, and the upper half part of the first test piece sequentially penetrates out of the first vertical groove, the second vertical groove and a fourth positioning groove at the upper end of the third positioning block; the lower half part of the first test piece sequentially penetrates out of the first vertical groove, the first opening, a fourth positioning groove at the lower end of the third positioning block and the second opening;
the middle part of the second test piece is clamped on the third vertical groove, the second fixture block is clamped in the second through hole, the upper half part of the second test piece sequentially penetrates out from the third vertical groove and the fourth positioning groove at the upper end of the third positioning block, and the lower half part of the second test piece sequentially penetrates out from the first opening, the fourth positioning groove at the lower end of the third positioning block and the second opening.
Furthermore, a needle tip limiting groove used for limiting the needle tip on the first test piece and the second test piece is arranged in the containing groove.
Furthermore, the upper cover is connected with the bottom frame through screws, and the chip positioning plate and the test seat main body are fixed in the inner space of the upper cover and the inner space of the bottom frame.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses the semiconductor chip test seat of scheme, the needle point and the pin of first test piece and second test piece can be respectively with the pin of chip and touch a mouthful perpendicular through touch, the whole location is accurate, and the mutual location fit precision of chip and first test piece and second test piece is high, the test of having improved whole test seat is accurate, moreover, the steam generator is simple in structure, low in cost, the processing manufacturing can conveniently shorten processing cycle, it is convenient to maintain in the later stage customer uses, can save maintenance time and improve production efficiency.
Drawings
The technical scheme of the utility model is further explained by combining the attached drawings as follows:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the structure of FIG. 1 from another perspective;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is an exploded view of the three-dimensional structure of the present invention;
FIG. 5 is an enlarged view of portion B of FIG. 4;
FIG. 6 is an enlarged view of portion C of FIG. 4;
FIG. 7 is a schematic structural view of a chip positioning plate;
FIG. 8 is a schematic view of the structure of the first test strip mated with the second test strip;
FIG. 9 is a partial schematic view of the first and second connection blocks in cooperation with the first and second test strips;
FIG. 10 is a schematic view of the structure of FIG. 9 from another perspective;
FIG. 11 is a schematic structural diagram of a first positioning block;
FIG. 12 is a schematic view of a second positioning block;
FIG. 13 is a schematic structural view of a third positioning block;
wherein: chassis 1, test socket main part 2, chip locating plate 3, upper cover 4, chip 5, hold chamber 10, contact port 11, test piece group 20, locating component 21, holding tank 30, through-hole 40, first test piece 201, second test piece 202, needle leg 203, needle point 204, first fixture block 205, second fixture block 206, first locating block 211, second locating block 212, third locating block 213, first vertical slot 214, first through-hole 215, second vertical slot 216, third vertical slot 217, second through-hole 218, first opening 219, fourth vertical slot 220, second opening 221, needle point spacing slot 300.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1-13, a semiconductor chip testing socket according to the present invention includes a bottom frame 1, a testing socket main body 2, a chip positioning plate 3 and an upper cover 4; the underframe 1 is internally provided with a cross-shaped accommodating cavity 10; a plurality of contact openings 11 are formed at the intersection of the cross-shaped accommodating cavity 10, the contact openings are divided into four groups, each group is provided with two rows of contact openings, and each row of contact openings comprises eight contact openings 11; the test seat main body 2 is arranged in the accommodating cavity 10; the chip positioning plate 3 is arranged above the test seat main body 2, the chip positioning plate 3 is provided with a holding tank 30 for limiting a chip, and the chip positioning plate 3 adopts imported Teflon and ensures good positioning effect and wear resistance through accurate carving and high-precision carving; the upper cover 4 covers the chip positioning plate 3 and the test socket main body 2 on the bottom frame 1, and the upper cover 4 is provided with a through hole 40 for exposing the accommodating groove 30 on the chip positioning plate 3, so as to facilitate the subsequent placement of the chip 5 in the accommodating groove 30, one end of the test socket main body 2 is in contact with the chip 5, and the other end of the test socket main body penetrates through the contact opening 11 and then is connected with a pad on a PCB (not shown in the figure).
Specifically, the test socket main body 2 comprises four test sheet assemblies arranged in a cross shape, and the four test sheet assemblies are just correspondingly arranged in a cross-shaped accommodating cavity; the test piece assembly comprises a test piece group and a positioning assembly used for placing the test piece group.
Wherein the test strip assembly 20 includes a first test strip 201 and a second test strip 202; the second test strip 202 is arranged in a containing cavity formed by the first test strip 201; the first test piece 201 and the second test piece 202 are both provided with a needle leg 203 and a needle point 204, and the needle legs and the needle points on the first test piece 201 and the second test piece 202 are both arranged oppositely left and right; the needle legs 203 of the first test strip 201 and the second test strip 202 vertically penetrate through the corresponding contact openings 11; the first test strip 201 and the second test strip 202 are respectively provided with a first fixture block 205 and a second fixture block 206.
In addition, the positioning assembly 21 includes a first positioning block 211, a second positioning block 212 and a third positioning block 213, which are connected in sequence; one side of first locating piece 211 is equipped with a plurality of parallel arrangement, and runs through first perpendicular groove 214 of first locating piece 211, and is a plurality of first through-hole 215 that runs through first locating piece 211 is opened to the lower part in first perpendicular groove 214, and first through-hole is rectangular shape, first through-hole with perpendicular the setting in perpendicular groove, first through-hole 215 wherein is used for holding first fixture block 205.
A second vertical groove 216 and a third vertical groove 217 which are step-shaped are arranged on the second positioning block 212, and a second through hole 218 which is perpendicular to the third vertical groove 217 is arranged on the third vertical groove 217; the second through hole is elongated, the second through hole 218 penetrates through the second positioning block 212, and the second through hole 218 is used for accommodating the second fixture block 206; the second positioning block 212 is provided with a first opening 219 below the third vertical slot 217.
The third positioning block 213 is provided with fourth vertical slots 220 symmetrically arranged up and down, and one side of the fourth vertical slot 220 is provided with a second opening 221.
During installation, the middle part of the first test piece 201 is arranged in the first vertical groove 214, the first fixture block 205 is clamped in the first through hole 21, and the upper half part of the first test piece sequentially penetrates out of the first vertical groove 214, the second vertical groove 216 and the fourth positioning groove 220 at the upper end of the third positioning block; the lower half part of the first test piece 201 sequentially penetrates out of the first vertical groove 214, the first opening 219, the fourth positioning groove 220 at the lower end of the third positioning block and the second opening 221.
The middle part of the second test piece is clamped on the third vertical groove 217, the second clamping block 206 is clamped in the second through hole, the upper half part of the second test piece sequentially penetrates out of the third vertical groove 217 and the fourth positioning groove 220 at the upper end of the third positioning block, and the lower half part of the second test piece sequentially penetrates out of the first opening 219, the fourth positioning groove 220 at the lower end of the third positioning block and the second opening 221.
As a further preferred embodiment, the accommodating groove 30 is provided therein with a tip retaining groove 300 for retaining the tip 204 of the first test strip 201 and the second test strip 202.
As a further preferred embodiment, the upper cover 1 is fastened and connected with the bottom frame 4 through screws, and the chip positioning plate 3 and the test socket main body 2 are fixed in the inner space of the upper cover 4 and the bottom frame 1, so that it is ensured that the chip 5 can be accurately positioned with the first test piece and the second test piece, and accurately positioned with the PCB board through the contact port, and the accuracy and reliability of the subsequent test are determined.
In addition, the whole test seat adopts non-metal engineering plastics to replace metal parts, so that the non-metal processing difficulty is low, the use is convenient, and the cost is low; meanwhile, the limiting groove of the chip, the contact surface of the chip and the contact position of the test piece are all wrapped by nonmetal, so that the condition that the related electrical performance is close to zero interference during testing is ensured as much as possible.
During the in-service use, still be equipped with the PCB board at the chassis, be equipped with on the PCB board with touch the pad that the mouth corresponds, in operation, fix first test piece and second test piece installation on locating component, place the chip at spacing inslot simultaneously, carry out spacing fixed through the quadriversal of spacing groove to make the needle point of first test piece and second test piece run through touch mouthful back with the pad links to each other perpendicularly, the pin leg of first test piece and second test piece and the pin of chip contact perpendicularly, confirm the precision and the reliability of later stage test.
The utility model discloses a semiconductor chip test seat, the needle point and the pin of first test piece and second test piece can be respectively with the pin of chip and touch a mouthful perpendicular through touch, the whole location is accurate, and the mutual location fit precision of chip and first test piece and second test piece is high, the test of having improved whole test seat is accurate, moreover, the steam generator is simple in structure, low in cost, the processing manufacturing can conveniently shorten processing cycle, it is convenient to maintain in the later stage customer uses, can save maintenance time and improve production efficiency.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (6)
1. A semiconductor chip test socket, comprising:
the device comprises a base frame, a plurality of contact ports and a plurality of connecting rods, wherein an accommodating cavity is formed in the base frame;
the test seat main body is arranged in the accommodating cavity;
the chip positioning plate is arranged above the test seat main body, and is provided with a holding tank for limiting a chip;
the upper cover covers the chip positioning plate and the test seat main body on the bottom frame, and a through hole is formed in the upper cover;
the accommodating groove is positioned in the through hole, and a chip is arranged in the accommodating groove; one end of the test seat main body is vertically contacted with the chip, and the other end of the test seat main body vertically penetrates through the contact port.
2. The semiconductor chip test socket according to claim 1, wherein: the accommodating cavity is in a cross shape.
3. The semiconductor chip test socket according to claim 1, wherein: the test seat main body comprises four test sheet assemblies arranged in a cross shape; the test piece assembly comprises a test piece group and a positioning assembly for placing the test piece group;
wherein the test strip group comprises a first test strip and a second test strip; the second test piece is arranged in the accommodating cavity formed by the first test piece; the first test piece and the second test piece are both provided with a needle leg and a needle point, and the needle legs and the needle points on the first test piece and the second test piece are arranged left and right; a first clamping block and a second clamping block are respectively arranged on the first test piece and the second test piece; the needle legs of the first test piece and the second test piece penetrate through the contact port.
4. The semiconductor chip test socket according to claim 3, wherein: the positioning assembly comprises a first positioning block, a second positioning block and a third positioning block which are sequentially connected; a plurality of first vertical grooves penetrating through the first positioning block are formed in one side of the first positioning block, first through holes penetrating through the first positioning block are formed in the lower portions of the first vertical grooves, and the first through holes are perpendicular to the vertical grooves;
the second positioning block is provided with a second vertical groove and a third vertical groove which are step-shaped, the third vertical groove is provided with a second through hole which is perpendicular to the third vertical groove, and the second through hole penetrates through the second positioning block; a first opening positioned below the third vertical groove is formed in the second positioning block;
fourth vertical grooves are symmetrically arranged up and down on the third positioning block, and a second opening is formed in one side of each fourth vertical groove;
the middle part of the first test piece is arranged in the first vertical groove, the first fixture block is clamped in the first through hole, and the upper half part of the first test piece sequentially penetrates out of the first vertical groove, the second vertical groove and a fourth positioning groove at the upper end of the third positioning block; the lower half part of the first test piece sequentially penetrates out of the first vertical groove, the first opening, a fourth positioning groove at the lower end of the third positioning block and the second opening;
the middle part of the second test piece is clamped on the third vertical groove, the second fixture block is clamped in the second through hole, the upper half part of the second test piece sequentially penetrates out from the third vertical groove and the fourth positioning groove at the upper end of the third positioning block, and the lower half part of the second test piece sequentially penetrates out from the first opening, the fourth positioning groove at the lower end of the third positioning block and the second opening.
5. The semiconductor chip test socket according to claim 4, wherein: and a needle tip limiting groove used for limiting the needle tip on the first test piece and the second test piece is arranged in the containing groove.
6. The semiconductor chip test socket according to claim 1, wherein: the upper cover is connected with the bottom frame through screws, and the chip positioning plate and the test seat main body are fixed in the inner space of the upper cover and the inner space of the bottom frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022743186.3U CN213875919U (en) | 2020-11-24 | 2020-11-24 | Semiconductor chip test seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022743186.3U CN213875919U (en) | 2020-11-24 | 2020-11-24 | Semiconductor chip test seat |
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| Publication Number | Publication Date |
|---|---|
| CN213875919U true CN213875919U (en) | 2021-08-03 |
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ID=77038642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022743186.3U Active CN213875919U (en) | 2020-11-24 | 2020-11-24 | Semiconductor chip test seat |
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| CN (1) | CN213875919U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112462223A (en) * | 2020-11-24 | 2021-03-09 | 苏州朗之睿电子科技有限公司 | Semiconductor chip test seat |
| CN116482415A (en) * | 2023-04-23 | 2023-07-25 | 重庆云潼车芯电子科技有限公司 | Full bridge MOSFET test socket |
| CN118209759A (en) * | 2024-03-19 | 2024-06-18 | 苏州韬盛电子科技有限公司 | Semiconductor test socket and mounting method thereof |
-
2020
- 2020-11-24 CN CN202022743186.3U patent/CN213875919U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112462223A (en) * | 2020-11-24 | 2021-03-09 | 苏州朗之睿电子科技有限公司 | Semiconductor chip test seat |
| CN112462223B (en) * | 2020-11-24 | 2024-08-27 | 苏州朗之睿电子科技有限公司 | Semiconductor chip test seat |
| CN116482415A (en) * | 2023-04-23 | 2023-07-25 | 重庆云潼车芯电子科技有限公司 | Full bridge MOSFET test socket |
| CN118209759A (en) * | 2024-03-19 | 2024-06-18 | 苏州韬盛电子科技有限公司 | Semiconductor test socket and mounting method thereof |
| CN118209759B (en) * | 2024-03-19 | 2025-03-21 | 苏州韬盛电子科技有限公司 | Semiconductor test socket and installation method thereof |
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