CN209524795U - A kind of temperature-uniforming plate for strengthening heat transfer capability - Google Patents
A kind of temperature-uniforming plate for strengthening heat transfer capability Download PDFInfo
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- CN209524795U CN209524795U CN201821863494.6U CN201821863494U CN209524795U CN 209524795 U CN209524795 U CN 209524795U CN 201821863494 U CN201821863494 U CN 201821863494U CN 209524795 U CN209524795 U CN 209524795U
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Abstract
The utility model discloses a kind of temperature-uniforming plates for strengthening heat transfer capability, including upper cover plate, support column and lower cover plate, by being sintered to fix between the upper cover plate and lower cover plate, it is internal after the upper cover plate and lower cover plate sintering to form vacuum cavity, support column is evenly arranged between the upper cover plate and lower cover plate.The temperature-uniforming plate of the reinforcing heat transfer capability is by being provided with multiple capillary structures, so that after working fluid liquefaction lower cover plate can be back to by groove capillary structure, groove capillary structure improves the permeability of working fluid simultaneously, reduce the reflux flow resistance of working fluid, and increase the mass flow rate of working fluid, improve the heat transfer capability of temperature-uniforming plate, when the device passes through high-temperature soldering upper cover plate and lower cover plate simultaneously, support column and upper cover plate and lower cover plate or on, the contact surface of lower capillary structure, also it is tightly engaged into via molecule Diffusion Welding, increase the mechanical strength of device.
Description
Technical field
The utility model relates to temperature-uniforming plate technical field, specially a kind of temperature-uniforming plate for strengthening heat transfer capability.
Background technique
The metal shell of existing temperature-uniforming plate is combined by upper and lower two metal cap body, and electronic component is attached at as evaporation
In the lower metal cap body at end, and upper metal cap body is then as cooling interface, the electronic component running of metal cap body absorption instantly when institute
After the heat of generation, it is used as power via the vaporization liquefaction cycle for being closed in working fluid in vacuum cavity, then by upper metal cap body
It radiates, however, lower metal cap body heating work liquid forms steam state and rises to metal cover circle when temperature-uniforming plate heat
Face, since the cooling interface of upper metal cap body has conductive force, the heat removed from upper metal cap body, and upper metal cap body is cooling
The liquefied working fluid in interface is but difficult to be recycled to lower metal cap body, so that lower metal cap body temperature is excessively high always, temperature is difficult
To distribute, therefore a kind of temperature-uniforming plate of reinforcing heat transfer capability is needed to solve the above problems.
Utility model content
The purpose of this utility model is to provide a kind of temperature-uniforming plates for strengthening heat transfer capability, to solve above-mentioned background skill
The existing strong temperature-uniforming plate proposed in art has conductive force since upper metal cap body cools down interface, and upper metal cap body cools down boundary
The liquefied working fluid in face is but difficult to be recycled to lower metal cap body, so that lower metal cap body temperature is excessively high always, temperature is difficult to
The problem of distributing.
To achieve the above object, the utility model provides the following technical solutions: a kind of samming for strengthening heat transfer capability
Plate, including upper cover plate, support column and lower cover plate, by being sintered to fix between the upper cover plate and lower cover plate, the upper cover plate and
It is internal after lower cover plate sintering to form vacuum cavity, support column, the upper cover are evenly arranged between the upper cover plate and lower cover plate
Working fluid is placed with inside vacuum cavity between plate and lower cover plate.
Preferably, the side of the lower cover plate contact heat source has heating zone, and the upper cover plate has to be heated with lower cover plate
The corresponding cooling zone in area.
Preferably, the lower cover plate is made of metal plate and capillary structure.
Preferably, the upper cover plate is made of metal plate and capillary structure.
Preferably, the upper cover plate and lower cover plate all have capillary structure, and capillary structure is by mesh-type metal mesh and powder
Last layer sintering composition.
Preferably, the support column is made of metallic conductor and capillary structure.
Preferably, the metallic conductor section is selected from circle.
Preferably, the working fluid has the characteristic that can be changed into steam state by liquid.
Preferably, the capillary structure of the upper cover plate and lower cover plate is to be combined by mesh-type metal mesh with metal plate sintering
The powder bed with uniform thickness is refilled later to carry out double sintering and formed.
Preferably, the support column by be distributed with around solid metal body certain thickness powder bed and metallic object sintering and
At.
Preferably, the working fluid is dipped in upper cover plate, in the capillary structure of lower cover plate and support column.
Compared with prior art, the utility model has the beneficial effects that the temperature-uniforming plate of the reinforcing heat transfer capability is by one
Seven layers of composition such as layer upper cover plate, two layers of mesh-type metal mesh, one layer of support column, two layers of powder bed and one layer of lower cover plate, pass through
Multiple capillary structures are provided with, so that lower cover plate, while ditch can be back to by groove capillary structure after working fluid liquefaction
Slot capillary structure improves the permeability of working fluid, reduces the reflux flow resistance of working fluid, and increases working fluid
Mass flowrate, mass flowrate refers to the quality size that the unit time flows through in particular range as its name suggests, improves samming
The heat transfer capability of plate, while when the device passes through high-temperature soldering upper cover plate and lower cover plate, support column and upper cover plate and lower cover
The contact surface of plate or upper and lower capillary structure is also tightly engaged into via molecule Diffusion Welding, increases the mechanical strength of device.
Detailed description of the invention
Fig. 1 is the structure schematic elevation view of the utility model；
Fig. 2 is that the structure of the utility model faces diagrammatic cross-section；
Fig. 3 is that the structure of the utility model faces explosive view；
Fig. 4 is the structure overlook explosive view of the utility model.
In figure: 1, upper cover plate；2, support column；3, lower cover plate；4, mesh-type metal mesh；5, powder bed.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-4 is please referred to, a kind of embodiment provided by the utility model:
A kind of temperature-uniforming plate for strengthening heat transfer capability, including upper cover plate 1, support column 2 and lower cover plate 3, upper cover plate 1 is under
It is internal after upper cover plate 1 and the sintering of lower cover plate 3 to form vacuum cavity, upper cover plate 1 and lower cover plate 3 by being sintered to fix between cover board 3
Between be evenly arranged with support column 2, be placed with working fluid inside the vacuum cavity between upper cover plate 1 and lower cover plate 5.
Preferably, the side that lower cover plate 3 contacts heat source has heating zone, and upper cover plate 1 has and 3 heating zone pair of lower cover plate
The cooling zone answered achievees the effect that equalization temperature by working fluid in two region internal circulation flows.
Preferably, lower cover plate 3 is made of metal plate and capillary structure, and upper cover plate 1 is made of metal plate and capillary structure, on
Cover board 1 and lower cover plate 3 all have capillary structure, and capillary structure is made of mesh-type metal mesh 4 and the sintering of powder bed 5, mesh
There are two formula metal mesh 4 and powder bed 5 are all arranged, and it is symmetrical about support column 2, working fluid is convenient for by groove capillary structure
Flowing.
Preferably, working fluid has the characteristic that can be changed into steam state by liquid, passes through working fluid vaporization absorption heat
Amount adsorbs the heat of 3 side of lower cover plate.
Preferably, support column 2 is made of metallic conductor and capillary structure, and metallic conductor section is selected from circle, however not excluded that has
Square, rectangle, parallel four side row and and non-square, non-rectangle and non-parallel quadrangle it is combined made of have
Arrangement at regular intervals, support column 2 by being distributed with certain thickness powder bed 5 and metallic object sintering around solid metal body and
At being sintered in 2 surface of support column with metallic object to form capillary structure, effect is on cooperation upper cover plate 1 and lower cover plate 3
Groove capillary structure, so that device overall structure is connected as one, convenient for the circulation of working fluid.
Preferably, working fluid is dipped in upper cover plate 1, in the capillary structure of lower cover plate 3 and support column 2, working fluid liquefaction
It is back to lower cover plate 3 through support column 2 by upper cover plate 1 afterwards, forms channel between adjacent support column 2, effect is to reduce work
Resistance when liquid reflux realizes circulation of the working fluid between upper cover plate 1 and lower cover plate 3, and temperature on lower cover plate 3 is avoided to begin
It is excessively high eventually, it is difficult to distribute.
Working principle: when in use, first when lower cover plate 3 contacts heat source, lower cover plate 3 can import heat, to vacuum
The working fluid of inside cavity is heated, so that working fluid becomes steam state from liquid, working fluid can be because of weight at this time
It die-offs and rises, when the working fluid of steam state is contacted with upper cover plate 1, by the heat absorption of the cooling zone on upper cover plate 1, so that vapour
The working solution temperature reduction of state becomes liquid from steam state, then by the groove capillary structure on upper cover plate 1, through on support column 2
Groove capillary structure formed channel be back to lower cover plate 3, realize the recycling of working fluid, lower cover plate 3 will not be made
Temperature it is excessively high always, it is difficult to distribute, the permeability of working fluid improved by groove capillary structure, reduces working fluid
Reflux flow resistance, and increase the mass flowrate of working fluid, mass flowrate refers to the unit time in specific model as its name suggests
The quality size flowed through in enclosing, improves the heat transfer capability of temperature-uniforming plate, at the same the device by high-temperature soldering upper cover plate 1 and
When lower cover plate 3, the contact surface of support column 2 and upper cover plate 1 and lower cover plate 3 or upper and lower capillary structure, also via molecule diffusion welding (DW)
It connects and is tightly engaged into, increase the mechanical strength of device.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
Claims (11)
1. a kind of temperature-uniforming plate for strengthening heat transfer capability, including upper cover plate (1), support column (2) and lower cover plate (3), feature
It is: by being sintered to fix between the upper cover plate (1) and lower cover plate (3), after the upper cover plate (1) and lower cover plate (3) sintering
Inside forms vacuum cavity, is evenly arranged with support column (2), the upper cover plate between the upper cover plate (1) and lower cover plate (3)
(1) working fluid is placed with inside the vacuum cavity between lower cover plate (3).
2. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 1, it is characterised in that: the lower cover plate
(3) side for contacting heat source has heating zone, and the upper cover plate (1) has cooling zone corresponding with lower cover plate (3) heating zone.
3. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 1, it is characterised in that: the lower cover plate
(3) it is made of metal plate and capillary structure.
4. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 1, it is characterised in that: the upper cover plate
(1) it is made of metal plate and capillary structure.
5. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 1, it is characterised in that: the upper cover plate
(1) and lower cover plate (3) all has capillary structure, and capillary structure is made of mesh-type metal mesh (4) and powder bed (5) sintering.
6. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 1, it is characterised in that: the support column
(2) it is made of metallic conductor and capillary structure.
7. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 6, it is characterised in that: the metallic conductor
Section is selected from circle.
8. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 1, it is characterised in that: the working solution
Body has the characteristic that can be changed into steam state by liquid.
9. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 5, it is characterised in that: the upper cover plate
It (1) is to refill to have after being combined by mesh-type metal mesh (4) with metal plate sintering with the capillary structure of lower cover plate (3)
The powder bed (5) of even thickness carries out double sintering and is formed.
10. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 6, it is characterised in that: the support column
(2) it is sintered by certain thickness powder bed (5) is distributed with around solid metal body with metallic object.
11. a kind of temperature-uniforming plate for strengthening heat transfer capability according to claim 7, it is characterised in that: the working solution
Body is dipped in upper cover plate (1), in the capillary structure of lower cover plate (3) and support column (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821863494.6U CN209524795U (en) | 2018-11-13 | 2018-11-13 | A kind of temperature-uniforming plate for strengthening heat transfer capability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821863494.6U CN209524795U (en) | 2018-11-13 | 2018-11-13 | A kind of temperature-uniforming plate for strengthening heat transfer capability |
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| Publication Number | Publication Date |
|---|---|
| CN209524795U true CN209524795U (en) | 2019-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821863494.6U Active CN209524795U (en) | 2018-11-13 | 2018-11-13 | A kind of temperature-uniforming plate for strengthening heat transfer capability |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420634A (en) * | 2020-10-26 | 2021-02-26 | 南昌航空大学 | High-efficiency chip heat dissipation structure |
| CN112447630A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat dissipation body and chip package having the same |
| CN112447631A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat radiation structure of packaged chip |
| CN114383454A (en) * | 2022-02-10 | 2022-04-22 | 嵊州天脉导热科技有限公司 | VC soaking plate lower cover plate capillary structure |
-
2018
- 2018-11-13 CN CN201821863494.6U patent/CN209524795U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420634A (en) * | 2020-10-26 | 2021-02-26 | 南昌航空大学 | High-efficiency chip heat dissipation structure |
| CN112447630A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat dissipation body and chip package having the same |
| CN112447631A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat radiation structure of packaged chip |
| CN114383454A (en) * | 2022-02-10 | 2022-04-22 | 嵊州天脉导热科技有限公司 | VC soaking plate lower cover plate capillary structure |
| CN114383454B (en) * | 2022-02-10 | 2024-05-10 | 嵊州天脉导热科技有限公司 | VC vapor chamber lower cover plate capillary structure |
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