CN209693159U - A kind of high-accuracy PCB metallized semi-pore circuit board structure - Google Patents
A kind of high-accuracy PCB metallized semi-pore circuit board structure Download PDFInfo
- Publication number
- CN209693159U CN209693159U CN201822038072.1U CN201822038072U CN209693159U CN 209693159 U CN209693159 U CN 209693159U CN 201822038072 U CN201822038072 U CN 201822038072U CN 209693159 U CN209693159 U CN 209693159U
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- Prior art keywords
- pcb
- heat
- motherboard
- fin
- circuit board
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- 239000011148 porous material Substances 0.000 title claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 9
- 230000004087 circulation Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000005526 G1 to G0 transition Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of high-accuracy PCB metallized semi-pore circuit board structures, including PCB motherboard, PCB daughter board and PCB bottom plate, the PCB daughter board is grabbed by the button of bottom end to be fixedly linked with PCB motherboard, metal half bore is offered on the upside of the PCB daughter board, fixed column is welded between the PCB motherboard and PCB bottom plate, the middle side of the fixed column, which wears to connect, is fixed with heat sink, the utility model passes through heat dissipating layer, fin, the matching design of heat sink and heat-sink shell, generated heat is quickly sent to the fin of bottom side along the heat dissipating layer of bottom side when PCB motherboard and the operation of PCB daughter board, increasing corresponding contact area makes fin sufficiently contact with air to reach more effective heat dissipation effect, simultaneously in fin and heat sink side via design, but also corresponding air energy Enough quickly circulations, heat dissipation effect can effectively be guaranteed by matching with the radiator fan in outside, and structure design is close reasonable, has very strong practicability, be suitble to promote.
Description
Technical field
The utility model belongs to wiring board technology field, and in particular to a kind of high-accuracy PCB metallized semi-pore route is hardened
Structure.
Background technique
Currently, being used with the extensive utilization of electronic product surface mounting technology and the becoming increasingly complex of use environment
Family requires more and more complexity to the production of PCB product, is not only quality requirements, and process requires height, in limitation route
When plate is installed, since route is more complicated, electrical component is numerous, and the heat that electric current generates is not easy to shift or spread, and causes electricity
Gas element or aging circuit cause fault, and in mounting process complexity, poor reliability.
It is that CN206380158U Chinese patent discloses a kind of high-accuracy PCB metallized semi-pore wiring board to the displosure number,
Including PCB motherboard, pillar, PCB bottom plate, PCB daughter board, through-hole, supporting plate, coldplate, cooling tube, button grabbed, and groove, cooling hole dissipates
Hot chamber and metal half bore, the PCB motherboard lower part pass through pillar connection PCB bottom plate；It is fixed that the PCB daughter board is grasped by button
In the groove in the middle part of PCB motherboard；The supporting plate is supported on the middle part of PCB motherboard Yu PCB daughter board；The coldplate two sides
Cooling tube is installed；The metal half bore is arranged on PCB daughter board top.Above-mentioned utility model PCB daughter board, coldplate, cooling tube,
Button grabs the setting with groove, is conducive to improve heat dissipation effect, install convenient, simple process is convenient for marketing and application.
But above scheme still has corresponding limitation: cooling tube and PCB motherboard and PCB daughter board in practical applications
Between there is no enough contacts area, it is difficult to realize the quick transmitting of heat, corresponding heat dissipation effect, while pcb board is located for a long time
Working at relatively high temperatures, there are corresponding security risks, corresponding failure easily occur.
Utility model content
It is above-mentioned to solve the purpose of this utility model is to provide a kind of high-accuracy PCB metallized semi-pore circuit board structure
The problem of being proposed in background technique.
To achieve the above object, the utility model provides the following technical solutions: a kind of high-accuracy PCB metallized semi-pore route
Hardened structure, including PCB motherboard, PCB daughter board and PCB bottom plate, the PCB daughter board are grabbed and PCB motherboard stationary phase by the button of bottom end
Even, metal half bore is offered on the upside of the PCB daughter board, is welded with fixed column between the PCB motherboard and PCB bottom plate, it is described
The middle side of fixed column, which wears to connect, is fixed with heat sink, and the equidistant interlocking in four sides of the heat sink is installed on fin, the heat sink
Middle side offer through-hole, the bottom side of the PCB motherboard is bonded with heat dissipating layer, and the upper end of the PCB bottom plate is coated with heat-sink shell.
Preferably, the PCB motherboard is identical as the section thickness of PCB bottom plate, there are four the metal half bore opens up.
Preferably, the quadrangle of the heat sink offers jack hole, and the diameter length of the jack hole is greater than fixed column
Diameter of section length.
Preferably, the height of the fin and the height of fixed column are identical, and the section thickness of the heat sink is lower than wing
The height of piece.
Preferably, for the fin between heat dissipating layer and heat-sink shell, the thickness of the heat dissipating layer and heat-sink shell is not low
In 2um.
Preferably, the length of the heat sink and width are below the length and width of PCB motherboard, and the through-hole is in oval
Shape.
The technical effect and advantage of the utility model: the utility model passes through heat dissipating layer, fin, heat sink and heat-sink shell
Generated heat is quickly sent to the wing of bottom side along the heat dissipating layer of bottom side when matching design, PCB motherboard and the operation of PCB daughter board
Piece increases corresponding contact area and makes fin sufficiently contact with air to reach more effective heat dissipation effect, together
When fin and heat sink in side via design, but also corresponding air can quickly circulate, the radiator fan with outside
Heat dissipation effect can effectively be guaranteed by matching, and the heat-sink shell design of bottom side can effectively the heat to fin carry out accordingly
Absorption carries out auxiliary heat dissipation, and structure design is close reasonable, has very strong practicability, is suitble to promote.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram of the utility model heat sink；
Fig. 3 is the present invention looks up structural representation of the utility model PCB motherboard；
Fig. 4 is the overlooking structure diagram of the utility model PCB bottom plate.
In figure: 1-PCB daughter board, 2- metal half bore, 3- button grab, 4-PCB motherboard, 5-PCB bottom plate, 6- fixed column, 7- fin,
8- heat sink, 9- jack hole, 10- through-hole, 11- heat dissipating layer, 12- heat-sink shell.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of high-accuracy PCB metallized semi-pore circuit board structure as shown in Figs 1-4, including
PCB motherboard 4, PCB daughter board 1 and PCB bottom plate 5, the PCB daughter board 1 grab the groove opened up on 3 and PCB motherboard 4 by the button of bottom end
It is fixedly linked, the upside of the PCB daughter board 1 offers metal half bore 2, is welded between the PCB motherboard 4 and PCB bottom plate 5 solid
Fixed column 6, the middle side of the fixed column 6, which wears to connect, is fixed with heat sink 8, and the equidistant interlocking in four sides of the heat sink 8 is installed on wing
Piece 7, the middle side of the heat sink 8 offer through-hole 10, and the bottom side of the PCB motherboard 4 is bonded with heat dissipating layer 11, the heat dissipating layer
11 be artificial graphite radiating film, runs generated heat convenient for PCB motherboard 4 and PCB daughter board 1 and quickly conducts to fin 7, described
The upper end of PCB bottom plate 5 is coated with heat-sink shell 12, and the heat-sink shell 12 is alumilite process coating, convenient for the heat on fin 7
It carries out certain absorption and carries out auxiliary heat dissipation.
Specifically, the PCB motherboard 4 is identical as the section thickness of PCB bottom plate 5, there are four the metal half bore 2 opens up.
Specifically, the quadrangle of the heat sink 8 offers jack hole 9, the diameter length of the jack hole 9, which is greater than, to be fixed
The diameter of section length of column 6.
Specifically, the height of the fin 7 is identical as the height of fixed column 6, the section thickness of the heat sink 8 is lower than
The height of fin 7.
Specifically, the fin 7 is between heat dissipating layer 11 and heat-sink shell 12, the thickness of the heat dissipating layer 11 and heat-sink shell 12
Degree is not less than 2um.
Specifically, the length of the heat sink 8 and width are below the length and width of PCB motherboard 4, the through-hole 10 is in
Oval shape.
The utility model when in use, passes through the matching design of heat dissipating layer 11, fin 7, heat sink 8 and heat-sink shell 12, PCB
Heat dissipating layer 11 of the generated heat along bottom side is quickly sent to the fin 7 of bottom side when motherboard 4 and the operation of PCB daughter board 1, increases
Corresponding contact area makes fin 7 sufficiently contact with air to reach more effective heat dissipation effect, at the same fin 7 with
And the through-hole 10 of side designs in heat sink 8, but also corresponding air can quickly circulate, matches with the radiator fan in outside
It can effectively guarantee heat dissipation effect, the design of heat-sink shell 12 of bottom side can effectively be inhaled the heat to fin 7 accordingly
It is attached, auxiliary heat dissipation is carried out, structure design is close reasonable, has very strong practicability, is suitble to promote.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (6)
1. a kind of high-accuracy PCB metallized semi-pore circuit board structure, including PCB motherboard (4), PCB daughter board (1) and PCB bottom plate
(5), it is characterised in that: the PCB daughter board (1) grabs (3) by the button of bottom end and is fixedly linked with PCB motherboard (4), PCB
It is offered on the upside of plate (1) metal half bore (2), is welded with fixed column (6), institute between the PCB motherboard (4) and PCB bottom plate (5)
The middle side for stating fixed column (6) is worn to connect and is fixed with heat sink (8), and the equidistant interlocking in four sides of the heat sink (8) is installed on fin
(7), the middle side of the heat sink (8) offers through-hole (10), and the bottom side of the PCB motherboard (4) is bonded with heat dissipating layer (11), institute
The upper end for stating PCB bottom plate (5) is coated with heat-sink shell (12).
2. a kind of high-accuracy PCB metallized semi-pore circuit board structure according to claim 1, it is characterised in that: the PCB
Motherboard (4) is identical as the section thickness of PCB bottom plate (5), there are four the metal half bore (2) opens up.
3. a kind of high-accuracy PCB metallized semi-pore circuit board structure according to claim 1, it is characterised in that: described to dissipate
The quadrangle of hot plate (8) offers jack hole (9), and the diameter length of the jack hole (9) is greater than the diameter of section of fixed column (6)
Length.
4. a kind of high-accuracy PCB metallized semi-pore circuit board structure according to claim 1, it is characterised in that: the wing
The height of piece (7) is identical as the height of fixed column (6), and the section thickness of the heat sink (8) is lower than the height of fin (7).
5. a kind of high-accuracy PCB metallized semi-pore circuit board structure according to claim 1, it is characterised in that: the wing
Piece (7) is located between heat dissipating layer (11) and heat-sink shell (12), and the heat dissipating layer (11) and the thickness of heat-sink shell (12) are not less than
2um。
6. a kind of high-accuracy PCB metallized semi-pore circuit board structure according to claim 1, it is characterised in that: described to dissipate
The length and width of hot plate (8) are below the length and width of PCB motherboard (4), and the through-hole (10) is in oval shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822038072.1U CN209693159U (en) | 2018-12-06 | 2018-12-06 | A kind of high-accuracy PCB metallized semi-pore circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822038072.1U CN209693159U (en) | 2018-12-06 | 2018-12-06 | A kind of high-accuracy PCB metallized semi-pore circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209693159U true CN209693159U (en) | 2019-11-26 |
Family
ID=68595536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822038072.1U Active CN209693159U (en) | 2018-12-06 | 2018-12-06 | A kind of high-accuracy PCB metallized semi-pore circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209693159U (en) |
-
2018
- 2018-12-06 CN CN201822038072.1U patent/CN209693159U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200508 Address after: 3a11, block B, Tongxin technology building, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen xinruijie Electronic Co.,Ltd. Address before: 518000 zone a, floor 3, building 1, Taoyuan Industrial Zone, Huangtian community, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen tuochi Electronic Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240622 Address after: 518000, Main Tower 2117C, Ocean Shipping Center, No. 59 Linhai Avenue, Nanshan Street, Qianhai Shenzhen Hong Kong Cooperation Zone, Shenzhen, Guangdong Province Patentee after: Shenzhen Gongying Era Technology Industry Co.,Ltd. Country or region after: China Address before: 518000 3a11, block B, Tongxin technology building, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen xinruijie Electronic Co.,Ltd. Country or region before: China |