CN209328637U - A kind of novel high-power Chip-R - Google Patents
A kind of novel high-power Chip-R Download PDFInfo
- Publication number
- CN209328637U CN209328637U CN201822003928.1U CN201822003928U CN209328637U CN 209328637 U CN209328637 U CN 209328637U CN 201822003928 U CN201822003928 U CN 201822003928U CN 209328637 U CN209328637 U CN 209328637U
- Authority
- CN
- China
- Prior art keywords
- electrode
- fixedly connected
- component
- chip
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
The utility model discloses a kind of novel high-power Chip-Rs, including ceramic substrate, the top of the ceramic substrate is fixedly connected with resistor body, the top of the termination electrode is fixedly connected with face electrode, and the bottom end of termination electrode is fixedly connected with back electrode, one end of the termination electrode is fixedly connected with target, external electrode is fixedly connected on the outside of the target, the front and back side of the bottom end of the external electrode is fixedly connected to feet, and strip groove is offered on the downside of one end of external electrode.The utility model makes Chip-R and external board pads form certain space by strip groove, scolding tin can be made to be filled up completely in the space that Chip-R and external board pads are formed, weld Chip-R with external board pads more firm, ceramic substrate is increased at a distance from external board pads by feet, so as to improve the service life of Chip-R so that the heat of the generation of resistor body quickly disperses.
Description
Technical field
The utility model relates to technical field of electronic accessory, specifically a kind of novel high-power Chip-R.
Background technique
Chip-R is one of glassy metal uranium resistor, is to mix metal powder and glass uranium powder, using silk screen
Print process is imprinted on manufactured resistor on substrate, and the effect of Chip-R is broadly divided into: partial pressure, shunting, impedance matching and filtering,
The effect of Zero-ohm resistor, variable resistance, special resistance, it is small, small in size with humidity and high temperature resistant, temperature coefficient, again
Amount is light, can greatly save circuit space cost, refines design more, reduces stray electric field and stray magnetic field, and electrical property
Stablize, high reliablity, assembly cost is low, and with automatic dress be sticked it is standby match, high mechanical strength, high frequency characteristics is superior etc. many excellent
Point, compared to direct insertion resistance, Chip-R is easier to weld and disassembly, substantially instead of traditional direct insertion resistance,
Chip-R is widely used in computer, mobile phone, e-dictionary, medical electronics product, video camera, electronic electric meter and VCD machine
Deng.
With the continuous development of modern society, either in our everyday home life or in enterprise's production, electricity
Sub- product is not located not exist, and Chip-R is often most devices inside electronic product, breaks down, will lead to it is various not
Predictable product quality problem, wherein the power of high-power chip resistor is high, and the heat of generation is big, if carried out not in time
Heat dissipation is easy to cause weld cracking, falls off, and the oxidation rate of Chip-R itself is accelerated, and service life is caused to reduce, in
State's patent discloses a kind of Chip-R (103578668 A of Authorization Notice No. CN), the patented technology structure is simple, performance can
It leans on, not the company of easily causing weldering Hu and short circuit, resistive edge electrode and target electrical conductivity consistency are good, keep its thickness identical, produce
Product quality is uniform, effectively improves product overall performance, but its welding performance is bad, and Chip-R is in the prolonged course of work
In, weld is easy cracking, falls off, and its heat dissipation performance is bad, and the oxidation rate of itself is very fast, and service life is not high.Therefore,
Those skilled in the art provide a kind of novel high-power Chip-R, to solve the problems mentioned in the above background technology.
Summary of the invention
The purpose of this utility model is to provide a kind of novel high-power Chip-Rs, to solve to mention in above-mentioned background technique
Its welding performance out is bad, and Chip-R is in the prolonged course of work, and weld is easy cracking, falls off, and it radiates
Performance is bad, and the oxidation rate of itself is very fast, the not high problem of service life.
To achieve the above object, the utility model provides the following technical solutions:
A kind of novel high-power Chip-R, including ceramic substrate, the top of the ceramic substrate are fixedly connected with resistance
Body, and the both ends of ceramic substrate are fixedly connected to termination electrode, the top of the resistor body is fixedly connected with the first protective layer, institute
The top for stating the first protective layer is fixedly connected with the second protective layer, and the top of the termination electrode is fixedly connected with face electrode, and holds
The bottom end of electrode is fixedly connected with back electrode, and one end of the termination electrode is fixedly connected with target, the target
Outside is fixedly connected with external electrode, and the front and back side of the bottom end of the external electrode is fixedly connected to feet, and external electrode
One end on the downside of offer strip groove.
As a further solution of the present invention: first protective layer and the second protective layer are a kind of organic glass
The component of material, the ceramic substrate are a kind of component of aluminum oxide material.
The back electrode is a kind of component of fine silver material as a further solution of the present invention, the face electricity
Extremely a kind of component of silver-palladium alloy material, and one end of face electrode is connect with resistor body.
The termination electrode is a kind of component of nickel-chromium alloy material as a further solution of the present invention, and is held
One end of electrode is embedded in the side of resistor body lower end, and the target is the structure that a kind of surface is sprayed with nickel alloy material
Part, the external electrode are the component that a kind of surface is sprayed with leypewter material, the back electrode, target and face electrode
It is respectively positioned on the inside of external electrode.
The depth of the strip groove is equal to the thickness of external electrode as a further solution of the present invention, described
External electrode is that a kind of section configuration is the " [component of " type structure.
The feet is a kind of component with a thickness of 0.05~0.10mm as a further solution of the present invention,
And feet is a kind of component of nickel-chromium alloy material.
Compared with prior art, the utility model has the beneficial effects that
1, so that Chip-R and external board pads is formed certain space by strip groove, to Chip-R into
When row welding, scolding tin can be made to be filled up completely in the space of Chip-R and external board pads formation, to make to paste
Sheet resistance is more firm with external board pads welding, avoids the Chip-R for a long time under the condition of high temperature,
Due to overheat, causes weld and fall off, improve the practicability of Chip-R.
2, ceramic substrate is increased at a distance from external board pads by feet, so as to so that resistor body production
Raw heat quickly disperses, and reduces the temperature of resistor body, slows down the oxidation rate of Chip-R, improves Chip-R
Service life.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of novel high-power Chip-R；
Fig. 2 is a kind of top view of novel high-power Chip-R；
Fig. 3 is the bottom view in a kind of novel high-power Chip-R.
In figure: 1, ceramic substrate；2, resistor body；3, the first protective layer；4, the second protective layer；5, external electrode；6, back electricity
Pole；7, termination electrode；8, target；9, face electrode；10, strip groove；11, feet.
Specific embodiment
Please refer to Fig. 1~3, in the utility model embodiment, a kind of novel high-power Chip-R, including ceramic substrate 1,
The top of ceramic substrate 1 is fixedly connected with resistor body 2, and the both ends of ceramic substrate 1 are fixedly connected to termination electrode 7, resistor body 2
Top is fixedly connected with the first protective layer 3, and the top of the first protective layer 3 is fixedly connected with the second protective layer 4, the top of termination electrode 7
End is fixedly connected with face electrode 9, and the bottom end of termination electrode 7 is fixedly connected with back electrode 6, during one end of termination electrode 7 is fixedly connected with
Between electrode 8, the outside of target 8 is fixedly connected with external electrode 5, and the front and back side of the bottom end of external electrode 5 is fixedly connected with
There is feet 11, strip groove 10 is offered on the downside of one end of external electrode 5.
Resistor body 2 is by mechanical wounding in order to prevent, and the surface of resistor body 2 can be made to form insulation effect, avoids electricity
Resistance body 2 is contacted with proximity conductor and is broken down, and the first protective layer 3 and the second protective layer 4 are a kind of organic glass material
Component, ceramic substrate 1 are a kind of component of aluminum oxide material.
In order to securely weld together with external board pads, back electrode 6 is a kind of component of fine silver material, is
Make resistor body 2 and face electrode 9 is firm links together, face electrode 9 is a kind of component of silver-palladium alloy material, face electrode 9
One end connect with resistor body 2.
In order to securely connect resistor body 2, resistor body 2 is set to have good solderability and reliability, termination electrode 7 is one kind
Nickel-evanohm material component, one end of termination electrode 7 are embedded in the side of 2 lower end of resistor body, in order to improve target 8
Heat resistance, thermal shock when buffering is welded, target 8 are the component that a kind of surface is sprayed with nickel alloy material, outer in order to make
Portion's electrode 5 has good solderability and extends the service life of external electrode 5, and external electrode 5 is that a kind of surface is sprayed with tin-lead conjunction
The component of golden material, back electrode 6, target 8 and face electrode 9 are damaged in order to prevent, back electrode 6, target 8 and face
Electrode 9 is respectively positioned on the inside of external electrode 5.
In order to make Chip-R and external board pads form certain space, welded to Chip-R
When, scolding tin can be made to be filled up completely in the space of Chip-R and external board pads formation, the depth of strip groove 10
Equal to the thickness of external electrode 5, external electrode 5 is that a kind of section configuration is the " [component of " type structure.
In order to increase ceramic substrate 1 at a distance from the external circuit board, dissipate the heat of the generation of resistor body 2 quickly
It goes, feet 11 is a kind of component with a thickness of 0.05~0.10mm, and feet 11 is a kind of component of nickel-chromium alloy material.
Working principle of the utility model is: when needing to weld Chip-R, firstly, being welded in external circuit board
One layer of rosin is coated on disk, then, is sticked using automatic dress for the requirement Chip-R according to design, is flattened on outside
In board pads, wherein feet 11 is supported on the quadrangle of external board pads, then, using welding machine to external electrode 5
The space formed with external board pads is welded, and is filled up completely scolding tin in external electrode 5 and external circuit board
In the space that pad is formed, so that it is more firm to weld Chip-R with external board pads, avoid for a long time
Chip-R under the condition of high temperature is caused weld and fallen off, improved the practicability of Chip-R, most due to overheat
Scolding tin is cleaned out afterwards, ceramic substrate 1 is increased at a distance from external board pads by feet 11, so as to
So that the heat of the generation of resistor body 2 quickly disperses, the temperature of resistor body 2 is reduced, slows down the oxidation speed of Chip-R
Degree, improves the service life of Chip-R.
It is above-described, the only preferable specific embodiment of the utility model, but the protection scope of the utility model is simultaneously
It is not limited to this, anyone skilled in the art within the technical scope disclosed by the utility model, according to this reality
It is subject to equivalent substitution or change with novel technical solution and its utility model design, should all covers the protection in the utility model
Within the scope of.
Claims (6)
1. a kind of novel high-power Chip-R, including ceramic substrate (1), which is characterized in that the top of the ceramic substrate (1)
It is fixedly connected with resistor body (2), and the both ends of ceramic substrate (1) are fixedly connected to termination electrode (7), the resistor body (2)
Top is fixedly connected with the first protective layer (3), and the top of first protective layer (3) is fixedly connected with the second protective layer (4), institute
The top for stating termination electrode (7) is fixedly connected with face electrode (9), and the bottom end of termination electrode (7) is fixedly connected with back electrode (6), institute
The one end for stating termination electrode (7) is fixedly connected with target (8), is fixedly connected with external electrical on the outside of the target (8)
The front and back side of pole (5), the bottom end of the external electrode (5) is fixedly connected to feet (11), and one end of external electrode (5)
Downside offers strip groove (10).
2. a kind of novel high-power Chip-R according to claim 1, which is characterized in that first protective layer (3)
It is a kind of component of organic glass material with the second protective layer (4), the ceramic substrate (1) is a kind of aluminum oxide material
Component.
3. a kind of novel high-power Chip-R according to claim 1, which is characterized in that the back electrode (6) is one
The component of kind of fine silver material, the face electrode (9) are a kind of component of silver-palladium alloy material, and one end of face electrode (9) and electricity
Resistance body (2) connection.
4. a kind of novel high-power Chip-R according to claim 1, which is characterized in that the termination electrode (7) is one
The component of kind nickel-chromium alloy material, and one end of termination electrode (7) is embedded in the side of resistor body (2) lower end, the target
(8) component of nickel alloy material is sprayed with for a kind of surface, the external electrode (5) is that a kind of surface is sprayed with leypewter material
The component of matter, the back electrode (6), target (8) and face electrode (9) are respectively positioned on the inside of external electrode (5).
5. a kind of novel high-power Chip-R according to claim 1, which is characterized in that the depth of the strip groove (10)
Degree is equal to the thickness of external electrode (5), and the external electrode (5) is that a kind of section configuration is the " [component of " type structure.
6. a kind of novel high-power Chip-R according to claim 1, which is characterized in that the feet (11) is one kind
With a thickness of the component of 0.05~0.10mm, and feet (11) is a kind of component of nickel-chromium alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822003928.1U CN209328637U (en) | 2018-12-01 | 2018-12-01 | A kind of novel high-power Chip-R |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822003928.1U CN209328637U (en) | 2018-12-01 | 2018-12-01 | A kind of novel high-power Chip-R |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209328637U true CN209328637U (en) | 2019-08-30 |
Family
ID=67712477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822003928.1U Expired - Fee Related CN209328637U (en) | 2018-12-01 | 2018-12-01 | A kind of novel high-power Chip-R |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209328637U (en) |
-
2018
- 2018-12-01 CN CN201822003928.1U patent/CN209328637U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105006316B (en) | Ceramic thermistor vacuum sputtering electrode and its manufacture method | |
| JPWO2011162181A1 (en) | Surface mount varistor | |
| CN209328637U (en) | A kind of novel high-power Chip-R | |
| CN108493121B (en) | A kind of support plate production and packaging method solving double-sided circuit wafer short-circuited with solder | |
| CN101937747B (en) | Chip resistor and manufacturing method thereof and communication equipment | |
| CN103617852A (en) | Paster type power thermistor element and manufacture method thereof | |
| CN202758689U (en) | Thick-film super-power planar resistor of composite base plate | |
| CN204497239U (en) | Metallic packaging big current, high voltage, fast recovery diode | |
| CN202855461U (en) | Chip resistor | |
| CN104411028B (en) | The electrode connecting structure of a kind of Electric radiant Heating Film and its preparation method and heating unit | |
| CN202996456U (en) | Double-insulating-layer chip type resistor | |
| CN208208459U (en) | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure | |
| CN203339210U (en) | LED eutectic packaging pedestal, | |
| CN208353640U (en) | One kind touching thick film heating element | |
| CN206789535U (en) | A kind of fan-out package structure of power electronic devices | |
| CN206370418U (en) | One kind printing ceramic diode flip chip packaging structure | |
| CN203535979U (en) | Short circuit chip for surface gold-coated microwave circuit | |
| CN200941325Y (en) | Surface attaching positive coefficient thermistor | |
| CN209071327U (en) | A kind of high-voltage switch gear diode package structure | |
| CN201387775Y (en) | High frequency power SMD resistor | |
| CN215680279U (en) | Voltage dependent resistor electrode structure | |
| CN212276935U (en) | Chip resistor | |
| CN202259637U (en) | 20-watt load plate with impedance of 50 Omega and with thin aluminum nitride ceramic substrate | |
| CN203118935U (en) | DFN (dual flat-pack no-lead) package structure for rectifier chip | |
| CN209880293U (en) | Anti-collision resistor patch device and lamp strip assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190830 Termination date: 20191201 |