CN209731690U - A kind of dust-proof multilayer printed circuit board - Google Patents
A kind of dust-proof multilayer printed circuit board Download PDFInfo
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- CN209731690U CN209731690U CN201920013171.6U CN201920013171U CN209731690U CN 209731690 U CN209731690 U CN 209731690U CN 201920013171 U CN201920013171 U CN 201920013171U CN 209731690 U CN209731690 U CN 209731690U
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- circuit board
- printed circuit
- multilayer printed
- dust
- heat
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Abstract
The utility model discloses a kind of dust-proof multilayer printed circuit boards, including insulating substrate, the upper surface of the insulating substrate is uniformly coated with heat conduction silicone, the upper surface of the heat conduction silicone is fixedly connected with multilayer printed circuit board, heat-conducting plate is symmetrically arranged at left and right sides of the insulating substrate, side and insulating substrate of the heat-conducting plate close to insulating substrate, heat conduction silicone is fixedly connected with multilayer printed circuit board, the upper end of the multilayer printed circuit board is provided with dust excluding plate, the left and right ends of the dust excluding plate are fixedly connected with inserted block, the upper end of the heat-conducting plate and positional symmetry corresponding with inserted block offers jack, the inserted block passes through jack far from one end of dust excluding plate and is fixedly connected by end cap with heat-conducting plate, the utility model relates to printed circuit board technology fields.This is used for dust-proof multilayer printed circuit board, has achieved the purpose that dust-proof, good heat dissipation effect, extends the service life of printed circuit board.
Description
Technical field
The utility model relates to printed circuit board technology field, specially a kind of dust-proof multilayer printed circuit board.
Background technique
Printed board develops to two-sided, multilayer and flexibility from single layer, and still keeps respective development trend.Due to not
Disconnectedly develop to high-precision, high density and high reliability direction, constantly reduces volume, reduce cost, improve performance, so that printing
Plate still maintains powerful vitality in the development engineering of future electronic equipment.Summary is raw to the following printed board both at home and abroad
The discussion for producing manufacturing technology developments is substantially coincident, i.e., to high density, in high precision, and fine pore, thin wire, thin space,
Highly reliable, multiple stratification, high-speed transfer, light weight, slim direction is developed, upper simultaneously to productivity is improved in production, reduces cost, subtracts
Of low pollution adapts to multi items, the development of small lot production mode reform.
It needs to prevent dust accumulation in printed circuit board use process, dust, which once enters electrical component, will cause electrical member
The different degrees of damage of part, operation of electric element can generate heat in the process, and thermal accumlation can shorten the use of printed circuit board
Service life.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of dust-proof multilayer printed circuit board, solve it is dust-proof,
The problem of heat dissipation effect difference.
(2) technical solution
In order to achieve the above object, the utility model is achieved by the following technical programs: a kind of dust-proof multilayered printed electricity
Road plate, including insulating substrate, the upper surface of the insulating substrate are uniformly coated with heat conduction silicone, the heat conduction silicone it is upper
End is provided with multilayer printed circuit board, and the multilayer printed circuit board is fixedly connected by heat conduction silicone with insulating substrate, institute
State and be symmetrically arranged with heat-conducting plate at left and right sides of insulating substrate, the heat-conducting plate close to insulating substrate side and insulating substrate,
Heat conduction silicone is fixedly connected with multilayer printed circuit board, and the upper end of the multilayer printed circuit board is provided with dust excluding plate, described
The left and right ends of dust excluding plate are fixedly connected with inserted block, and the upper end of the heat-conducting plate and positional symmetry corresponding with inserted block offer slotting
Hole, the inserted block pass through jack far from one end of dust excluding plate and are fixedly connected by end cap with heat-conducting plate.
Preferably, the upper surface of the multilayer printed circuit board is evenly arranged with electrical component, and the electrical component uses
The method of welding is fixed on the upper surface of multilayer printed circuit board.
Preferably, the lower surface of the insulating substrate is evenly arranged with the first reflective ink layer, and the heat-conducting plate uses aluminium
Alloy material is made.
Preferably, the cylindrical and periphery by proximal cover inner wall of the inserted block carries out external screw thread grinding process, described
The inner wall of end cap carries out internal screw thread grinding process, and the end cap is threadedly coupled with inserted block.
Preferably, the dust excluding plate is in the arc-shaped to raise upward, and the upper surface of the dust excluding plate is evenly arranged with second
Reflective ink layer.
(3) beneficial effect
The utility model provides a kind of dust-proof multilayer printed circuit board.Have it is following the utility model has the advantages that
(1), the dust-proof multilayer printed circuit board, dust excluding plate are in the arc-shaped to raise upward, and dust is not easy to rest on circle
In cambered surface, it is not easy to accumulate dust, inserted block passes through jack and fixes by end cap, easy disassembly dust excluding plate, multilayer printed circuit
Plate is fixed by heat conduction silicone and insulating substrate, and heat conductive silica gel has high thermal conductivity, and splendid thermal conductivity, good electricity is absolutely
Property, will not solidification, can be to avoid the risk of short circuit, heat conduction silicone quickly absorbs heat, is then conducted to again thermally conductive
Plate, heat-conducting plate are made of aluminum alloy materials, good heat conduction effect, can quickly be evaporated into heat in air, have reached dust-proof, scattered
The good purpose of thermal effect, extends the service life of printed circuit board.
Detailed description of the invention
Fig. 1 is the dust-proof multilayer printed circuit board structural schematic diagram of the utility model；
Fig. 2 is the a-quadrant enlarged diagram of the utility model.
In figure: 1 insulating substrate, 2 heat conduction silicones, 3 multilayer printed circuit boards, 4 heat-conducting plates, 5 dust excluding plates, 6 inserted blocks, 7 are inserted
Hole, 8 end caps, 9 electrical components, 10 first reflective ink layers, 11 second reflective ink layers.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of dust-proof multilayer printed circuit board, including exhausted
Edge substrate 1, the upper surface of insulating substrate 1 are uniformly coated with heat conduction silicone 2, and the upper end of heat conduction silicone 2 is provided with multilayer print
Circuit board 3 processed, multilayer printed circuit board 3 are fixedly connected by heat conduction silicone 2 with insulating substrate 1, the left and right two of insulating substrate 1
Side is symmetrically arranged with heat-conducting plate 4, and heat-conducting plate 4 is printed close to the side and insulating substrate 1 of insulating substrate 1, heat conduction silicone 2 and multilayer
Circuit board 3 processed is fixedly connected, and the upper end of multilayer printed circuit board 3 is provided with dust excluding plate 5, and the left and right ends of dust excluding plate 5 are fixed to be connected
It is connected to inserted block 6, the upper end of heat-conducting plate 4 and positional symmetry corresponding with inserted block 6 offers jack 7, inserted block 6 is far from dust excluding plate 5
One end passes through jack 7 and is fixedly connected by end cap 8 with heat-conducting plate 4.
The upper surface of multilayer printed circuit board 3 is evenly arranged with electrical component 9, and electrical component 9 is solid using the method for welding
It is scheduled on the upper surface of multilayer printed circuit board 3.
The lower surface of insulating substrate 1 is evenly arranged with the first reflective ink layer 10, and heat-conducting plate 4 uses aluminum alloy materials system
At.
The cylindrical and periphery by 8 inner wall of proximal cover of inserted block 6 carries out external screw thread grinding process, the inner wall of end cap 8 into
Row internal screw thread grinding process, end cap 8 are threadedly coupled with inserted block 6.
Dust excluding plate 5 is in the arc-shaped to raise upward, and the upper surface of dust excluding plate 5 is evenly arranged with the second reflective ink layer 11.
In use, dust excluding plate 5 is in the arc-shaped to raise upward, dust is not easy to rest on arc surface, it is not easy to accumulate
Dust, inserted block 6 pass through jack 7 and are fixed by end cap 8, and easy disassembly dust excluding plate 5, multilayer printed circuit board 3 passes through thermal conductive silicon
Glue-line 2 and insulating substrate 1 are fixed, and heat conductive silica gel has high thermal conductivity, and splendid thermal conductivity, the good exhausted property of electricity will not solid
Change, can quickly absorb heat to avoid the risk of short circuit, heat conduction silicone 2, then be conducted to heat-conducting plate 4, heat-conducting plate 4 again
It is made, good heat conduction effect, can quickly be evaporated into heat in air of aluminum alloy materials.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of dust-proof multilayer printed circuit board, including insulating substrate (1), it is characterised in that: the upper table of the insulating substrate (1)
Face is uniformly coated with heat conduction silicone (2), and the upper end of the heat conduction silicone (2) is provided with multilayer printed circuit board (3), described
Multilayer printed circuit board (3) is fixedly connected by heat conduction silicone (2) with insulating substrate (1), the left and right of the insulating substrate (1)
Two sides are symmetrically arranged with heat-conducting plate (4), side and insulating substrate (1), thermally conductive of the heat-conducting plate (4) close to insulating substrate (1)
Layer of silica gel (2) is fixedly connected with multilayer printed circuit board (3), and the upper end of the multilayer printed circuit board (3) is provided with dust excluding plate
(5), the left and right ends of the dust excluding plate (5) are fixedly connected with inserted block (6), the upper end of the heat-conducting plate (4) and right with inserted block (6)
The positional symmetry answered offers jack (7), and the inserted block (6) passes through jack (7) far from the one end of dust excluding plate (5) and passes through end cap
(8) it is fixedly connected with heat-conducting plate (4).
2. a kind of dust-proof multilayer printed circuit board according to claim 1, it is characterised in that: the multilayer printed circuit board
(3) upper surface is evenly arranged with electrical component (9), and the electrical component (9) is fixed on multilayered printed using the method for welding
The upper surface of circuit board (3).
3. a kind of dust-proof multilayer printed circuit board according to claim 1, it is characterised in that: under the insulating substrate (1)
Surface is evenly arranged with the first reflective ink layer (10), and the heat-conducting plate (4) is made of aluminum alloy materials.
4. a kind of dust-proof multilayer printed circuit board according to claim 1, it is characterised in that: the inserted block (6) is cylindrical
And external screw thread grinding process is carried out by the periphery of proximal cover (8) inner wall, the inner wall of the end cap (8) carries out internal screw thread burnishing part
Reason, the end cap (8) are threadedly coupled with inserted block (6).
5. a kind of dust-proof multilayer printed circuit board according to claim 1, it is characterised in that: the dust excluding plate (5) is in upward
The arc-shaped of protrusion, the upper surface of the dust excluding plate (5) is evenly arranged with the second reflective ink layer (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920013171.6U CN209731690U (en) | 2019-01-04 | 2019-01-04 | A kind of dust-proof multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920013171.6U CN209731690U (en) | 2019-01-04 | 2019-01-04 | A kind of dust-proof multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209731690U true CN209731690U (en) | 2019-12-03 |
Family
ID=68679215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920013171.6U Active CN209731690U (en) | 2019-01-04 | 2019-01-04 | A kind of dust-proof multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209731690U (en) |
-
2019
- 2019-01-04 CN CN201920013171.6U patent/CN209731690U/en active Active
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