CN206460826U - A kind of film patch resistance - Google Patents
A kind of film patch resistance Download PDFInfo
- Publication number
- CN206460826U CN206460826U CN201720105235.6U CN201720105235U CN206460826U CN 206460826 U CN206460826 U CN 206460826U CN 201720105235 U CN201720105235 U CN 201720105235U CN 206460826 U CN206460826 U CN 206460826U
- Authority
- CN
- China
- Prior art keywords
- electrodes
- electrode
- protective layer
- substrate
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011241 protective layer Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000010410 layer Substances 0.000 claims abstract description 22
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011521 glass Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
Abstract
The utility model discloses a kind of film patch resistance, including substrate, electrode, resistive layer and protective layer；State the aluminium oxide ceramics that substrate is high-purity；The electrode includes two face electrodes, two back electrodes, two termination electrodes, two targets and two outer electrodes；Both sides of two face electrode prints in the upper surface of substrate；Two back electrodes are printed on the both sides of the lower surface of substrate；Two termination electrodes are printed on the two sides of substrate and overlapped respectively with face electrode and back electrode；Two targets are covered on the outer surface of face electrode, termination electrode and back electrode of substrate both sides；Two outer electrodes are covered on the outer surface of two targets；Resistive layer is printed on the upper surface of substrate and is covered between two face electrodes；The second protection layer that protective layer includes a protective layer for being covered in the upper surface of resistive layer and is covered on the upper surface of a protective layer.Film patch resistance of the present utility model, small volume, lightweight, electric performance stablity, reliability are high.
Description
Technical Field
The utility model relates to an electronic components especially relates to a film chip resistor.
Background
The chip resistor is called a chip fixed resistor and is characterized by humidity resistance, high temperature resistance, high reliability, uniform appearance size, accuracy and small tolerance of temperature coefficient and resistance value. The film chip resistor and the thick film chip resistor are divided according to the production process. Thick film chip resistors are formed by screen printing resistive material deposited on an insulating substrate (e.g., alumina ceramic) and then sintered. The thin film sheet resistor, usually a metal thin film resistor, is fabricated by sputtering a resistive material (vacuum coating technique) on an insulating substrate in vacuum by evaporation and sputtering. As electronic products are becoming thinner and more diversified, how to adapt the thin film chip resistor to the development needs is a problem to be solved by those skilled in the art.
Disclosure of Invention
An object of the utility model is to provide a film chip resistor, its is small, light in weight, electrical property stability, reliability height.
The technical scheme for realizing the purpose is as follows: a film chip resistor comprises a substrate, electrodes, a resistor layer and a protective layer; wherein,
the substrate is high-purity alumina ceramic;
the electrodes comprise two face electrodes, two back electrodes, two end electrodes, two middle electrodes and two external electrodes; the two surface electrodes are printed on two sides of the upper surface of the substrate in a one-to-one correspondence manner; the two back electrodes are printed on two sides of the lower surface of the substrate in a one-to-one correspondence manner; the two terminal electrodes are printed on two side faces of the substrate in a one-to-one correspondence mode and are respectively overlapped with the face electrode and the back electrode; the two middle electrodes are covered on the outer surfaces of the surface electrode, the end electrode and the back electrode on two sides of the substrate in a one-to-one correspondence manner; the two outer electrodes are covered on the outer surfaces of the two middle electrodes in a one-to-one correspondence manner;
the resistance layer is printed on the upper surface of the substrate and covers between the two surface electrodes, the cross section of the resistance layer is in an inverted trapezoid shape, and the inclination of two side surfaces is 45 degrees;
the protective layer comprises a primary protective layer covering the upper surface of the resistance layer and a secondary protective layer covering the upper surface of the primary protective layer; the cross section of the primary protection layer is trapezoidal, and the inclination of two side surfaces is 60 degrees; the cross section of the secondary protective layer is also trapezoidal, the inclination of the two side faces is also 60 degrees, a groove pit is hollowed out on the lower surface of the secondary protective layer, and the two side walls of the groove pit are matched with the two side faces of the primary protective layer.
In the above thin film chip resistor, the area of the front electrode is larger than the area of the back electrode.
In the thin film chip resistor, the primary protective layer and the secondary protective layer are both glass sheets with a thickness of 10 mm.
In the above thin film chip resistor, the thickness of the middle electrode and the thickness of the outer electrode are both 16 μm.
The utility model discloses a film chip resistor has following characteristics: the volume is small, the weight is light, and the miniaturization of the whole machine product is facilitated; the size is stable, the mechanical strength is high, and the assembly cost is low; small temperature coefficient, stable electrical property and high reliability.
Drawings
Fig. 1 is a schematic structural diagram of the thin film chip resistor of the present invention.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
Referring to fig. 1, the present invention relates to a thin film chip resistor, which includes a substrate 1, an electrode, a resistor layer 2 and a protective layer.
The substrate 1 is high-purity alumina ceramic;
the electrodes comprise two face electrodes 31, two back electrodes 32, two end electrodes 33, two middle electrodes 34 and two outer electrodes 35; wherein, two surface electrodes 31 are printed on two sides of the upper surface of the substrate 1 in a one-to-one correspondence; two back electrodes 32 are printed on both sides of the lower surface of the substrate 1 in one-to-one correspondence; two terminal electrodes 33 are printed on two side surfaces of the substrate 1 in a one-to-one correspondence manner and are respectively overlapped with the surface electrode 31 and the back electrode 32, so that the surface electrode 31 and the back electrode 32 are conducted; two intermediate electrodes 34 are covered on the outer surfaces of the face electrode 31, the terminal electrode 33 and the back electrode 32 on both sides of the substrate 1 in a one-to-one correspondence; the two outer electrodes 35 are overlaid on the outer surface of the intermediate electrode 34 in a one-to-one correspondence.
The area of the face electrode 31 is larger than that of the back electrode 32.
The thickness of the intermediate electrode 34 and the outer electrode 35 are both 16 microns.
A resistive layer 2 is printed on the upper surface of the substrate 1 and covers between the two surface electrodes 31, the resistive layer 2 having a cross section of an inverted trapezoid shape and having two side surfaces inclined at 45 °.
The protective layer includes a primary protective layer 41 covering the upper surface of the resistance layer 2 and a secondary protective layer 42 covering the upper surface of the primary protective layer 41; the primary protective layer 41 and the secondary protective layer 42 are each a glass sheet having a thickness of 10 mm. The cross section of the primary protective layer 41 is trapezoidal and the inclination of both side surfaces is 60 °. The cross section of the secondary protection layer 42 is also trapezoidal, the inclination of the two side surfaces is also 60 degrees, a groove is hollowed out on the lower surface of the secondary protection layer 42, and the two side walls of the groove are matched with the two side surfaces of the primary protection layer 41 to cover the side surfaces of the primary protection layer 41. The structure can firmly combine each component, and the mechanical strength of the resistor is high,
the above embodiments are provided only for the purpose of illustration, not for the limitation of the present invention, and those skilled in the relevant art can make various changes or modifications without departing from the spirit and scope of the present invention, therefore, all equivalent technical solutions should also belong to the scope of the present invention, and should be defined by the claims.
Claims (1)
1. A film chip resistor comprises a substrate, electrodes, a resistor layer and a protective layer; it is characterized in that the preparation method is characterized in that,
the substrate is high-purity alumina ceramic;
the electrodes comprise two face electrodes, two back electrodes, two end electrodes, two middle electrodes and two external electrodes; the two surface electrodes are printed on two sides of the upper surface of the substrate in a one-to-one correspondence manner; the two back electrodes are printed on two sides of the lower surface of the substrate in a one-to-one correspondence manner; the two terminal electrodes are printed on two side faces of the substrate in a one-to-one correspondence mode and are respectively overlapped with the face electrode and the back electrode; the two middle electrodes are covered on the outer surfaces of the surface electrode, the end electrode and the back electrode on two sides of the substrate in a one-to-one correspondence manner; the two outer electrodes are covered on the outer surfaces of the two middle electrodes in a one-to-one correspondence manner;
the area of the surface electrode is larger than that of the back electrode;
the thickness of the middle electrode and the thickness of the outer electrode are both 16 microns;
the resistance layer is printed on the upper surface of the substrate and covers between the two surface electrodes, the cross section of the resistance layer is in an inverted trapezoid shape, and the inclination of two side surfaces is 45 degrees;
the protective layer comprises a primary protective layer covering the upper surface of the resistance layer and a secondary protective layer covering the upper surface of the primary protective layer; the cross section of the primary protection layer is trapezoidal, and the inclination of two side surfaces is 60 degrees; the cross section of the secondary protective layer is also trapezoidal, the inclination of the two side faces is also 60 degrees, a groove pit is hollowed out on the lower surface of the secondary protective layer, and the two side walls of the groove pit are matched with the two side faces of the primary protective layer;
the primary protective layer and the secondary protective layer are both glass sheets with the thickness of 10 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720105235.6U CN206460826U (en) | 2017-01-27 | 2017-01-27 | A kind of film patch resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720105235.6U CN206460826U (en) | 2017-01-27 | 2017-01-27 | A kind of film patch resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206460826U true CN206460826U (en) | 2017-09-01 |
Family
ID=59694168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720105235.6U Expired - Fee Related CN206460826U (en) | 2017-01-27 | 2017-01-27 | A kind of film patch resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206460826U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113969104A (en) * | 2020-07-22 | 2022-01-25 | 长鑫存储技术有限公司 | Lead-free glass paste, chip resistor and preparation method thereof |
| US11802076B2 (en) | 2020-07-22 | 2023-10-31 | Changxin Memory Technologies, Inc. | Lead-free glass paste, chip resistor and method for producing same |
-
2017
- 2017-01-27 CN CN201720105235.6U patent/CN206460826U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113969104A (en) * | 2020-07-22 | 2022-01-25 | 长鑫存储技术有限公司 | Lead-free glass paste, chip resistor and preparation method thereof |
| CN113969104B (en) * | 2020-07-22 | 2023-05-23 | 长鑫存储技术有限公司 | Leadless glass slurry, chip resistor and preparation method thereof |
| US11802076B2 (en) | 2020-07-22 | 2023-10-31 | Changxin Memory Technologies, Inc. | Lead-free glass paste, chip resistor and method for producing same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8937610B2 (en) | Dual-substrate capacitive touch panel | |
| US8649155B2 (en) | Electronic component including reinforcing electrodes | |
| CN206460826U (en) | A kind of film patch resistance | |
| CN101271750A (en) | Electronic component and manufacturing the same | |
| WO2020189217A1 (en) | Chip resistor | |
| US8854175B2 (en) | Chip resistor device and method for fabricating the same | |
| CN202816523U (en) | Chip resistor with double resistive layers | |
| KR20130076599A (en) | Resistor and method for manufacturing the same | |
| JP5577917B2 (en) | Chip varistor | |
| CN109950043A (en) | Monolithic electronic component | |
| CN108140460B (en) | Chip resistor | |
| CN111834125B (en) | Multilayer ceramic electronic component | |
| CN206401110U (en) | A kind of special thick film Chip-R of antistatic automobile | |
| CN101047062B (en) | Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component | |
| JP4529337B2 (en) | Weight sensor | |
| CN217588572U (en) | Resistor with protective layer | |
| JP3508574B2 (en) | Chip type surge absorber | |
| JP2001035707A (en) | Laminated chip varistor | |
| JP2014082003A (en) | Esd protection device and manufacturing method therefor | |
| JP2001135501A (en) | Chip type thermistor | |
| US20240177894A1 (en) | Laminated varistor | |
| US20240177895A1 (en) | Laminated varistor | |
| US20240161950A1 (en) | Multilayer ceramic component | |
| CN206331918U (en) | A kind of novel patch capacitor | |
| JP3885965B2 (en) | Surface mount chip network components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181227 Address after: Room A1003, 1st floor, 223 Jianghan Road, Minhang District, Shanghai, 201112 Patentee after: SHANGHAI HAZHE ELECTRONICS Co.,Ltd. Address before: 215143 No. 243 Kangyang Road, Huangdi Town, Xiangcheng District, Suzhou City, Jiangsu Province Patentee before: IOIP CHINA CO.,LTD. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210811 Address after: 215010 No. 26, Qinghua Road, Hushuguan Town, high tech Zone, Suzhou, Jiangsu Patentee after: Suzhou Xier Intelligent Photoelectric Co.,Ltd. Address before: Room A1003, 1st floor, 223 Jianghan Road, Minhang District, Shanghai, 201112 Patentee before: SHANGHAI HAZHE ELECTRONICS Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170901 Termination date: 20220127 |