CN107910149B - Sheet resistor sputtering side electrode device - Google Patents
Sheet resistor sputtering side electrode device Download PDFInfo
- Publication number
- CN107910149B CN107910149B CN201711136393.9A CN201711136393A CN107910149B CN 107910149 B CN107910149 B CN 107910149B CN 201711136393 A CN201711136393 A CN 201711136393A CN 107910149 B CN107910149 B CN 107910149B
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- CN
- China
- Prior art keywords
- plate
- opening
- bracket
- pressing
- pressing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 17
- 238000003825 pressing Methods 0.000 claims abstract description 23
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a chip resistor sputtering side electrode device, which comprises a bracket (1), wherein an opening (2) is arranged on one side of the bracket (1), and a pressing component (3) is connected at the opening (2) in a matching way; the pressing assembly (3) comprises a pressing plate (4), a first clamping plate (5) is arranged on one side of the pressing plate (4), a second clamping plate (6) is arranged on the other side of the pressing plate (4), and a spring (7) is fixedly connected to the pressing plate (4). The invention has the advantages that: the device is used for carrying out sputtering processing on the side electrodes by putting scattered chip resistors together in batches, has the advantages of simple structure, convenient combination, low price, easy operation, time and labor saving, and can sputter the side electrodes of the chip resistors on the existing round-rolling type sputtering machine.
Description
Technical Field
The invention relates to electronic component production equipment and a device, in particular to a chip resistor sputtering side electrode device.
Background
In the production process of the chip resistor, the side electrode of the chip resistor needs to be sputtered, and a plane sputtering machine is needed to be used in the sputtering process, so that the plane sputtering machine is expensive, and the existing round-rolling type coating machine cannot sputter the side electrode of the chip resistor.
Disclosure of Invention
The invention aims to solve the defects that the planar sputtering machine is high in price at the present stage, the traditional round rolling type coating machine cannot sputter the side electrode of a chip resistor, and the like, and provides a sputtering side electrode device for the chip resistor.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
A chip resistor sputtering side electrode device, characterized in that: comprises a bracket, an opening is arranged on one side of the bracket, and a compression assembly is matched and connected at the opening;
the pressing component comprises a pressing plate, a first clamping plate is arranged on one side of the pressing plate, a second clamping plate is arranged on the other side of the pressing plate, and a spring is fixedly connected to the pressing plate.
On the basis of the technical scheme, the following further technical scheme is available:
The bracket comprises a square annular frame, a through groove is formed in the annular frame on one side opposite to the opening, a stop pin is respectively arranged on two sides of the through groove, a bottom plate is arranged in the annular frame, and the bottom plate is in limit fit with the stop pin.
The annular frames on two sides of the opening are respectively provided with a groove, and the bottom plate is correspondingly arranged in the two grooves.
The outer side of the first clamping plate is provided with a semicircular clamping groove, and the outer side of the second clamping plate is provided with a hook.
The bracket at one side of the opening is connected with a buckle plate through a pin shaft, and the buckle plate is in buckling fit with the second clamping plate.
The inner side of the buckle plate is provided with a clamping groove which is buckled with the second clamping plate.
The invention has the advantages that: the device is used for carrying out sputtering processing on the side electrodes by putting scattered chip resistors together in batches, has the advantages of simple structure, convenient combination, low price, easy operation, time and labor saving, and can sputter the side electrodes of the chip resistors on the existing round-rolling type sputtering machine.
Drawings
FIG. 1 is a schematic view of the basic structure of the present invention;
FIG. 2 is a right side view of FIG. 1;
FIG. 3 is a bottom view of FIG. 1;
FIG. 4 is a side view of the bracket;
fig. 5 is a schematic structural view of the hold-down assembly.
Detailed Description
In order that the invention may be more readily understood, a detailed description of the invention is provided below with reference to the accompanying drawings, the specific embodiments described herein being for purposes of illustration only and not for limitation.
As shown in fig. 1, 2,3 and 4, the chip resistor sputtering side electrode device provided by the invention comprises a bracket 1, wherein the bracket 1 comprises a square annular frame 8, one side of the annular frame 8 is provided with an opening 2, the other side of the annular frame 8 is provided with a through groove 9, the annular frames 8 on both sides of the opening 2 are respectively provided with a groove 16, each groove 16 on both sides of the through groove 9 is respectively provided with a stop pin 10, a bottom plate 11 is connected between the two grooves 16 in a matched manner, and the bottom plate 11 is in limit fit with the two stop pins 10.
An opening groove 17 is formed in the annular frame 8 on one side of the opening 2, a buckling plate 15 is connected in the opening groove 17 through a pin shaft 14, the buckling plate 15 can swing in the opening groove 17 around the pin shaft 14, and a clamping groove is formed in the inner side of the buckling plate 15.
As shown in fig. 5, the opening 2 is matched and connected with the pressing assembly 3, the pressing assembly 3 comprises a pressing plate 4, a first clamping plate 5 is arranged on one side of the pressing plate 4, a semicircular clamping groove 12 is formed in the outer side of the first clamping plate 5, a second clamping plate 6 is arranged on the other side of the pressing plate 4, a hook 13 is arranged on the outer side of the second clamping plate 6, a buckling rod 18 is connected to the annular frame 8 on one side of the opening 2, the buckling rod 18 is correspondingly buckled in the semicircular clamping groove 12, and the hook 13 is correspondingly buckled in the clamping groove of the buckling plate 15. Two springs 7 are fixedly connected to the pressing plate 4, and each spring 7 is fixedly connected to the pressing plate 4 through a screw.
In use, the chip resistor requiring the electrode on the electro-sputtering side is fixed in the bracket 1 by the hold-down assembly 3 and the base plate 11.
Claims (1)
1. A chip resistor sputtering side electrode device, characterized in that: comprises a bracket (1), an opening (2) is arranged on one side of the bracket (1), and a compression assembly (3) is matched and connected at the opening (2);
The pressing assembly (3) comprises a pressing plate (4), a first clamping plate (5) is arranged on one side of the pressing plate (4), a second clamping plate (6) is arranged on the other side of the pressing plate (4), and a spring (7) is fixedly connected to the pressing plate (4);
The bracket (1) comprises a square annular frame (8), a through groove (9) is formed in the annular frame (8) on the opposite side of the opening (2), a stop pin (10) is respectively arranged on two sides of the through groove (9), a bottom plate (11) is arranged in the annular frame (8), and the bottom plate (11) is in limit fit with the stop pin (10);
a groove (16) is formed in the annular frame (8) at two sides of the opening (2), and the bottom plate (11) is correspondingly arranged in the two grooves (16);
a semicircular clamping groove (12) is formed in the outer side of the first clamping plate (5), and a hook (13) is arranged in the outer side of the second clamping plate (6);
The bracket (1) at one side of the opening (2) is connected with a buckle plate (15) through a pin shaft (14), and the buckle plate (15) is in buckling fit with the second clamping plate (6);
the inner side of the buckle plate (15) is provided with a clamping groove which is buckled with the second clamping plate (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711136393.9A CN107910149B (en) | 2017-11-16 | 2017-11-16 | Sheet resistor sputtering side electrode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711136393.9A CN107910149B (en) | 2017-11-16 | 2017-11-16 | Sheet resistor sputtering side electrode device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107910149A CN107910149A (en) | 2018-04-13 |
| CN107910149B true CN107910149B (en) | 2024-05-07 |
Family
ID=61844248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711136393.9A Active CN107910149B (en) | 2017-11-16 | 2017-11-16 | Sheet resistor sputtering side electrode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107910149B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002280715A (en) * | 2001-03-16 | 2002-09-27 | Morimitsu Wakabayashi | Method for lead-less connection of electronic circuit |
| CN201773657U (en) * | 2010-08-31 | 2011-03-23 | 三星高新电机（天津）有限公司 | Clamp transfer device for chip resistors |
| CN202846472U (en) * | 2012-09-07 | 2013-04-03 | 成都默一科技有限公司 | Adjustable holddown device |
| CN202855461U (en) * | 2012-09-10 | 2013-04-03 | 成都默一科技有限公司 | Chip resistor |
| CN202945319U (en) * | 2012-09-07 | 2013-05-22 | 成都默一科技有限公司 | Pressing device of strip-shaped appliance |
| CN204509457U (en) * | 2015-03-25 | 2015-07-29 | 中国振华集团云科电子有限公司 | A kind of exclusion end face stops sputtering fixture |
| CN205033111U (en) * | 2015-09-07 | 2016-02-17 | 贝迪斯电子有限公司 | Piece formula resistance overload anchor clamps |
| CN105374480A (en) * | 2015-12-24 | 2016-03-02 | 株洲宏达电通科技有限公司 | High-power chip whole-film fixed resistor and production method thereof |
| CN207474187U (en) * | 2017-11-16 | 2018-06-08 | 贝迪斯电子有限公司 | A kind of plate resistor sputters lateral electrode device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358445A (en) * | 2014-04-24 | 2017-01-25 | 松下知识产权经营株式会社 | Chip resistor and method for manufacturing same |
-
2017
- 2017-11-16 CN CN201711136393.9A patent/CN107910149B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002280715A (en) * | 2001-03-16 | 2002-09-27 | Morimitsu Wakabayashi | Method for lead-less connection of electronic circuit |
| CN201773657U (en) * | 2010-08-31 | 2011-03-23 | 三星高新电机（天津）有限公司 | Clamp transfer device for chip resistors |
| CN202846472U (en) * | 2012-09-07 | 2013-04-03 | 成都默一科技有限公司 | Adjustable holddown device |
| CN202945319U (en) * | 2012-09-07 | 2013-05-22 | 成都默一科技有限公司 | Pressing device of strip-shaped appliance |
| CN202855461U (en) * | 2012-09-10 | 2013-04-03 | 成都默一科技有限公司 | Chip resistor |
| CN204509457U (en) * | 2015-03-25 | 2015-07-29 | 中国振华集团云科电子有限公司 | A kind of exclusion end face stops sputtering fixture |
| CN205033111U (en) * | 2015-09-07 | 2016-02-17 | 贝迪斯电子有限公司 | Piece formula resistance overload anchor clamps |
| CN105374480A (en) * | 2015-12-24 | 2016-03-02 | 株洲宏达电通科技有限公司 | High-power chip whole-film fixed resistor and production method thereof |
| CN207474187U (en) * | 2017-11-16 | 2018-06-08 | 贝迪斯电子有限公司 | A kind of plate resistor sputters lateral electrode device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107910149A (en) | 2018-04-13 |
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