CN213403633U - Novel circuit board - Google Patents
Novel circuit board Download PDFInfo
- Publication number
- CN213403633U CN213403633U CN202022671767.0U CN202022671767U CN213403633U CN 213403633 U CN213403633 U CN 213403633U CN 202022671767 U CN202022671767 U CN 202022671767U CN 213403633 U CN213403633 U CN 213403633U
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- layer
- coating
- circuit board
- resistant
- high strength
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- Expired - Fee Related
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Abstract
The utility model discloses a novel circuit board, the plate body includes corrosion-resistant layer, first high strength layer, second high strength layer and high temperature resistant layer, corrosion-resistant layer is located the surface of first high strength layer, first high strength layer is located the surface of second high strength layer, second high strength layer is located the surface on high temperature resistant layer, the upper and lower two sides of plate body are all scribbled and are equipped with the dope layer, the dope layer includes wear-resistant coating and heat conduction coating, the upper and lower two sides of locating the plate body are scribbled to the heat conduction coating, wear-resistant coating scribbles and is located heat conduction coating surface, wear-resistant coating is ceramic polymer paint layer, heat conduction coating is radiation cooling coating, corrosion-resistant layer is the ABS plastic layer. The utility model discloses a corrosion-resistant layer, first high strength layer, second high strength layer, high temperature resistant layer, wear-resisting coating and heat conduction coating mutually support, have solved present circuit board life weak point, the problem that people used not convenient for.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a novel circuit board.
Background
The name of the circuit board is ceramic circuit board, alumina ceramic circuit board, aluminium nitride ceramic circuit board, PCB board, aluminium base board, high frequency board, thick copper board, impedance board, ultra-thin circuit board and printing (copper etching technology) circuit board etc. the circuit board makes the circuit miniaturisation, the intuitionistic, to the batch production of fixed circuit with electric apparatus overall arrangement important role, the circuit board can be called printed wiring board or printed circuit board, but present circuit board life is short, not convenient for people to use, for this reason, we propose a novel circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel circuit board possesses long service life's advantage, has solved present circuit board life weak point, the problem that people used not convenient for.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel circuit board, the package rubbing board body, the plate body includes corrosion-resistant layer, first high strength layer, second high strength layer and high temperature resistant layer, corrosion-resistant layer is located the surface on first high strength layer, first high strength layer is located the surface on second high strength layer, second high strength layer is located the surface on high temperature resistant layer, the upper and lower two sides of plate body all scribbles and is equipped with the dope layer, the dope layer includes wear-resistant coating and heat conduction coating.
Preferably, the heat-conducting coating is coated on the upper surface and the lower surface of the plate body, and the wear-resistant coating is coated on the surface of the heat-conducting coating.
Preferably, the wear-resistant coating is a ceramic polymer paint layer, and the heat-conducting coating is a radiation heat-dissipation cooling paint.
Preferably, the corrosion-resistant layer is an ABS plastic layer, and the first high-strength layer is a polycarbonate sheet.
Preferably, the second high-strength layer is a PA plastic plate, and the high-temperature resistant layer is a PPO plastic layer.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model discloses a wear-resistant coating, can improve the wearability of circuit board, prevent that the circuit board from wearing and tearing in the use, utilize heat conduction coating, can play the radiating effect of heat conduction, improve the thermal diffusivity of circuit board, avoid the life of high temperature influence circuit board, utilize the corrosion-resistant layer, can improve the corrosion resistance of circuit board, avoid the circuit board to be corroded by the external material, utilize first high strength layer and second high strength layer, adopt the high strength material of two kinds of differences, can make the circuit board have higher intensity, avoid the circuit board condition such as fracture to appear, utilize the high temperature resistant layer, can improve the high temperature resistance of circuit board, avoid the life of high temperature influence circuit board, the current circuit board life is short, be not convenient for the problem that people used.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application, and in which:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of the plate structure of the present invention;
fig. 3 is the structure diagram of the coating layer of the present invention.
In the figure: 1. a plate body; 101. a corrosion-resistant layer; 102. a first high-strength layer; 103. a second high-strength layer; 104. a high temperature resistant layer; 2. a coating layer; 201. a wear-resistant coating; 202. a thermally conductive coating.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses a plate body 1, corrosion-resistant layer 101, first high strength layer 102, second high strength layer 103, high temperature resistant layer 104, dope layer 2, wear-resistant coating 201 and heat conduction coating 202 part are the parts that general standard component or the technical staff in the field know, and its structure and principle all are that this technical staff all can learn through the technical manual or learn through conventional experimental method.
Referring to fig. 1-3, a novel circuit board, a board body 1 includes a corrosion-resistant layer 101, a first high-strength layer 102, a second high-strength layer 103, and a high-temperature resistant layer 104, the corrosion-resistant layer 101 is located on an outer surface of the first high-strength layer 102, the corrosion-resistant layer 101 is an ABS plastic layer, the first high-strength layer 102 is a polycarbonate plate, the first high-strength layer 102 is located on an outer surface of the second high-strength layer 103, the second high-strength layer 103 is located on an outer surface of the high-temperature resistant layer 104, the second high-strength layer 103 is a PA plastic plate, the high-temperature resistant layer 104 is a PPO plastic layer, the upper and lower surfaces of the board body 1 are both coated with a paint layer 2, the paint layer 2 includes a wear-resistant coating 201 and a heat-conductive coating 202, the heat-conductive coating 202 is coated on the upper and lower surfaces of the board body 1, the wear-resistant coating 201 is a ceramic polymer paint layer, the heat-conductive coating, can improve the wearability of circuit board, prevent that the circuit board from wearing and tearing in the use, utilize heat conduction coating 202, can play the radiating effect of heat conduction, improve the thermal diffusivity of circuit board, avoid high temperature to influence the life of circuit board, utilize corrosion-resistant layer 101, can improve the corrosion resistance of circuit board, avoid the circuit board to be corroded by the foreign matter, utilize first high strength layer 102 and second high strength layer 103, adopt the high strength material of two kinds of differences, can make the circuit board have higher intensity, avoid the condition such as fracture to appear in the circuit board, utilize high temperature resistant layer 104, can improve the high temperature resistance of circuit board, avoid the life of high temperature influence circuit board, it is short to have solved present circuit board life, be not convenient for the problem that people used.
During the use, through wear-resistant coating 201, can improve the wearability of circuit board, prevent that the circuit board from wearing and tearing in the use, utilize heat conduction coating 202, can play the radiating effect of heat conduction, improve the thermal diffusivity of circuit board, avoid the high temperature to influence the life of circuit board, utilize corrosion-resistant layer 101, can improve the corrosion resistance of circuit board, avoid the circuit board to be corroded by external material, utilize first high strength layer 102 and second high strength layer 103, adopt two kinds of different high strength materials, can make the circuit board have higher intensity, avoid the circumstances such as circuit board fracture to appear, utilize high temperature resistant layer 104, can improve the high temperature resistance of circuit board, avoid the life of high temperature influence circuit board, current circuit board life is short, the problem of being not convenient for people to use is solved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a novel circuit board, includes plate body (1), its characterized in that: the plate body (1) comprises a corrosion-resistant layer (101), a first high-strength layer (102), a second high-strength layer (103) and a high-temperature-resistant layer (104), wherein the corrosion-resistant layer (101) is located on the outer surface of the first high-strength layer (102), the first high-strength layer (102) is located on the outer surface of the second high-strength layer (103), the second high-strength layer (103) is located on the outer surface of the high-temperature-resistant layer (104), coating layers (2) are coated on the upper surface and the lower surface of the plate body (1), and each coating layer (2) comprises a wear-resistant coating layer (201) and a heat-conducting coating layer (202).
2. The novel circuit board of claim 1, wherein: the heat conduction coating (202) is coated on the upper surface and the lower surface of the plate body (1), and the wear-resistant coating (201) is coated on the surface of the heat conduction coating (202).
3. The novel circuit board of claim 1, wherein: the wear-resistant coating (201) is a ceramic polymer paint layer, and the heat-conducting coating (202) is a radiation heat-dissipation cooling coating.
4. The novel circuit board of claim 1, wherein: the corrosion-resistant layer (101) is an ABS plastic layer, and the first high-strength layer (102) is a polycarbonate plate.
5. The novel circuit board of claim 1, wherein: the second high-strength layer (103) is a PA plastic plate, and the high-temperature resistant layer (104) is a PPO plastic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022671767.0U CN213403633U (en) | 2020-11-18 | 2020-11-18 | Novel circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022671767.0U CN213403633U (en) | 2020-11-18 | 2020-11-18 | Novel circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213403633U true CN213403633U (en) | 2021-06-08 |
Family
ID=76194490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022671767.0U Expired - Fee Related CN213403633U (en) | 2020-11-18 | 2020-11-18 | Novel circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213403633U (en) |
-
2020
- 2020-11-18 CN CN202022671767.0U patent/CN213403633U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210608 Termination date: 20211118 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |