CN103415192A - Temperature averaging device of steam chamber heat pipe/microchannel cold plate composite structure - Google Patents
Temperature averaging device of steam chamber heat pipe/microchannel cold plate composite structure Download PDFInfo
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- CN103415192A CN103415192A CN2013103661317A CN201310366131A CN103415192A CN 103415192 A CN103415192 A CN 103415192A CN 2013103661317 A CN2013103661317 A CN 2013103661317A CN 201310366131 A CN201310366131 A CN 201310366131A CN 103415192 A CN103415192 A CN 103415192A
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Abstract
The invention discloses a temperature averaging device of a steam chamber heat pipe/microchannel cold plate composite structure. The device comprises a metal shell, steam cavity heat pipe layers and a microchannel cold plate layer, wherein the microchannel cold plate layer is located between the two steam cavity heat pipe layers, and the steam cavity heat pipe layers and the microchannel cold plate layer are all located in the metal shell. The liquid working medium phase-change heat exchange method is adopted for the device to transmit a large amount of heat in a gasified latent heat mode, and therefore the heat exchange capacity is remarkably improved. Because only one face of an existing steam cavity heat pipe is an evaporating face and is small in area, the utilization area of the whole is limited. The upper face and the lower face of the temperature averaging device of the composite structure are both evaporating faces, therefore, electronic components with high heating flux can be distributed on both the whole surface of the upper face and the whole surface of the lower face, the utilization rate is obviously improved, and the temperature averaging device of the composite structure can meet the thermal control requirements of the electronic components with high heating flux in the electronic industry field better. The temperature averaging device of the steam chamber heat pipe/microchannel cold plate composite structure is smaller in height, the height of a single microchannel cold plate layer in the prior art is 9mm, but the overall height of the temperature averaging device of the steam chamber heat pipe/microchannel cold plate composite structure is not larger than 9 mm.
Description
Technical field
The present invention relates to the dissipation from electronic devices field, be specifically related to a kind of vapor chamber heat pipe/microchannel cold plates composite construction temperature equalization system, for the temperature uniforming heat radiation of high heat flux electronic device.
Technical background
In electronics industry, the density of heat flow rate of electronic device has broken through 100W/cm at present
2.Ten degrees centigrade of the every risings of the temperature of electronic device, reliability will reduce by 50%, and therefore the high heat flux electronic device being carried out to temperature control is extremely urgent demand.That common radiating mode has is air-cooled, liquid cooling and Phase cooling.The research of document 1(liquid cold plate, Xu Dehao, Yang Dongmei, electric mechanical engineering, the first phase in 2006,4-6 page) point out, when density of heat flow rate is greater than 5W/cm
2The time, the air-cooled type of cooling just can not meet the heat radiation requirement, just should adopt the type of cooling of liquid cooling.Microchannel cold plates is to use at present more liquid cooling cooling device.Microchannel cold plates has higher cooling effectiveness, but also has following problem: 1, size restrictions is comparatively obvious.The size of microchannel cold plates can not be excessive, and the length between especially importing and exporting is unsuitable long, otherwise it is excessive to cause being arranged in the temperature contrast of the lip-deep electronic device of microchannel cold plates, can't meet the requirements of whole uniform temperature.2, microchannel cold plates is mainly taken away heat in the mode of forced convection, and this is only applicable to density of heat flow rate and is less than 100W/cm
2Situation.Under the high heat flux condition, because the temperature difference of microchannel cold plates import and outlet is larger, therefore cause being arranged near outlet electronic device temperature apparently higher than the temperature that is arranged near the electronic device import, this situation is in the situation that arrange that a large amount of electronic devices are especially obvious, particularly be difficult to the root mean square temperature difference of a plurality of electronic devices is controlled in the preferred range, for example 5 ℃, be difficult to the even temperature effect that reaches good.Therefore, under the high heat flux condition, should adopt phase change heat exchange device to dispel the heat.
Summary of the invention
The object of the present invention is to provide a kind of vapor chamber heat pipe/microchannel cold plates composite construction temperature equalization system, solved the heat dissipation problem of high heat flux electronic device, the uniform temperature problem of especially a plurality of electronic devices.Due to the vapor chamber heat pipe only within it section physical process occurs, and no-movable part, machinery-free loss, do not consume extra power and reliability is high, the temperature that therefore is particularly suitable for the high heat flux electronic device is controlled.
The technical solution that realizes the object of the invention is: a kind of vapor chamber heat pipe/microchannel cold plates composite construction temperature equalization system, comprise metal shell, steam cavity heat pipe layer and microchannel cold plates layer, the microchannel cold plates layer is between two steam cavity heat pipe layers, and steam cavity heat pipe layer and microchannel cold plates layer all are positioned at metal shell.Described steam cavity heat pipe layer comprises capillary layer and reinforcement, capillary layer comprises evaporating surface capillary layer, cryosurface capillary layer, surrounding sidewall capillary layer and covers the capillary layer on reinforcement surface, reinforcement one end is connected in evaporating surface capillary layer inwall, and the other end is connected in cryosurface capillary layer inwall.The preferred cylinder of reinforcement, between adjacent reinforcement, horizontal spacing is not more than 40 mm.The capillary layer that covers the reinforcement surface is made by sintering metal powder.Described microchannel cold plates layer adopts the total runner of S type.The total height of vapor chamber heat pipe/microchannel cold plates composite construction temperature equalization system is not more than 9mm.
Compared with prior art, the remarkable advantage of vapor chamber heat pipe of the present invention/microchannel cold plates composite construction temperature equalization system is: 1, phase-change heat-exchange, adopt the mode of liquid working substance phase-change heat-exchange to transmit amount of heat with the form of gasification latent heat, significantly improved exchange capability of heat; 2, utilance of the present invention is higher, existing vapor chamber heat pipe only one side is that evaporating surface and area are less, what so just cause integral body utilizes area limited, two surfaces up and down of composite construction temperature equalization system of the present invention are evaporating surface, namely on the whole surface of upper and lower surface, all can arrange the high heat flux electronic device, so just obviously improve utilance, and be more suitable for the thermal control demand of high heat flux electronic device in electronics industry; 3, the upper and lower two-layer vapor chamber heat pipe layer that is of composite construction temperature equalization system of the present invention.Due to vapor chamber heat pipe layer inside, be the cavity be communicated with, during work, inside is full of the saturated steam that temperature is identical all the time, therefore on the evaporating surface surface, can form good temperature uniform properties.The heat pipe layer of the vapor chamber up and down inside of composite construction temperature equalization system of the present invention preferably adopts the sintering metal powder layer as capillary structure, and the inner evaporating surface of vapor chamber heat pipe layer and cryosurface and reinforcement surface all preferably are coated with sintering metal powder, in order to reduce the return flow path of condensed fluid working medium and improve the antigravity performance; 4, height of the present invention is thinner, and the height of the single microchannel cold plates layer of prior art just has 9mm, and whole height of the present invention is not more than 9mm.
The accompanying drawing explanation
Fig. 1 is the principle schematic of vapor chamber heat pipe of the present invention/microchannel cold plates composite construction temperature equalization system.
Fig. 2 is the physical dimension schematic diagram of vapor chamber heat pipe of the present invention/microchannel cold plates composite construction temperature equalization system, wherein figure (A) is the longitudinal section partial schematic diagram of described composite construction temperature equalization system, and figure (B) is the cross section partial schematic diagram of the vapor chamber heat pipe layer of described composite construction temperature equalization system.
Fig. 3 is the local enlarged diagram of the capillary layer of vapor chamber heat pipe of the present invention/microchannel cold plates composite construction temperature equalization system.
Fig. 4 is the cross sectional representation of the microchannel cold plates layer of vapor chamber heat pipe of the present invention/microchannel cold plates composite construction temperature equalization system.
Embodiment
Below in conjunction with accompanying drawing, will be described the specific embodiment of the present invention.
In conjunction with Fig. 1, be arranged in the lip-deep high heat flux electronic device of vapor chamber heat pipe layer 2 (being called thermal source in Fig. 1) and by heat, conduct the evaporating surface capillary layer 6 that amount of heat is passed to vapor chamber heat pipe layer 2, because vapor chamber heat pipe layer 2 inside are vapour-liquid two-phase saturation condition, therefore the liquid working substance that absorbs heat is vaporized rapidly, be accompanied by the increase of pressure, gas working medium is to 7 motions of cryosurface capillary layer, in the middle of after arriving cryosurface capillary layer 7, being subject to, microchannel cold plates layer 3 is cooling, gas working medium discharges the latent heat of vaporization, again be converted into liquid, and along the capillary layer 9 of reinforcement 5 and capillary layer 8 backflows of surrounding sidewall, enter evaporating surface capillary layer 6 under the driving of pressure, complete thus the circulation of liquid working substance, simultaneously, microchannel cold plates layer 3 is brought the latent heat of vaporization that phase transformation discharges into external environment, in order to maintain the evaporation-condensation circulation of vapor chamber heat pipe layer 2 inside.
Vapor chamber heat pipe of the present invention/microchannel cold plates composite construction temperature equalization system utilizes the phase transformation of the liquid working substance of vapor chamber heat pipe layer 2 inner encapsulation, the amount of heat that will be arranged in its surperficial high heat flux electronic device with the form of gasification latent heat transmits, by microchannel cold plates layer 3, a large amount of latent heats of vaporization that vapor chamber heat pipe layer 2 transmits are passed to external environment, in order to the high heat flux electronic device is carried out to temperature control.The inner cavity for being communicated with of vapor chamber heat pipe layer 2 of described composite construction temperature equalization system, when work, be full of all the time the saturated steam that temperature is identical in the cavity of vapor chamber heat pipe layer 2, therefore can carry out to the high heat flux electronic device that is arranged in vapor chamber heat pipe layer 2 surface effectively all temperature controls.
In conjunction with Fig. 2 and Fig. 3, the total height that described composite construction temperature equalization system is removed after the cover plate of upper and lower vapor chamber heat pipe layer 2 is 8mm, wherein the cover plate of two-layer vapor chamber heat pipe layer 2 is the cover plate of not shown vapor chamber heat pipe layer 2 in 0.5mm(Fig. 2 A), the housing depth of two-layer vapor chamber heat pipe layer 2 is 2mm, the microchannel runner height of microchannel cold plates layer 3 is 2mm, and the diameter of reinforcement 5 is 5mm.The capillary layer 4 of vapor chamber heat pipe layer 2 inside adopts and consists of sintering metal powder, also can adopt such as silk screen or conduit as capillary layer 4.The width of flow path of the microchannel of described microchannel cold plates layer 3 is 0.5mm, and the ratio of the depth-width ratio height and the width of microchannel runner is not less than 4.The hydraulic diameter that it should be noted described microchannel runner should be not more than 3mm.As can be seen from Figure 2B, described vapor chamber heat pipe layer 2 internal placement have reinforcement 5, and this reinforcement 5 is cylindrical, and diameter is 5mm.In Fig. 2 B, the transverse arrangement of turbo spacing of reinforcement 5 is 25mm, is vertically 15mm.It should be noted, the transverse arrangement of turbo spacing of described reinforcement 5 is not more than 40mm, and vertically arrange and be not less than two rows, and in horizontal and vertical impartial pitch arrangement.
Described capillary layer 4 adopts the metal powder sintered of multiple particle diameter to make, and its thickness is not less than four times of average grain diameter of the metal dust that sintering adopts.According to prior art, the metal dust of greater particle size mainly plays combination, namely by the metal dust that melts large particle diameter, increases the contact area of molten metal powder, so that in conjunction with other metal dusts than small particle diameter.Metal dust than small particle diameter is filled in gap, in order to form loose structure, provides required capillary force.The different-grain diameter metal dust can form the porous media that inside is multiple aperture, for example, sinter layer is large particle diameter powder near the part of housing, and it can reduce the flow resistance of liquid working substance, part away from housing is the small particle diameter powder, and it can provide larger capillary force.In addition, can be according to multiple particle diameters that requires the comprehensive selection sintered powder such as antigravity, permeability.
In conjunction with Fig. 4, the middle microchannel cold plates layer 3 of composite construction temperature equalization system of the present invention has 5 groups of runners altogether, and wherein every group of runner all has 55 microchannel runners, and the total runner that connects every group of runner is the serpentine runner.As can be known by prior art, because being flowing in when Reynolds number is hundreds of in microchannel can reach turbulence state, so the exchange capability of heat of microchannel cold plates layer 3 is greater than conventional runner cold drawing layer.It should be noted, although the exchange capability of heat of microchannel cold plates layer 3 is stronger, the flow resistance of microchannel cold plates layer 3 is also larger, therefore should select according to rational flow resistance quantity, spacing and the height of the microchannel runner of microchannel cold plates layer 3.
The present invention can be controlled at the root mean square temperature difference of 40 high heat flux electronic devices in 5 ℃.
Claims (5)
1. vapor chamber heat pipe/microchannel cold plates composite construction temperature equalization system, it is characterized in that: comprise metal shell (1), steam cavity heat pipe layer (2) and microchannel cold plates layer (3), microchannel cold plates layer (3) is positioned between two steam cavity heat pipe layers (2), and steam cavity heat pipe layer (2) and microchannel cold plates layer (3) all are positioned at metal shell (1).
2. vapor chamber heat pipe according to claim 1/microchannel cold plates composite construction temperature equalization system, it is characterized in that: steam cavity heat pipe layer (2) comprises capillary layer (4) and reinforcement (5), capillary layer (4) comprises evaporating surface capillary layer (6), cryosurface capillary layer (7), surrounding sidewall capillary layer (8) and covers the capillary layer (9) on reinforcement surface, reinforcement one end is connected in evaporating surface capillary layer (6) inwall, and the other end is connected in cryosurface capillary layer (7) inwall.
3. vapor chamber heat pipe according to claim 2/microchannel cold plates composite construction temperature equalization system is characterized in that: reinforcement (5) is cylinder preferably, and between adjacent reinforcement (5), horizontal spacing is not more than 40 mm; The capillary layer (9) that covers the reinforcement surface is made by sintering metal powder.
4. vapor chamber heat pipe according to claim 1/microchannel cold plates composite construction temperature equalization system, is characterized in that: the total runner of microchannel cold plates layer (3) employing S type.
5. vapor chamber heat pipe according to claim 1/microchannel cold plates composite construction temperature equalization system, it is characterized in that: the total height of vapor chamber heat pipe/microchannel cold plates composite construction temperature equalization system is not more than 9mm.
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| CN201310366131.7A CN103415192B (en) | 2013-08-20 | 2013-08-20 | Vapor chamber heat pipe/microchannel cold plates composite construction temperature equalization system |
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| CN201310366131.7A CN103415192B (en) | 2013-08-20 | 2013-08-20 | Vapor chamber heat pipe/microchannel cold plates composite construction temperature equalization system |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824825A (en) * | 2014-02-13 | 2014-05-28 | 中国科学院工程热物理研究所 | Microchannel phase-change heat transfer device |
| CN105025692A (en) * | 2015-08-17 | 2015-11-04 | 中国建筑标准设计研究院有限公司 | Cooling system of data center |
| CN106455454A (en) * | 2016-12-02 | 2017-02-22 | 中国船舶重工集团公司第七二四研究所 | Cold plate based on capillary and small passage composite structure |
| CN106887419A (en) * | 2017-02-27 | 2017-06-23 | 华为技术有限公司 | Steam cavity combined radiator and electronic installation |
| CN110351993A (en) * | 2019-07-25 | 2019-10-18 | 何昊 | A kind of liquid cooling plate based on phase transformation liquid cooling and the phase transformation liquid cooling heat radiation system using it |
| CN111613592A (en) * | 2020-06-05 | 2020-09-01 | 中国科学院工程热物理研究所 | Electronic device cooling device |
| TWI812723B (en) * | 2018-05-30 | 2023-08-21 | 日商大日本印刷股份有限公司 | Vapor chamber, electronic device and sheet for vapor chamber |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020186538A1 (en) * | 2001-06-08 | 2002-12-12 | Hiroaki Kase | Cooling module and the system using the same |
| US20060000584A1 (en) * | 2001-08-28 | 2006-01-05 | Advanced Materials Technology Pte. Ltd. | Advanced microelectronic heat dissipation package and method for its manufacture |
| US20100128436A1 (en) * | 2008-11-26 | 2010-05-27 | General Electric Company | Method and apparatus for cooling electronics |
-
2013
- 2013-08-20 CN CN201310366131.7A patent/CN103415192B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020186538A1 (en) * | 2001-06-08 | 2002-12-12 | Hiroaki Kase | Cooling module and the system using the same |
| US20060000584A1 (en) * | 2001-08-28 | 2006-01-05 | Advanced Materials Technology Pte. Ltd. | Advanced microelectronic heat dissipation package and method for its manufacture |
| US20100128436A1 (en) * | 2008-11-26 | 2010-05-27 | General Electric Company | Method and apparatus for cooling electronics |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824825A (en) * | 2014-02-13 | 2014-05-28 | 中国科学院工程热物理研究所 | Microchannel phase-change heat transfer device |
| CN103824825B (en) * | 2014-02-13 | 2017-01-04 | 中国科学院工程热物理研究所 | Micro-channel phase change heat exchange device |
| CN105025692A (en) * | 2015-08-17 | 2015-11-04 | 中国建筑标准设计研究院有限公司 | Cooling system of data center |
| CN105025692B (en) * | 2015-08-17 | 2018-01-19 | 中国建筑标准设计研究院有限公司 | A kind of data center cooling system |
| CN106455454A (en) * | 2016-12-02 | 2017-02-22 | 中国船舶重工集团公司第七二四研究所 | Cold plate based on capillary and small passage composite structure |
| CN106887419A (en) * | 2017-02-27 | 2017-06-23 | 华为技术有限公司 | Steam cavity combined radiator and electronic installation |
| TWI812723B (en) * | 2018-05-30 | 2023-08-21 | 日商大日本印刷股份有限公司 | Vapor chamber, electronic device and sheet for vapor chamber |
| CN110351993A (en) * | 2019-07-25 | 2019-10-18 | 何昊 | A kind of liquid cooling plate based on phase transformation liquid cooling and the phase transformation liquid cooling heat radiation system using it |
| CN111613592A (en) * | 2020-06-05 | 2020-09-01 | 中国科学院工程热物理研究所 | Electronic device cooling device |
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| CN103415192B (en) | 2015-09-23 |
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