CN202855461U - Chip resistor - Google Patents
Chip resistor Download PDFInfo
- Publication number
- CN202855461U CN202855461U CN 201220456543 CN201220456543U CN202855461U CN 202855461 U CN202855461 U CN 202855461U CN 201220456543 CN201220456543 CN 201220456543 CN 201220456543 U CN201220456543 U CN 201220456543U CN 202855461 U CN202855461 U CN 202855461U
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- resistive layer
- chip resistor
- insulating substrate
- electrode
- groove
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Abstract
The utility model discloses a chip resistor which comprises an insulation substrate, surface electrodes, a resistor layer, end electrodes and an insulation layer, wherein the surface electrodes are respectively arranged on the upper surface of the insulation substrate, the resistor layer is arranged on the upper surface of the insulation substrate and is connected with the two surface electrodes, the end electrodes are respectively arranged on two ends of the insulation substrate and are connected with the corresponding surface electrodes, the insulation layer is arranged on the upper surface of the resistor layer, a groove is arranged in the upper surface of the insulation substrate, and the resistor layer is arranged in the groove. The chip resistor has a simple structure, becomes small and light, is low in production cost, is improved in cooling function, and is enhanced in stability.
Description
Technical field
The utility model relates to a kind of resistor, particularly relates to a kind of chip resistor.
Background technology
In recent years, electronic technology develops rapidly, and the integrated level of electronic product is more and more higher, and is also more and more higher to the requirement of electronic devices and components.The development need of light littleization of electronic product has been complied with in the appearance of chip device just, has saved large quantity space for electronic product, makes the proud realization of miniaturization of electronic product.Chip resistor, its humidity, high temperature resistant, reliability is high, apparent size is even, resistance precisely and temperature coefficient and resistance tolerance little.Existing chip resistor, thick-film type adopts silk screen printing resistive material to be deposited in sintering forms on the insulating body, film-type is to adopt in a vacuum the techniques such as evaporation and sputter that resistive material is deposited in to make on the insulating body, characteristics are low-temperature coefficient (± 5PPM/ ℃), high accuracy (± 0.01% ~ ± 1%).Because of low price, and can reduce product appearance size in large tracts of land saving space, plate resistor has replaced most of lead resistance.The miniaturization of device is had higher requirement to stability and the reliability of its characteristic, therefore, also requires higher to the material of its use and the characteristic of product structure.Use device reliability higher than the requirement of general electronic products for the high-precision electronic product to it, use the small parameter fluctuation of device just can affect the reliability of this electronic product.The thermal effect of device then is main force's factor, not only affects the characteristic of device itself, and the performance of the electronic product of this device is used in impact especially.Chip resistor is because of itself little characteristic, and thermal effect is the key factor that affects its stability and reliability.
Therefore, for the thermal effect of the chip resistor that further weakens, accelerating heat radiation, improve stability and reliability, increase the service life, is an important directions of these technical field research and development.
Summary of the invention
The purpose of this utility model is the chip resistor that a kind of simple in structure and stable performance is provided in order to address the above problem.
For achieving the above object, the utility model has adopted following technical scheme:
A kind of chip resistor described in the utility model, comprise insulating substrate, table electrode, resistive layer, termination electrode and insulating barrier, the table electrode is separately positioned on the upper surface on described insulating substrate surface, resistive layer is arranged on the upper surface of described insulating substrate and connects described two table electrodes, termination electrode is separately positioned on the two ends of described insulating substrate and connects corresponding table electrode, insulating barrier is arranged on the described resistive layer, upper surface at described insulating substrate is provided with groove, and described resistive layer is arranged in this groove.
At the insulating substrate upper surface groove is set, resistive layer is arranged in this groove, thereby resistive layer is contacted better with substrate, under the operating state, the heat that the resistive layer energising is distributed can distribute by insulating substrate faster, reduced the working temperature of resistor, made resistor work more stable, longer service life.
As preferred plan, described resistive layer is the conductive paste resistive layer.Adopt printing to form conductive paste resistive layer figure, also can adopt other modes to realize.
Particularly, described table electrode is metallic conduction cream, and described insulating barrier is the glass medium insulating barrier, adopts silk screen printing to form conductive pattern and insulating barrier figure.
Further, described termination electrode comprises metallic conduction cream and the coat of metal, and the described coat of metal is arranged at described metallic conduction cream surface.The coat of metal adopts to electroplate and realizes, also can adopt other mode to realize.
The beneficial effects of the utility model are:
The utility model is simple in structure, has not only realized miniaturization, the lighting of product, and production cost is low, but also has improved the heat sinking function of product, has strengthened the stability of product, prolongs life of product.
Description of drawings
Fig. 1 is the stereogram of the utility model chip resistor;
Fig. 2 is the view in transverse section of Fig. 1;
Fig. 3 is the longitdinal cross-section diagram of Fig. 2;
Fig. 4 is the insulating substrate longitdinal cross-section diagram of the utility model chip resistor.
Among the figure: the 1-insulating substrate, the 2-resistive layer, 3-shows electrode, 4-termination electrode, 5-insulating barrier, 6-groove
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, embodiment of the present utility model is described in further detail:
As depicted in figs. 1 and 2, a kind of chip resistor described in the utility model, comprise insulating substrate 1, be respectively arranged with table electrode 3 at the two ends of insulating substrate 1, table electrode 3 extends to respectively the two sides of insulating substrate 1, resistive layer 2 is arranged at upper surface and the connection table electrode 3 of insulating substrate 1, insulating barrier 5 is arranged at the upper surface of resistive layer 2 and insulating substrate 1, as shown in Figure 3, the upper surface of insulating substrate 1 is fluted 6, as shown in Figure 4, in the present embodiment, groove 6 is for rectangle but do not terminate in this shape, and resistive layer 1 is arranged in the groove 6, and termination electrode 4 is arranged at the surface of table electrode 3, resistive layer 2 fully contacts with insulating substrate 1, accelerate hot conduction, improved heat dispersion, prolonged the life-span of resistor.
Above-described embodiment only is a kind of embodiment of the present utility model; illustrative and not restrictive; also have many variations all to belong to the technical solution of the utility model; can three types such as the shape of electrode; the shape of insulating substrate upper groove can change with resistive layer; therefore, be to change and modification not breaking away from that lower of the utility model design makes, all within protection range of the present utility model.
Claims (5)
1. chip resistor, comprise insulating substrate, table electrode, resistive layer, termination electrode and insulating barrier, described table electrode is separately positioned on the upper surface of described insulating substrate, described resistive layer is arranged on the upper surface of described insulating substrate and connects two described table electrodes, described termination electrode is separately positioned on the two ends of described insulating substrate and connects corresponding table electrode, described insulating barrier is arranged on the upper surface of described resistive layer, it is characterized in that: the upper surface at described insulating substrate is provided with groove, and described resistive layer is arranged in the described groove.
2. a kind of chip resistor according to claim 1, it is characterized in that: described resistive layer is the conductive paste resistive layer.
3. a kind of chip resistor according to claim 1, it is characterized in that: described table electrode is metallic conduction cream table electrode.
4. a kind of chip resistor according to claim 1, it is characterized in that: described termination electrode comprises metallic conduction cream and the coat of metal, the described coat of metal is arranged at described metallic conduction cream surface.
5. a kind of chip resistor according to claim 1, it is characterized in that: described insulating barrier is the glass medium insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220456543 CN202855461U (en) | 2012-09-10 | 2012-09-10 | Chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220456543 CN202855461U (en) | 2012-09-10 | 2012-09-10 | Chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202855461U true CN202855461U (en) | 2013-04-03 |
Family
ID=47986632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220456543 Expired - Fee Related CN202855461U (en) | 2012-09-10 | 2012-09-10 | Chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202855461U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103971868A (en) * | 2014-05-29 | 2014-08-06 | 昆山福烨电子有限公司 | Novel thin-film resistor |
| CN107910149A (en) * | 2017-11-16 | 2018-04-13 | 贝迪斯电子有限公司 | A kind of plate resistor sputters lateral electrode device |
| WO2023279467A1 (en) * | 2021-07-08 | 2023-01-12 | 深圳镓芯半导体科技有限公司 | Compound semiconductor oscillator assembly |
-
2012
- 2012-09-10 CN CN 201220456543 patent/CN202855461U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103971868A (en) * | 2014-05-29 | 2014-08-06 | 昆山福烨电子有限公司 | Novel thin-film resistor |
| CN107910149A (en) * | 2017-11-16 | 2018-04-13 | 贝迪斯电子有限公司 | A kind of plate resistor sputters lateral electrode device |
| CN107910149B (en) * | 2017-11-16 | 2024-05-07 | 贝迪斯电子有限公司 | Sheet resistor sputtering side electrode device |
| WO2023279467A1 (en) * | 2021-07-08 | 2023-01-12 | 深圳镓芯半导体科技有限公司 | Compound semiconductor oscillator assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20131202 Address after: 518000 A5 block B2, third industrial zone, Yan Chuan, Songgang street, Baoan District, Guangdong, Shenzhen Patentee after: Shenzhen Pak Heng Electronics Co., Ltd. Address before: High tech Zone Gaopeng road in Chengdu city of Sichuan province 610041 5 block A No. 2 A-320 Patentee before: Chengdu Moyi Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20170910 |